CN114585238A - Cooling system, mobile terminal and control circuit - Google Patents

Abstract

The invention relates to the technical field of terminal heat dissipation, in particular to a heat dissipation system, a mobile terminal and a control circuit. Comprises a shell, a heat dissipation component and a control panel; the shell comprises a first component, a second component and a third component; one end of the second component is connected with one end of the first component, one end of the third component is connected with the other end of the first component, and the second component is not connected with the other end of the third component, so that the first component, the second component and the third component are surrounded to form a heat dissipation space with an opening; the heat dissipation assembly and the control board are arranged in the heat dissipation space; the heat dissipation assembly comprises a heat dissipation sheet and a refrigerating piece which is composed of at least two semiconductor refrigerating chips; one side of the cooling fin is connected with one side of the refrigeration piece, and when the cooling component is arranged in the cooling space, the other side of the refrigeration piece faces the opening of the cooling space and is in contact with the mobile terminal needing to be cooled and then cools the mobile terminal. The cooling system with higher cooling amplitude is provided.

Description

Cooling system, mobile terminal and control circuit

Technical Field

The invention relates to the technical field of terminal heat dissipation, in particular to a heat dissipation system, a mobile terminal and a control circuit.

Background

With the progress of science and technology, a mobile terminal is almost a necessary tool for each adult, but a mobile terminal or a chip of the mobile terminal generates partial heat when running, and if the partial heat cannot be timely dissipated after the partial heat is generated by the mobile terminal or the chip of the mobile terminal, the temperature of the mobile terminal and the chip of the mobile terminal is higher and higher in the process of continuously using the mobile terminal, and the temperature of the mobile terminal and the temperature of the chip of the mobile terminal are overhigh, the running speed of the mobile terminal and the chip of the mobile terminal is seriously influenced, so that in order to overcome the influence caused by overhigh temperature of the mobile terminal and the chip of the mobile terminal, the prior art provides a heat dissipation system, wherein the heat dissipation system in the prior art comprises a shell, the shell forms a heat dissipation space, and a semiconductor refrigeration chip and a heat dissipation fin are arranged in the heat dissipation space, the mobile terminal or the chip of the mobile terminal which needs to be cooled is connected with one end of the semiconductor refrigeration chip, the other end of the semiconductor refrigeration chip is connected with one end of the radiating fin, the other end of the radiating fin is in contact area with air through a tooth shape, the working principle of the semiconductor refrigeration chip is heat transfer cooling, the temperature transferred to the radiating fin can be quickly taken away by the air by increasing the contact area of the radiating fin and the air, the heat dissipation space of the shell is distributed, and the mobile terminal and the chip of the mobile terminal are kept at lower temperature. However, in the existing heat dissipation system, only one semiconductor refrigeration chip is included, so that the heat dissipation efficiency of the existing heat dissipation system is low, and the cooling amplitude is not high, so that partial heat can remain on the heat-dissipated mobile terminal or the chip of the mobile terminal, and the regulation and control of the cooling efficiency cannot be realized.

In summary, the technical problem actually solved by the present invention is how to provide a heat dissipation system with a higher cooling range.

Disclosure of Invention

In order to overcome the technical defects, the invention aims to provide a heat dissipation system, a mobile terminal and a control circuit, and provides a heat dissipation system with a higher cooling range.

The invention discloses a heat dissipation system, which is applied to a mobile terminal and comprises a shell, a heat dissipation assembly and a control panel; the shell comprises a first component, a second component and a third component; one end of the second component is connected with one end of the first component, one end of the third component is connected with the other end of the first component, and the second component is not connected with the other end of the third component, so that the first component, the second component and the third component are surrounded to form a heat dissipation space with an opening; the heat dissipation assembly and the control board are arranged in the heat dissipation space; the heat dissipation assembly comprises a heat dissipation sheet and a refrigerating piece which is composed of at least two semiconductor refrigerating chips; one side of the cooling fin is connected with one side of the refrigeration piece, and when the cooling component is arranged in the cooling space, the other side of the refrigeration piece faces the opening of the cooling space and is in contact with the mobile terminal needing to be cooled and then cools the mobile terminal.

