CN216565705U - Double-layer conductive circuit and display module - Google Patents

Abstract

The utility model provides a double-layer conductive circuit, comprising: a substrate; the first conducting circuit is arranged on the substrate; and the second conducting circuit and the first conducting circuit are arranged on the same side of the substrate, the first conducting circuit and the second conducting circuit are stacked to form a plurality of crossing parts, an insulating adhesive is arranged at the crossing part needing to be insulated between the first conducting circuit and the second conducting circuit, the second conducting circuit is fixed on one side, away from the substrate, of the first conducting circuit through the insulating adhesive in a bonding mode, conducting materials are arranged at the crossing part needing to be electrically conducted between the first conducting circuit and the second conducting circuit, and the first conducting circuit and the second conducting circuit are electrically connected through the conducting materials so that the first conducting circuit and the second conducting circuit are electrically conducted. In addition, the utility model also provides a display module. The technical scheme of the utility model effectively solves the problem of complex manufacturing process of the double-layer conducting circuit.

Description

Double-layer conductive circuit and display module

Technical Field

The utility model relates to the technical field of conducting circuits, in particular to a double-layer conducting circuit and a display module.

Background

Printed circuit boards, i.e., copper clad laminates, include rigid copper clad laminates and flexible copper clad laminates. The substrate of the rigid copper-clad laminate is a resin laminate, including but not limited to epoxy, phenolic aldehyde and other resin plates; the substrate of the flexible copper clad laminate is a high molecular film or a single-layer heat-resistant glass varnished cloth, and the high molecular film comprises but is not limited to polyester, polyimide, a fluorine-containing polymer film and the like.

Printed circuit boards can also be classified as single-sided circuit boards, double-sided circuit boards, and multilayer circuit boards. The existing multilayer circuit board is formed by mutually overlapping two or more conductive layers. The conductive layers in the multilayer wiring board are generally bonded together by an insulating material such as resin, and the manufacturing process is complicated, which is one of the most complicated types of printed circuit boards.

SUMMERY OF THE UTILITY MODEL

The utility model provides a double-layer conductive circuit and a display module, and the manufacturing process is simple.

In a first aspect, an embodiment of the present invention provides a double-layer conductive circuit, including:

a substrate;

the first conducting circuit is arranged on the substrate; and

the second conducting circuit, with first conducting circuit set up in same one side of base plate, first conducting circuit with the second conducting circuit stacks up and sets up and forms a plurality of crossing portions, first conducting circuit with the crossing portion that needs the insulation between the second conducting circuit is equipped with the insulating viscose, the second conducting circuit passes through the insulating viscose bonding is fixed in first conducting circuit deviates from one side of base plate, first conducting circuit with the crossing portion that needs the electrical property to switch on between the second conducting circuit is equipped with conducting material, first conducting circuit with the second conducting circuit passes through conducting material electric connection, so that first conducting circuit with electrical property switches on between the second conducting circuit.

In a second aspect, an embodiment of the present invention provides a display module, where the display module includes a plurality of LED lamp beads and the above-mentioned double-layer conductive circuit, and the double-layer conductive circuit is electrically connected to the plurality of LED lamp beads.

According to the double-layer conductive circuit and the display module, the first conductive circuit and the second conductive circuit are arranged on the same side of the substrate, and the insulating viscose or the conductive material is arranged at the intersection part formed by the first conductive circuit and the second conductive circuit, so that the first conductive circuit and the second conductive circuit are insulated or electrically conducted according to the requirement of arrangement of an actual circuit, and the double-layer conductive circuit with good conductive performance and stable circuit structure is formed. In addition, the double-layer conductive circuit can be manufactured by adopting any type of substrate, so that the double-layer conductive circuit has strong applicability and can be applied to a wide range of scenes.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic diagram of a double-layer conductive circuit according to a first embodiment of the utility model.

Fig. 2 is a schematic diagram of a double-layer conductive circuit according to a second embodiment of the utility model.

Fig. 3 is a schematic view of a display module according to a first embodiment of the utility model.

Fig. 4 is a schematic view of a display module according to a second embodiment of the utility model.

Fig. 5 is a flowchart of a method for manufacturing a dual-layer conductive circuit according to an embodiment of the utility model.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the above-described drawings (if any) are used for distinguishing between similar items and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances, in other words that the embodiments described are to be practiced in sequences other than those illustrated or described herein. Moreover, the terms "comprises," "comprising," and any other variation thereof, may also include other things, such as processes, methods, systems, articles, or apparatus that comprise a list of steps or elements is not necessarily limited to only those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such processes, methods, articles, or apparatus.

