WO2023082173A1

WO2023082173A1 - Double-layer conductive circuit and manufacturing method therefor, and display module

Info

Publication number: WO2023082173A1
Application number: PCT/CN2021/130296
Authority: WO
Inventors: 奚邦籽; 朱德忠
Original assignee: 深圳市华鼎星科技有限公司
Priority date: 2021-11-12
Filing date: 2021-11-12
Publication date: 2023-05-19

Abstract

Provided in the present invention is a double-layer conductive circuit. The circuit comprises a substrate; a first conductive circuit, which is arranged on the substrate; and a second conductive circuit, which is arranged on the same side of the substrate as the first conductive circuit, wherein the first conductive circuit and the second conductive circuit are arranged in a stacked manner and form several intersecting parts; insulating adhesives are provided on intersecting parts which need to be insulated between the first conductive circuit and the second conductive circuit, and the second conductive circuit is bonded and fixed, by means of the insulating adhesives, to the side of the first conductive circuit that faces away from the substrate; conductive materials are provided on intersecting parts which need to be electrically conductive between the first conductive circuit and the second conductive circuit; and the first conductive circuit and the second conductive circuit are electrically connected to each other by means of the conductive materials, such that the first conductive circuit and the second conductive circuit are in electrical connection. In addition, further provided in the present invention are a display module and a manufacturing method for a double-layer conductive circuit. By means of the technical solution in the present invention, the problem of a manufacturing process for a double-layer conductive circuit being complex is effectively solved.

Description

Double-layer conductive circuit and its manufacturing method and display module

technical field

The invention relates to the technical field of making conductive circuits, in particular to a double-layer conductive circuit, a manufacturing method thereof, and a display module.

Background technique

Printed circuit boards, namely copper clad plates, include rigid copper clad plates and flexible copper clad plates. The substrate of the rigid copper-clad plate is a resin laminate, including but not limited to epoxy, phenolic and other resin plates; the substrate of the flexible copper-clad plate is a polymer film or a single-layer heat-resistant glass varnish, and the polymer film includes but not Limited to polyester, polyimide, fluoropolymer films, etc.

technical problem

Printed circuit boards can also be divided into single-sided circuit boards, double-sided circuit boards and multilayer circuit boards. Existing multilayer circuit boards are composed of two or more conductive layers superimposed on each other. The conductive layers in a multilayer circuit board are usually bonded together by insulating materials such as resin, and the manufacturing process is complicated, which is the most complicated type of printed circuit board.

technical solution

The invention provides a double-layer conductive circuit, a manufacturing method thereof and a display module, and the manufacturing process is simple.

In the first aspect, an embodiment of the present invention provides a double-layer conductive circuit, and the double-layer conductive circuit includes: a substrate; a first conductive circuit disposed on the substrate; and a second conductive circuit connected to the first conductive circuit It is arranged on the same side of the substrate, and the first conductive circuit and the second conductive circuit are stacked to form several intersections, and the intersections between the first conductive circuit and the second conductive circuit need to be insulated Insulating glue is provided, and the second conductive circuit is bonded and fixed on the side of the first conductive circuit away from the substrate through the insulating adhesive, and the connection between the first conductive circuit and the second conductive circuit is Conductive materials are provided at the intersections that require electrical conduction, and the first conductive circuit and the second conductive circuit are electrically connected through the conductive material, so that the first conductive circuit and the second conductive circuit There is electrical continuity between the lines.

In the second aspect, an embodiment of the present invention provides a display module, the display module includes several LED lamp beads and the above-mentioned double-layer conductive circuit, and the double-layer conductive circuit is electrically connected to the plurality of LED lamp beads. connect.

In a third aspect, an embodiment of the present invention provides a method for manufacturing a double-layer conductive circuit. The method for manufacturing a double-layer conductive circuit includes: providing a substrate provided with a first conductive circuit, wherein the first conductive circuit is provided with The first preset position and the second preset position; coating insulating adhesive on the first preset position of the first conductive circuit; setting the second conductive circuit on the first conductive circuit, wherein the second The conductive circuit is bonded and fixed on the side of the first conductive circuit away from the substrate through the insulating adhesive, and the second conductive circuit is stacked with the first conductive circuit to form several intersections. The part includes the first preset position and the second preset position, the first preset position is a position where insulation is required between the first conductive circuit and the second conductive circuit; and a conductive material is provided At the second preset position, wherein the second preset position is a position where electrical conduction is required between the first conductive circuit and the second conductive circuit, the first conductive circuit and the second conductive circuit The second conductive circuit is electrically connected through the conductive material, so that the first conductive circuit and the second conductive circuit are electrically connected.

