CN220173661U - Separated radiator - Google Patents

Abstract

The utility model relates to the technical field of radiators, in particular to a split radiator. A first semiconductor refrigerator is arranged between a heat exchange block and a heat radiation fin of a second heat radiation module on the split type radiator, when current flows through the first semiconductor refrigerator, a temperature difference is generated, one surface of the first semiconductor refrigerator becomes cold, which is called a cold surface, and the other surface becomes hot, which is called a hot surface; compared with the prior art that the heat exchange block is in direct contact with the heat radiating fins, the split water-cooling radiator has the advantages that when in use, the temperature of the heat exchange block is lower, and the temperature of the heat radiating fins is higher, so that the split radiator can fully utilize the heat radiating fins to radiate heat, and therefore, the heat radiating capability is higher, and the heat radiating capability of electronic products can be better.

Description

Separated radiator

Technical Field

The utility model relates to the field of radiators, in particular to a split radiator.

Background

In order to improve the radiating effect of the radiator, a separated water-cooling radiator appears on the market, and the separated water-cooling radiator comprises a first radiating module and a second radiating module which are arranged in a separated mode, wherein two water pipes are connected between the first radiating module and the second radiating module, the first radiating module is used for being in contact with an electronic product so as to exchange heat with the electronic product, after heat exchange, water-cooling solution flows to the second radiating module through one of the water pipes for cooling, and the cooled water-cooling solution flows back to the first radiating module through the other water pipe for exchanging heat with the electronic product again.

The second heat dissipation module generally comprises heat dissipation fins and a heat exchange block, wherein a water channel is arranged on the heat exchange block, the heat exchange block is contacted with the heat dissipation fins, water-cooling solution flowing from the first heat dissipation module to the second heat dissipation module flows through the water channel and exchanges heat with the heat exchange block in the water channel, and the heat exchange block is contacted with the heat dissipation fins, so that the heat exchange block can exchange heat with the heat dissipation fins, and the cooling of the water-cooling solution is realized.

However, the heat exchange between the heat exchange block and the heat dissipation fins in the prior art is too slow to fully exert the heat dissipation capability of the heat dissipation fins, so that the heat dissipation effect of the separate radiator in the prior art needs to be improved.

Disclosure of Invention

The embodiment of the utility model aims to solve the technical problem that the heat dissipation capacity of the heat dissipation fins in the prior art cannot be fully exerted, so that the heat dissipation effect of the separate type heat dissipation device in the prior art is required to be improved.

The split type radiator provided by the embodiment of the utility model comprises: the electronic equipment comprises a first heat dissipation module, a second heat dissipation module and a first heat dissipation module, wherein the first heat dissipation module is used for being in contact with the electronic equipment and comprises a cold head, a first water channel is arranged in the cold head, and two ends of the first water channel are exposed on the outer side face of the cold head; a first water pipe, one end of which is communicated with one end of the first water channel; one end of the second water pipe is communicated with the other end of the first water channel; the second heat dissipation module comprises a first semiconductor refrigerator, heat dissipation fins, a heat exchange block and a water pump, wherein the heat exchange block is arranged on a cold surface of the first semiconductor refrigerator, the heat dissipation fins are arranged on a hot surface of the first semiconductor refrigerator, a second water channel is arranged in the heat exchange block, two ends of the second water channel are exposed on the outer side surface of the heat exchange block, the other end of the first water pipe is communicated with one end of the second water channel, and the other end of the second water pipe is communicated with the other end of the second water channel through the water pump.

Further, the first heat dissipation module further comprises a heat exchange plate and a heat conducting medium, one surface of the heat exchange plate is used for being connected with the electronic equipment, the heat conducting medium is arranged on the other surface of the heat exchange plate, and the cold head is arranged on one side, opposite to the heat exchange plate, of the heat conducting medium.

Further, the heat conducting medium is a second semiconductor refrigerator, the other surface of the heat exchange plate is arranged on the cold surface of the second semiconductor refrigerator, and the cold head is arranged on the hot surface of the second semiconductor refrigerator.

Further, the first semiconductor refrigerator has a larger power and a larger size than the second semiconductor refrigerator.

Further, the second heat dissipation module further comprises a power supply interface, and the power supply interface is electrically connected with the first semiconductor refrigerator, the water pump and the second semiconductor refrigerator.

Further, the first heat dissipation module further comprises a magnet, and the magnet is arranged on one side of the heat exchange plate, which faces the cold head.

Further, the magnet is a ring magnet or an arc magnet, and the magnet is arranged along the peripheral wall of the first heat dissipation module.

