CN215073581U - Cooling for Domain Controllers - Google Patents
Cooling for Domain Controllers Download PDFInfo
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- CN215073581U CN215073581U CN202120824478.1U CN202120824478U CN215073581U CN 215073581 U CN215073581 U CN 215073581U CN 202120824478 U CN202120824478 U CN 202120824478U CN 215073581 U CN215073581 U CN 215073581U
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- domain controller
- semiconductor refrigeration
- heat
- heat dissipation
- assembly
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- 238000001816 cooling Methods 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 claims abstract description 75
- 238000005057 refrigeration Methods 0.000 claims abstract description 49
- 230000017525 heat dissipation Effects 0.000 claims abstract description 33
- 238000000429 assembly Methods 0.000 claims abstract description 4
- 230000000712 assembly Effects 0.000 claims abstract description 4
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000004044 response Effects 0.000 claims description 2
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 2
- 230000033228 biological regulation Effects 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 abstract 1
- 238000009825 accumulation Methods 0.000 description 5
- 230000005679 Peltier effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
本公开的实施例公开了域控制器的散热装置。该方法的一具体实施方式包括：叠置的蓄冷组件、散热片和设置到上述蓄冷组件和散热片之间的多个半导体制冷组件，其中，上述蓄冷组件与域控制器连接，用于积蓄和传递上述域控制器的热量；上述半导体制冷组件用于冷却上述蓄冷组件传递的热量，上述半导体制冷组件与上述域控制器电连接；在工作状态下，上述域控制器通过控制电流以调节上述半导体制冷组件的制冷能力。该实施方式实现主动调温功能，提高散热效率。同时该散热装置结构简单，便于维修与拆卸。
Embodiments of the present disclosure disclose a cooling device for a domain controller. A specific embodiment of the method includes: a stacked cool storage assembly, a heat sink, and a plurality of semiconductor refrigeration assemblies disposed between the cool storage assembly and the heat sink, wherein the cool storage assembly is connected to a domain controller for accumulating and Transfer the heat of the above-mentioned domain controller; the above-mentioned semiconductor refrigeration component is used to cool the heat transmitted by the above-mentioned cold storage component, and the above-mentioned semiconductor refrigeration component is electrically connected with the above-mentioned domain controller; in the working state, the above-mentioned domain controller controls the current to adjust the above-mentioned semiconductor The cooling capacity of the cooling component. This embodiment implements an active temperature regulation function and improves heat dissipation efficiency. At the same time, the structure of the heat dissipation device is simple, which is convenient for maintenance and disassembly.
Description
Technical Field
The embodiment of the disclosure relates to the technical field of heat dissipation, in particular to a heat dissipation device of a domain controller.
Background
The related domain controller usually adopts a complex multi-core heterogeneous chip as a main operation unit so as to meet the computational power requirement of the algorithm. And further causes the heat productivity of the chip to be larger.
The traditional passive heat dissipation mode can not meet the heat dissipation requirement of a domain controller with high computation power and high heat productivity. Meanwhile, the traditional water cooling system has low efficiency, complex disassembly and assembly and easy liquid leakage to cause scrapping.
Accordingly, there is a need in the art for a new heat sink that solves the above problems.
SUMMERY OF THE UTILITY MODEL
This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
Some embodiments of the present disclosure provide a heat dissipation apparatus for a domain controller to solve the technical problems mentioned in the above background section.
The heat dissipation device comprises a cold accumulation component, a heat dissipation sheet and a plurality of semiconductor refrigeration components arranged between the cold accumulation component and the heat dissipation sheet, wherein the cold accumulation component is connected with a domain controller and is used for accumulating and transferring heat of the domain controller; the semiconductor refrigeration component is used for cooling the heat transferred by the cold accumulation component and is electrically connected with the domain controller; under the working state, the domain controller regulates the refrigerating capacity of the semiconductor refrigerating assembly by controlling the current.
In some embodiments, the semiconductor cooling module includes a plurality of cooling units, each of the cooling units includes an N-type semiconductor element and a P-type semiconductor element having first ends connected to each other, a second end of the P-type semiconductor element is connected to a second end of an N-type semiconductor element of an adjacent cooling unit, a second end of an upstream-most N-type semiconductor element is connected to a positive power supply terminal provided to the domain controller, and a second end of a downstream-most P-type semiconductor element is connected to a negative power supply terminal, so that a heat absorption terminal and a heat dissipation terminal are formed at the first and second ends of the semiconductor cooling module.
In some embodiments, the first and second ends of the semiconductor refrigeration assembly are provided with insulating ceramics.
In some embodiments, the first end of the semiconductor refrigeration component is disposed toward the cold storage component.
In some embodiments, the cold storage assembly is provided with a first fin towards the semiconductor refrigeration assembly; the radiating fin is provided with a second fin which deviates from the semiconductor refrigerating component.
In some embodiments, the first fin is provided with a base, and the base is detachably connected with the semiconductor refrigeration assembly.
In some embodiments, the cold storage assembly and the heat sink are provided with temperature sensors connected to the domain controller, and the domain controller controls the current to adjust the cooling capacity of the semiconductor cooling assembly in response to the temperature detected by the temperature sensors exceeding a preset threshold.