Beneficial effect

In the above-mentioned double-layer conductive circuit and its manufacturing method and display module, by arranging the first conductive circuit and the second conductive circuit on the same side of the substrate, the intersection formed by the first conductive circuit and the second conductive circuit is provided with insulating adhesive or conductive material, so that the first conductive circuit and the second conductive circuit are insulated or electrically connected according to the requirements of actual circuit layout, thereby forming a double-layer conductive circuit with good conductivity and stable circuit structure. In addition, no matter what type of substrate is used, the double-layer conductive circuit can be made, so that the double-layer conductive circuit has strong applicability and can be applied in a wide range of scenarios.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to the structures shown in these drawings without creative effort.

FIG. 1 is a schematic diagram of a double-layer conductive circuit provided by the first embodiment of the present invention.

FIG. 2 is a schematic diagram of a double-layer conductive circuit provided by a second embodiment of the present invention.

FIG. 3 is a schematic diagram of a display module provided by the first embodiment of the present invention.

FIG. 4 is a schematic diagram of a display module provided by a second embodiment of the present invention.

FIG. 5 is a flowchart of a method for manufacturing a double-layer conductive circuit provided by an embodiment of the present invention.

The realization of the purpose of the present invention, functional characteristics and advantages will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

BEST MODE FOR CARRYING OUT THE INVENTION

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of this application and the above drawings are used to distinguish similar planning objects and do not necessarily Used to describe a specific sequence or sequence. It is to be understood that the terms so used are interchangeable under appropriate circumstances; in other words, the described embodiments are practiced in sequences other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof may also include other contents, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to only those explicitly listed instead, may include other steps or elements not explicitly listed or inherent to the process, method, product or apparatus.

It should be noted that the descriptions involving "first", "second", etc. in the present invention are only for descriptive purposes, and should not be understood as indicating or implying their relative importance or implicitly indicating the number of indicated technical features . Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of these features. In addition, the technical solutions of the various embodiments can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist , nor within the scope of protection required by the present invention.

Embodiments of the present invention

Please refer to FIG. 1 , which is a schematic diagram of a double-layer conductive circuit provided by the first embodiment of the present invention. The double-layer conductive circuit 100 provided by the first embodiment includes a substrate 10 , a first conductive circuit 20 and a second conductive circuit 30 . Wherein, the substrate 10 includes a transparent substrate and an opaque substrate; the substrate 10 may be a flexible substrate or a non-flexible substrate, which is not limited here.

The first conductive circuit 20 is disposed on the substrate 10 . In this embodiment, the first conductive circuit 20 is directly disposed on the surface of the substrate 10 by etching, electroplating or electroless plating, or coating or printing. The first conductive circuit 20 includes a plurality of first wires 21 , and the first wires 21 are arranged along a first direction X. It can be understood that, the first conductive circuit 20 forms a plurality of first conductive lines 21 arranged along the first direction X on the surface of the substrate 10 by etching, electroplating or electroless plating, or coating or printing.

The second conductive circuit 30 is disposed on the same side of the substrate 10 as the first conductive circuit 20 , and the first conductive circuit 20 and the second conductive circuit 30 are stacked. In this embodiment, the second conductive circuit 30 includes a plurality of second wires 31 , and the second wires 31 are arranged along the second direction Y. Wherein, the first direction X is different from the second direction Y. Taking the double-layer conductive circuit 100 shown in FIG. 1 as an example, the first direction X and the second direction Y are perpendicular to each other. In some feasible embodiments, an acute angle or an obtuse angle is formed between the first direction X and the second direction Y. In this embodiment, the second wire 31 is a bare metal wire with a circular cross section. The bare metal wire includes but not limited to copper wire, silver wire, and aluminum wire. It can be understood that the second conductive circuit 30 is formed by arranging the second wire 31 along the second direction Y on the first conductive circuit 20 or the substrate 10 .

