CN210401986U

CN210401986U - AR projection box with heat dissipation effect

Info

Publication number: CN210401986U
Application number: CN201921619688.6U
Authority: CN
Inventors: 章和盛; 刘海辉; 蔡桂斌; 余健波
Original assignee: Zhongke Xingtu Shenzhen Digital Technology Industry R&D Center Co Ltd
Current assignee: Zhongke Xingtu Shenzhen Digital Technology Industry R&D Center Co Ltd
Priority date: 2019-09-27
Filing date: 2019-09-27
Publication date: 2020-04-24
Anticipated expiration: 2029-09-27

Abstract

An AR projection box with a heat dissipation effect comprises a box body, a demonstration disc and a support; the box body is connected with the demonstration disc through a bracket; the box body corresponds to the demonstration disc and also comprises a heat dissipation mechanism; the heat dissipation mechanism is detachably arranged on the box body; the heat dissipation mechanism comprises a cylindrical semiconductor refrigeration chip; the heat-emitting end of the semiconductor refrigeration chip is provided with a plurality of radiating fins, and the radiating fins are exposed out of the box body; the cold end of the semiconductor refrigeration chip faces the interior of the box body; the temperature of the interior of the projection box can be reduced, and the equipment can work in a low-temperature environment.

Description

AR projection box with heat dissipation effect

Technical Field

The utility model belongs to AR equipment field especially relates to an AR projection case with radiating effect.

Background

AR technology has become increasingly popular, and more fields will use AR projection as demonstration and teaching. Like some teaching sand tables, will need to carry out the projection demonstration on the sand table, the projection in-process, equipment such as projecting apparatus, camera, quick-witted case are because high strength work, very generate heat easily, overheated then can influence work efficiency, therefore needs can in time cool down.

SUMMERY OF THE UTILITY MODEL

The utility model provides a AR projection case with radiating effect can guarantee wherein that equipment can work at low temperature environment for the inside cooling of projection case.

The utility model discloses a following mode realizes:

an AR projection box with a heat dissipation effect comprises a box body, a demonstration disc and a support; the box body is connected with the demonstration disc through a bracket; the box body corresponds to the demonstration disc and is characterized by also comprising a heat dissipation mechanism; the heat dissipation mechanism is detachably arranged on the box body; the heat dissipation mechanism comprises a cylindrical semiconductor refrigeration chip; the heat-emitting end of the semiconductor refrigeration chip is provided with a plurality of radiating fins, and the radiating fins are exposed out of the box body; the cold end of the semiconductor refrigeration chip faces the interior of the box body.

Furthermore, the side wall of the box body is provided with a mounting structure; the mounting structure consists of a fixed plate and a drawing plate; the fixing plate comprises two side plates and a bottom plate; the bottom plate is provided with an upper notch; the drawing plate is provided with a lower notch; the upper notch corresponds to the lower notch, and the upper notch and the lower notch are matched to form a round hole matched with the semiconductor refrigeration chip; the two side plates are provided with slide rails; sliding strips are arranged at the two ends of the drawing plate; the sliding strip is matched with the sliding rail; the semiconductor refrigeration chip is arranged on the round hole.

Furthermore, two clamping pieces are arranged on two sides of the semiconductor refrigeration chip; the bottom plate is provided with two mounting grooves corresponding to the clamping pieces; the two clamping pieces are respectively provided with metal elastic pieces for connecting the anode and the cathode of the semiconductor refrigeration chip; the mounting grooves are respectively provided with conductive elastic sheets corresponding to the metal elastic sheets.

Furthermore, the radiating fins are arranged in a semicircular shape.

Furthermore, the demonstration disc is provided with a bath saline layer, a water inlet, a water outlet and a water pump; the water inlet and the water outlet are communicated through a heat-conducting water pipe; the heat conduction water pipe penetrates through the radiating fin; the water pump drives the bath water to flow in the heat-conducting water pipe.

The utility model has the advantages that: the box body environment is cooled through a semiconductor refrigeration chip. The heat dissipation mechanism is detachably connected with the box body through the mounting structure, and the mounting is convenient. And the liquid in the demonstration disc is utilized to assist in cooling.

Drawings

FIG. 1 is a schematic view of a heat dissipation mechanism and mounting structure;

FIG. 2 is a schematic diagram of the metal spring and the conductive spring;

Detailed Description

An AR projection box with a heat dissipation effect comprises a box body 1, a demonstration disc 2 and a support 3; the box body 1 is connected with the demonstration disc 2 through a bracket 3; the box body 1 corresponds to the demonstration disc 2 and also comprises a heat dissipation mechanism; the heat dissipation mechanism 24 is detachably arranged on the box body 1; the heat dissipation mechanism 4 comprises a cylindrical semiconductor refrigeration chip 41; the heat-emitting end of the semiconductor refrigeration chip is provided with a plurality of radiating fins 42, and the radiating fins 442 are exposed out of the box body 1; the cold end of the semiconductor refrigeration chip 41 faces the interior of the box body 1.