Preferably, the first assembly, the second assembly, the third assembly and the control panel are respectively provided with a ventilation opening.

Preferably, when the heat dissipation assembly is arranged in the heat dissipation space, the heat dissipation assembly does not contact the first assembly, the second assembly and the third assembly respectively.

Preferably, when the heat dissipation assembly and the control panel are arranged in the heat dissipation space, the heat dissipation assembly, the control panel and the first assembly are sequentially stacked.

Preferably, the radiating fin comprises a radiating base plate and a plurality of radiating fins, the radiating fins are respectively arranged on the same surface of the radiating base plate, and the opposite surface of the radiating base plate, which is provided with the radiating fins, is connected with one surface of the refrigerating piece.

Preferably, the refrigeration member comprises: the semiconductor refrigeration device comprises a first semiconductor refrigeration chip, a second semiconductor refrigeration chip, a first heat conduction interface material, a second heat conduction interface material and a substrate; one surface of the first semiconductor refrigeration chip is connected with one surface of the second semiconductor refrigeration chip through the substrate; the first heat-conducting interface material is arranged on the opposite surface of one surface of the first semiconductor refrigeration chip, which is connected with the second semiconductor refrigeration chip; the second heat-conducting interface material is arranged on the opposite surface of one surface of the second semiconductor refrigeration chip, which is connected with the first semiconductor refrigeration chip; the opposite surface of the side of the radiating substrate provided with the radiating tooth sheet is connected with one side of the first semiconductor refrigeration chip through a first heat-conducting interface material; one side of the refrigeration contact plate is arranged on the other side of the second semiconductor refrigeration chip connected with the first semiconductor refrigeration chip through a second heat conduction interface material, and the other side of the refrigeration contact plate is connected with a mobile terminal needing to be radiated.

Preferably, still include the exhaust fan, the exhaust fan is located in the heat dissipation space, and radiator unit, control panel, exhaust fan, first subassembly are in proper order overlapped.

Preferably, the mobile terminal comprises a mobile phone or a tablet or a computer.

Another objective of the present invention is to provide a mobile terminal, which is provided with at least one heat dissipation system as described above.

In view of the above, a third object of the present invention is to provide a control circuit of the heat dissipation system, including a Type-C female socket, an OVP overvoltage protector, a first voltage reducer, a second voltage reducer, a third voltage reducer, a fourth voltage reducer, a protocol interaction unit, a toggle switch, and a bluetooth MCU; the output end of the Type-C female seat is connected with the input end of the OVP overvoltage protector; the output end of the OVP overvoltage protector is respectively connected with the input ends of the first voltage reducer, the second voltage reducer, the third voltage reducer, the fourth voltage reducer and the protocol interaction unit in parallel; the protocol interaction unit is used for communicating with an adapter of the Type-C female socket and acquiring high-power voltage, and can be communicated with the Bluetooth MCU; the output ends of the first voltage reducer and the protocol interaction unit and the toggle switch are connected with a Bluetooth MCU, and the Bluetooth MCU can be communicated with the second voltage reducer, the third voltage reducer and the fourth voltage reducer; the output ends of the second voltage reducer, the third voltage reducer and the fourth voltage reducer are respectively connected with the first semiconductor refrigeration chip, the second semiconductor refrigeration chip and the exhaust fan; when the toggle switch is toggled, the Bluetooth MCU is communicated with the second voltage reducer, the third voltage reducer and the fourth voltage reducer, and the Bluetooth MCU controls the output voltage values of the second voltage reducer, the third voltage reducer and the fourth voltage reducer according to signals of the toggle switch so as to control the power of the first semiconductor refrigeration chip, the second semiconductor refrigeration chip and the exhaust fan.

After the technical scheme is adopted, compared with the prior art, the heat dissipation terminal has the advantages that the heat dissipation terminal with higher cooling amplitude is provided by superposing the first semiconductor refrigeration chip and the second semiconductor refrigeration chip, and the first semiconductor refrigeration chip, the second semiconductor refrigeration chip and the exhaust fan are respectively controlled by the intelligent chips, so that multiple temperature control and multiple noise gears are realized; if a lower cooling environment is required, a semiconductor refrigeration chip can be added to realize the cooling; the running speed and the service life of the mobile terminal and the chip of the mobile terminal are improved.