In some feasible embodiments, part of the first wires 21 may be arranged in the same direction as the second wires 31 , and part of the second wires 31 may be arranged in the same direction as the first wires 21 .

The first conductive trace 20 and the second conductive trace 30 form several intersections 23 . Specifically, the first conducting wire 21 and the second conducting wire 31 overlap to form the intersection portion 23 . It can be understood that the first conductive circuit 20 and the second conductive circuit 30 are arranged in layers, and the first conductive line 21 is arranged along the first direction X, and the second conductive line 31 is arranged along the second direction Y, and the first direction X and the second direction If Y is different, the first conductive wire 21 and the second conductive wire 31 will form an overlapped portion, that is, the intersection portion 23 . In this embodiment, the intersection 23 between the first conductive circuit 20 and the second conductive circuit 30 that needs to be insulated is provided with insulating adhesive 40, and the first conductive circuit 20 and the second conductive circuit 30 need to be electrically connected The intersection portion 23 is provided with a conductive material 50 . Wherein, the insulating adhesive 40 is viscous, and the second conductive circuit 30 is fixed on the side of the first conductive circuit 20 away from the substrate 10 through the adhesive bonding of the insulating adhesive 40 . The first conductive circuit 20 and the second conductive circuit 30 are electrically connected through the conductive material 50 , so that the first conductive circuit 20 and the second conductive circuit 30 are electrically connected. Wherein, the insulating glue 40 is disposed at the intersection 23 between the first wire 21 and the second wire 31 that needs to be insulated, and is disposed between the first wire 21 and the second wire 31 . The conductive material 50 is disposed at the intersection 23 between the first wire 21 and the second wire 31 where electrical conduction is required, and is disposed between the first wire 21 and the second wire 31 . In some feasible embodiments, the conductive material 50 also covers the second wire 31 corresponding to the intersection 23 that needs to be electrically connected. The specific positions where the insulating glue 40 and the conductive material 50 are disposed on the crossing portion 23 can be determined according to the requirements of actual circuit layout. That is to say, the insulating glue 40 is provided at the intersection 23 that needs to be insulated between the first wire 21 and the second wire 31 according to the preset circuit, and the cross section 23 that needs to be electrically connected between the first wire 21 and the second wire 31 The intersection portion 23 is provided with a conductive material 50 .

The second conductive circuit 30 is fixed to the first conductive circuit 20 by insulating glue 40 and/or conductive material 50 . In this embodiment, the insulating adhesive 40 is a viscous insulating material, including but not limited to materials such as polyester, epoxy, polyurethane, polybutadienate, silicone, polyesterimide, polyimide, etc. production. The conductive material 50 includes but not limited to solder paste, silver glue and the like. It can be understood that the second conductive circuit 30 can be fixed to the first conductive circuit 20 through the insulating adhesive 40, the second conductive circuit 30 can be fixed to the first conductive circuit 20 through the conductive material 50, and the second conductive circuit 30 can also be fixed to the first conductive circuit 20 through the conductive material 50. The insulating glue 40 and the conductive material 50 are fixed on the first conductive circuit 20 . In this embodiment, an insulation enhancing layer 60 is disposed between the insulating glue 40 and the first wire 21 . Wherein, the insulation enhancing layer 60 is made of insulating material.

In this embodiment, when the substrate 10 is a transparent substrate, the diameter of the second wire 31 is less than 0.3 mm, so that the double-layer conductive circuit 100 is transparent as a whole. Wherein, the transparent substrate includes but is not limited to polyimide, glass and other materials.

In the above embodiment, by setting the first conductive line and the second conductive line on the same side of the substrate, the intersection formed by the first conductive line and the second conductive line is provided with insulating glue or conductive material, so that the first conductive line and the second conductive line The wires are insulated or electrically connected according to the requirements of actual line layout, thereby forming a double-layer conductive line with good conductivity and stable line structure. In addition, no matter what type of substrate is used, the double-layer conductive circuit can be made, so that the double-layer conductive circuit has strong applicability and can be applied in a wide range of scenarios. When the substrate is a transparent substrate, the diameter of the second wire can be set to be less than 0.3 mm, so that the double-layer conductive circuit is transparent as a whole, thereby making it more visually attractive. The insulation enhancement layer can increase the insulation effect between the first wire and the second wire, making the double-layer conductive circuit more reliable.