It should be noted that the description relating to "first", "second", etc. in the present invention is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Please refer to fig. 1, which is a diagram illustrating a dual-layer conductive trace according to a first embodiment of the present invention. The first embodiment provides a double-layer conductive trace 100 including a substrate 10, a first conductive trace 20, and a second conductive trace 30. Wherein, the substrate 10 includes a transparent substrate and an opaque substrate; the substrate 10 may be a flexible substrate or a non-flexible substrate, and is not limited herein.

The first conductive traces 20 are disposed on the substrate 10. In this embodiment, the first conductive traces 20 are directly disposed on the surface of the substrate 10 by etching, electroplating or chemical plating, or coating or printing. The first conductive traces 20 include a plurality of first conductive lines 21, and the first conductive lines 21 are arranged along the first direction X. It is understood that the first conductive traces 20 are formed on the surface of the substrate 10 by etching, electroplating or electroless plating, or coating or printing, and a plurality of first conductive traces 21 are disposed along the first direction X.

The second conductive traces 30 and the first conductive traces 20 are disposed on the same side of the substrate 10, and the first conductive traces 20 and the second conductive traces 30 are stacked. In the present embodiment, the second conductive traces 30 include a plurality of second conductive lines 31, and the second conductive lines 31 are disposed along the second direction Y. Wherein, the first direction X is different from the second direction Y. Taking the dual-layer conductive circuit 100 shown in fig. 1 as an example, the first direction X and the second direction Y are perpendicular to each other. In some possible embodiments, the first direction X and the second direction Y are acute or obtuse angles. In the present embodiment, the second conductive wire 31 is a bare metal wire, and the cross section of the bare metal wire is circular, and the bare metal wire includes, but is not limited to, a copper wire, a silver wire, and an aluminum wire. It is understood that the second conductive trace 30 is formed by routing the second conductive line 31 to the first conductive trace 20 or the substrate 10 in the second direction Y.

In some possible embodiments, a portion of the first conductive lines 21 may be disposed in the same direction as the second conductive lines 31, and a portion of the second conductive lines 31 may be disposed in the same direction as the first conductive lines 21.

The first conductive traces 20 and the second conductive traces 30 form a number of intersections 23. Specifically, the first wire 21 and the second wire 31 overlap to form the intersection 23. It is understood that the first conductive trace 20 and the second conductive trace 30 are stacked, and the first conductive trace 21 is disposed along the first direction X, and the second conductive trace 31 is disposed along the second direction Y, and the first direction X is different from the second direction Y, the first conductive trace 21 and the second conductive trace 31 form an overlapped portion, i.e., the intersection 23. In this embodiment, the insulating adhesive 40 is disposed at the intersection 23 between the first conductive trace 20 and the second conductive trace 30, and the conductive material 50 is disposed at the intersection 23 between the first conductive trace 20 and the second conductive trace 30. Wherein, the insulating glue 40 has viscosity, and the second conductive trace 30 is fixed on the side of the first conductive trace 20 away from the substrate 10 by the viscosity of the insulating glue 40. The first conductive traces 20 and the second conductive traces 30 are electrically connected by a conductive material 50, so that the first conductive traces 20 and the second conductive traces 30 are electrically connected. The insulating adhesive 40 is disposed between the first conductive line 21 and the second conductive line 31 at the intersection 23 where insulation is required, and between the first conductive line 21 and the second conductive line 31. The conductive material 50 is disposed at the intersection 23 between the first conductive line 21 and the second conductive line 31, which requires electrical conduction, and between the first conductive line 21 and the second conductive line 31. In some possible embodiments, the conductive material 50 further covers the second conductive line 31 corresponding to the intersection 23 that needs to be electrically conducted. The specific location where the insulating adhesive 40 and the conductive material 50 are disposed at the intersection 23 can be determined according to the requirements of the actual wiring layout. That is, the insulating paste 40 is disposed at the crossing portion 23 requiring insulation between the first wire 21 and the second wire 31 according to a predetermined route, and the conductive material 50 is disposed at the crossing portion 23 requiring electrical conduction between the first wire 21 and the second wire 31.