Drawings

Fig. 1 is a schematic diagram of a heat dissipation system, a mobile terminal and a control circuit according to the present invention;

fig. 2 is a schematic diagram of a housing of a heat dissipation system, a mobile terminal and a control circuit according to the present invention;

fig. 3 is a schematic diagram of a heat dissipation assembly of the heat dissipation system, the mobile terminal and the control circuit according to the present invention;

fig. 4 is a schematic diagram of a heat sink of the heat dissipation assembly of the heat dissipation system, the mobile terminal and the control circuit according to the present invention;

fig. 5 is a schematic diagram of a cooling element of a cooling assembly of the cooling system, the mobile terminal and the control circuit according to the present invention;

fig. 6 is a schematic diagram of a heat dissipation system, a mobile terminal and a control circuit of the heat dissipation system of the control circuit according to the present invention.

Reference numerals:

the heat dissipation module comprises a shell 1, a first component 101, a second component 102, a third component 103, a vent 104, a heat dissipation component 2, a heat dissipation plate 21, a heat dissipation substrate 211, a heat dissipation toothed sheet 212, a refrigeration piece 22, a first semiconductor refrigeration chip 221, a second semiconductor refrigeration chip 222, a first heat conduction interface material 223, a second heat conduction interface material 224, a substrate 225, a refrigeration contact plate 226, a control plate 3, an exhaust fan 4, a Type-C female seat 501, an OVP overvoltage protector 502, a first voltage reducer 503, a second voltage reducer 504, a third voltage reducer 505, a fourth voltage reducer 506, a protocol interaction unit 507, a toggle switch 508 and a Bluetooth MCU 509.

Detailed Description

The advantages of the invention are further illustrated in the following description of specific embodiments in conjunction with the accompanying drawings.

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the disclosure, as detailed in the appended claims.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

In the description of the present invention, unless otherwise specified and limited, it is to be noted that the terms "mounted," "connected," and "connected" are to be interpreted broadly, and may be, for example, a mechanical connection or an electrical connection, a communication between two elements, a direct connection, or an indirect connection via an intermediate medium, and specific meanings of the terms may be understood by those skilled in the art according to specific situations.

In the following description, suffixes such as "module", "component", or "unit" used to denote elements are used only for facilitating the explanation of the present invention, and have no specific meaning in themselves. Thus, "module" and "component" may be used in a mixture.

Referring to fig. 1 to 5, the present embodiment provides a heat dissipation system, which includes a housing 1, a heat dissipation assembly 2, and a control board 3; as shown in fig. 1 or fig. 2, the housing 1 includes a first component 101, a second component 102, and a third component 103; one end of the second component 102 is arranged at one end of the first component 101, the third component 103 is arranged at the other end of the first component 101, the other ends of the second component 102 and the third component 103 face the same direction respectively, and the other ends of the second component 102 and the third component 103 are not connected, so that the first component 101, the second component 102 and the third component 103 form a structure similar to a U shape, and a heat dissipation space with an opening is formed by the first component 101, the second component 102 and the third component 103 in an enclosing manner; in heat dissipation assembly 2 and control panel 3 located the heat dissipation space who is enclosed to establish by first subassembly 101, second subassembly 102, third subassembly 103 and forms, heat dissipation assembly 2 includes cooling fin 21, the refrigeration piece 22 that a plurality of semiconductor refrigeration chips are constituteed because the cooling piece 22 can select a plurality of semiconductor refrigeration chips according to the radiating effect that actual need reached, therefore its quantity is various, this embodiment mainly describes through setting up two semiconductor refrigeration chips. One side of the cooling fin 21 is connected with one side of the refrigeration piece 22, and when the cooling assembly 2 is arranged in the cooling space, the other side of the refrigeration piece 22 connected with the cooling fin 21 faces the opening of the cooling space, and the other side of the refrigeration piece 22 connected with the cooling fin 21 is contacted and connected with the mobile terminal or the chip of the mobile terminal needing to be cooled through the opening of the cooling space formed by the first component 101, the second component 102 and the third component 103, the working principle is that the heat generated by the mobile terminal or the chip of the mobile terminal in operation is contacted with the side of the cooling piece 22 connected with the cooling fin 21 of the cooling system through the chip of the mobile terminal or the mobile terminal, and then the heat generated by the mobile terminal or the chip of the mobile terminal in operation is transferred to the opposite side of the refrigeration piece 22 through a physical heat transfer mode, the cooling element 22 can counteract part of the received heat due to its temperature, and a part of the heat is transferred to the heat sink 21 by heat transfer, the heat sink 21 is in direct contact with the air in the heat dissipation space formed by the first, second and third components 101, 102 and 103, so that the air in the heat dissipation space can absorb the heat of the heat sink 21, thereby completing the heat dissipation process.