Please refer to FIG. 2 , which is a schematic diagram of a double-layer conductive circuit provided by the second embodiment of the present invention. The difference between the double-layer conductive circuit 200 provided by the second embodiment and the double-layer conductive circuit 100 provided by the first embodiment is that in the double-layer conductive circuit 200 provided by the second embodiment, the first conductive circuit 20 and the second Insulating glue 40 is provided between the conductive lines 30 except for the crossing portion 23 and the reserved position 70 . It can be understood that the insulating glue 40 is provided between the first conductive circuit 21 and the second conductive circuit 30 except the position where the conductive material 50 is provided and the reserved position 70 . The insulating adhesive 40 is disposed between the second wire 31 and the substrate 10 , and the second conductive circuit 31 is fixed to the substrate 10 through the insulating adhesive 40 . Wherein, the reserved position 70 includes, but is not limited to, a position for arranging other electronic components, a position for drawing out for external soldering, and the like.

An insulation enhancement layer 60 is provided between the first conductive circuit 20 and the second conductive circuit 30 except for the intersection portion 23 and the reserved position 70 .

Other structures of the double-layer conductive circuit 200 provided by the second embodiment are basically the same as those of the double-layer conductive circuit 100 provided by the first embodiment, and will not be repeated here.

In the above embodiment, insulating glue is provided between the first conductive line and the second conductive line except for the position where the conductive material is provided and the reserved position, so that the second conductive line can be more firmly fixed on the substrate , so that the structure of the double-layer conductive circuit is more stable.

Please refer to FIG. 5 , which is a flowchart of a method for manufacturing a double-layer conductive circuit provided by an embodiment of the present invention. The manufacturing method of the double-layer conductive circuit is used to manufacture the double-layer conductive circuit described in the above embodiments, and the manufacturing method of the double-layer conductive circuit specifically includes the following steps.

Step S102, providing a substrate provided with a first conductive circuit. Specifically, the substrate 10 is provided, and the surface of the substrate 10 is etched, electroplated or chemically plated, or coated or printed with the first conductive circuit 20 . In this embodiment, the first conductive circuit 20 is directly disposed on the surface of the substrate 10 by etching. The first conductive circuit 20 includes a plurality of first wires 21 , and the first wires 21 are arranged along a first direction X. It can be understood that, the first conductive circuit 20 forms a plurality of first conductive lines 21 arranged along the first direction X on the surface of the substrate 10 by etching, electroplating or electroless plating, or coating or printing. Wherein, the first conductive circuit 20 is provided with a first preset position and a second preset position. The first preset position and the second preset position are set according to requirements of actual line layout. The substrate 10 includes, but is not limited to, flexible substrates and non-flexible substrates. Among them, the materials used to make flexible substrates include but are not limited to polyethylene terephthalate (polyethylene terephthalate) glycol terephthalate, PET), transparent polyimide (CPI), modified polyimide (MPI), polyethylene naphthalate (PEN), cycloolefin polymer (Cyclo Olefin Polymer, COP), etc., non-flexible substrates include but are not limited to PCB, aluminum alloy coated with insulating resin, etc. It can be understood that no matter whether the substrate 10 is a flexible substrate or a non-flexible substrate, the substrate 10 is an insulating substrate. Even if a non-insulating substrate is used for the substrate 10, such as aluminum alloy, an insulating layer needs to be coated on the surface of the non-insulating substrate to form an insulating substrate.

Step S104 , coating an insulating adhesive on a first predetermined position of the first conductive circuit. Wherein, the insulating adhesive 40 is a viscous insulating material, including but not limited to polyester, epoxy, polyurethane, polybutadienate, silicone, polyesterimide, polyimide and other materials.

Step S106, disposing the second conductive circuit on the first conductive circuit. In this embodiment, the second conductive circuit 30 and the first conductive circuit 20 are disposed on the same side of the substrate 10 , and the second conductive circuit 30 and the first conductive circuit 20 are stacked. The second conductive circuit 30 includes a plurality of second wires 31 , and the second wires 31 are arranged along the second direction Y. Wherein, the first direction X is different from the second direction Y. Wherein, the second wire 31 is a bare metal wire with a circular cross section. Bare metal wires include but are not limited to copper wires, silver wires, and aluminum wires. It can be understood that the second conductive circuit 30 is formed by arranging the second wire 31 on the substrate 10 along the second direction Y. Wherein, the substrate 10 may be a transparent substrate or an opaque substrate. When the substrate 10 is a transparent substrate, the diameter of the second conductive circuit 30 is less than 0.3 mm.

