CN218632407U - Heat dissipation device of phased array antenna and phased array antenna - Google Patents
Heat dissipation device of phased array antenna and phased array antenna Download PDFInfo
- Publication number
- CN218632407U CN218632407U CN202223303935.6U CN202223303935U CN218632407U CN 218632407 U CN218632407 U CN 218632407U CN 202223303935 U CN202223303935 U CN 202223303935U CN 218632407 U CN218632407 U CN 218632407U
- Authority
- CN
- China
- Prior art keywords
- heat
- soaking plate
- array antenna
- phased array
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates to an antenna technology field, concretely relates to heat abstractor of phased array antenna, include: the radiating fins are arranged on two sides of the soaking plate, an air channel structure is designed on the radiating fins, a radiating fan is arranged on the side face of each radiating fin, the radiating fan draws air from the side face of the air channel structure and upwards feeds air from the lower side of the air channel structure to realize forced cold air, and the soaking plate is of a gas-liquid two-phase evaporation condensation circulation structure. According to the technical scheme in the embodiment of the application, the heat emitted by the heat sources such as the antenna array surface TR chip and the power module is rapidly and uniformly transmitted to the heat radiating fins on the two sides of the surface of the soaking plate through the working medium in the cavity of the soaking plate, forced air cooling heat radiation is carried out by adopting parallel air draft of the axial flow fan, the heat on the heat radiating fins is taken away, and the heat radiating efficiency of the heat radiating device is improved.
Description
Technical Field
The utility model relates to an antenna technology field, concretely relates to heat abstractor of phased array antenna.
Background
With the technical development of the phased array antenna and the great improvement of the system integration level, the number of TR chips of the phased array antenna is increased, the heat consumption is increased, and meanwhile, the heat flux density of the phased array antenna is sharply increased due to the limitation of the size and the layout of an antenna structure system, so that the heat dissipation becomes a key problem of the phased array antenna. The commonly used heat dissipation mode of present phased array antenna mainly has: natural convection, forced air cooling, liquid cooling. For the phased array antenna with higher heat flux density, the required structure size is correspondingly larger due to low heat dissipation efficiency of natural convection, and the heat dissipation efficiency can not meet the use requirement; the liquid-cooled heat dissipation system is huge and complex, and has many pipelines, high manufacturing cost and poor reliability. The heat radiation structure of present phased array antenna is complicated, and structure cost is high, and the TR chip is sensitive to the temperature anomaly in the system simultaneously, and signal phase place can drift along with temperature variation to after the adjacent two-channel difference in temperature exceeded 10 ℃, the space synthesis efficiency of wave beam can descend, finally leads to the decline of antenna performance.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problems, a first aspect of the present application provides a heat dissipation apparatus for a phased array antenna, which adopts a combination of a soaking plate and a heat dissipation fan to solve the technical problems of low heat dissipation efficiency of a phased array antenna array surface, large structural size and weight, and large temperature difference between two adjacent channels in the prior art, and also provides a phased array antenna including the heat dissipation apparatus for the phased array antenna.
The utility model discloses the technical scheme of first aspect does:
a heat dissipation device for a phased array antenna, comprising: the heat radiating fins are arranged on two sides of the soaking plate, an air channel structure is designed on each heat radiating fin, the side faces of the heat radiating fins are air outlets, the lower side faces of the heat radiating fins are air inlets, the heat radiating fan is installed at the air outlets of the heat radiating fins, the air outlet direction of the heat radiating fan is perpendicular to the air inlet direction of the air channels on the heat radiating fins, and the soaking plate is of a gas-liquid two-phase evaporation condensation circulating structure.
In some embodiments, the gas-liquid two-phase evaporation condensation circulation structure comprises a substrate, a vacuum sealed cavity, support pillars, a capillary structure and a liquid working medium, wherein a plurality of vacuum sealed cavities are arranged in the substrate, a plurality of support pillars are arranged in an array of the vacuum sealed cavities, the vacuum sealed cavities are communicated with the capillary structure, and the capillary structure is attached to the surface of the substrate, and the liquid working medium is filled in the vacuum sealed cavities.
In some embodiments, a heat conducting pad is arranged between the antenna array surface and the soaking plate, and the heat conducting pad is respectively attached to the surfaces of the antenna array surface and the soaking plate to transfer heat generated by a heat source of the antenna array surface to the soaking plate.
