CN215073581U - Heat sink of domain controller - Google Patents
Heat sink of domain controller Download PDFInfo
- Publication number
- CN215073581U CN215073581U CN202120824478.1U CN202120824478U CN215073581U CN 215073581 U CN215073581 U CN 215073581U CN 202120824478 U CN202120824478 U CN 202120824478U CN 215073581 U CN215073581 U CN 215073581U
- Authority
- CN
- China
- Prior art keywords
- domain controller
- heat
- semiconductor
- assembly
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Embodiments of the present disclosure disclose a heat sink of a domain controller. One embodiment of the method comprises: the device comprises a cold accumulation component, a radiating fin and a plurality of semiconductor refrigeration components arranged between the cold accumulation component and the radiating fin, wherein the cold accumulation component is connected with a domain controller and is used for accumulating and transmitting heat of the domain controller; the semiconductor refrigeration component is used for cooling the heat transferred by the cold accumulation component and is electrically connected with the domain controller; under the working state, the domain controller regulates the refrigerating capacity of the semiconductor refrigerating assembly by controlling the current. The embodiment realizes the active temperature adjusting function and improves the heat radiating efficiency. Meanwhile, the heat dissipation device is simple in structure and convenient to maintain and disassemble.
Description
Technical Field
The embodiment of the disclosure relates to the technical field of heat dissipation, in particular to a heat dissipation device of a domain controller.
Background
The related domain controller usually adopts a complex multi-core heterogeneous chip as a main operation unit so as to meet the computational power requirement of the algorithm. And further causes the heat productivity of the chip to be larger.
The traditional passive heat dissipation mode can not meet the heat dissipation requirement of a domain controller with high computation power and high heat productivity. Meanwhile, the traditional water cooling system has low efficiency, complex disassembly and assembly and easy liquid leakage to cause scrapping.
Accordingly, there is a need in the art for a new heat sink that solves the above problems.
SUMMERY OF THE UTILITY MODEL
This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
Some embodiments of the present disclosure provide a heat dissipation apparatus for a domain controller to solve the technical problems mentioned in the above background section.
The heat dissipation device comprises a cold accumulation component, a heat dissipation sheet and a plurality of semiconductor refrigeration components arranged between the cold accumulation component and the heat dissipation sheet, wherein the cold accumulation component is connected with a domain controller and is used for accumulating and transferring heat of the domain controller; the semiconductor refrigeration component is used for cooling the heat transferred by the cold accumulation component and is electrically connected with the domain controller; under the working state, the domain controller regulates the refrigerating capacity of the semiconductor refrigerating assembly by controlling the current.
In some embodiments, the semiconductor cooling module includes a plurality of cooling units, each of the cooling units includes an N-type semiconductor element and a P-type semiconductor element having first ends connected to each other, a second end of the P-type semiconductor element is connected to a second end of an N-type semiconductor element of an adjacent cooling unit, a second end of an upstream-most N-type semiconductor element is connected to a positive power supply terminal provided to the domain controller, and a second end of a downstream-most P-type semiconductor element is connected to a negative power supply terminal, so that a heat absorption terminal and a heat dissipation terminal are formed at the first and second ends of the semiconductor cooling module.
In some embodiments, the first and second ends of the semiconductor refrigeration assembly are provided with insulating ceramics.
In some embodiments, the first end of the semiconductor refrigeration component is disposed toward the cold storage component.
In some embodiments, the cold storage assembly is provided with a first fin towards the semiconductor refrigeration assembly; the radiating fin is provided with a second fin which deviates from the semiconductor refrigerating component.
In some embodiments, the first fin is provided with a base, and the base is detachably connected with the semiconductor refrigeration assembly.
In some embodiments, the cold storage assembly and the heat sink are provided with temperature sensors connected to the domain controller, and the domain controller controls the current to adjust the cooling capacity of the semiconductor cooling assembly in response to the temperature detected by the temperature sensors exceeding a preset threshold.
The above embodiments of the present disclosure have the following advantages: through the heat abstractor of some embodiments of this disclosure's domain controller, can realize the initiative function of adjusting the temperature, improve the radiating efficiency. Meanwhile, the heat dissipation device is simple in structure and convenient to maintain and disassemble. Specifically, the semiconductor refrigeration assembly is electrically connected with a domain controller, and the domain controller can adapt the capacity of the semiconductor refrigeration assembly for active refrigeration through the Peltier effect by adjusting the current. Compared with the traditional passive heat dissipation mode, the heat dissipation device is higher in heat dissipation efficiency, and meanwhile, the refrigerating capacity can be adjusted more pertinently, so that the power consumption is more reasonable. Compared with a water cooling system, the heat dissipation device is safer, and avoids faults caused by liquid leakage.