The second conductive circuit 30 forms several intersections with the first conductive circuit 20 . Specifically, the first conducting wire 21 and the second conducting wire 31 are overlapped to form a crossing portion 23, and the crossing portion 23 includes a first preset position and a second preset position. Wherein, the first preset position is a position where insulation is required between the first conductive circuit 21 and the second conductive circuit 30 . That is to say, the insulating glue 40 is coated on the intersection portion 23 between the first conductive circuit 21 and the second conductive circuit 30 that needs to be insulated. It can be understood that the first preset position is a position where the first wire 21 needs to be insulated from the second wire 31 according to the requirement of actual circuit layout. When the second wire 31 is disposed on the first conductive line 20 , the second wire 31 is insulated from the first wire 21 . Meanwhile, due to the viscosity of the insulating adhesive 40 , the second conductive circuit 30 can be fixed to the first conductive circuit 20 through the insulating adhesive 40 .

Step S108, setting the conductive material at the second preset position. Wherein, the second preset position is a position where electrical conduction is required between the first conductive circuit 20 and the second conductive circuit 30 . The first conductive circuit and the second conductive circuit are electrically connected through the conductive material 50 , so that the first conductive circuit 20 and the second conductive circuit 30 are electrically connected. That is to say, the conductive material 50 disposed between the first conductive circuit 20 and the second conductive circuit 30 needs to be electrically connected to the intersection portion 23 . It can be understood that the second preset position is a position where the first wire 21 and the second wire 31 need to be connected according to the requirements of actual circuit layout. Wherein, the conductive material 50 includes but not limited to solder paste, silver glue and the like. The second conductive circuit 30 can also be fixed to the first conductive circuit 20 through the conductive material 50 . In some feasible embodiments, the first conductive circuit 20 and the second conductive circuit 30 may also be electrically connected by setting pins.

In some feasible embodiments, in addition to being coated on the first preset position, the insulating adhesive is also coated on positions of the first conductive circuit other than the second preset position and the reserved position.

In the above-mentioned embodiment, by forming the first conductive line on one side of the substrate, insulating adhesive is provided, the second conductive line is fixed to the first conductive line through the insulating adhesive, and then the first conductive line and the second conductive line are made of conductive material. The conductive lines are electrically connected, the overall manufacturing process is simple, and the production efficiency can be greatly improved. At the same time, the materials for manufacturing the double-layer conductive circuit are easy to obtain, so that the cost of the double-layer conductive circuit is low.

Please refer to FIG. 3 , which is a schematic diagram of the display module provided by the first embodiment of the present invention. The display module 1000 provided in the first embodiment includes a plurality of LED lamp beads 300 and a double-layer conductive circuit 100 , and the double-layer conductive circuit 100 is electrically connected to the plurality of LED lamp beads 300 . In this embodiment, the plurality of LED lamp beads 300 are disposed on the same side of the substrate 10 as the first conductive circuit 20 , and are electrically connected to the first conductive circuit 20 . Wherein, the specific structure of the double-layer conductive circuit 100 refers to the above-mentioned embodiments. Since the display module 1000 adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

Please refer to FIG. 4 , which is a schematic diagram of the display module provided by the second embodiment of the present invention. The difference between the display module 2000 provided by the second embodiment and the display module 1000 provided by the first embodiment is that the display module 2000 provided by the second embodiment includes several LED lamp beads 300 and double-layer conductive circuits 200, The double-layer conductive circuit 200 is electrically connected to a plurality of LED lamp beads 300 . The specific structure of the double-layer conductive circuit 200 refers to the above-mentioned embodiments. Other structures of the display module 2000 provided in the second embodiment are basically the same as those of the display module 1000 provided in the first embodiment, and will not be repeated here. Since the display module 2000 adopts all the technical solutions of the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments.

Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

The above-listed are only preferred embodiments of the present invention, which certainly cannot limit the scope of rights of the present invention. Therefore, equivalent changes made according to the claims of the present invention still fall within the scope of the present invention.