The above embodiments of the present disclosure have the following advantages: through the heat abstractor of some embodiments of this disclosure's domain controller, can realize the initiative function of adjusting the temperature, improve the radiating efficiency. Meanwhile, the heat dissipation device is simple in structure and convenient to maintain and disassemble. Specifically, the semiconductor refrigeration assembly is electrically connected with a domain controller, and the domain controller can adapt the capacity of the semiconductor refrigeration assembly for active refrigeration through the Peltier effect by adjusting the current. Compared with the traditional passive heat dissipation mode, the heat dissipation device is higher in heat dissipation efficiency, and meanwhile, the refrigerating capacity can be adjusted more pertinently, so that the power consumption is more reasonable. Compared with a water cooling system, the heat dissipation device is safer, and avoids faults caused by liquid leakage.
Drawings
The above and other features, advantages and aspects of various embodiments of the present disclosure will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. Throughout the drawings, the same or similar reference numbers refer to the same or similar elements. It should be understood that the drawings are schematic and that elements and features are not necessarily drawn to scale.
Fig. 1 is an exploded schematic view of some embodiments of a heat sink of a domain controller according to the present disclosure;
FIG. 2 is a cross-sectional view of some embodiments of a heat sink of a domain controller according to the present disclosure;
fig. 3 is a schematic structural view of a semiconductor cooling assembly of a heat sink of a domain controller according to the present disclosure.
Detailed Description
Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present disclosure are shown in the drawings, it is to be understood that the disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided for a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the disclosure are for illustration purposes only and are not intended to limit the scope of the disclosure.
It should be noted that, for convenience of description, only the relevant portions of the related inventions are shown in the drawings. The embodiments and features of the embodiments in the present disclosure may be combined with each other without conflict.
It should be noted that the terms "first", "second", and the like in the present disclosure are only used for distinguishing different devices, modules or units, and are not used for limiting the order or interdependence relationship of the functions performed by the devices, modules or units.
It is noted that references to "a", "an", and "the" modifications in this disclosure are intended to be illustrative rather than limiting, and that those skilled in the art will recognize that "one or more" may be used unless the context clearly dictates otherwise.
The names of messages or information exchanged between devices in the embodiments of the present disclosure are for illustrative purposes only, and are not intended to limit the scope of the messages or information.
The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Referring first to fig. 1, fig. 1 is an exploded view of some embodiments of a heat dissipation device of a domain controller according to the present disclosure. Fig. 2 is a cross-sectional view of some embodiments of a heat sink of a domain controller according to the present disclosure. As shown in fig. 1 and 2, the heat dissipating device of the domain controller includes a cold storage module 2, 3 semiconductor refrigeration modules 3, and heat sinks 4 stacked on the domain controller 1. The above components may be connected by thermally conductive silicone grease. Although the above-mentioned semiconductor cooling assemblies in the drawings are illustrated as 3, this is not the only one, and those skilled in the art can make adjustments to the number of semiconductor cooling assemblies without departing from the scope of the present disclosure.
The cold storage module 2 is connected to the domain controller 1 for storing and transferring heat of the domain controller 1. As an example, the cold storage assembly may be provided with a case and a cold storage agent for releasing cold in a high temperature state while transferring heat generated from the domain controller.
Optionally, the upper end (the end facing the semiconductor refrigeration component) of the cold storage component 2 is provided with a first fin, so as to improve the heat dissipation efficiency.
Continuing to refer to fig. 1 and 2, a base 21 is disposed on the first fin, and the base 21 is used to connect with the semiconductor cooling device 3. By way of example, the base can be provided with a connecting hole, and a connecting pin is arranged at the bottom of the semiconductor refrigeration assembly. In an assembled state, the connecting pin is detachably inserted into the connecting hole. Thereby making the semiconductor refrigeration assembly easier to install and replace.
Referring next to fig. 3, fig. 3 is a schematic structural diagram of a semiconductor cooling module of a heat dissipation device of a domain controller according to the present disclosure. As shown in fig. 3, the semiconductor refrigeration assembly 3 includes two sets of refrigeration units. Each refrigeration unit comprises an N-type semiconductor element 31 and a P-type semiconductor element 32. In the refrigeration unit, the first end (upper end shown in fig. 3) of the N-type semiconductor element 31 and the first end of the P-type semiconductor element 32 are connected by a conductive member 37. The conductive member 37 may be a copper sheet or the like. The second end (lower end shown in fig. 3) of the P-type semiconductor element 32 and the second end of the N-type semiconductor element 33 in the adjacent refrigeration unit are connected by a conductive member 37. In the assembled state, the second end of the N-type semiconductor element 31 of the refrigeration unit at the most upstream (leftmost end shown in fig. 3) is connected to the positive power supply. The second end of the P-type semiconductor element 34 of the most downstream refrigeration unit is connected to the negative pole of the power supply. The above power supply may be configured by the domain controller 1. The semiconductor refrigeration assembly is connected through a lead. During the energization, since the work of overflow of the N-type semiconductor element 31 and the P-type semiconductor element 32 is different, a peltier phenomenon occurs in the process of passing a current from the N-type semiconductor element 31 to the P-type semiconductor element 32, and a heat absorption phenomenon occurs at the first end (upper end shown in fig. 3) of the semiconductor cooling module 3. When current flows from the P-type semiconductor device 32 to the N-type semiconductor device 33, a heat dissipation phenomenon occurs at the second end (the lower end shown in fig. 3) of the semiconductor cooling module 3. Thereby forming a cold end at the first end of semiconductor refrigeration assembly 3 and a hot end at the second end of semiconductor refrigeration assembly 3. The cold end is disposed toward the cold storage module 2 so that the heat generated by the domain controller 1 can be cooled. It should be noted that, although fig. 3 illustrates two refrigeration units as an example, this is not the only one. The number of refrigeration units can be adjusted by the skilled person according to the actual situation.