Drawings
The above and other features, advantages and aspects of various embodiments of the present disclosure will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. Throughout the drawings, the same or similar reference numbers refer to the same or similar elements. It should be understood that the drawings are schematic and that elements and features are not necessarily drawn to scale.
Fig. 1 is an exploded schematic view of some embodiments of a heat sink of a domain controller according to the present disclosure;
FIG. 2 is a cross-sectional view of some embodiments of a heat sink of a domain controller according to the present disclosure;
fig. 3 is a schematic structural view of a semiconductor cooling assembly of a heat sink of a domain controller according to the present disclosure.
Detailed Description
Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present disclosure are shown in the drawings, it is to be understood that the disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided for a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the disclosure are for illustration purposes only and are not intended to limit the scope of the disclosure.
It should be noted that, for convenience of description, only the relevant portions of the related inventions are shown in the drawings. The embodiments and features of the embodiments in the present disclosure may be combined with each other without conflict.
It should be noted that the terms "first", "second", and the like in the present disclosure are only used for distinguishing different devices, modules or units, and are not used for limiting the order or interdependence relationship of the functions performed by the devices, modules or units.
It is noted that references to "a", "an", and "the" modifications in this disclosure are intended to be illustrative rather than limiting, and that those skilled in the art will recognize that "one or more" may be used unless the context clearly dictates otherwise.
The names of messages or information exchanged between devices in the embodiments of the present disclosure are for illustrative purposes only, and are not intended to limit the scope of the messages or information.
The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Referring first to fig. 1, fig. 1 is an exploded view of some embodiments of a heat dissipation device of a domain controller according to the present disclosure. Fig. 2 is a cross-sectional view of some embodiments of a heat sink of a domain controller according to the present disclosure. As shown in fig. 1 and 2, the heat dissipating device of the domain controller includes a cold storage module 2, 3 semiconductor refrigeration modules 3, and heat sinks 4 stacked on the domain controller 1. The above components may be connected by thermally conductive silicone grease. Although the above-mentioned semiconductor cooling assemblies in the drawings are illustrated as 3, this is not the only one, and those skilled in the art can make adjustments to the number of semiconductor cooling assemblies without departing from the scope of the present disclosure.
The cold storage module 2 is connected to the domain controller 1 for storing and transferring heat of the domain controller 1. As an example, the cold storage assembly may be provided with a case and a cold storage agent for releasing cold in a high temperature state while transferring heat generated from the domain controller.
Optionally, the upper end (the end facing the semiconductor refrigeration component) of the cold storage component 2 is provided with a first fin, so as to improve the heat dissipation efficiency.
Continuing to refer to fig. 1 and 2, a base 21 is disposed on the first fin, and the base 21 is used to connect with the semiconductor cooling device 3. By way of example, the base can be provided with a connecting hole, and a connecting pin is arranged at the bottom of the semiconductor refrigeration assembly. In an assembled state, the connecting pin is detachably inserted into the connecting hole. Thereby making the semiconductor refrigeration assembly easier to install and replace.
Referring next to fig. 3, fig. 3 is a schematic structural diagram of a semiconductor cooling module of a heat dissipation device of a domain controller according to the present disclosure. As shown in fig. 3, the semiconductor refrigeration assembly 3 includes two sets of refrigeration units. Each refrigeration unit comprises an N-type semiconductor element 31 and a P-type semiconductor element 32. In the refrigeration unit, the first end (upper end shown in fig. 3) of the N-type semiconductor element 31 and the first end of the P-type semiconductor element 32 are connected by a conductive member 37. The conductive member 37 may be a copper sheet or the like. The second end (lower end shown in fig. 3) of the P-type semiconductor element 32 and the second end of the N-type semiconductor element 33 in the adjacent refrigeration unit are connected by a conductive member 37. In the assembled state, the second end of the N-type semiconductor element 31 of the refrigeration unit at the most upstream (leftmost end shown in fig. 3) is connected to the positive power supply. The second end of the P-type semiconductor element 34 of the most downstream refrigeration unit is connected to the negative pole of the power supply. The above power supply may be configured by the domain controller 1. The semiconductor refrigeration assembly is connected through a lead. During the energization, since the work of overflow of the N-type semiconductor element 31 and the P-type semiconductor element 32 is different, a peltier phenomenon occurs in the process of passing a current from the N-type semiconductor element 31 to the P-type semiconductor element 32, and a heat absorption phenomenon occurs at the first end (upper end shown in fig. 3) of the semiconductor cooling module 3. When current flows from the P-type semiconductor device 32 to the N-type semiconductor device 33, a heat dissipation phenomenon occurs at the second end (the lower end shown in fig. 3) of the semiconductor cooling module 3. Thereby forming a cold end at the first end of semiconductor refrigeration assembly 3 and a hot end at the second end of semiconductor refrigeration assembly 3. The cold end is disposed toward the cold storage module 2 so that the heat generated by the domain controller 1 can be cooled. It should be noted that, although fig. 3 illustrates two refrigeration units as an example, this is not the only one. The number of refrigeration units can be adjusted by the skilled person according to the actual situation.