Further, the second heat dissipation module further comprises a fan, and the fan is arranged on one side, far away from the first semiconductor refrigerator, of the heat dissipation fins.

Further, the first heat dissipation module further comprises a button and a control circuit module, the control circuit module is electrically connected with the first semiconductor refrigerator, the water pump and the fan, the button is exposed on the surface of the first heat dissipation module and is connected with the control circuit, and the first semiconductor refrigerator, the water pump and the fan can be controlled to be turned on or off by pressing the button.

Further, the split radiator further comprises a pipe sleeve, and the pipe sleeve is wrapped at the positions of the first water pipe and the second water pipe exposed at the first radiating module and the second radiating module.

Compared with the prior art, the split radiator provided by the embodiment of the utility model has the beneficial effects that: the first semiconductor refrigerator is arranged between the heat exchange block and the heat radiating fins in the second heat radiating module on the split type radiator, when current flows through the first semiconductor refrigerator, a temperature difference is generated, one surface of the first semiconductor refrigerator is cooled, which is called a cold surface, and the other surface of the first semiconductor refrigerator is heated, which is called a hot surface.

Drawings

The utility model will now be described in further detail with reference to the accompanying drawings and examples, in which:

fig. 1 is a schematic perspective view of a split radiator according to an embodiment of the present utility model;

FIG. 2 is an exploded view of a first heat dissipating module provided by an embodiment of the present utility model;

FIG. 3 is an exploded view of the first heat dissipating module of FIG. 2 at another angle;

FIG. 4 is a cross-sectional view of a first heat dissipating module provided by an embodiment of the present utility model;

FIG. 5 is a cross-sectional view of a coldhead provided in an embodiment of the present utility model;

FIG. 6 is a schematic view of a portion of the split radiator of FIG. 1;

fig. 7 is an exploded view of a fan, heat fins, a first semiconductor refrigerator, and a heat exchange block provided in an embodiment of the present utility model;

fig. 8 is a cross-sectional view of a heat exchange block provided by an embodiment of the present utility model.

The reference numerals in the drawings are as follows:

1000. a separate radiator;

100. a first heat dissipation module; 110. a cold head; 111. a first waterway; 120. a heat exchange plate; 130. a heat-conducting medium; 131. a second semiconductor refrigerator; 140. a magnet; 150. a peripheral wall; 160. a button; 170. a control circuit module;

200. a first water pipe;

300. a second water pipe;

400. a second heat dissipation module; 410. a first semiconductor refrigerator; 420. a heat radiation fin; 430. a heat exchange block; 431. a second waterway; 440. a water pump; 450. a power supply interface; 460. a fan;

500. a pipe sleeve.

Detailed Description

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. Preferred embodiments of the present utility model will now be described in detail with reference to the accompanying drawings.

The embodiment of the present utility model provides a split type heat sink 1000, as shown in fig. 1 to 8, the split type heat sink 1000 includes a first heat dissipation module 100, a first water pipe 200, a second water pipe 300, and a second heat dissipation module 400. The first heat dissipation module 100 is used for contacting with an electronic device, the first heat dissipation module 100 includes a cold head 110, a first water channel 111 is disposed in the cold head 110, and two ends of the first water channel 111 are exposed on an outer side surface of the cold head 110. The second heat dissipation module 400 includes a first semiconductor refrigerator 410, heat dissipation fins 420, a heat exchange block 430 and a water pump 440, the heat exchange block 430 is disposed on a cold surface of the first semiconductor refrigerator 410, the heat dissipation fins 420 are disposed on a hot surface of the first semiconductor refrigerator 410, a second water channel 431 is disposed in the heat exchange block 430, two ends of the second water channel 431 are exposed on an outer side surface of the heat exchange block 430, one end of the first water pipe 200 is communicated with one end of the first water channel 111, the other end of the first water pipe 200 is communicated with one end of the second water channel 431, one end of the second water pipe 300 is communicated with the other end of the first water channel 111, and the other end of the second water pipe 300 is communicated with the other end of the second water channel 431 through the water pump 440.

When the split radiator 1000 is used, the first heat dissipation module 100 can be contacted with the electronic device, and at this time, the cold head 110 on the first heat dissipation module 100 can exchange heat with the electronic device, so as to cool the electronic device; the water pump 440 drives the water-cooling solution to flow between the cold head 110 and the heat exchange block 430, when the water-cooling solution flows through the first water channel 111, the water-cooling solution can exchange heat with the cold head 110, so that heat exchanged by the electronic device to the cold head 110 can be exchanged by the water-cooling solution and carried to the heat exchange block 430 of the second heat dissipation module 400 for heat exchange, and since the heat exchange block 430 is disposed on the cold surface of the first semiconductor refrigerator 410 and the heat dissipation fins 420 are disposed on the hot surface of the first semiconductor refrigerator 410, heat on the second heat dissipation module 400 can be exchanged to the heat dissipation fins 420 through the first semiconductor refrigerator 410, thereby cooling the water-cooling solution flowing through the second water channel 431, and the cooled water-cooling solution can flow to the cold head 110 again to help cooling the electronic device again.