In some embodiments, the heat dissipation fins and the soaking plate are integrally designed, and heat of the soaking plate is directly conducted to the heat dissipation fins, so that thermal resistance is reduced, and heat dissipation efficiency is improved.
In some embodiments, the air channel structure is formed by gaps of a plurality of staggered parallel radiating fins.
In some embodiments, a spacer is arranged between the transmitting front and the receiving front of the upper surface of the soaking plate, and the spacer is designed to be in a rectangular toothed shape.
In some embodiments, the upper surface of the soaking plate is provided with a boss corresponding to the heat source.
Another aspect is directed to a phased array antenna that includes a heat sink of the phased array antenna of any of the embodiments above.
In some embodiments, the phased-array antenna further comprises a radio frequency module, a power supply module, a digital processing module and a cover plate, wherein the radio frequency module, the power supply module and the digital processing module are installed on the lower surface of the soaking plate, the soaking plate is provided with installation holes, and the cover plate is fixed on the soaking plate through screws.
In some embodiments, a thermal pad is disposed between the rf module, the power module, the digital processing module and the vapor chamber, and the thermal pad is closely attached to the rf module, the power module, the digital processing module and the vapor chamber.
The technical scheme provided in the embodiment of the application has the following technical effects or advantages:
1) According to the technical scheme in the embodiment of the application, the heat emitted by the antenna array surface TR chip is rapidly and uniformly transferred to the radiating fins on two sides of the surface of the soaking plate through the working medium in the cavity of the soaking plate, and then the axial flow fan is connected in parallel for exhausting air to perform forced air cooling radiation, so that the heat on the radiating fins is taken away, and the radiating efficiency of the radiating device is improved;
2) One side of the inner part of the cavity of the soaking plate, which is close to the heat source, is sintered with metal powder with a certain thickness, so that the condensed liquid can quickly flow back to the heat source, the soaking plate can not only carry out axial heat transfer, but also carry out radial heat transfer, the heat in the vacuum cavity is transferred in a two-dimensional direction, the temperature gradient of the whole radiating surface is reduced, the temperature equalizing effect is obvious, and the temperature consistency of the TR chip is ensured;
3) The vapor chamber and the frame structure are integrally designed, and the vapor chamber and the frame structure are used as a main body of the heat dissipation device and a main body frame structure of the antenna system, so that the vapor chamber and the system frame structure are integrally designed, and the integration level of the system is improved;
4) Most areas in the substrate of the soaking plate adopt a cavity structure, the structure is light and convenient, and the lightweight design is realized; the inner cavity is provided with the support column, and intensity is high, and heat conductivility is good.
5) The spacer is arranged between the transmitting array surface and the receiving array surface of the upper surface of the soaking plate, the spacer is designed to be in a rectangular toothed surface shape, the heat dissipation area of the system is increased, and meanwhile, the surface isolation degree and the space isolation degree of the transmitting array surface and the receiving array surface are improved.
6) The upper surface of the soaking plate is provided with a boss corresponding to the antenna radio frequency chip, the height of the air medium required by the surface layer microstrip line on the lower surfaces of the transmitting array surface and the receiving array surface is protected, the electrical performance of the transmitting array surface and the receiving array surface is realized, and the heat conduction performance of the heating source and the soaking plate is improved.