Optionally, the first and second ends of the semiconductor refrigeration assembly may also be provided with insulating ceramics (36, 36 shown in fig. 3) that perform the insulating and heat dissipating functions.
The heat sink 4 can transmit heat generated at the second end of the semiconductor refrigeration assembly, so as to realize a heat dissipation effect. Alternatively, the upper end (end facing away from the domain controller) of the heat sink 4 may be provided with a second fin.
Further, temperature sensors (not shown in the drawings) may also be provided on the cold storage package 2 and the heat sink 4. The temperature sensor is connected to the domain controller 1. The temperature sensor is used for detecting temperature information of the cold storage component 2 and the heat sink 4. When the temperature represented by the temperature information detected by the temperature sensor exceeds a preset threshold, the domain controller 1 can control the power supply to adjust the current output to the semiconductor refrigeration component 3, so as to adjust the refrigeration capacity of the refrigeration unit. The heat dissipation device is higher in heat dissipation efficiency, meanwhile, the refrigerating capacity can be adjusted more pertinently, and the power consumption is more reasonable. The preset threshold value may be determined through repeated experiments. The adjustment can be carried out by a person skilled in the art according to the actual situation.
The heat sink of the domain controller according to the present disclosure can actively cool heat generated by the domain controller by the peltier effect generated by the N-type semiconductor element and the P-type semiconductor element of the refrigeration unit when a current flows therethrough. The heat dissipation capability is improved.
Meanwhile, the temperature sensors are arranged on the cold accumulation assembly and the cooling fins, so that the current generated by the power supply can be adjusted by the domain controller according to the temperature information collected by the temperature sensors, and the refrigerating capacity of the refrigerating unit is adjusted. Thereby improving the flexibility and intelligence degree of the heat dissipation device. The power consumption is reduced, and the reliability of the heat dissipation device is improved.
The foregoing description is only exemplary of the preferred embodiments of the disclosure and is illustrative of the principles of the technology employed. It will be understood by those skilled in the art that the scope of the invention in the embodiments of the present disclosure is not limited to the specific combinations of the above-mentioned features, but also covers other embodiments formed by any combination of the above-mentioned features or their equivalents without departing from the spirit of the present disclosure. For example, the above features and (but not limited to) technical features with similar functions disclosed in the embodiments of the present disclosure are mutually replaced to form the technical solution.
Claims (7)
1. A heat dissipating device for a domain controller, comprising a cold storage module, a heat dissipating fin, and a plurality of semiconductor cooling modules interposed between the cold storage module and the heat dissipating fin, which are stacked, wherein,
the cold accumulation assembly is connected with the domain controller and is used for accumulating and transferring heat of the domain controller;
the semiconductor refrigeration component is used for cooling the heat transferred by the cold accumulation component and is electrically connected with the domain controller;
under the working state, the domain controller adjusts the refrigerating capacity of the semiconductor refrigerating assembly by controlling the current.
2. The heat dissipating device of claim 1, wherein the semiconductor cooling module comprises a plurality of cooling units, the cooling units comprising N-type semiconductor elements and P-type semiconductor elements connected at first ends, a second end of the P-type semiconductor element being connected to a second end of an N-type semiconductor element of an adjacent cooling unit, a second end of the most upstream N-type semiconductor element being connected to a positive power supply provided to the domain controller, and a second end of the most downstream P-type semiconductor element being connected to a negative power supply, thereby forming a heat absorbing end and a heat releasing end at the first and second ends of the semiconductor cooling module.