The second conductive trace 30 is secured to the first conductive trace 20 by an insulating adhesive 40 and/or a conductive material 50. In the present embodiment, the insulating adhesive 40 is an insulating material with adhesive property, including but not limited to, materials made of polyester, epoxy, polyurethane, polybutadiene acid, silicone, polyester imide, polyimide, etc. The conductive material 50 includes, but is not limited to, solder paste, silver paste, and the like. It is understood that the second conductive trace 30 can be secured to the first conductive trace 20 by an insulating adhesive 40, the second conductive trace 30 can be secured to the first conductive trace 20 by a conductive material 50, and the second conductive trace 30 can also be secured to the first conductive trace 20 by the insulating adhesive 40 and the conductive material 50. In this embodiment, an insulation reinforcing layer 60 is disposed between the insulation paste 40 and the first conductive line 21. Wherein, the insulation enhancing layer 60 is made of insulation material.

In this embodiment, when the substrate 10 is a transparent substrate, the diameter of the second conductive line 31 is smaller than 0.3 mm, so that the double-layer conductive trace 100 is transparent as a whole. The transparent substrate includes, but is not limited to, polyimide, glass, and the like.

In the above embodiment, the first conductive trace and the second conductive trace are disposed on the same side of the substrate, and the cross portion formed by the first conductive trace and the second conductive trace is provided with the insulating adhesive or the conductive material, so that the first conductive trace and the second conductive trace are insulated or electrically conducted according to the requirement of actual circuit layout, and thus the double-layer conductive trace with good conductive performance and stable trace structure is formed. In addition, the double-layer conductive circuit can be manufactured by adopting any type of substrate, so that the double-layer conductive circuit has strong applicability and can be applied to a wide range of scenes. When the base plate is transparent base plate, can set up the diameter that the second wire is less than 0.3 millimeter for double-deck conducting wire is whole to be transparent form, thereby is more pleasing to the eye in the vision. The insulation enhancement layer can increase the insulation effect between the first conducting wire and the second conducting wire, so that the double-layer conducting wire is more reliable.

Please refer to fig. 2, which is a diagram illustrating a dual-layer conductive trace according to a second embodiment of the present invention. The second embodiment provides a two-layer conductive trace 200 which is different from the two-layer conductive trace 100 provided by the first embodiment in that the two-layer conductive trace 200 provided by the second embodiment is provided with an insulating adhesive 40 between the first conductive trace 20 and the second conductive trace 30 except for the intersection 23 and the reserved position 70. It will be appreciated that an insulating adhesive 40 is provided between the first conductive trace 21 and the second conductive trace 30, except where the conductive material 50 is provided and the reserved locations 70. The insulating adhesive 40 is disposed between the second conductive trace 31 and the substrate 10, and the second conductive trace 31 is fixed to the substrate 10 by the insulating adhesive 40. The reserved positions 70 include, but are not limited to, positions for arranging other electronic components, positions for leading out external soldering, and the like.

An insulation-enhancing layer 60 is provided between the first conductive trace 20 and the second conductive trace 30 in addition to the intersection 23 and the reserved location 70.

Other structures of the double-layer conductive circuit 200 provided by the second embodiment are substantially the same as those of the double-layer conductive circuit 100 provided by the first embodiment, and are not described in detail herein.

In the above embodiment, the portions between the first conductive traces and the second conductive traces except for the position where the conductive material is disposed and the reserved position are all provided with the insulating adhesive, so that the second conductive traces can be more firmly fixed to the substrate, and the structure of the double-layer conductive traces is more stable.

Please refer to fig. 5, which is a flowchart illustrating a method for fabricating a dual-layer conductive line according to an embodiment of the present invention. The method for manufacturing the double-layer conductive circuit is used for manufacturing the double-layer conductive circuit in the embodiment, and the method for manufacturing the double-layer conductive circuit specifically comprises the following steps.

Step S102, a substrate having a first conductive trace is provided. Specifically, a substrate 10 is provided, and a first conductive trace 20 is etched, electroplated or electroless-plated, or coated or printed on a surface of the substrate 10. In this embodiment, the first conductive traces 20 are directly disposed on the surface of the substrate 10 by etching. The first conductive traces 20 include a plurality of first conductive lines 21, and the first conductive lines 21 are disposed along the first direction X. It is understood that the first conductive traces 20 are formed on the surface of the substrate 10 by etching, electroplating or electroless plating, or coating or printing, and a plurality of first conductive traces 21 are disposed along the first direction X. The first conductive traces 20 have a first predetermined position and a second predetermined position. The first preset position and the second preset position are set according to the requirement of actual circuit layout. The substrate 10 includes, but is not limited to, a flexible substrate and a non-flexible substrate. Among them, materials from which the flexible substrate is made include, but are not limited to, polyethylene terephthalate (PET), transparent polyimide (CPI), Modified Polyimide (MPI), polyethylene naphthalate (PEN), Cyclic Olefin Polymer (COP), etc., and the non-flexible substrate includes, but is not limited to, a PCB, an aluminum alloy coated with an insulating resin, etc. It is understood that the substrate 10 is an insulating substrate regardless of whether the substrate 10 is a flexible substrate or a non-flexible substrate. Even if a non-insulating base material such as an aluminum alloy or the like is used for the substrate 10, an insulating layer needs to be applied to the surface of the non-insulating base material to form an insulating substrate.