Drawings
Fig. 1 is an exploded view of the phased array antenna of the present invention;
fig. 2 is a partial enlarged view of the heat dissipating fins and spacers in the exploded view of the phased array antenna of the present invention;
fig. 3 is a partial enlarged view of the heat dissipating fins and the heat dissipating fan in the exploded view of the phased array antenna of the present invention;
fig. 4 is a schematic structural diagram of the phased array antenna spacer of the present invention;
fig. 5 is a schematic diagram of the internal heat dissipation of the vapor chamber of the heat dissipation device of the phased array antenna of the present invention;
wherein, 1-antenna array; 2-a radio frequency module; 3, a power supply module; 4-digital processing module; 5, soaking plates; 51, sealing the cavity in vacuum; 52-support column; 53-liquid working medium; 54-capillary structure; 6-radiating fins; 7-a radiator fan; 8, covering a plate; 9-a spacer; 10-boss.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1-5, the utility model provides a heat abstractor of phased array antenna, include: the vapor chamber 5 is arranged below the antenna array surface 1, and the vapor chamber 5 is of a gas-liquid two-phase evaporation condensation circulating structure; the two sides of the soaking plate 5 are provided with radiating fins 6, the radiating fins 6 are provided with air channel structures, and the air channel structures are formed by gaps of a plurality of staggered parallel radiating fins 6; the side surface of the radiating fin 6 is provided with a radiating fan 7, the radiating fan 7 draws air from the side surface of the air channel structure to enable air to enter upwards from the lower side of the air channel structure, the radiating fan 7 is an axial flow fan, forced air cooling radiation is carried out through parallel air drawing, and heat on the radiating fin is taken away; the vapor chamber (5) is in a gas-liquid two-phase evaporation and condensation circulating structure. The liquid working medium absorbs the heat of the TR component heat source and begins to vaporize into gas, the gas flows to the condensation zone of the soaking plate, the condensed working medium releases heat and returns to the evaporation zone through the capillary structure in the cavity, the liquid working medium realizes the heat transfer in the reciprocating process of evaporation and condensation, and the heat dissipation efficiency of the structure is improved.
Furthermore, the side face of the heat radiation fan 7 is provided with a fan mounting plate, so that impurities can be prevented from entering the fan, and meanwhile, the safety of installation and adjustment personnel is guaranteed.
As shown in fig. 5, in some embodiments, the vapor chamber 5 is modified to have a vapor-liquid two-phase evaporation and condensation cycle structure, which includes: the device comprises a substrate, a vacuum sealed cavity 51, a support column 52, a liquid working medium 53 and a capillary structure 54; the array of the vacuum seal cavities 51 of the plurality of vacuum seal cavities 51 in the substrate is provided with a plurality of support columns 52, the vacuum seal cavities 51 are communicated with a capillary structure 54, the capillary structure 54 is attached to the surface of the substrate, the vacuum seal cavities 51 are filled with liquid working media 53, the liquid working media 53 absorb heat in an evaporation area of the substrate, vaporize into gas and rapidly disperse to the whole vacuum seal cavities 51, the gas releases heat in a condensation area and condenses into liquid, the liquid working media 53 returns to the evaporation area through the capillary structure 54, so that the heat is rapidly transferred through the reciprocating circulation, and the temperature consistency of the array surface antenna 1 is ensured. The capillary structure 54 in the cavity of the soaking plate 5 enables the heat in the vacuum cavity to be conducted in a two-dimensional direction, so that the temperature consistency of the TR chip can be ensured; meanwhile, the vapor chamber and the frame structure are integrally designed, the vapor chamber is used as a main body of the heat dissipation device and also used as a main frame structure of the antenna system, the vapor chamber takes the heat dissipation main body and the structural bearing main body into consideration, the integrated design of the vapor chamber and the system frame structure is realized, and the integration level is high; most regions of the substrate of the vapor chamber 5 adopt a cavity structure, so that the structure is light, the structural strength is high, and the lightweight design is realized. The utility model discloses the radiating efficiency is high, and simple structure is light, and the temperature uniformity is good, and the integrated level is high, is applicable to the high, the little phased array antenna of structure space of thermal current density of ka frequency channel.
Furthermore, the heat dissipation fins 6 and the soaking plates 5 are integrally designed, so that the heat of the soaking plates 5 is diffused and conducted to the heat dissipation fins 6 towards the two sides of the soaking plates, and the heat dissipation effect is improved; the graphene coating is sprayed on the surface of the heat dissipation fin 6, and the graphene coating has high heat conductivity, so that the heat conductivity of the heat dissipation fin can be improved to a great extent.
Furthermore, the soaking plate 5 is formed by high-frequency diffusion welding, and has high structural strength and good heat conducting property.
In some embodiments, a heat conducting pad is arranged between the antenna array surface 1 and the vapor chamber 5, the heat conducting pad is respectively attached to the surfaces of the antenna array surface 1 and the vapor chamber 5, the heat conducting pad has high heat conductivity and small thickness, the thermal resistance is reduced, and heat generated by a heat source of the antenna array surface 1 is transferred to the vapor chamber.
Furthermore, the side wall of the soaking plate 5 is provided with a sealing ring, so that the sealing performance of the heat dissipation device is ensured, and the electrical performance of the phased array antenna is ensured.
