CN215578723U

CN215578723U - Module heat management device

Info

Publication number: CN215578723U
Application number: CN202121654609.2U
Authority: CN
Inventors: 石露露; 付垚; 李永伟
Original assignee: Beijing WeLion New Energy Technology Co ltd
Current assignee: Beijing WeLion New Energy Technology Co ltd
Priority date: 2021-07-20
Filing date: 2021-07-20
Publication date: 2022-01-18
Anticipated expiration: 2031-07-20

Abstract

The utility model discloses a module heat management device which comprises a bracket, a heat conducting plate and a semiconductor refrigerator used for transferring heat and cold to a module through the heat conducting plate, wherein the heat conducting plate is arranged on the bracket. In the module heat management device that this application provided, refrigerate and heat as required through the semiconductor cooler, simple structure need not external equipment, has improved module heat management device's use convenience effectively.

Description

Module heat management device

Technical Field

The utility model relates to the technical field of module heat treatment, in particular to a module heat management device.

Background

In the new energy power battery industry, the battery module research and development and trial-manufacture process need to be matched with a corresponding module heat management device in order to verify the heat management capability of the module.

Traditional module heat management device adopts water-cooling unit to dispel the heat to the module, however, because water-cooling unit occupation space is great, needs external cold water, and is higher to service environment requirement, and it is inconvenient to use.

Therefore, how to improve the convenience of using the module thermal management device is a technical problem that needs to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a module heat management device, which is improved in use convenience.

In order to achieve the above object, the present invention provides a module thermal management device, which comprises a bracket, a heat conducting plate and a semiconductor refrigerator for transferring heat and cold to a module through the heat conducting plate, wherein the heat conducting plate is installed on the bracket.

Preferably, the semiconductor refrigerator is detachably mounted on the heat conductive plate.

Preferably, the number of the semiconductor refrigerators is one or at least two.

Preferably, the semiconductor cooler is mounted on the heat conductive plate by a quick clamp.

Preferably, the heat-conducting plate is provided with a working groove body for placing the module, and the working groove body and the semiconductor refrigerator are arranged on two opposite sides of the heat-conducting plate which are arranged in a back direction.

Preferably, the projection is along the thickness direction of the heat conducting plate, and the working groove body is positioned in the projection of the semiconductor refrigerator.

Preferably, the heat conducting plate is a heat conducting aluminum plate.

Preferably, the refrigerator also comprises a temperature controller for controlling the operation of the semiconductor refrigerator.

Preferably, the bracket comprises a body and a supporting leg for supporting the body, the semiconductor refrigerator is positioned in a space enclosed by the supporting leg, and the heat conducting plate is installed on the body.

Preferably, a heat conduction layer is attached between the semiconductor refrigerator and the heat conduction plate.

In the technical scheme, the module heat management device provided by the utility model comprises a bracket, a heat conducting plate and a semiconductor refrigerator for transferring heat and cold to the module through the heat conducting plate, wherein the heat conducting plate is arranged on the bracket.

According to the module heat management device, the semiconductor refrigerator is used for refrigerating and heating according to needs, the structure is simple, external equipment is not needed, and the use convenience of the module heat management device is effectively improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a module thermal management device according to an embodiment of the present invention.

Wherein in FIG. 1: 1-bracket, 2-semiconductor refrigerator, 3-heat conducting plate, 4-quick clamp and 5-module.

Detailed Description

The core of the utility model is to provide a module heat management device, which is improved in use convenience.

In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings and embodiments.

Please refer to fig. 1.

In one embodiment, the module thermal management device according to an embodiment of the present invention includes a bracket 1, a heat-conducting plate 3, and a semiconductor cooler 2 for transferring heat and cold to a module 5 through the heat-conducting plate 3, the heat-conducting plate 3 being mounted on the bracket 1. In order to improve the working efficiency, the heat conducting plate 3 is preferably a heat conducting aluminum plate. Of course, the heat-conducting plate 3 may be an iron plate or the like in the case of mounting. The size of the heat conducting plate 3 is determined according to actual needs, and the application is not particularly limited.

The semiconductor refrigerator 2 integrates heating and refrigerating functions, and meets various requirements of heat management. Specifically, the semiconductor cooler 2 is composed of a plurality of semiconductor cooling fins, and the number of the cooling fins can be increased or decreased according to the power required by the module heat management device. Normally, the semiconductor cooler 2 may be in a cooling mode, and the heating mode may be started when the power supply is reversely connected, specifically, the semiconductor cooler 2 may be driven by a low-voltage power supply.

As can be seen from the above description, in the module heat management device provided in the embodiment of the present application, the semiconductor refrigerator 2 is used for cooling and heating as required, the structure is simple and compact, no external device is needed, the module 5 arranged on the semiconductor refrigerator can exchange heat with power on, the module is easy to manufacture and maintain, and the flexibility and the use convenience of the module heat management device are effectively improved.

