CN115474329A - Flexible circuit board, display module and display device - Google Patents

Abstract

The embodiment of the application provides a flexible circuit board, a display module and a display device. The flexible circuit board includes: the combined layer comprises a first design potential routing line and a third signal routing line which are arranged on the same layer, the orthographic projection of the second signal routing line on the combined layer does not exceed the range of the first design potential routing line, and the second shielding layer is arranged on one side, far away from the combined layer, of the second signal routing line and covers the combined layer. According to the embodiment of the application, the second initial signal wiring is re-routed in the newly-added local wiring structure to serve as the new second signal wiring, the film layer structure of the original second initial signal wiring serves as the first design potential wiring, the second signal wiring is guaranteed not to be interfered by other signals, a whole layer of grounding layer or other protective devices do not need to be added to the original second initial signal wiring, the number of layers of the flexible circuit board can be reduced, and the flexible circuit board is enabled to be light and thin.

Description

Flexible circuit board, display module assembly and display device

Technical Field

The application relates to the technical field of flexible circuit boards, in particular to a flexible circuit board, a display module and a display device.

Background

With the continuous development of display technologies, users have higher and higher requirements on display resolution, refresh rate and the like. The performance requirement of the display device is higher, the function requirement is more comprehensive, the flexible circuit board inside the display device is too much wired, the whole thickness is thickened, and the display device is heavy.

Therefore, the flexible circuit board can adopt a multilayer board structure, but when the size of the flexible circuit board is larger, each signal wiring is integrated in one flexible circuit board, the distance is short, and the problems of signal interference and the like are often caused, so that some protective devices are required to be added near each signal wiring, the anti-electromagnetic interference capability of each signal wiring is improved, the phenomenon that each signal wiring generates too much electromagnetic radiation to cause mutual interference is avoided, and the thickness of the flexible circuit board is further increased.

Disclosure of Invention

This application provides a flexible circuit board, display module assembly and display device to the shortcoming of current mode for solve the technical problem that the flexible circuit board that prior art exists is thick.

In a first aspect, an embodiment of the present application provides a flexible circuit board, including: the stacked first shielding layer, the first signal wiring and combination layer and the second signal wiring and second shielding layer on one side of the combination layer far away from the first signal wiring;

the combined layer comprises a first design potential wire and a third signal wire which are arranged on the same layer;

the orthographic projection of the second signal wiring on the combination layer does not exceed the range of the first design potential wiring;

the second shielding layer is arranged on one side of the second signal routing wire far away from the combination layer and covers the combination layer.

Optionally, the flexible circuit board further comprises: a first cover film, a first glue structure and a second cover film;

the first cover film is positioned between the first signal wire and the first shielding layer;

the first glue structure is positioned between the first design potential wire and the second signal wire;

the second cover film is positioned between the third signal wire and the second shielding layer;

the first adhesive structure and the second cover film are arranged on the same layer.

Optionally, the first cement structure comprises: a first substrate and a cement structure surrounding the first substrate.

Optionally, the flexible circuit board further comprises: and the third covering film is positioned between the second signal wire and the second shielding layer.

Optionally, the second signal trace includes at least one of a touch driving line, a touch sensing line, a display communication signal line or a power signal line.

Optionally, the second signal routing includes a touch driving line and a touch sensing line; the flexible circuit board further includes: the pin component is exposed out of the second shielding layer;

one part of pins of the pin assembly are electrically connected with the touch driving wires, and the other part of pins of the pin assembly are electrically connected with the touch sensing wires;

the pin assembly, the touch driving line and the touch induction line are not overlapped in the direction perpendicular to the flexible circuit board.

Optionally, the flexible circuit board further comprises: a chip;

the touch driving line and the touch sensing line are respectively electrically connected with the chip;

on the first shielding layer, the orthographic projection of the chip is located in the middle area of the first shielding layer, and the orthographic projection of the touch driving lines and the touch sensing lines is located in the edge area of the first shielding layer.