Step S104, coating an insulating adhesive on a first predetermined position of the first conductive trace. The insulating adhesive 40 is an insulating material with adhesive property, and includes, but is not limited to, materials made of polyester, epoxy, polyurethane, polybutadienic acid, silicone, polyester imide, polyimide, and the like.

Step S106, a second conductive trace is disposed on the first conductive trace. In this embodiment, the second conductive traces 30 and the first conductive traces 20 are disposed on the same side of the substrate 10, and the second conductive traces 30 and the first conductive traces 20 are stacked. The second conductive traces 30 include a plurality of second conductive lines 31, and the second conductive lines 31 are arranged along the second direction Y. Wherein, the first direction X is different from the second direction Y. The second conductive wire 31 is a bare metal conductive wire, and the cross section thereof is circular. The bare metal conductor includes, but is not limited to, copper wire, silver wire, and aluminum wire. It is understood that the second conductive traces 30 are formed by routing second conductive lines 31 to the substrate 10 in the second direction Y. The substrate 10 may be a transparent substrate or an opaque substrate. When the substrate 10 is a transparent substrate, the diameter of the second conductive traces 30 is less than 0.3 mm.

The second conductive traces 30 form intersections with the first conductive traces 20. Specifically, the first wire 21 and the second wire 31 overlap to form the intersection 23, and the intersection 23 includes a first preset position and a second preset position. The first preset position is a position where insulation is required between the first conductive trace 21 and the second conductive trace 30. That is, the insulating glue 40 is applied to the crossing portion 23 between the first conductive trace 21 and the second conductive trace 30, which needs to be insulated. It will be appreciated that the first predetermined position is a position where the first conductor 21 needs to be insulated from the second conductor 31 according to the requirements of the actual wiring layout. When the second conductive line 31 is disposed on the first conductive trace 20, the second conductive line 31 is insulated from the first conductive line 21. Meanwhile, since the insulating paste 40 has viscosity, the second conductive trace 30 may be fixed to the first conductive trace 20 by the insulating paste 40.

Step S108, a conductive material is disposed at a second predetermined position. The second predetermined position is a position where electrical conduction is required between the first conductive trace 20 and the second conductive trace 30. The first conductive traces and the second conductive traces are electrically connected by a conductive material 50, so that the first conductive traces 20 and the second conductive traces 30 are electrically connected. That is, the conductive material 50 is disposed between the first conductive traces 20 and the second conductive traces 30, and the intersection 23 needs to be electrically connected. It is understood that the second preset position is a position where the first wire 21 and the second wire 31 need to be communicated according to the requirement of the actual wiring layout. The conductive material 50 includes, but is not limited to, solder paste, silver paste, and the like. The second conductive trace 30 may also be secured to the first conductive trace 20 by a conductive material 50. In some possible embodiments, the first conductive trace 20 and the second conductive trace 30 may also be electrically connected by way of pins.

In some possible embodiments, the insulating adhesive is applied to the first conductive traces except for the second predetermined locations and the reserved locations in addition to the first predetermined locations.

In the above embodiment, the first wire circuit is formed on one side of the substrate, the insulating adhesive is arranged, the second conductive circuit is fixed on the first conductive circuit through the insulating adhesive, and the conductive material is reused to electrically connect the first conductive circuit and the second conductive circuit, so that the whole manufacturing process is simple, and the production efficiency can be greatly improved. Meanwhile, the material for manufacturing the double-layer conducting circuit is easy to obtain, so that the cost of the double-layer conducting circuit is low.