When current passes through the semiconductor refrigerator, a temperature difference is generated, one surface of the semiconductor refrigerator becomes cold, the other surface of the semiconductor refrigerator becomes hot, the patent is called a cold surface, the patent is called a hot surface, the first semiconductor refrigerator 410 is additionally arranged between the heat exchange block 430 and the heat dissipation fins 420, wherein the heat exchange block 430 is arranged on the cold surface of the first semiconductor refrigerator 410, the heat dissipation fins 420 are arranged on the hot surface of the first semiconductor refrigerator 410, and compared with the embodiment that the heat exchange block 430 is in direct contact with the heat dissipation fins 420, the temperature of the split type water-cooling radiator of the embodiment is lower when in use, and the temperature of the heat exchange block 430 is higher. Therefore, the split heat sink 1000 of the present embodiment can more fully utilize the heat dissipation fins 420 to dissipate heat, so that the heat dissipation capability is stronger and the heat dissipation capability can be better for the electronic product.

It should be noted that the water-cooling solution may flow from the first water pipe 200 into the first water channel 111 and then flow to the second water channel 431 via the second water pipe 300, or may flow from the second water pipe 300 into the first water channel 111 and then flow to the second water channel 431 via the first water pipe 200, which is not limited herein.

Referring to fig. 2-4, in a specific embodiment, the first heat dissipation module 100 further includes a heat exchange plate 120 and a heat conducting medium 130, one surface of the heat exchange plate 120 is used for being connected with an electronic device, the heat conducting medium 130 is disposed on the other surface of the heat exchange plate 120, and the cold head 110 is disposed on a side of the heat conducting medium 130 facing away from the heat exchange plate 120.

Specifically, when the split heat sink 1000 is in use, the heat exchanger plate 120 is connected to the electronic device to exchange heat with the electronic device, and heat on the heat exchanger plate 120 is exchanged to the cold head 110 via the heat-conducting medium 130, so that the cold head 110 is used to cool the electronic device. Compared with the embodiment in which the heat exchanger plate 120 is directly connected to the cold head 110, the heat-conducting medium 130 can improve the heat exchange efficiency, so that the heat on the heat exchanger plate 120 can be more exchanged to the cold head 110, and the heat dissipation of the electronic product is better.

Referring to fig. 2 to 4, in a specific embodiment, the heat conducting medium 130 is a second semiconductor refrigerator 131, the other surface of the heat exchanging fin 120 is mounted on the cold surface of the second semiconductor refrigerator 131, and the cold head 110 is mounted on the hot surface of the second semiconductor refrigerator 131. Specifically, when the current passes through the second semiconductor refrigerator 131, a temperature difference is generated, one surface of the second semiconductor refrigerator 131 is cooled, and the other surface is heated, so that the second semiconductor refrigerator 131 can further reduce the temperature of the heat exchanger plate 120 during use, so that the split type radiator 1000 can better radiate heat for electronic products.

Preferably, the first semiconductor refrigerator 410 is larger in power and size than the second semiconductor refrigerator 131. Because the size of the first semiconductor refrigerator 410 is limited by the electronic device, but the second semiconductor refrigerator 131 cannot, the power and the size of the first semiconductor refrigerator 410 are larger than those of the second semiconductor refrigerator 131 in the embodiment, so that the first semiconductor refrigerator 410 can be utilized to rapidly cool the water-cooled solution flowing through the second water channel, the heat dissipation capacity of the split radiator 1000 can be stronger, and the heat dissipation of the electronic product can be better.

Optionally, the heat conducting medium 130 is a heat conducting silicone grease. Although the surfaces of the heat exchanging fin 120 and the cold head 110 are smooth, a tiny gap exists between the heat exchanging fin 120 and the cold head 110, and the tiny gap can cause uneven heat transfer, thereby affecting the heat dissipation effect, and the tiny gap can be filled by the heat conducting silicone grease arranged between the heat exchanging fin 120 and the cold head 110, so that the heat transfer efficiency is improved.