Claims

A double-layer conductive circuit, characterized in that the double-layer conductive circuit comprises:

Substrate;

a first conductive line disposed on the substrate; and

The second conductive circuit is arranged on the same side of the substrate as the first conductive circuit, and the first conductive circuit and the second conductive circuit are stacked to form several intersections, and the first conductive circuit and the second conductive circuit are arranged in layers. Insulating adhesive is provided at the intersection between the second conductive lines that needs to be insulated, and the second conductive line is bonded and fixed on the side of the first conductive line away from the substrate through the insulating adhesive. The intersection between the first conductive circuit and the second conductive circuit that requires electrical conduction is provided with a conductive material, and the first conductive circuit and the second conductive circuit are electrically connected through the conductive material, so that The first conductive circuit is electrically connected to the second conductive circuit.
The double-layer conductive circuit according to claim 1, wherein the first conductive circuit includes several first conductive wires, the first conductive wires are arranged along the first direction, and the second conductive circuit includes several second conductive wires , the second wire is arranged along a second direction, and the first direction is different from the second direction.
The double-layer conductive circuit according to claim 2, wherein the first wire and the second wire are overlapped to form the intersection, and the insulating glue is arranged on the first wire and the second wire An insulated intersection between the two wires is provided between the first wire and the second wire.
The double-layer conductive circuit according to claim 2, wherein the first wire and the second wire are overlapped to form the intersection, and the conductive material is arranged on the first wire and the second wire Intersections that require electrical conduction between them are arranged between the first wire and the second wire, or the conductive material covers the second wire corresponding to the intersection that requires electrical conduction. wire.
The double-layer conductive circuit according to claim 2, wherein the first conductive circuit is directly arranged on the surface of the substrate by etching, electroplating or electroless plating, or coating or printing; The wire is a bare metal wire, the cross section of the second wire is circular, and the second conductive circuit is fixed to the first conductive circuit by the insulating glue and/or the conductive material.
The double-layer conductive circuit according to claim 3, wherein an insulation strengthening layer is arranged between the insulating glue and the first wire.
The double-layer conductive circuit according to claim 6, characterized in that, the insulating glue is provided between the first conductive circuit and the second conductive circuit except for the intersection and the reserved position and the insulation enhancing layer, the insulating glue is disposed between the second wire and the substrate, and the second conductive circuit is fixed to the substrate through the insulating glue.
The double-layer conductive circuit according to any one of claims 2 to 5, wherein the substrate comprises a transparent substrate, and the diameter of the second wire is less than 0.3 mm.
The double-layer conductive circuit according to claim 5, wherein the bare metal wire comprises a copper wire, a silver wire or an aluminum wire.
The double-layer conductive circuit according to claim 1, wherein the conductive material comprises solder paste or silver glue.
A display module, characterized in that the display module includes several LED lamp beads and the double-layer conductive circuit according to any one of claims 1 to 10, the double-layer conductive circuit and the plurality of LEDs The lamp beads are electrically connected.
A method for manufacturing a double-layer conductive circuit, characterized in that the method for manufacturing a double-layer conductive circuit comprises:

Provide a substrate with a first conductive circuit, wherein the first conductive circuit is provided with a first preset position and a second preset position; apply insulating adhesive to the first preset position of the first conductive circuit ;

A second conductive circuit is arranged on the first conductive circuit, wherein the second conductive circuit is bonded and fixed on the side of the first conductive circuit away from the substrate through the insulating adhesive, and the second conductive circuit is The line and the first conductive line are stacked to form several intersections, the intersections include the first preset position and the second preset position, and the first preset position is the first conductive line The position where insulation is required between the line and the second conductive line; and the conductive material is arranged at the second preset position, wherein the second preset position is the first conductive line and the second conductive line The position where electrical conduction is required between the lines, the first conductive line and the second conductive line are electrically connected through the conductive material, so that the first conductive line and the second conductive line Electrical conduction.
The method for manufacturing a double-layer conductive circuit according to claim 12, wherein providing the substrate provided with the first conductive circuit specifically comprises: providing the substrate; and etching, electroplating or electroless plating, or coating the surface of the substrate Cloth or print the first conductive trace.