As shown in fig. 2 and 4, in some embodiments, a spacer 9 is arranged between the transmitting front and the receiving front of the upper surface of the soaking plate 5, and the spacer 9 is designed to be in a rectangular toothed surface shape, so that the heat dissipation area of the system is increased, and the surface isolation degree and the space isolation degree of the transmitting front and the receiving front are improved.
In some embodiments, the upper surface of the soaking plate 5 is provided with a boss 10 corresponding to the heat source. Furthermore, a plurality of rectangular bosses are arranged on the upper surface of the soaking plate corresponding to the position of a heat source of the antenna array surface. Specifically, the position corresponding to the antenna radio frequency chip is provided with a boss so as to protect the height of an air medium required by a surface layer microstrip line on the lower surfaces of the antenna transmitting array surface and the antenna receiving array surface, thereby realizing the electrical performance of the transmitting array surface and the receiving array surface.
On the other hand as shown in fig. 1, the utility model also provides a phased array antenna who contains the first aspect, still include radio frequency module 2, power module 3, digital processing module 4 and apron 8, antenna array face 1 the lower surface at soaking board 5 is installed to radio frequency module 2, power module 3, digital processing module 4, be provided with the mounting hole on soaking board 5, apron 8 passes through the fix with screw on soaking board 5. Be provided with support piece on the apron, on the one hand can improve the intensity of apron, and on the other hand separates into independent unit with power module, digital processing module, radio frequency module, guarantees structural electromagnetic shield.
Furthermore, there is the heat conduction pad between radio frequency module 2, power module 3, digital processing module 4 and soaking board 5, the heat conduction pad is hugged closely with radio frequency module 2, power module 3, digital processing module 4 and soaking board 5 respectively, increases the area of contact of radio frequency module, power module, digital processing module and soaking board, transmits away power module, radio frequency module, digital processing module's heat through the soaking board, realizes power module, radio frequency module, digital processing module's normal work.
The utility model discloses phased array antenna's heat abstractor's theory of operation does:
the soaking plate rapidly transfers heat emitted by a central heat source of the antenna array surface TR chip to the soaking plate 5 and the radiating fins 6 at two sides, then the axial flow fan is connected in parallel for air draft to perform forced air cooling radiation, so that the heat on the radiating fins 6 is taken away, and meanwhile, the surfaces of the radiating fins 6 are coated with the graphene coating, so that the radiating efficiency of the radiating device is improved; the soaking plate can not only carry out axial heat transfer, but also carry out radial heat transfer, so that the temperature gradient of the whole radiating surface is reduced, the temperature equalizing effect is obvious, and the temperature consistency of two adjacent channels of the antenna array surface is ensured; meanwhile, the soaking plate and the frame structure are integrally designed, the soaking plate is used as a main body of the heat dissipation device and also used as a main body frame structure of the antenna system, the integrated design of the soaking plate and the system frame structure is realized, and the integration level is high; most areas of the soaking substrate base plate adopt a cavity structure, the structure is light, and the lightweight design of the phased-array antenna is realized.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. A heat dissipation device for a phased array antenna, comprising: set up soaking plate (5) in antenna array face (1) below, soaking plate (5) both sides are equipped with radiating fin (6), and the design has the wind channel structure on radiating fin (6), and the side of radiating fin (6) is equipped with radiator fan (7), and radiator fan (7) are followed the side convulsions of wind channel structure, make wind from the downside of wind channel structure air inlet that makes progress, realize forcing cold wind, soaking plate (5) are gas-liquid two-phase evaporation condensation cycle structure.
2. The heat dissipation device of the phased-array antenna according to claim 1, wherein the gas-liquid two-phase evaporation condensation circulation structure comprises a substrate, vacuum sealed cavities (51), support pillars (52), a liquid working medium (53) and a capillary structure (54), wherein a plurality of vacuum sealed cavities (51) are arranged in the substrate, a plurality of support pillars (52) are arranged in the array of the vacuum sealed cavities (51), the vacuum sealed cavities (51) are communicated with the capillary structure (54), and the capillary structure (54) is attached to the surface of the substrate, and the vacuum sealed cavities (51) are filled with the liquid working medium (53).
3. The heat sink for a phased array antenna according to claim 1, characterized in that a heat conducting pad is provided between the antenna array (1) and the soaking plate (5), the heat conducting pad is respectively attached to the surfaces of the antenna array (1) and the soaking plate (5) to transfer the heat generated by the heat source of the antenna array (1) to the soaking plate.