Optionally, the flexible circuit board further comprises: the second design potential wire and the fourth signal wire are stacked between the second signal wire and the second shielding layer along the direction far away from the second signal wire;

the orthographic projection of the second signal wire on the second design potential wire does not exceed the range of the second design potential wire.

In a second aspect, an embodiment of the present application further provides a display module, including: a display panel and any one of the flexible circuit boards as provided in the first aspect above.

In a third aspect, an embodiment of the present application further provides a display device, including: the display module according to the second aspect is provided above.

The technical scheme provided by the embodiment of the application brings beneficial technical effects that:

in the related art, a second initial signal trace of the flexible circuit board exists locally and is arranged on the same layer as a third signal trace, in the embodiment of the application, a layer of local trace structure which only occupies a small area is added above an original locally existing second initial signal trace of the flexible circuit board, the second initial signal trace is re-routed in a newly added local trace structure to serve as a new second signal trace, a film structure of the original second initial signal trace serves as a first design potential trace, the first design potential trace and the third signal trace are arranged on the same layer, so that the new second signal trace completely corresponds to the first design potential trace, the second shielding layer can cover the new second signal trace, it is ensured that the second signal trace is not interfered by other signals, and it is not necessary to add a whole layer or other protective devices to the original second initial signal trace, the layer number of the flexible circuit board can be reduced, and the flexible circuit board is made light and thin.

Furthermore, the newly-added second signal routing is locally present, the number of layers is less relative to the whole flexible circuit board, the thickness is thinner, the section difference with a large-area tiled area of the flexible circuit board is lower, and the reliability of the second shielding layer can be ensured. The original manufacturing process of the wiring in the flexible circuit board can be used for manufacturing, and the cost is controllable.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic cross-sectional view illustrating a structure of a flexible circuit board according to an embodiment of the present disclosure;

fig. 2 is a schematic cross-sectional view of another structure of a flexible circuit board according to an embodiment of the present disclosure;

fig. 3 is a schematic cross-sectional view of a structure of another flexible circuit board according to an embodiment of the present application;

fig. 4 is a schematic top view of a structure of a flexible circuit board according to an embodiment of the present disclosure.

Reference numerals:

100-a flexible circuit board;

110-a first shielding layer; 120-a first signal trace;

130-a combined layer; 131-a first design potential trace; 132-a third signal trace;

140-a second signal trace;

150-a second shielding layer;

160-first cover film; 170-a first cement structure; 180-a second cover film; 190-a third cover film;

101-a pin assembly; 102-a chip; 103-a second design potential trace; 104-a fourth signal trace;

105-electronic component area.

Detailed Description

Embodiments of the present application are described below in conjunction with the drawings in the present application. It should be understood that the embodiments set forth below in connection with the drawings are exemplary descriptions for explaining technical solutions of the embodiments of the present application, and do not limit the technical solutions of the embodiments of the present application.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. The term "and/or" as used herein refers to at least one of the items defined by the term, e.g., "a and/or B" may be implemented as "a", or as "B", or as "a and B".

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

In the related art, some signal traces are locally present in the flexible circuit board, and the characteristic impedance of the signal traces is generally calculated by using a designed potential trace (a ground layer or a power supply layer, where a signal of the ground layer is also referred to as "ground", i.e., a reference point of zero potential, and is also a common end forming a circuit signal loop, and a signal of the power supply layer plays a role in supplying power to the power supply layer) as a reference.

Generally, in order to provide a zero potential reference for signal traces, a whole designed potential layer (ground layer) is directly covered on the signal traces, which results in low space utilization inside the flexible circuit board and thick overall thickness, and is not favorable for the development of light and thin display devices.

For example, in the related art, the second initial signal trace and the third signal trace are disposed on the same layer, and there may be other signal traces that are not listed here, and these signal traces are all routed in the same layer inside the flexible circuit board, and the second initial signal trace has a high requirement on the quality of signal transmission, so that the second initial signal trace needs to be subjected to anti-interference protection.