The first module 101, the second module 102, the third module 103, and the control panel 3 are provided with air vents 104, respectively. When the heat sink 21 transfers heat to the air in the heat dissipation space, the temperature of the air in the heat dissipation space gradually increases with time, and when the temperature of the air in the heat dissipation space is higher than the temperature of the heat sink 21 or equal to the temperature of the heat sink 21, the heat dissipation effect cannot be achieved at this time, so that the air in the heat dissipation space needs to be discharged out of the heat dissipation space, and therefore, the air in the heat dissipation space needs to be circulated, and the air with the heat transferred by the heat sink 21 in the heat dissipation space is discharged out of the heat dissipation space through the ventilation openings in the first component 101 and/or the second component 102 and/or the third component 103, and the air outside the heat dissipation space is circulated into the heat dissipation space through the first component 101 and/or the second component 102 and/or the third component 103. Since the control board 3 is disposed in a heat dissipation space defined by the first module 101, the second module 102, and the third module 103, the control board 3 is also provided with a vent 104 to prevent the control board from affecting the circulation of air in the heat dissipation space.

When the heat dissipation assembly 2 is disposed in the heat dissipation space defined by the first assembly 101, the second assembly 102, and the third assembly 103, the heat dissipation assembly 2 does not contact the first assembly 101, the second assembly 102, and/or the third assembly 103, respectively. Since the heat dissipation assembly 2 is used for dissipating heat, the heat dissipation assembly 2 carries heat, and when the heat to be dissipated is excessive, the temperature of the heat dissipation assembly 2 will also become high, and if the heat dissipation assembly 2 contacts the first assembly 101 and/or the second assembly 102 and/or the third assembly 103, the performance of the first assembly 101 and/or the second assembly 102 and/or the third assembly 103 will be affected by the heat dissipation assembly 2 with high temperature.

It should be noted that, when the heat dissipation assembly 2 and the control board 3 are disposed in the heat dissipation space defined by the first assembly 101, the second assembly 102, and the third assembly 103, the heat dissipation assembly 2, the control board 3, and the first assembly 101 are sequentially stacked, and both ends of the vent 104 on the control board 3 face the heat dissipation assembly 2 and the first assembly 101, respectively, in fig. 1, both ends on the control board 3 are hatched (oblique lines) to indicate that both ends of the control board 3 are solid, and therefore, the vent 104 on the control board 3 is indicated in the middle of the control board 3 without hatching.

It should be noted that, referring to fig. 4, the heat sink 21 includes a heat dissipating substrate 211 and a plurality of heat dissipating fins 212, the plurality of heat dissipating fins 212 are respectively located on the same surface of the heat dissipating substrate 211, and the surface of the heat dissipating substrate 211 opposite to the surface provided with the heat dissipating fins 212 is connected to the surface of the cooling element 22. It should be noted that, because the heat sink 21 directly contacts with the air in the heat dissipation space surrounded by the first component 101, the second component 102, and the third component 103 for heat dissipation, the plurality of heat dissipation fins 212 are disposed on the heat dissipation substrate 211 of the heat sink 21, and each heat dissipation fin 212 is not in contact with and relatively uniformly distributed on the same surface of the heat dissipation substrate 211, so as to increase the contact area between the heat sink 21 and the air in the heat dissipation space surrounded by the first component 101, the second component 102, and the third component 103, thereby increasing the efficiency of transferring the heat on the heat sink 21 to the air in the heat dissipation space, and thus increasing the heat dissipation efficiency and the heat dissipation effect of the heat dissipation system.