Referring to fig. 1, in an embodiment, the second heat dissipation module 400 further includes a power supply interface 450, and the power supply interface 450 is electrically connected to the first semiconductor refrigerator 410, the water pump 440, and the second semiconductor refrigerator 131.

Specifically, the split radiator 1000 needs to use electric energy when in use, so the split radiator 1000 needs to be provided with a power supply interface 450, and a power line is plugged into the power supply interface 450 to supply electric energy to the first semiconductor refrigerator 410, the water pump 440 and the second semiconductor refrigerator 131. The power supply interface 450 may be disposed on the first heat dissipation module 100 or the second heat dissipation module 400, but when the first heat dissipation module 100 is used, the first heat dissipation module 100 contacts with an electronic device, if the electronic device is a mobile phone, a tablet computer, or other devices, the back of the electronic device is equivalent to one more power line when the electronic device is used, so that the user experience is poor, and the problem will not occur when the power supply interface 450 is disposed on the second heat dissipation module 400, so that the power supply interface 450 is disposed on the second heat dissipation module 400 in this embodiment.

When the first heat dissipation module 100 is used, if it can be installed on an electronic device, the user experience is improved. For example, the electronic device is a mobile phone, the first heat dissipation module 100 contacts with the back of the mobile phone, so as to dissipate heat of the mobile phone, if the first heat dissipation module 100 can be installed on the back of the mobile phone, the user does not need to pay attention to the first heat dissipation module 100 when playing the mobile phone, and if the first heat dissipation module 100 and the mobile phone cannot be installed on the electronic device, the user needs to hold the first heat dissipation module 100 with fingers when playing the mobile phone, so that the first heat dissipation module 100 is attached to the mobile phone. Therefore, only the first heat dissipation module 100 can be connected with the electronic device, so that the hands of the user can be thoroughly released, and the user experience is improved. In order to enable the first heat dissipation module 100 to be mounted on an electronic device, the present utility model provides the following two embodiments for the purpose of examination:

referring to fig. 2-4, in the first embodiment, the first heat dissipating module 100 further includes a magnet 140, where the magnet 140 is disposed on a side of the heat exchanging fin 120 facing the cold head 110.

Specifically, the magnet 140 may be attached to the electronic device, so providing the magnet 140 on the first heat dissipation module 100 may implement mounting the first heat dissipation module 100 on the electronic device. In addition, the mounting mode of adopting magnetic adsorption is convenient to mount and dismount, and electronic equipment is not easy to scratch, so that user experience is good.

Referring to fig. 2-4, in a specific embodiment, the magnets 140 are ring magnets or arc magnets, and the magnets 140 are disposed along the peripheral wall 150 of the first heat dissipating module 100. Because the ring magnet or the arc magnet disposed along the peripheral wall 150 of the first heat dissipation module 100 has a larger adsorption area, the ring magnet or the arc magnet can be more firmly adsorbed on the electronic device, and is not easy to separate from the electronic device, so that the user experience is excellent.

In the second embodiment, the first heat dissipation module 100 further includes two clamping plates, which can be respectively clamped at two opposite sides of the electronic device, so that the first heat dissipation module 100 can be mounted on the electronic device.

In a specific embodiment, the first heat dissipating module 100 further includes a distance adjusting structure connected to one of the clamping plates, or the distance adjusting structure is connected to both clamping plates to adjust the distance between the two clamping plates. The arrangement can improve the universality of the first heat dissipation module 100, so that the first heat dissipation module 100 can be arranged on electronic equipment with different sizes.

Referring to fig. 6 and 7, in an embodiment, the heat dissipating module further includes a fan 460, and the fan 460 is disposed on a side of the heat dissipating fin 420 away from the first semiconductor refrigerator 410.

Specifically, the fan 460 can assist the heat dissipation of the heat dissipation fins 420, and only the heat dissipation efficiency of the heat dissipation fins 420 is high when the heat is dissipated into the air more quickly, the fan 460 can accelerate the air flow near the heat dissipation fins 420, so that the heat dissipation fins 420 can dissipate the heat into the air more quickly, and the heat dissipation efficiency is improved. In addition, the heat dissipation fan 460 can also help the heat dissipation fins 420 keep clean, and prevent dust from accumulating on the fins to affect the heat dissipation effect of the heat dissipation fins 420.

Referring to fig. 2-4, in an embodiment, the first heat dissipation module 100 further includes a button 160 and a control circuit module 170, the control circuit module 170 is electrically connected to the first semiconductor refrigerator 410, the water pump 440 and the fan 460, and the button 160 is exposed on the surface of the first heat dissipation module 100 and is connected to the control circuit. Pressing the button 160 can control the first semiconductor refrigerator 410, the water pump 440, and the fan 460 to be turned on or off.