The application provides a flexible circuit board 100, display module assembly and display device aims at solving prior art technical problem as above.

The following describes the technical solution of the present application and how to solve the above technical problems in detail by specific embodiments. It should be noted that the following embodiments may be referred to, referred to or combined with each other, and the description of the same terms, similar features, similar implementation steps, etc. in different embodiments is not repeated.

Referring to fig. 1, an embodiment of the present application provides a flexible circuit board 100, including: the stacked first shielding layer 110, the first signal trace 120 and the combination layer 130, and the second signal trace 140 and the second shielding layer 150 on the side of the combination layer 130 far from the first signal trace 120.

The combination layer 130 includes a first designed potential trace 131 and a third signal trace 132 disposed in the same layer.

The orthographic projection of the second signal trace 140 on the combination layer 130 does not exceed the range of the first designed potential trace 131.

The second shielding layer 150 is disposed on a side of the second signal trace 140 away from the combination layer 130 and covers the combination layer 130.

In this embodiment, a local trace structure occupying only a small area is added on an original locally existing second initial signal trace of the flexible circuit board 100, the second initial signal trace is re-routed in the newly added local trace structure as a new second signal trace 140, a film layer structure of the original second initial signal trace is used as a first design potential trace 131, the first design potential trace 131 and a third signal trace 132 are arranged in the same layer, so that the new second signal trace 140 completely corresponds to the first design potential trace 131, the first signal trace 120 and the second signal trace 140 are isolated, the second shielding layer 150 can cover the new second signal trace 140, it is ensured that the second signal trace 140 is not interfered by other signals, it is not necessary to add a whole ground layer or other protective devices to the original second initial signal trace, the number of layers of the flexible circuit board 100 can be reduced, the flexible circuit board 100 is made light and thin, and the manufacturing cost of the flexible circuit board 100 is reduced.

The second signal trace 140 is close to the first design potential trace 131, that is, the second signal trace 140 is close to the design potential plane (ground plane), so as to achieve the effects of shielding and providing backflow nearby, so that the backflow area of the loop of the second signal trace 140 is small, and good signal quality is ensured.

Further, the newly added second signal trace 140 exists locally, the number of layers is less than that of the whole flexible circuit board 100, the thickness is thinner, the difference between the number of layers and the segment of the tiled area of the flexible circuit board 100 is lower, and the reliability of the second shielding layer 150 can be ensured. The original manufacturing process of the wiring in the flexible circuit board 100 can be used for manufacturing, and the cost is controllable.

It is understood that the tiling area of the flexible circuit board 100 is an area of the flexible circuit board 100 where no local trace structure is newly added.

Optionally, the second signal trace 140 is a high-frequency (frequency exceeding the design frequency) signal trace.

Optionally, the first design potential trace 131 includes at least one of a ground trace, a power line, or other traces for transmitting a low potential signal, and may also be a ground plane (ground layer) or a power layer when necessary, so as to completely cover one side of the second signal trace 140, avoid a situation of overlapping with other signal traces in space, and avoid electromagnetic interference between the second signal trace 140 and other signal traces, thereby affecting signal transmission quality.

Optionally, according to actual needs, the area of the second signal trace 140 is larger than that of the second initial signal trace, the area of the second signal trace 140 is increased, and interference of signals of other signal traces on signal transmission of the second signal trace 140 is reduced.

Optionally, at least one layer of other signal traces is disposed between the first signal trace 120 and the combination layer 130, and the type of the flexible circuit board 100 (e.g., two-layer board, four-layer board, six-layer board, etc.) is selected according to the number of layers of the actual signal traces.

Optionally, in the embodiment of the present application, the insulating layers are disposed on two sides of the first signal trace 120, the second signal trace 140, the third signal trace 132, and the fourth signal trace 104, so as to isolate the signal traces.