4. The heat sink for a phased array antenna according to claim 1, characterised in that the heat sink fins (6) are designed integrally with the soaking plate (5).
5. The heat sink for a phased array antenna according to claim 1, characterized in that the air channel structure is formed by gaps of a plurality of offset parallel fins (6).
6. The heat sink for a phased array antenna according to claim 1, characterized in that a spacer (9) is provided between the transmitting front and the receiving front of the upper surface of the soaking plate (5).
7. The heat sink for a phased array antenna according to claim 1, wherein the upper surface of the soaking plate (5) is provided with a boss (10) at a position corresponding to the heat source.
8. A phased array antenna comprising the heat sink of the phased array antenna of any of claims 1-7.
9. The phased array antenna according to claim 8, further comprising a radio frequency module (2), a power supply module (3), a digital processing module (4) and a cover plate (8), wherein the radio frequency module (2), the power supply module (3) and the digital processing module (4) are mounted on the lower surface of the soaking plate (5), mounting holes are formed in the soaking plate (5), and the cover plate (8) is fixed on the soaking plate (5) through screws.
10. Phased array antenna according to claim 9, characterised in that there are thermal pads between the rf module (2), the power module (3), the digital processing module (4) and the soaking plate (5), the thermal pads being in close contact with the rf module (2), the power module (3), the digital processing module (4) and the soaking plate (5) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223303935.6U CN218632407U (en) | 2022-12-09 | 2022-12-09 | Heat dissipation device of phased array antenna and phased array antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223303935.6U CN218632407U (en) | 2022-12-09 | 2022-12-09 | Heat dissipation device of phased array antenna and phased array antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218632407U true CN218632407U (en) | 2023-03-14 |
Family
ID=85454235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223303935.6U Active CN218632407U (en) | 2022-12-09 | 2022-12-09 | Heat dissipation device of phased array antenna and phased array antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218632407U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116387791A (en) * | 2023-03-17 | 2023-07-04 | 航天恒星科技有限公司 | Radiating structure of phased array antenna and phased array antenna applying same |
-
2022
- 2022-12-09 CN CN202223303935.6U patent/CN218632407U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116387791A (en) * | 2023-03-17 | 2023-07-04 | 航天恒星科技有限公司 | Radiating structure of phased array antenna and phased array antenna applying same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107567248B (en) | Liquid cooling heat radiator | |
| CN201667332U (en) | Semiconductor power module | |
| US11137175B2 (en) | Composite water-cooling radiator structure | |
| CN218632407U (en) | Heat dissipation device of phased array antenna and phased array antenna | |
| CN102017134A (en) | Heatsink, cooling module, and coolable electronic board | |
| CN209930821U (en) | Liquid-cooled heat conduction block and water-cooled radiator | |
| CN114764269B (en) | Computing system and computing device | |
| CN113916027A (en) | Radiator and communication equipment | |
| CN111026253A (en) | Liquid-cooled chip radiator with low-resistance flow channel enhanced heat exchange upper cover | |
| TWI726806B (en) | Water-cooling heat dissipation device and manufacturing method thereof | |
| US20230354557A1 (en) | Heat sink and communication device | |
| CN114945259A (en) | Integrated cooling module and electronic device with same | |
| CN113630993A (en) | Case, power amplifier and communication equipment | |
| WO2023010836A1 (en) | Heat dissipation module and electronic device | |
| CN114679896A (en) | Tile type TR assembly heat pipe type air cooling radiator | |
| CN110831406B (en) | Efficient heat dissipation device for electronic device with ultrahigh heat flux density | |
| CN210900093U (en) | Fin radiator | |
| CN210808027U (en) | Heat sink using phase change heat transfer | |
| CN219741019U (en) | Radiator module and equipment cabinet | |
| CN112447631A (en) | Heat radiation structure of packaged chip | |
| JP3152577U (en) | Heat dissipation structure for communication equipment case | |
| CN215301268U (en) | GPU board card structure | |
| CN216852904U (en) | Convection type heat radiation module with multiple heat radiators | |
| CN220340613U (en) | Heat dissipation structure | |
| CN217086851U (en) | Tile type TR (transmitter-receiver) component heat pipe type air-cooled radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |