CN2769785Y - Special radiator for semiconductor refrigerating assembly - Google Patents
Special radiator for semiconductor refrigerating assembly Download PDFInfo
- Publication number
- CN2769785Y CN2769785Y CN 200420029805 CN200420029805U CN2769785Y CN 2769785 Y CN2769785 Y CN 2769785Y CN 200420029805 CN200420029805 CN 200420029805 CN 200420029805 U CN200420029805 U CN 200420029805U CN 2769785 Y CN2769785 Y CN 2769785Y
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- fin
- heat
- building block
- block system
- radiator
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Abstract
The utility model relates to a radiator for semiconductor refrigerating assembly, comprising a plurality of cordwood system type fin radiating fin units, a transverse conductive heat rod or heat conduction pipe, a fastening strap, rivets or screws used for fastening and a base plate. Each fin and the base plate are formed into integration separately. The fin has tightening pores and transverse heat conduction pores. The combined radiating fins transverse heat conduction pore is inserted into transverse heat conduction rod or heat pipe; the fastening strap is tightly locked by two fastening rivets or screws. The utility model integrates the advantages of extrusion type and imbedding or soldering type finned radiator and forms a finned radiator through the concave and convex coordination of cordwood system type fin base plate strips. Cost is low and radiation effect is good. The utility model can be used in refrigeration device combined by semiconductor refrigeration assembly, finished product manufacture and application on heat radiation and heat exchanger of heating component.
Description
Technical field
The utility model relates to the manufacturing of semiconductor cooler, particularly a kind of heat radiator dedicated for semiconductor refrigerating assembly.
Background technology
Semiconductor refrigerating assembly must be taked enough cooling measures to its " hot side " when refrigerating operaton, if not only do not reach the refrigeration of expectation, also can reduce the service life of semiconductor refrigerating assembly, when serious because the bad semiconductor refrigerating assembly that also may cause of heat radiation is entirely ineffective.
The radiating mode of semiconductor refrigerating assembly has multiple, and the simplest is fan-cooled radiator, and wherein modal fan-cooled radiator is " finned radiator ".Existing finned radiator has three kinds: extruded type, embedding (comprising soldering) formula and shovel chip.
Fig. 1 is existing extruded type finned radiator.As shown in the figure, every kind of specification all needs extrusion die separately, also because be subjected to the restriction of extrusion die intensity, every inch fin density is reduced simultaneously, and fin height/thickness ratio is restricted, and influences the increase of area of dissipation.Specifically, the processing of extruded type radiator is simple, and the cost of material is low, and shortcoming is every inch fin density low (a 4-6 bar); Fin height/thickness is than the restriction that is subjected to extrusion die intensity, and fin can not be too high, therefore influences the increase of area of dissipation; The radiator of every kind of specification all needs to use corresponding extrusion die, could squeeze to shut out needed shaped material of radiator; The radiator of processing with this mode is used for the heat radiation of electrical device originally, is borrowed in the heat radiation of semiconductor refrigerating assembly, and this radiator seems, and thermal resistance is big, and radiating effect is poor; Because its cost is minimum, is still used in a large number so far.
Fig. 2 is existing embedding (comprising a braze welding type) formula finned radiator.As shown in the figure, the fin density of embedding is higher, and fin height/thickness ratio is big, and area of dissipation can be very big, good heat dissipation effect.Shortcoming is also clearly: because substrate will be processed (or extruding) a lot of grooves in advance, cause substrate thickness to strengthen, increased material and processing cost; In N fin embedding substrate groove of separately cutting, not only processed complex, thermal contact resistance is also bigger between substrate and the fin, though can reduce thermal contact resistance with soldering, has further strengthened processing charges.Specifically, the advantage of panel radiator is every inch fin density height (6-10 bar), and fin height/thickness is than unrestricted, and thermal resistance is less, good heat dissipation effect; Shortcoming is that the substrate thickness of embedding fin can not be too thin, and this had both strengthened Master Cost, had increased the weight of radiator again; The processing method that fin embeds (comprising braze welding type) is loaded down with trivial details, the processing charges height; Add embedded mode itself and determined between fin and the substrate it is not same one, what can influence radiating effect for this; For these reasons, although good heat dissipation effect, the cost height, processing method is loaded down with trivial details, causes this type radiator seldom to be used.
Fig. 3 is existing shovel chip finned radiator.As shown in the figure, all fins all start after " shovel " earlier from the substrate parent, and this just is completely free of the restriction of extrusion die, every inch fin number density height, and fin height/thickness ratio is big, and area of dissipation can be very big; But because the slit is too small between fin shape and fin, radiating effect is instead not as embedding braze welding type; The too thick material cost that increased of substrate, the too high generality that also influences its use of processing charges.Specifically, the advantage of shovel gilled radiator is every inch fin number a lot (10-25), fully without extrusion die, and good integrity; Shortcoming is that spacing of fins has influenced result of ventilating heat dissipation from the overstocked fin shape of adding; Add this radiator processing charges height, radiating effect when air draught (particularly) less than Embedded effect, also seldom is used this type radiator so far.
The utility model content
The purpose of this utility model provides a kind of heat radiator dedicated for semiconductor refrigerating assembly, can overcome the shortcoming of prior art.The finned radiator of the building block system fin fin unit that proposes at the characteristics that existing heatsink weight is heavy, radiating effect is poor, processing method is loaded down with trivial details and cost is high.The utility model overall weight is light, good heat dissipation effect, and cost is low.This radiator can with semiconductor refrigerating assembly, fan being connected of whole refrigeration system even.