In some possible embodiments, as shown in fig. 2, the flexible circuit board 100 further includes: a first cover film 160, a first glue structure 170 and a second cover film 180;

the first coverlay 160 is located between the first signal trace 120 and the first shielding layer 110.

The first glue structure 170 is located between the first design potential trace 131 and the second signal trace 140.

The second cover film 180 is located between the third signal trace 132 and the second shielding layer 150.

The first adhesive structure 170 and the second cover film 180 are disposed in the same layer.

In this embodiment, the first cover film 160 can protect the first signal traces 120, and the bending performance of the flexible circuit board 100 at the side where the first signal traces 120 are located is improved. The first glue structure 170 is used to bond the newly added second signal trace 140 and the first design potential trace 131 (for example, a ground trace, a power line, or other traces for transmitting low potential signals), so that the cost is low, and the feasibility of the embodiment of the present application can be improved.

Because there are no other signal traces above the third signal trace 132, it is equivalent to that the third signal trace 132 is a top-layer signal trace in the large-area tiled area of the flexible circuit board 100, and then the second cover film 180 is disposed above the third signal trace 132 to protect the third signal trace 132, thereby improving the bending performance of the flexible circuit board 100 at the side where the third signal trace 132 is located.

In the related art, the second cover film 180 needs to cover a whole layer of the combination layer 130, and in this embodiment, the cover film between the first design potential trace 131 and the second signal trace 140 can be eliminated, so that the newly added local trace structure is not too thick.

Optionally, the first signal trace 120 may include multiple sub-signal traces disposed at the same layer, and may be designed according to actual requirements.

Optionally, each signal trace in this embodiment may be manufactured by a Flexible Copper Clad Laminate (FCCL), for example, the first signal trace 120 in this embodiment may be manufactured by a first FCCL, the combination layer 130 may be manufactured by a second FCCL, the first FCCL and the second FCCL are laminated by a laminating adhesive, and a desired protection structure and other structures are manufactured on the non-laminated side, so as to obtain the Flexible circuit board 100. However, the second signal traces 140 in the embodiment of the present invention do not need to be manufactured by using a whole FCCL, and only need to be locally increased, which is equivalent to reducing the number of layers of the large-area stack in the flexible circuit board 100, so as to reduce the manufacturing cost.

Optionally, the flexible circuit board 100 of the present application is applicable to flexible circuit boards 100 of types such as single-sided boards, double-sided boards, multi-layer boards, etc. in the related art, it is only necessary to redesign the second initial signal trace in the original flexible circuit boards 100 of various types in the newly added local trace structure, and change the position of the original second initial signal trace into the first design potential trace 131.

In some possible embodiments, the first cement structure 170 includes: a first substrate and a cement structure encasing the first substrate.

In this embodiment, the second signal trace 140 in the newly added local trace structure and the first design potential trace 131 in the combination layer 130 are pressed by the first adhesive structure 170, and the first adhesive structure 170 may be a structure in which the aluminum foil composite cloth is used as a first substrate, and the high-performance special thermal sensitive adhesive is uniformly coated, and has high peel strength, good initial adhesion, excellent cohesive force, and good weather resistance. The thermal sensitive adhesive is sensitive to heat, can show viscosity under the heating condition, can stick the local wiring structure and the combination layer 130 after being cooled, and has the advantages of easily obtained materials, simple and convenient method and easy realization.

In some possible embodiments, as shown in fig. 2, the flexible circuit board 100 further includes: and a third cover film 190 between the second signal trace 140 and the second shielding layer 150.

In this embodiment, a layer of third cover film 190 may be added on the second signal traces 140 to protect the circuit structure of the second signal traces 140, so as to improve the reliability of the second signal traces 140.

Optionally, each coverlay provided by the embodiment of the present application is a polyimide coverlay, which has a specification of 1/2mil (mil) or 1mil, and has a very thin thickness, which has a small influence on the overall thickness of the flexible circuit board 100.

In some possible embodiments, the second signal trace 140 includes at least one of a touch driving line 141, a touch sensing line 141, a display communication signal line, or a power signal line.

In this embodiment, the second signal trace 140 may be a signal trace or a plurality of signal traces, and is located at a plurality of local positions of the flexible printed circuit board 100, in this embodiment, a local trace structure is added to the areas related to the signal traces, the signal trace is routed in the local trace structure, the original trace position is used as the first design potential trace 131, so as to reduce the number of layers of the flexible printed circuit board 100, which is caused by the protection device due to the anti-interference.

In some possible embodiments, referring to fig. 4, the second signal trace 140 includes a touch driving line and a touch sensing line. The flexible circuit board 100 further includes: the lead assembly 101 is exposed from the second shielding layer 150.

A part of the pins of the pin assembly 101 is electrically connected to the touch driving lines, and another part of the pins is electrically connected to the touch sensing lines.

The pin assembly 101, the touch driving lines and the touch sensing lines are not overlapped with each other in a direction perpendicular to the flexible circuit board 100.

The signal transmitted by the touch communication signal trace is particularly sensitive, the touch communication signal trace may include a touch driving line and a touch sensing line, and the design potential trace needs to be disposed on both sides of the touch communication signal trace, for the large and medium-sized flexible circuit board 100, the touch driving line and the touch sensing line are too many, the required ground plane area is large, and the design of adding a whole ground layer is often adopted. In this embodiment, only a local trace structure needs to be added to the sensitive portion related to the signals, and the signals are routed in the added local trace structure, so that the electromagnetic shielding performance of the touch driving lines and the touch sensing lines can be ensured, the thickness of the tiled area of the flexible circuit board 100 can be reduced, and the design of the whole terminal is facilitated.

Most of the touch driving lines and touch sensing lines in this embodiment are located at two ends of the lead assembly 101, and the added local routing structure does not affect the position of the lead assembly 101. The direction perpendicular to the flexible circuit board 100 in the present embodiment refers to a direction perpendicular to the flexible circuit board 100 in a tiled state.

In fig. 4, which portion is a touch driving line and which portion is a touch sensing line are not limited herein, and those skilled in the art can set the second signal trace 140 according to actual situations.

In some possible embodiments, referring to fig. 4, the flexible circuit board 100 further includes: a chip 102.

The touch driving lines and the touch sensing lines are electrically connected to the chip 102, respectively.

On the first shielding layer 110, an orthographic projection of the chip 102 is located in a middle area of the first shielding layer 110, and orthographic projections of the touch driving lines and the touch sensing lines are located in an edge area of the first shielding layer 110.

Fig. 4 is a schematic top view illustrating a structure of a flexible circuit board 100 according to an embodiment of the present disclosure, in which a chip 102 is located in an inner region of the flexible circuit board 100, pins in a pin assembly 101 are arranged in different regions, and touch driving lines and touch sensing lines are located at two ends of at least some of the regions where the pins are located.

In the present embodiment, the lead assembly 101 is generally located at an edge region of the flexible circuit board 100, and is spaced from a region where the chip 102 is located in a direction perpendicular to the flexible circuit board 100. The touch driving lines and the touch sensing lines are connected with the chip 102 at a longer distance, and the arrangement mode of the local routing structure provided by the application is adopted to re-route the routing in the newly added local routing structure, so that the thickness of the tiled area of the flexible circuit board 100 is reduced on the basis of ensuring electromagnetic isolation from other signal routing.

It is understood that the second shielding layer 150 on the top layer is removed in fig. 4 for easy understanding, and in practice, the flexible circuit board 100 shown in fig. 4 further includes the second shielding layer 150.

Optionally, the dotted line in fig. 4 is a trace schematic line for electrical connection in the flexible circuit board 100.

Optionally, referring to fig. 4, the flexible circuit board 100 further includes an electronic component area 105 including capacitors, resistors, diodes, and the like, which form basic components of the flexible circuit board 100.

Alternatively, the electronic component region 105 is disposed on a stiffener, which may be made of steel sheet, capable of soldering electronic components, or compensating for the strength of the softer flexible circuit board 100.

In some possible embodiments, as shown in fig. 3, the flexible circuit board 100 further includes: the second design potential trace 103 and the fourth signal trace 104 are stacked between the second signal trace 140 and the second shielding layer 150 along a direction away from the second signal trace 140.

The orthographic projection of the second signal trace 140 on the second design potential trace 103 does not exceed the range of the second design potential trace 103.

In this embodiment, some of the fourth signal traces 104 can also be routed in the newly added local trace structure according to actual situations, and the fourth signal traces 104 do not need to be designed in the tiled area of the flexible circuit board 100. The thickness of the local wiring structure is increased, the flexible circuit board 100 is bent and the like in the display device, the internal space of the display device is utilized to avoid the local wiring structure, and the internal space of the display device is reasonably utilized. Moreover, after the fourth signal trace 104 is added, a layer of second design potential trace 103 needs to be added between the second signal trace 140 and the fourth signal trace 104, so that both sides of the second signal trace 140 have design potential traces, thereby ensuring the signal transmission quality of the second signal trace 140.

Based on the same inventive concept, the embodiment of the present application further provides a display module, including: a display panel and any one of the flexible circuit boards 100 as provided in the previous embodiments.

The display module provided in this embodiment includes any one of the flexible circuit boards 100 provided in the above embodiments, and the implementation principles thereof are similar and will not be described herein again.

Optionally, the touch driving lines and the touch sensing lines of the flexible circuit board 100 are electrically connected to a touch panel in the display panel, respectively.

Based on the same inventive concept, an embodiment of the present application further provides a display device, including: the display module provided in the foregoing embodiments.

The display device provided in this embodiment includes any one of the display modules provided in the above embodiments, and the implementation principles thereof are similar and will not be described herein again.

By applying some embodiments of the present application, at least the following beneficial effects can be achieved:

1. the layer number of the flexible circuit board 100 can be reduced by adding a layer of local routing structure which only occupies a small area on an original locally existing second initial signal routing line of the flexible circuit board 100, re-routing the second initial signal routing line in a newly added local routing structure to serve as a new second signal routing line 140, taking a film layer structure of the original second initial signal routing line as a first design potential routing line 131, arranging the first design potential routing line 131 and a third signal routing line 132 at the same layer, enabling the new second signal routing line 140 to completely correspond to the first design potential routing line 131, isolating the first signal routing line 120 from the second signal routing line 140, enabling the second shielding layer 150 to cover the new second signal routing line 140, ensuring that the second signal routing line 140 is not interfered by other signals, and avoiding adding a whole layer of grounding layer or other protective devices to the original second initial signal routing line, thereby being capable of reducing the layer number of the flexible circuit board 100, and reducing the manufacturing cost of the flexible circuit board 100.

2. The first cover film 160 can protect the first signal traces 120, and improve the bending performance of the flexible circuit board 100 at the side of the first signal traces 120. The first glue structure 170 is used to bond the newly added second signal trace 140 and the first design potential trace 131, so that the cost is low, and the feasibility of the embodiment of the application can be improved.

3. The second signal trace 140 of the newly added local trace structure and the first design potential trace 131 of the combination layer 130 are pressed by the first adhesive structure 170, and the first adhesive structure 170 may be a structure that uses aluminum foil composite cloth as a first base material and is uniformly coated with high-performance special-purpose heat-sensitive adhesive, and has high peel strength, good initial adhesion, excellent cohesion and good weather resistance. The thermal sensitive adhesive is sensitive to heat, shows viscosity under the heating condition, can stick the local wiring structure and the combination layer 130 after being cooled, and has the advantages of easily obtained materials, simple and convenient method and easy realization.

4. For the flexible circuit board 100 with a large and medium size, the number of touch driving lines and touch sensing lines is too large, and the area of the ground plane required is large, so that a design of adding a whole ground layer is often adopted. In this embodiment, only the local trace structures are newly added to the sensitive portions related to the signals, and the signals are routed in the newly added local trace structures, so that the electromagnetic shielding performance of the touch driving lines and the touch sensing lines can be ensured, the thickness of the tiled area (where the local trace structures are not newly added) of the flexible circuit board 100 can be ensured to be reduced, and the design of the whole terminal is facilitated.

5. Some of the fourth signal traces 104 can also be routed in the newly added local trace structure according to actual situations, and the fourth signal traces 104 do not need to be designed in the tiled area of the flexible circuit board 100. The thickness of the local wiring structure is increased, the flexible circuit board 100 is bent and the like in the display device, the internal space of the display device is used for avoiding the local wiring structure, and the internal space of the display device is reasonably used. Moreover, after the fourth signal trace 104 is added, a layer of second design potential trace 103 needs to be added between the second signal trace 140 and the fourth signal trace 104, so that both sides of the second signal trace 140 have design potential traces, thereby ensuring the signal transmission quality of the second signal trace 140.

In the description of the present application, the directions or positional relationships indicated by the words "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like are for convenience of description or simplicity of describing the embodiments of the present application based on the exemplary directions or positional relationships shown in the drawings, and do not indicate or imply that the devices or components referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present application.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is only a part of the embodiments of the present application, and it should be noted that it is within the scope of the embodiments of the present application that other similar implementation means based on the technical idea of the present application can be adopted by those skilled in the art without departing from the technical idea of the present application.

Claims (10)

1. A flexible circuit board, comprising:

the combined type circuit board comprises a first shielding layer, a first signal wire and a combined layer which are stacked, wherein the combined layer comprises a first design potential wire and a third signal wire which are arranged on the same layer;

the orthographic projection of the second signal routing on the combination layer does not exceed the range of the first design potential routing;

the second shielding layer is arranged on one side, far away from the combination layer, of the second signal routing and covers the combination layer.

2. The flexible circuit board of claim 1, further comprising:

the first cover film is positioned between the first signal routing and the first shielding layer;

a first glue structure located between the first design potential trace and the second signal trace;

the second cover film is positioned between the third signal routing and the second shielding layer;

the first adhesive structure and the second cover film are arranged on the same layer.

3. The flexible circuit board of claim 2, wherein the first glue structure comprises: a first substrate and a cement structure encasing the first substrate.

4. The flexible circuit board of claim 1, further comprising: and the third covering film is positioned between the second signal routing wire and the second shielding layer.

5. The flexible circuit board of claim 1, wherein the second signal traces comprise at least one of touch driving lines, touch sensing lines, display communication signal lines, or power signal lines.

6. The flexible circuit board of claim 1, wherein the second signal traces comprise touch driving lines and touch sensing lines; the flexible circuit board further includes: a pin component exposed out of the second shielding layer;

one part of pins of the pin assembly are electrically connected with the touch driving wires, and the other part of pins of the pin assembly are electrically connected with the touch sensing wires;

the pin assembly, the touch driving line and the touch induction line are not overlapped in a direction perpendicular to the flexible circuit board.

7. The flexible circuit board of claim 6, further comprising: a chip;

the touch driving line and the touch sensing line are respectively electrically connected with the chip;

on the first shielding layer, the orthographic projection of the chip is located in the middle area of the first shielding layer, and the orthographic projection of the touch driving lines and the touch sensing lines is located in the edge area of the first shielding layer.

8. The flexible circuit board of claim 1, further comprising: a second design potential trace and a fourth signal trace stacked between the second signal trace and the second shielding layer in a direction away from the second signal trace;

and the orthographic projection of the second signal wiring on the second design potential wiring does not exceed the range of the second design potential wiring.

9. A display module, comprising: a display panel and a flexible circuit board as claimed in any one of claims 1 to 8.

10. A display device, comprising: the display module of claim 9.

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