Wherein semiconductor refrigerator 2 can be installed on support 1, for the convenience of heat and cold transfer, it is preferable that semiconductor refrigerator 2 is installed on heat-conducting plate 3, preferably, semiconductor refrigerator 2 is detachably installed on heat-conducting plate 3.

Specifically, the number of the semiconductor refrigerators 2 is one or at least two, and the number of the semiconductor refrigerators 2 is set as required.

In one embodiment, semiconductor cooler 2 is mounted to thermally conductive plate 3 by snap fit or quick clamp 4. Use quick clamp 4 to fix semiconductor cooler 2 on heat-conducting plate 3, the circuit is simple, and the wiring is convenient, adopts quick clamp 4 to fix semiconductor cooler 2 in heat-conducting plate 3 below, and it is very convenient to maintain.

In order to place the module 5, preferably, the heat conducting plate 3 is provided with a working groove body for placing the module 5, and the working groove body and the semiconductor refrigerator 2 are arranged on two opposite sides of the heat conducting plate 3, which are arranged in a back direction. Specifically, a refrigerator groove body for placing the semiconductor refrigerator 2 can be arranged on the heat conducting plate 3.

In order to improve the working efficiency, preferably, the projection is carried out along the thickness direction of the heat conducting plate 3, the working groove body is positioned in the projection of the semiconductor refrigerator 2, and the heat and the cold of the semiconductor refrigerator 2 are timely transmitted to the position of the module 5 through the arrangement.

On the basis of the schemes, the module thermal management device also comprises a temperature controller used for controlling the work of the semiconductor refrigerator 2. The model of temperature controller is not limited as long as can satisfy the function can, through the start-up and the disconnection of temperature controller, can set up the opening temperature according to the demand, can realize temperature automatic control.

During specific work, the module 5 to be tested is placed on the upper surface of the heat-conducting plate 3, as far as possible in the central position. The module heat management device is powered on, the temperature controller starts to work, the switch is closed after the temperature reaches a preset value, and the semiconductor refrigerator 2 starts to work to radiate or heat the module 5.

In order to facilitate the assembly and disassembly of the semiconductor refrigerator 2, preferably, the bracket 1 comprises a body and a supporting leg for supporting the body, the semiconductor refrigerator 2 is positioned in a space formed by enclosing the supporting leg, and the heat conducting plate 3 is installed on the body. Specifically, the bracket 1 may be of a plastic structure or a metal structure, and specifically, the bracket 1 may be an iron bracket.

In order to further improve the working efficiency, preferably, a heat conduction layer is attached between the semiconductor refrigerator 2 and the heat conduction plate 3, and specifically, the heat conduction layer may be heat conduction silicone grease. During operation, the semiconductor refrigerator 2 is fixed on the whole heat conducting plate 3 by using the quick clamp 4, and the part of the direct contact between the semiconductor refrigerator 2 and the heat conducting plate 3 is coated uniformly in advance by using the heat conducting silicone grease with high heat conductivity coefficient, so that the contact between the semiconductor refrigerator 2 and the heat conducting plate 3 has higher heat exchange efficiency.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The module heat management device is characterized by comprising a support (1), a heat conducting plate (3) and a semiconductor refrigerator (2) used for transferring heat and cold to a module (5) through the heat conducting plate (3), wherein the heat conducting plate (3) is installed on the support (1).

2. Modular thermal management device according to claim 1, characterized in that said semiconductor cooler (2) is removably mounted on said thermally conductive plate (3).

3. Modular thermal management device according to claim 2, characterized in that the semiconductor coolers (2) are one or at least two.

4. Modular thermal management device according to claim 2, characterized in that said semiconductor cooler (2) is mounted on said thermally conductive plate (3) by means of quick clamps (4).

5. The module heat management device according to claim 1, wherein a working groove body for placing the module (5) is formed on the heat conducting plate (3), and the working groove body and the semiconductor refrigerator (2) are located on opposite sides of the heat conducting plate (3) which are arranged in a back direction.

6. The modular thermal management device according to claim 5, characterized in that said work tank is located inside the projection of said semiconductor refrigerator (2), projected in the direction of the thickness of said thermally conductive plate (3).

7. Modular thermal management device according to claim 1, characterized in that said thermally conductive plate (3) is a thermally conductive aluminium plate.

8. The modular thermal management apparatus of claim 1, further comprising a thermostat for controlling the operation of the semiconductor cooler (2).

9. The modular thermal management device according to claim 1, characterized in that said support (1) comprises a body and legs for supporting said body, said semiconductor refrigerator (2) being located in the space enclosed by said legs, said thermally conductive plate (3) being mounted on said body.

10. The modular thermal management device according to any of claims 1 to 9, characterized in that a heat conducting layer is applied between the semiconductor cooler (2) and the heat conducting plate (3).