It should be noted that, referring to fig. 5, the cooling element 22 includes a first semiconductor cooling chip 221, a second semiconductor cooling chip 222, a first heat-conducting interface material 223, a second heat-conducting interface material 224, a substrate 225, and a cooling contact plate 226; wherein, one side of the first semiconductor refrigeration chip 221 and one side of the second semiconductor refrigeration chip 222 are connected through the substrate 225, the first heat-conducting interface material 223 is disposed on the opposite side of the first semiconductor refrigeration chip 221 connected to the one side of the second semiconductor refrigeration chip 222, the second heat-conducting interface material 224 is disposed on the opposite side of the second semiconductor refrigeration chip 222 connected to the one side of the first semiconductor refrigeration chip 221, the opposite side of the heat-dissipating substrate 211 provided with the heat-dissipating fins 212 is connected to the one side of the first semiconductor refrigeration chip 221 through the first heat-conducting interface material 223, one side of the refrigeration contact plate 226 is disposed on the other side of the second semiconductor refrigeration chip 222 connected to the first semiconductor refrigeration chip 221 through the second heat-conducting interface material 224, and the other side of the refrigeration contact plate 226 is connected to the mobile terminal to be cooled, so that the refrigeration contact plate 226, the second heat-conducting interface material 224, the second semiconductor refrigeration chip 222, the refrigeration contact plate 226, The substrate 225, the first semiconductor refrigeration chip 221, the first heat conduction interface material 223, the heat dissipation substrate 211, the heat dissipation toothed sheet 212, the control board 3, and the first assembly 101 are sequentially stacked, and the refrigeration contact plate 226, the second heat conduction interface material 224, the second semiconductor refrigeration chip 222, the substrate 225, the first semiconductor refrigeration chip 221, the first heat conduction interface material 223, the heat dissipation substrate 211, and the heat dissipation toothed sheet 212 are sequentially stacked in contact.

It should be noted that, referring to fig. 1, the heat dissipation system further includes an exhaust fan 4, the exhaust fan 4 is disposed in the heat dissipation space, and the cooling contact plate 226, the second heat-conducting interface material 224, the second semiconductor cooling chip 222, the substrate 225, the first semiconductor cooling chip 221, the first heat-conducting interface material 223, the heat dissipation substrate 211, the heat dissipation toothed sheet 212, the control board 3, the exhaust fan 4, and the first component 101 are sequentially stacked. The exhaust fan 4 is used to accelerate the circulation of air in the heat dissipation space.

It should be noted that the mobile terminal may be a mobile phone, a tablet, a computer, or the like.

The invention also provides a mobile terminal, which at least comprises the heat dissipation system.

Referring to fig. 6, the present embodiment further provides a control circuit applied to the above heat dissipation system, where the current includes a Type-C female socket 501, an OVP overvoltage protector 502, a first voltage reducer 503, a second voltage reducer 504, a third voltage reducer 505, a fourth voltage reducer 506, a protocol interaction unit 507, a toggle switch 508, and a bluetooth MCU 509; as shown in the left side of fig. 6, as an adapter, in the control circuit, the output end of the Type-C female socket 501 is connected to the input end of the OVP overvoltage protector 502, the output end of the OVP overvoltage protector 502 is connected to the input ends of the first voltage reducer 503, the second voltage reducer 504, the third voltage reducer 505, the fourth voltage reducer 506 and the protocol interaction unit 507, the protocol interaction unit 507 is used for obtaining high-power voltage after communicating with the adapter of the Type-C female socket 501, the protocol interaction unit 507 can communicate with the bluetooth MCU509, the output ends of the first voltage reducer 503 and the protocol interaction unit 507 and the toggle switch 508 are connected to the bluetooth MCU509, the bluetooth MCU509 can communicate with the second voltage reducer 504, the third voltage reducer 505 and the fourth voltage reducer 506, the output units of the second voltage reducer 504, the third voltage reducer 505 and the fourth voltage reducer 506 are connected to the first semiconductor refrigeration chip 221, the second semiconductor refrigeration chip 222, the third voltage reducer 505 and the fourth voltage reducer 506 respectively, An exhaust fan 4.

