JPH07272934A - Printed circuit board - Google Patents

Abstract

PURPOSE:To provide a printed circuit board which allows the number of mounted parts for suppression of noise, size, weight and cost to be reduced and can prevent the noise from occurring. CONSTITUTION:First and second coil parts 5 and 10 having about identical spiral or winding shapes are formed on a part of going and return interconnection patterns 2, 7 and 3, 13, respectively, and these coil part-formed patterns are made mutually parallel on the same plane and/or layers 1A and 1B.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board,
More specifically, the present invention relates to a printed circuit board on which a printed wiring pattern made of a conductor is arranged together with elements such as ICs and resistors.

[0002]

2. Description of the Related Art Conventionally, in this type of printed circuit board, a magnetic material having a high resistivity, for example, a ferrite core, is interposed in the cable wire connected to the above-mentioned wiring pattern in order to prevent generation of noise as a measure against unnecessary radiation. In order to prevent noise from being propagated to the cable line, measures have been taken such as mounting a noise filter component. Note that such conduction noise is generally called normal mode noise generated between the two wirings in a pair of round-trip lines, and common mode noise generated between the two wirings and the ground or the housing. It can be classified into what is called noise. Therefore, when one or a plurality of electronic components are arranged on the substrate, a normal mode noise filter is used for the normal mode noise and a common mode noise is used for the common mode noise. The noise filters have been configured individually.

[0003]

However, in order to prevent noise in a printed circuit board on which one or a plurality of electronic components are mounted as described above, normally, a plurality of inductor and capacitor components are incorporated. A circuit must be constructed, and particularly expensive parts are required to prevent common mode noise.

It is an object of the present invention to pay attention to the above-mentioned conventional problems and, in order to solve the problems, to reduce the number of mounting parts for noise suppression, to reduce the size and weight, and at the same time, to provide a printed circuit board which is inexpensive and can prevent generation of noise. To provide.

[0005]

In order to achieve such an object, the present invention is a printed circuit board on which forward and return wiring patterns for sending electric signals or power are formed. Forming first and second coil portions having substantially the same shape as a spiral or winding type on a part of each of the first and second coil portions, and wiring patterns of the first and second coil portions on the same plane and / or a plurality of layers. It is characterized in that they are parallel to each other above.

[0006]

According to the present invention, the spiral and winding type first and first wiring patterns, each of which has substantially the same shape as the forward and return wiring patterns for supplying an electric signal or power supply current, and whose formation patterns are parallel to each other. By providing the two coil portions on the same surface and / or on a plurality of layers, and the signal or power supply current flowing through the first coil portion and the signal or power supply current flowing through the second coil portion are oriented in the same direction, the normal mode It is possible to function as a common mode filter by making it function as a filter and by making it the opposite direction.

[0007]

Embodiments of the present invention will be described in detail and specifically below with reference to the drawings.

FIG. 1 shows a first embodiment of the present invention. In addition,
In the following examples, in order to make the explanation easy to understand, in the case of a single-layer substrate, the lower surface (back surface) side thereof, and in the case of a multilayer substrate, the first
Each of the layers other than is shown in solid lines to indicate the wiring and the plated through holes in accordance with the upper surface (first layer) in a transparent manner.

In FIG. 1A, 1A is the upper surface of the printed board 1, and 2 and 3 are wiring patterns formed on the upper surface 1A of the board as reciprocating lines involved in sending and receiving electric signals. In the case of this example, the outward wiring pattern (hereinafter referred to as the first wiring pattern) 2 is formed in the shape of an inwardly wound spiral coil on the upper surface 1A as shown in this figure, and is provided at the center. Is connected to the plated through hole 4. The portion of the coil-shaped wiring pattern will be referred to as the first coil portion 5. Further, 6 is the first coil portion 4
Plated through-holes drilled outside
A wiring pattern (hereinafter referred to as a first connection pattern) which is connected to the first wiring pattern 2 side through the plated through hole 6 on the A side and is guided to the outside of the illustrated area of the substrate 1. The plated through holes 4 and 6 are connected by a jumper wire 8 shown by a broken line on the upper surface 1A side as shown in FIG.

On the other hand, the return wiring pattern 3 (hereinafter referred to as the second wiring pattern) is connected to the second coil portion 10 formed on the back surface 1B side through the plated through hole 9, and further the center of the second coil portion 10 is formed. It is connected to the plated through hole 11 provided in the section. In addition, 12 is a plated through hole formed outside the first coil portion 4 and the second coil portion 10, and 13 is a second connection pattern connected to the plated through hole 12 and wired in parallel with the first connection pattern 7. Is. The plated through hole 11 and the plated through hole 12 are connected by a jumper wire 14 as shown by a broken line in FIG.