Please refer to fig. 3, which is a schematic diagram of a display module according to a first embodiment of the utility model. The display module 1000 provided by the first embodiment comprises a plurality of LED lamp beads 300 and a double-layer conductive circuit 100, wherein the double-layer conductive circuit 100 is electrically connected with the LED lamp beads 300. In this embodiment, the LED beads 300 and the first conductive traces 20 are disposed on the same side of the substrate 10 and electrically connected to the first conductive traces 20. The specific structure of the double-layer conductive trace 100 refers to the above embodiments. Since the display module 1000 adopts all technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and are not described in detail herein.

Please refer to fig. 4, which is a schematic diagram of a display module according to a second embodiment of the present invention. The difference between the display module 2000 provided by the second embodiment and the display module 1000 provided by the first embodiment is that the display module 2000 provided by the second embodiment comprises a plurality of LED lamp beads 300 and a double-layer conductive circuit 200, and the double-layer conductive circuit 200 is electrically connected with the plurality of LED lamp beads 300. The specific structure of the double-layer conductive traces 200 refers to the above embodiments, and other structures of the display module 2000 provided by the second embodiment are substantially the same as those of the display module 1000 provided by the first embodiment, and are not repeated herein. Since the display module 2000 adopts all the technical solutions of all the embodiments, at least all the advantages brought by the technical solutions of the embodiments are achieved.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the utility model. Thus, insofar as these modifications and variations of the utility model fall within the scope of the claims of the utility model and their equivalents, the utility model is intended to include these modifications and variations.

While the utility model has been described with reference to what is presently considered to be the most practical and preferred embodiment, it is to be understood that the utility model is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims (11)

1. A dual layer conductive trace, comprising:

a substrate;

the first conducting circuit is arranged on the substrate; and

the second conducting circuit, with first conducting circuit set up in same one side of base plate, first conducting circuit with the second conducting circuit stacks up and sets up and forms a plurality of crossing portions, first conducting circuit with the crossing portion that needs the insulation between the second conducting circuit is equipped with the insulating viscose, the second conducting circuit passes through the insulating viscose bonding is fixed in first conducting circuit deviates from one side of base plate, first conducting circuit with the crossing portion that needs the electrical property to switch on between the second conducting circuit is equipped with conducting material, first conducting circuit with the second conducting circuit passes through conducting material electric connection, so that first conducting circuit with electrical property switches on between the second conducting circuit.

2. The dual layer conductive trace of claim 1, wherein the first conductive trace comprises a plurality of first conductive traces disposed along a first direction, the second conductive trace comprises a plurality of second conductive traces disposed along a second direction, the first direction different from the second direction.

3. The dual layer conductive trace of claim 2, wherein the first conductive trace and the second conductive trace overlap to form the crossover, and wherein the insulating paste is disposed between the crossover requiring insulation between the first conductive trace and the second conductive trace and between the first conductive trace and the second conductive trace.

4. The double-layer conductive trace according to claim 2, wherein the first conductive line and the second conductive line overlap to form the intersection, and the conductive material is disposed between the first conductive line and the second conductive line at the intersection where electrical conduction is required and between the first conductive line and the second conductive line, or the conductive material covers the second conductive line corresponding to the intersection where electrical conduction is required.

5. The dual-layer conductive circuit of claim 2, wherein the first conductive circuit is directly disposed on the surface of the substrate by etching, electroplating or electroless plating, or coating or printing; the second conducting wire is a metal bare conducting wire, the cross section of the second conducting wire is circular, and the second conducting circuit is fixed on the first conducting circuit through the insulating adhesive and/or the conducting material.

6. The dual layer conductive trace of claim 3, wherein an insulation reinforcement layer is disposed between the insulation paste and the first conductive line.

7. The dual-layer conductive trace of claim 6, wherein the insulating paste and the insulating reinforcement layer are disposed between the first conductive trace and the second conductive trace except for the intersection and the predetermined location, the insulating paste is disposed between the second conductive trace and the substrate, and the second conductive trace is secured to the substrate by the insulating paste.

8. The bi-layer conductive trace of any one of claims 2 to 5, wherein the substrate comprises a transparent substrate and the second conductive line has a diameter of less than 0.3 millimeters.

9. The double-layer conductive trace of claim 5, wherein the bare metal conductor comprises a copper wire, a silver wire, or an aluminum wire.

10. The dual layer conductive trace of claim 1, wherein the conductive material comprises solder paste or silver paste.

11. A display module, comprising a plurality of LED lamp beads and the double-layer conductive circuit of any one of claims 1 to 10, wherein the double-layer conductive circuit is electrically connected to the plurality of LED lamp beads.

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