It should be noted that the operating principle of the control circuit is as follows: the adapter is connected with the Type-C female seat 501 through a data line, at the moment, the Type-C female seat 501 is electrified, current flows to a first step-down device 503, a second step-down device 504, a third step-down device 505 and a fourth step-down device 506 respectively after passing through an OVP overvoltage protector 502, the current passing through the first step-down device 503 supplies power to a Bluetooth MCU509, the current passing through the second step-down device 504 supplies power to a first semiconductor refrigeration chip 221, the current passing through the third step-down device 505 supplies power to a second semiconductor refrigeration chip 222, the current passing through the fourth step-down device 506 supplies power to an exhaust fan 4, and when a toggle switch 508 is adjusted, the Bluetooth MCU509 adjusts the resistance values of the second step-down device 504, the third step-down device 505 and the fourth step-down device 506 according to a signal of the adjusted toggle switch 508, so as to control the magnitude of the current passing through the second step-down device 504 to the first semiconductor refrigeration chip 221, the magnitude of the current passing through the third step-down device 505 to the second semiconductor refrigeration chip 222, the third step-down device 505, the magnitude of the fourth step-down device 222, the second semiconductor refrigeration chip, the OVER, The current from the fourth voltage reducer 506 to the exhaust fan 4 is controlled to control the work efficiency of the first semiconductor refrigeration chip 221, the second semiconductor refrigeration chip 222 and the exhaust fan 4, and when the first semiconductor refrigeration chip 221, the second semiconductor refrigeration chip 222 and the exhaust fan 4 need high power, the bluetooth MCU509 communicates with the adapter through the protocol interaction module 507 to obtain high-power current.

The mobile terminal may be implemented in various forms. For example, the terminal described in the present invention may include a mobile terminal such as a mobile phone, a smart phone, a notebook computer, a PDA (personal digital assistant), a PAD (tablet computer), a PMP (portable multimedia player), a navigation device, and the like, and a fixed terminal such as a digital TV, a desktop computer, and the like. In the following, it is assumed that the terminal is a mobile terminal. However, it will be understood by those skilled in the art that the configuration according to the embodiment of the present invention can be applied to a fixed type terminal in addition to elements particularly used for moving purposes.

It should be noted that the embodiments of the present invention have been described in terms of preferred embodiments, and not by way of limitation, and that those skilled in the art can make modifications and variations of the embodiments described above without departing from the spirit of the invention.

Claims (10)

1. A heat dissipation system is applied to a mobile terminal and is characterized by comprising a shell, a heat dissipation assembly and a control panel; wherein the content of the first and second substances,

the housing comprises a first component, a second component and a third component; one end of the second assembly is connected with one end of the first assembly, one end of the third assembly is connected with the other end of the first assembly, and the other ends of the second assembly and the third assembly are not connected, so that the first assembly, the second assembly and the third assembly are surrounded to form a heat dissipation space with an opening;

the heat dissipation assembly and the control board are arranged in the heat dissipation space;

the heat dissipation assembly comprises a heat dissipation sheet and a refrigerating piece which is composed of at least two semiconductor refrigerating chips; one side of fin with the one side of refrigeration piece links to each other, just heat radiation assembly locates when in the heat dissipation space, the another side orientation of refrigeration piece the opening in heat dissipation space to the contact needs to be dispelled the heat behind the mobile terminal right the mobile terminal heat dissipation.

2. The heat dissipation system of claim 1, wherein the first assembly, the second assembly, the third assembly, and the control board are provided with ventilation openings, respectively.