3. The heat sink of claim 2, wherein the first and second ends of the semiconductor refrigeration assembly are provided with insulating ceramics.
4. The heat dissipation device of claim 3, wherein the first end of the semiconductor refrigeration component is disposed toward the cold storage component.
5. The heat dissipating device of claim 4, wherein the cold storage assembly is provided with first fins towards the semiconductor refrigeration assembly; and a second fin is arranged on the radiating fin away from the semiconductor refrigeration component.
6. The heat dissipation device of claim 5, wherein the first fins have pedestals disposed thereon, the pedestals being removably coupled to the semiconductor refrigeration assembly.
7. The heat sink device as claimed in claim 6, wherein a temperature sensor connected to the domain controller is disposed on the cold storage assembly and the heat sink, and the domain controller controls the current to adjust the cooling capacity of the semiconductor cooling assembly in response to the temperature detected by the temperature sensor exceeding a preset threshold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120824478.1U CN215073581U (en) | 2021-04-21 | 2021-04-21 | Heat sink of domain controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120824478.1U CN215073581U (en) | 2021-04-21 | 2021-04-21 | Heat sink of domain controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215073581U true CN215073581U (en) | 2021-12-07 |
Family
ID=79111818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120824478.1U Active CN215073581U (en) | 2021-04-21 | 2021-04-21 | Heat sink of domain controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215073581U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114954288A (en) * | 2022-05-30 | 2022-08-30 | 禾多科技（北京）有限公司 | Central domain controller and vehicle |
-
2021
- 2021-04-21 CN CN202120824478.1U patent/CN215073581U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114954288A (en) * | 2022-05-30 | 2022-08-30 | 禾多科技（北京）有限公司 | Central domain controller and vehicle |
| CN114954288B (en) * | 2022-05-30 | 2023-05-23 | 禾多科技（北京）有限公司 | Central domain controller and vehicle |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108390123B (en) | Power battery package thermal management system and car | |
| CN103199316A (en) | Battery pack and heat radiation structure thereof | |
| CN102315585A (en) | Air-cooling and heat-radiating device for high-power semiconductor laser module | |
| CN215073581U (en) | Heat sink of domain controller | |
| CN105281198A (en) | Thermal management device of semiconductor laser | |
| CN105759923A (en) | Separating type radiating device and method for closed industrial computer | |
| CN102299614A (en) | Semiconductor-refrigeration-based inverter radiating system | |
| CN112256113A (en) | Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration | |
| CN102193604B (en) | Heat-radiation circuit of CPU (Central Processing Unit) | |
| CN215187032U (en) | Heat dissipation base and electronic equipment assembly | |
| CN215068111U (en) | Heat dissipation base for notebook computer | |
| CN212362489U (en) | Heat radiator using semiconductor refrigeration | |
| CN213280441U (en) | Thermoelectric refrigerating device for electronic equipment and electronic equipment | |
| CN112038745B (en) | Active phased array radar antenna array surface autonomous heat dissipation device based on Peltier effect | |
| CN210986789U (en) | Multimedia host computer heat abstractor, multimedia host computer and vehicle | |
| CN210129217U (en) | Refrigerating system capable of monitoring power consumption immediately | |
| CN213545202U (en) | Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration | |
| KR20090089512A (en) | A heat exchanger using thermoelectric modules | |
| CN212517238U (en) | Uniform-temperature semiconductor refrigerating piece | |
| CN218851204U (en) | Heat dissipation module and refrigerating device | |
| CN110289246B (en) | Self-refrigeration method and device for interior of IGBT module | |
| CN221304798U (en) | Integrated semiconductor cold plate | |
| CN220274140U (en) | TEC auxiliary water-cooling heat dissipation device for pouring sealant electronic equipment | |
| CN213340350U (en) | Accurate temperature control structure of high-power chip | |
| CN216135037U (en) | Intelligent energy-saving fish tank |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 201, 202, 301, No. 56-4 Fenghuang South Road, Huadu District, Guangzhou City, Guangdong Province, 510806 Patentee after: Heduo Technology (Guangzhou) Co.,Ltd. Address before: 100099 101-15, 3rd floor, building 9, yard 55, zique Road, Haidian District, Beijing Patentee before: HOLOMATIC TECHNOLOGY (BEIJING) Co.,Ltd. |
|
| CP03 | Change of name, title or address |