Therefore, in the patterns 2, 5, 7 and 3, 10, 13 formed as the reciprocating lines, the upper surface 1A and the lower surface 1B of the substrate 1 are formed in substantially the same shape at the corresponding positions, and Angular spiral type first coil portion 5 and second coil portion 10 in which current flows in opposite directions
Since these are formed in the middle of the pattern, they both function as an inductor, and the characteristics as a common mode filter can be effectively exhibited.

FIG. 2 shows a second embodiment of the present invention. In addition,
In the following description, the same reference numerals are used for the respective parts denoted by the reference numerals in the first embodiment and having the same functions, and the detailed description thereof will be omitted. In this example as well, the basic configuration is the same, but the first wiring pattern 2 and the second wiring pattern 3 are formed on the upper surface 1A and the lower surface 1B of the substrate 1, respectively, and the first connection pattern 7 and the second connection pattern 7 are formed. The difference is that a chip capacitor 15 is provided between the connection pattern 13 and the first coil portion 5 and the second coil portion 10 are wound in opposite directions. However, as the chip capacitor, a constant may be selected according to the frequency characteristic of the noise filter, and the mounting position and the number thereof are not limited to those of this embodiment.

According to this embodiment, the first coil portion 5 and the second coil portion 10 are formed in the same spiral spiral shape at substantially corresponding positions on the upper and lower surfaces, and the current flow directions are the same. In addition to functioning as an inductor, since the chip capacitor 15 is interposed between the first connection pattern 7 and the second connection pattern 13, the characteristics as a normal mode filter can be effectively exhibited.

FIG. 3 shows a third embodiment of the present invention. In this example, both the first wiring pattern 2 and the second wiring pattern 3 are formed in a spiral shape on both the upper surface 1A and the lower surface 1B of the substrate while keeping them in parallel. 5A is the upper surface 1A formed by the first wiring pattern 2. Side first coil portion 10B is a second coil portion on the upper surface 1A side of the second wiring pattern 3. Also, 5
B is a first coil portion on the lower surface 1B side by the first wiring pattern 2 and 10A is a second coil portion on the lower surface 1B side by the second wiring pattern 3. The first coil portion 5 on the upper surface 1A side
A is connected to the first coil portion 5B on the lower surface 1B side through the plated through hole 4, and the second coil portion 1 on the lower surface 1B side is connected.
0A and the second coil portion 10B on the upper surface 1A side are connected to each other through the plated through holes 11. Further, in this example, the first wiring pattern 2 and the second wiring pattern 3 are formed in parallel with the substrate upper surface 1A side, and both the first connection pattern 7 and the second connection pattern 13 are formed on the substrate lower surface 1
The first coil portion 5B and the second coil portion 10A on the B side, respectively.
And is drawn out of the substrate region shown in the figure in a form connected to and.

In the case of this example, the first coil portions 5A and 5B formed by the first wiring pattern 2 and the second wiring pattern 2 are provided at corresponding positions on the upper surface 1A and the lower surface 1B of the substrate 1, respectively.
The second coil portions 10B and 10A are formed and the current flow directions are opposite to each other, so that the characteristics as a common mode filter can be effectively exhibited.

FIG. 4 shows a fourth embodiment of the present invention. Here, the first wiring pattern 2 is, as shown in (A) and (B), from the upper surface 1A to the lower surface 1B side through the plated through holes 21, and from the lower surface 1B to the upper surface 1A through the plated through holes 22. First winding coil of square winding type having the substrate 1 as a core through plated through holes 21, 23, 25, 27, 29 and 22, 24, 26, 28, 30 formed in the same row such as on the side It is formed in the part 500. Then, through the plated through hole 30, the upper surface 1A
And is connected to the first connection pattern 7 on the upper surface 1A as shown in FIG.

The second wiring pattern 3 has a lower surface 1B from the lower surface 1B through a plated through hole 41 and a lower surface 1A from the upper surface 1A through a plated through hole 42.
41, 43, 4 drilled in the same row such as on the B side
5, 47, 49 and 42, 44, 46, 48, 50 are formed on the second winding coil section 100 having the same shape as the above-described winding coil section 500, and the second connection pattern is formed on the lower surface 1B. 13 is connected.

Thus, the first winding coil section 500 and the second winding coil section 500
In the winding coil unit 100, the wirings of the first wiring pattern 2 and the second wiring pattern 3 are formed in parallel on the upper surface 1A and the lower surface 1B at predetermined intervals in the same direction and are adjacent to each other. The directions of current flow are opposite between the patterns. In this example, ferrite having a high resistivity is mixed in the base body of the substrate 1 forming the first winding coil section 500 and the second winding coil section 100 as described above, and both the upper surface 1A and the lower surface 1B of the ferrite are mixed. As shown in FIG. 4C, resist layers 51A and 51B made of a composite magnetic material mixed with ferrite are formed to protect both coil portions and increase the inductance.