The semiconductor refrigeration chip comprises an N-type semiconductor material and a P-type semiconductor material, when a thermocouple formed by connecting the N-type semiconductor material and the P-type semiconductor material passes through a current, heat transfer can be generated between two ends, the heat can be transferred from one end to the other end, and therefore temperature difference is generated to form a cold end and a hot end.

When the semiconductor refrigeration box is used, only the semiconductor refrigeration chip is needed to be electrified, one end of the semiconductor refrigeration chip is used for refrigerating, the heating end of the semiconductor refrigeration chip assists in heat dissipation through the radiating fins, and the refrigerating end of the semiconductor refrigeration chip is arranged in the box body and used for cooling the box body.

The side wall of the box body 1 is provided with a mounting structure; the mounting structure consists of a fixed plate 11 and a drawing plate 12; the fixing plate 11 comprises two side plates 111 and a bottom plate 112; the bottom plate 112 is provided with an upper notch 1121; the drawing plate 12 is provided with a lower notch 121; the upper notch 1121 and the lower notch 121 correspond to each other, and the upper notch 1121 and the lower notch 121 are matched to form a circular hole matched with the semiconductor refrigeration chip 41; the two side plates 111 are provided with slide rails 1111; the two ends of the drawing plate 12 are provided with sliding strips 122; the slide 122 is matched with the slide 1111; the semiconductor refrigeration chip 41 is arranged on the circular hole.

Two clamping pieces 43 are arranged on two sides of the semiconductor refrigeration chip 41; the bottom plate 112 is provided with two mounting grooves 113 corresponding to the clamping pieces 43; the two clamping pieces 43 are respectively provided with a metal elastic sheet 431 for connecting the anode and the cathode of the semiconductor refrigeration chip; the mounting grooves 113 are respectively provided with conductive elastic pieces 114 corresponding to the metal elastic pieces 431.

When the semiconductor refrigeration chip is installed in the round hole, the clamping piece is matched with the installation groove, so that the semiconductor refrigeration chip is clamped and fixed, the conductive elastic piece is in contact with the metal elastic piece, and the semiconductor refrigeration chip can be started to refrigerate only by electrifying the conductive elastic piece during use. The conductive elastic sheet power supply can be externally connected or internally arranged, the power supply connection is the prior art, and is not marked in the attached drawing of the embodiment.

The radiating fins are arranged in a semicircular shape. The demonstration disc 2 is provided with a bath saline layer 21, a water inlet 22, a water outlet 23 and a water pump; the water inlet 22 and the water outlet 23 are communicated through a heat conducting water pipe 24; the heat conducting water pipe 24 passes through the radiating fins 42; the water pump drives the bath water 21 to flow in the heat conducting water pipe 24.

The demonstration dish adopts the bath salt aqueous layer, because the bath salt aqueous layer is milk white, can regard as the cloth curtain of projection to use, leads into the heat conduction water pipe with the circulation of bath salt aqueous layer in this embodiment and can assist the fin heat dissipation.

Claims

1. An AR projection box with a heat dissipation effect comprises a box body, a demonstration disc and a support; the box body is connected with the demonstration disc through a bracket; the box body corresponds to the demonstration disc and is characterized by also comprising a heat dissipation mechanism; the heat dissipation mechanism is detachably arranged on the box body; the heat dissipation mechanism comprises a cylindrical semiconductor refrigeration chip; the heat-emitting end of the semiconductor refrigeration chip is provided with a plurality of radiating fins, and the radiating fins are exposed out of the box body; the cold end of the semiconductor refrigeration chip faces the interior of the box body.

2. The projection cabinet of claim 1, wherein the cabinet side walls are provided with mounting structures; the mounting structure consists of a fixed plate and a drawing plate; the fixing plate comprises two side plates and a bottom plate; the bottom plate is provided with an upper notch; the drawing plate is provided with a lower notch; the upper notch corresponds to the lower notch, and the upper notch and the lower notch are matched to form a round hole matched with the semiconductor refrigeration chip; the two side plates are provided with slide rails; sliding strips are arranged at the two ends of the drawing plate; the sliding strip is matched with the sliding rail; the semiconductor refrigeration chip is arranged on the round hole.

3. The projection box of claim 2, wherein two clamping pieces are arranged on two sides of the semiconductor refrigeration chip; the bottom plate is provided with two mounting grooves corresponding to the clamping pieces; the two clamping pieces are respectively provided with metal elastic pieces for connecting the anode and the cathode of the semiconductor refrigeration chip; the mounting grooves are respectively provided with conductive elastic sheets corresponding to the metal elastic sheets.

4. The projection cabinet of claim 1, wherein the fins are arranged in a semicircular pattern.

5. The projection cabinet of claim 1, wherein the demonstration tray is provided with a bath saline layer, a water inlet, a water outlet and a water pump; the water inlet and the water outlet are communicated through a heat-conducting water pipe; the heat conduction water pipe penetrates through the radiating fin; the water pump drives the bath water to flow in the heat-conducting water pipe.