Optionally, the first and second ends of the semiconductor refrigeration assembly may also be provided with insulating ceramics (36, 36 shown in fig. 3) that perform the insulating and heat dissipating functions.
The heat sink 4 can transmit heat generated at the second end of the semiconductor refrigeration assembly, so as to realize a heat dissipation effect. Alternatively, the upper end (end facing away from the domain controller) of the heat sink 4 may be provided with a second fin.
Further, temperature sensors (not shown in the drawings) may also be provided on the cold storage package 2 and the heat sink 4. The temperature sensor is connected to the domain controller 1. The temperature sensor is used for detecting temperature information of the cold storage component 2 and the heat sink 4. When the temperature represented by the temperature information detected by the temperature sensor exceeds a preset threshold, the domain controller 1 can control the power supply to adjust the current output to the semiconductor refrigeration component 3, so as to adjust the refrigeration capacity of the refrigeration unit. The heat dissipation device is higher in heat dissipation efficiency, meanwhile, the refrigerating capacity can be adjusted more pertinently, and the power consumption is more reasonable. The preset threshold value may be determined through repeated experiments. The adjustment can be carried out by a person skilled in the art according to the actual situation.
The heat sink of the domain controller according to the present disclosure can actively cool heat generated by the domain controller by the peltier effect generated by the N-type semiconductor element and the P-type semiconductor element of the refrigeration unit when a current flows therethrough. The heat dissipation capability is improved.
Meanwhile, the temperature sensors are arranged on the cold accumulation assembly and the cooling fins, so that the current generated by the power supply can be adjusted by the domain controller according to the temperature information collected by the temperature sensors, and the refrigerating capacity of the refrigerating unit is adjusted. Thereby improving the flexibility and intelligence degree of the heat dissipation device. The power consumption is reduced, and the reliability of the heat dissipation device is improved.
The foregoing description is only exemplary of the preferred embodiments of the disclosure and is illustrative of the principles of the technology employed. It will be understood by those skilled in the art that the scope of the invention in the embodiments of the present disclosure is not limited to the specific combinations of the above-mentioned features, but also covers other embodiments formed by any combination of the above-mentioned features or their equivalents without departing from the spirit of the present disclosure. For example, the above features and (but not limited to) technical features with similar functions disclosed in the embodiments of the present disclosure are mutually replaced to form the technical solution.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120824478.1U CN215073581U (en) | 2021-04-21 | 2021-04-21 | Cooling for Domain Controllers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120824478.1U CN215073581U (en) | 2021-04-21 | 2021-04-21 | Cooling for Domain Controllers |
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| Publication Number | Publication Date |
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| CN215073581U true CN215073581U (en) | 2021-12-07 |
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| CN202120824478.1U Active CN215073581U (en) | 2021-04-21 | 2021-04-21 | Cooling for Domain Controllers |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114585238A (en) * | 2022-03-28 | 2022-06-03 | 南昌黑鲨科技有限公司 | Cooling system, mobile terminal and control circuit |
| CN114954288A (en) * | 2022-05-30 | 2022-08-30 | 禾多科技（北京）有限公司 | Central domain controller and vehicle |
-
2021
- 2021-04-21 CN CN202120824478.1U patent/CN215073581U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114585238A (en) * | 2022-03-28 | 2022-06-03 | 南昌黑鲨科技有限公司 | Cooling system, mobile terminal and control circuit |
| CN114954288A (en) * | 2022-05-30 | 2022-08-30 | 禾多科技（北京）有限公司 | Central domain controller and vehicle |
| CN114954288B (en) * | 2022-05-30 | 2023-05-23 | 禾多科技（北京）有限公司 | Central domain controller and vehicle |
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Address after: 201, 202, 301, No. 56-4 Fenghuang South Road, Huadu District, Guangzhou City, Guangdong Province, 510806 Patentee after: Heduo Technology (Guangzhou) Co.,Ltd. Address before: 100099 101-15, 3rd floor, building 9, yard 55, zique Road, Haidian District, Beijing Patentee before: HOLOMATIC TECHNOLOGY (BEIJING) Co.,Ltd. |
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Effective date of registration: 20250121 Granted publication date: 20211207 |