Specifically, the button 160 is disposed on the surface of the first heat dissipation module 100, so that a user can control the on or off of the first semiconductor refrigerator 410, the water pump 440 and the fan 460 by using the button 160 when using the mobile phone.

In an exemplary embodiment, the button 160 is capable of turning on and off the first semiconductor refrigerator 410, the water pump 440, and the fan 460. The heat sink shift may also be adjusted, for example, by pressing button 160 to increase or decrease the power of first semiconductor refrigerator 410 and the rotational speed of fan 460.

Referring to fig. 1 and 6, in an embodiment, the split heat sink 1000 further includes a sleeve 500, and the sleeve 500 is wrapped around the first water pipe 200 and the second water pipe 300 at positions exposed to the first heat dissipation module 100 and the second heat dissipation module 400.

In the first aspect, the pipe sleeve 500 can fix the first water pipe 200 and the second water pipe 300 together, so that the first water pipe 200 and the second water pipe 300 keep consistent extending directions, and thus the first water pipe 200 and the second water pipe 300 are not messy, and the visual experience of the user is better.

In the second aspect, the pipe sleeve 500 wrapped around the first water pipe 200 and the second water pipe 300 can provide a certain protection effect for the first water pipe 200 and the second water pipe 300.

It should be understood that the foregoing embodiments are merely illustrative of the technical solutions of the present utility model, and not limiting thereof, and that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art; all such modifications and substitutions are intended to be included within the scope of this disclosure as defined in the following claims.

Claims (10)

1. A split radiator, comprising:

the electronic equipment comprises a first heat dissipation module, a second heat dissipation module and a first heat dissipation module, wherein the first heat dissipation module is used for being in contact with the electronic equipment and comprises a cold head, a first water channel is arranged in the cold head, and two ends of the first water channel are exposed on the outer side face of the cold head;

a first water pipe, one end of which is communicated with one end of the first water channel;

one end of the second water pipe is communicated with the other end of the first water channel;

the second heat dissipation module comprises a first semiconductor refrigerator, heat dissipation fins, a heat exchange block and a water pump, wherein the heat exchange block is arranged on a cold surface of the first semiconductor refrigerator, the heat dissipation fins are arranged on a hot surface of the first semiconductor refrigerator, a second water channel is arranged in the heat exchange block, two ends of the second water channel are exposed on the outer side surface of the heat exchange block, the other end of the first water pipe is communicated with one end of the second water channel, and the other end of the second water pipe is communicated with the other end of the second water channel through the water pump.

2. The split radiator of claim 1, wherein the first heat dissipation module further comprises a heat exchange plate and a heat transfer medium, one surface of the heat exchange plate is used for being connected with the electronic device, the heat transfer medium is arranged on the other surface of the heat exchange plate, and the cold head is arranged on one side of the heat transfer medium, which is opposite to the heat exchange plate.

3. The split radiator as claimed in claim 2, wherein the heat transfer medium is a second semiconductor refrigerator, the other surface of the heat exchange fin is mounted on a cold surface of the second semiconductor refrigerator, and the cold head is mounted on a hot surface of the second semiconductor refrigerator.

4. The split radiator as recited in claim 3, wherein the first semiconductor refrigerator is larger in power and size than the second semiconductor refrigerator.

5. The split radiator of claim 3, wherein the second heat dissipation module further comprises a power interface electrically connected to the first semiconductor refrigerator, the water pump, and the second semiconductor refrigerator.

6. The split radiator as claimed in any one of claims 1 to 5, wherein the first heat radiating module further includes a magnet provided at a side of the heat exchanging fin facing the cold head.

7. The split radiator as claimed in claim 6, wherein the magnet is a ring magnet or an arc magnet, the magnet being disposed along a peripheral wall of the first heat dissipating module.

8. The split radiator as claimed in any one of claims 1 to 5, wherein the second heat dissipating module further includes a fan installed at a side of the heat dissipating fin away from the first semiconductor refrigerator.

9. The split radiator of claim 8, wherein the first heat dissipating module further comprises a button and a control circuit module, the control circuit module is electrically connected with the first semiconductor refrigerator, the water pump and the fan, the button is exposed on the surface of the first heat dissipating module and connected with the control circuit, and pressing the button can control the first semiconductor refrigerator, the water pump and the fan to be turned on or off.

10. The split radiator as claimed in any one of claims 1 to 5, further comprising a tube sleeve, wherein the tube sleeve is wrapped around the first water tube and the second water tube at positions where the first heat dissipation module and the second heat dissipation module are exposed.