In the printed circuit board 1 thus constructed, the winding coil portion 50 wound in the same direction on both the first wiring pattern 2 and the second wiring pattern 3 forming the reciprocating line.
0 and 100 are formed, and the directions of the currents flowing through these winding coil portions are different from each other, so that the characteristics as a common mode filter can be effectively exhibited.

FIG. 5 shows a fifth embodiment of the present invention.
(A) shows the wiring formation state of the first layer, and (B) shows the second wiring state.
The third layer and (D) show the wiring formation state of the fourth layer, the third layer, and (C), respectively. Further, (E) shows the substrate 1 in a cross section taken along the line BB 'of (A). In (A), 2 is a first wiring pattern, 3 is a second wiring pattern, 7 is a first connection pattern, and 13 is a second connection pattern. In addition, in this example, when forming the plated through holes in the multilayer substrate 1, the plated through holes are formed so as to penetrate each layer, and each plated through hole is formed in the wiring patterns 2, 3 or the connection only in the layer in which the connection is required. It is connected to the terminals of patterns 7 and 13.

Reference numerals 61, 62 and 63, 64 denote plated through holes formed as described above. Therefore, all of these plated through holes are formed on the first layer 1-1 of the substrate 1.
A, second layer 1-12, third layer 1-23, fourth layer 1-3B
Is provided so as to penetrate through. Also, 5 is the second layer 1
-12 is the first coil portion, 10 is the third layer 1-23
The second coil portion formed on the first coil portion 5 and the second coil portion 5
In the case of this example, the coil portion 10 is the second layer 1-12 and the third layer.
The layers 1 to 23 are formed so as to be wound in the same direction at positions substantially corresponding to the upper and lower sides.

Thus, in the printed circuit board 1 according to this example, the first wiring pattern 2 formed on the first layer 1-1A has the coil portion 5 of the second layer 1-12 via the plated through holes 61.
And a terminal portion provided in the central portion of the first coil portion 5 is connected to the first layer 1-1A of the first layer 1-1A through the plated through hole 63.
It is connected to the connection pattern 7. In addition, the second wiring pattern 3 formed on the first layer 1-1A has a plated through hole 62.
The second connection pattern 1 of the first layer 1-1A is connected to the second coil section 10 of the third layer 1-23 via the plated through hole 64 provided in the center of the second coil section 10.
3 is connected. As shown in FIG. 5E, resist layers 66A and 66B were formed on the first layer 1-1A and the fourth layer 1-3B in this example.

In the printed circuit board 1 thus constructed,
As in the embodiment shown in FIGS. 1 and 2, the jumper wire 8
It is possible to connect only the plated through holes in the middle of the pattern forming the outward path and the return path without using 14 and 14, and the manufacturing process can be reduced accordingly.
Further, in the case of the present embodiment, currents flowing in opposite directions flow in the first coil portion 5 and the second coil portion 10, so that these coil portions can effectively exhibit the characteristics as a common mode filter. .

FIG. 6 shows a sixth embodiment of the present invention. In addition,
Also in this embodiment, (A), (B), (C) and (D) are the first layer 1-1A and the second layer 1-1 of the multilayer substrate 1.
2, the wiring patterns formed on the third layer 1-23 and the fourth layer 1-3B and the positions where the plated through holes are formed are formed. That is, 5A is formed on the first layer 1-1A, the first-layer first coil portion 5B continuous with the first wiring pattern 2 is formed on the third layer 1-23, and the first coil portion 5B is formed on the third layer 1-23 via the plated through hole 63. It is a 3rd layer 1st coil part connected to 5 A of 1st layer 1st coil parts. Third layer first coil portion 5
The outer terminal of B is connected to the first connection pattern 7 of the fourth layer 1-3B via the plated through hole 65.

Similarly, 10A is formed on the second layer 1-12, and its outer terminal is connected to the second wiring pattern 3 of the first layer 1-1A through the plated through holes 62. The coil portion 10B is formed on the fourth layer 1-3B so as to be continuous with the second connection pattern 13, and the end of the central portion thereof is formed through the plated through hole 64 to the second layer second coil portion 1B.
It is a 4th layer 2nd coil part connected to 0A.

In this example, the first wiring pattern 2 formed on the first layer 1-1A passes through the first layer first coil portion 5A and the plated through hole 63, and the current is the third layer, the third layer first coil portion 5B. To the first layer of the fourth layer via the plated through hole 65 from the outer end of the third layer first coil portion 5B.
Guided by the connection pattern 7. In addition, the current guided to the second connection pattern 13 of the fourth layer as a return path passes through the fourth layer second coil portion 10B of the same layer and the plated through hole 64, and then the second layer second coil formed in the second layer. Guided to the section 10A. Then, the plated through hole 6
2 to the first wiring pattern 3 of the first layer 1-1A.

As described above, in this example, the first layer first coil portion 5A, the second layer second coil portion 10A, the third layer first coil portion 5B, and the fourth layer second coil portion 10B are all substrates. The first layer 1-1A, the second layer 1-12, and the second layer 1 are formed in almost the same shape and at the same position in the vertical direction.
-12 and third layer 1-23, third layer 1-23 and fourth layer 1-
In 3B, since the currents flowing through the coil portions are in opposite directions, the characteristics of the common mode filter can be more effectively exhibited.

In the above-mentioned embodiments, the reciprocating printed wirings are arranged as angular spiral type or winding type coil portions at positions corresponding to the upper and lower sides of each layer in the single layer substrate or the multilayer substrate. The number of turns and shape of the coil portion, the wiring width, the number and position of the plated through-holes, and in the case of a multi-layer substrate, the number of layers in which the coil portion is arranged and which layer is formed are as described above. It is needless to say that the setting is not limited to that shown in the embodiment, and can be set freely according to the application of the printed circuit board and the like. Furthermore, the formation of the resist layer is not limited to the form described in the above embodiment, but it is also possible to form the resist layer in the substrate layer, for example.

[0029]

As described above, according to the present invention, first and second coil portions having substantially the same shape as the spiral type or the winding type are formed in a part of the forward and return wiring patterns. Since the wiring patterns of the first and second coil portions are made to be parallel to each other on the same plane and / or on a plurality of layers, it is easy to make both the common mode noise filter and the normal mode noise filter a wiring pattern. It is possible to provide a printed circuit board which can be formed inside, and contributes to reduction in the number of parts and reduction in size and weight and cost.

[Brief description of drawings]

FIG. 1 is a top view of the configuration according to the first embodiment of the present invention (A).
It is explanatory drawing shown by and a see-through bottom view (B).

FIG. 2 is a top view of the configuration according to the second embodiment of the present invention (A).
It is explanatory drawing shown by and a see-through bottom view (B).

FIG. 3 is a top view of the configuration according to the third embodiment of the present invention (A).
It is explanatory drawing shown by and a see-through bottom view (B).

FIG. 4 is an explanatory view showing a configuration according to a fourth embodiment of the present invention by a top view (A), a perspective bottom view (B) and a sectional view (C) taken along the line AA ′ of (A).

FIG. 5 is a plan view of a first layer (A), a perspective plan view of a second layer (B), a perspective plan view of a third layer (C), and a fourth layer of a structure according to a fifth embodiment of the present invention. It is explanatory drawing shown by the perspective view (D) and the BB 'sectional view (E) of (A).

FIG. 6 is a plan view of a first layer (A), a perspective plan view of a second layer (B), a perspective plan view of a third layer (C) and a fourth layer of a structure according to a sixth embodiment of the present invention. It is explanatory drawing shown by a perspective plan view (D).

[Explanation of symbols]

1 Substrate 1A Upper surface 1B Lower surface 2,3 Wiring pattern 4, 6, 9, 11, 12, 21-30, 41-50, 6
1-65 Plating through hole 5,5A, 5B, 10,10A, 10B Square spiral coil part 7,13 Connection pattern 15 Chip capacitor 100,500 Winding coil part 51A, 51B, 66A, 66B Resist layer

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Hideho Inagawa, 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Toru Osaka, 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. Incorporated (72) Inventor Yoshimi Terayama 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc.

Claims (6)

[Claims] 1. A printed circuit board on which a forward and backward wiring pattern for supplying an electric signal or a power source is formed, wherein a part of the forward and backward wiring pattern has a spiral or winding shape. A printed circuit board, wherein first and second coil portions are formed, and wiring patterns of the first and second coil portions are made parallel to each other on the same plane and / or on a plurality of layers. 2. The spiral type first and second coil portions are formed at relative positions with respect to the vertical direction of the wiring pattern forming surface, and the wiring pattern forming the first coil portion and the first and second coil portions are formed. The printed circuit board according to claim 1, wherein the directions of signals or power supply currents flowing in the wiring pattern forming the second coil portion are opposite to each other. 3. The spiral type first and second coil portions are formed at relative positions with respect to the vertical direction of the wiring pattern forming surface, and the wiring pattern forming the first coil portion and the first and second coil portions are formed. The printed circuit board according to claim 1, wherein the direction of a signal or a power supply current flowing in the wiring pattern forming the second coil portion is the same. 4. The printed circuit board is a multilayer board, and the first and second coil portions are formed so as to extend over at least two layers of the multilayer. The printed circuit board according to the section. 5. The printed circuit board according to claim 1, wherein the wiring patterns formed on the plurality of layers are connected to each other through plated through holes. 6. The printed board according to claim 1, wherein a magnetic material is contained in a main body of the printed board and / or a coating layer on the wiring pattern forming surface of the board. .