3. The heat dissipation system of claim 1, wherein when the heat dissipation assembly is disposed in the heat dissipation space, the heat dissipation assembly does not contact the first assembly, the second assembly, and the third assembly, respectively.

4. The heat dissipation system of claim 1, wherein the heat dissipation assembly, the control board, and the first assembly are sequentially stacked when the heat dissipation assembly and the control board are disposed in the heat dissipation space.

5. The heat dissipation system as claimed in claim 1, wherein the heat dissipation plate comprises a heat dissipation substrate and a plurality of heat dissipation fins, the plurality of heat dissipation fins are respectively disposed on a same surface of the heat dissipation substrate, and an opposite surface of a surface of the heat dissipation substrate on which the heat dissipation fins are disposed is connected to a surface of the refrigeration member.

6. The heat dissipating system of claim 5, wherein the cooling member comprises: the semiconductor refrigeration device comprises a first semiconductor refrigeration chip, a second semiconductor refrigeration chip, a first heat conduction interface material, a second heat conduction interface material, a substrate and a refrigeration contact plate; wherein, the first and the second end of the pipe are connected with each other,

one surface of the first semiconductor refrigeration chip is connected with one surface of the second semiconductor refrigeration chip through the substrate;

the first heat-conducting interface material is arranged on the opposite surface of one surface of the first semiconductor refrigeration chip, which is connected with the second semiconductor refrigeration chip;

the second heat-conducting interface material is arranged on the opposite surface of one surface of the second semiconductor refrigeration chip, which is connected with the first semiconductor refrigeration chip;

the opposite surface of the side of the heat dissipation substrate provided with the heat dissipation tooth sheet is connected with one surface of the first semiconductor refrigeration chip through the first heat conduction interface material;

one side of the refrigeration contact plate is arranged on the other side of the second semiconductor refrigeration chip connected with the first semiconductor refrigeration chip through the second heat conduction interface material, and the other side of the refrigeration contact plate is connected with the mobile terminal needing to be cooled.

7. The heat dissipation system of claim 1, further comprising an exhaust fan disposed in the heat dissipation space, wherein the heat dissipation assembly, the control board, the exhaust fan, and the first assembly are sequentially stacked.

8. The heat dissipation system of claim 1, wherein the mobile terminal comprises a mobile phone or a tablet or a computer.

9. A mobile terminal characterized in that it comprises at least one heat dissipation system according to any one of claims 1 to 7.

10. A control circuit applied to the heat dissipation system of any one of claims 1 to 7, which is characterized by comprising a Type-C female seat, an OVP overvoltage protector, a first voltage reducer, a second voltage reducer, a third voltage reducer, a fourth voltage reducer, a protocol interaction unit, a toggle switch and a Bluetooth MCU; wherein the content of the first and second substances,

the output end of the Type-C female seat is connected with the input end of the OVP overvoltage protector;

the output end of the OVP overvoltage protector is respectively connected with the input ends of the first voltage reducer, the second voltage reducer, the third voltage reducer, the fourth voltage reducer and the protocol interaction unit in parallel;

the protocol interaction unit is used for communicating with the adapter of the Type-C female socket and acquiring high-power voltage, and can be communicated with the Bluetooth MCU;

the output ends of the first voltage reducer and the protocol interaction unit and the toggle switch are connected with the Bluetooth MCU, and the Bluetooth MCU can be communicated with the second voltage reducer, the third voltage reducer and the fourth voltage reducer;

the output ends of the second voltage reducer, the third voltage reducer and the fourth voltage reducer are respectively connected with the first semiconductor refrigeration chip, the second semiconductor refrigeration chip and the exhaust fan;

when the toggle switch is toggled, the Bluetooth MCU is communicated with the second voltage reducer, the third voltage reducer and the fourth voltage reducer, and the Bluetooth MCU controls the output voltage values of the second voltage reducer, the third voltage reducer and the fourth voltage reducer according to signals of the toggle switch so as to control the power of the first semiconductor refrigeration chip, the second semiconductor refrigeration chip and the exhaust fan.

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