A kind of heat radiator dedicated for semiconductor refrigerating assembly of the utility model, it comprises the fin fin, it is characterized in that this heat radiator dedicated be by some building block system fin fin units, laterally the rivet of heat conductive rod or heat pipe, binding clip and fastening usefulness or screw and substrate in combination form; Each fin all has a style of one's own with substrate in the described building block system fin fin unit; Described building block system fin fin unit has fastener hole and horizontal thermal hole, and the horizontal thermal hole of building block system fin fin that combines inserts horizontal heat conductive rod or heat pipe, and two supporting binding clips of both sides are with two fastening rivets or screw lock.
Horizontal thermal hole in the middle of the described building block system fin fin inserts horizontal heat conductive rod or heat pipe.
Described rivet or screw are via two binding clips of fastener hole locking at described building block system fin fin two ends.
Described each building block system fin fin unit all is same shape and size, the fin and the substrate of each unit fuse, its cross sectional shape all is that top is rough height and thin fin, be convenient to strengthen area of dissipation, the bottom be concavo-convex join and short and thick substrate, be convenient to be combined into finned radiator as building blocks.
On the described real estate pilot hole is set.The fan pilot hole is arranged on the binding clip of described both sides.
Described building block system fin fin and horizontal heat conductive rod are respectively aluminum alloy for squeezing and make; Described horizontal heat pipe then is the inorganic medium heat pipe.
The purposes of the utility model heat radiator dedicated for semiconductor refrigerating assembly is to be used for the manufacturing of refrigeration device that semiconductor refrigerating assembly combines and finished product and in the heat radiation of heating components and parts and the application on the heat exchanger.
The utility model is a kind of combination of prefabricated building block system finned radiator unit of brand new and the method for distinctive fastening, heat conduction thereof.The utility model is to squeeze earlier to shut out building block system finned radiator unit section bar, then to the special-purpose section punching and cut into the building block system parts; Close building block system fin unit with the station hole sheet array on demand at two ends again, insert heat conduction on demand with hot pin or heat pipe, mix the binding clip of both sides, the riveting at fastening good two ends (or spiral shell) nail; The pilot hole that processing is necessary mills flat refrigerating assembly fitting surface at last.
The utility model is based on building block system unit fin, workpiece is combined into the finned radiator of plurality of specifications with minimum mould as the assembly building blocks; Every inch fin density can be chosen the 10-12 bar, and the height/thickness of fin is convenient to obtain bigger area of dissipation with the less material cost than there not being too big restriction; Avoid Embedded shortcoming, each fin all has a style of one's own with substrate portion itself; Novel structure makes each fin much thinner than the fin of common extruded type radiator, and combination back radiator base plate thickness is thinner than substrate embedded or the shovel gilled radiator, thereby entire radiator is in light weight; Its radiating effect of the utility model radiator of same volume surpasses the extruded type radiator significantly, is not less than panel radiator fully; Novel structure makes the radiator material cost of the present utility model of equal area of dissipation be lower than common extruded type radiator, and processing charges is lower than embedded and the shovel chip significantly, a little more than full extruded type; The utility model radiator is the advantage of integrated extruded type and embedding (or soldering) formula finned radiator, produces building block system rib substrate bar aluminium alloy extrusions in enormous quantities with the simplest extrusion die; Go out an above thermal hole, two fastener holes and be cut into the building block system unit with stamping die again; Abandoned panel radiator because the processing method that the structure backwardness causes numerous and diverse by the concavo-convex cooperation of building block system rib substrate bar, is combined into the finned radiator that needs very simply; Between substrate strip, imbed horizontal heat conductive rod or micro heat pipe, further improved horizontal thermal field gradient; With minimum material and processing cost, reach better radiating effect.
Radiator of the present utility model can process a plurality of pilot holes in advance, is convenient to radiator and semiconductor refrigerating assembly, fan being connected of whole refrigeration system even; The radiating effect of the utility model radiator excellence certainly will substitute existing finned radiator under the prerequisite that does not increase cost, makes it to become one of heat radiator dedicated for semiconductor refrigerating assembly.
Description of drawings
Fig. 1 is existing extruded type finned radiator.
Fig. 2 is existing embedding (comprising a braze welding type) formula finned radiator.
Fig. 3 is existing shovel chip finned radiator.
Fig. 4 is the schematic diagram of an embodiment of the utility model radiator.
Fig. 5 is the front view of the utility model radiator core component building block system fin fin unit.
Fig. 6 is its building block system fin fin unit schematic cross-section.
Fig. 7 is the front view of an embodiment of the utility model heat radiator dedicated for semiconductor refrigerating assembly.
Fig. 8 is the vertical view of an embodiment of the utility model heat radiator dedicated for semiconductor refrigerating assembly.
The specific embodiment
Below in conjunction with drawings and Examples the utility model is further specified:
Fig. 4 is the schematic diagram of an embodiment of the utility model radiator.As shown in the figure, 1-building block system fin fin unit, 2-laterally heat conductive rod or micro heat pipes, 3-fastening with rivet or screw, 4-binding clip, 5-semiconductor refrigerating assembly pilot hole, 6-refrigeration system pilot hole, 7-fan pilot hole.
The invention of the utility model core is: this kind finned radiator is to be assemblied to form by some building block system fin fin units; Every kind of unit can squeeze continuously with the simplest extrusion die and roll into special-purpose building block system fin aluminium alloy extrusions, Fig. 6 is the schematic diagram in its building block system fin fin unit cross section, as shown in the figure: 1A-be the fin part of building block system fin fin unit, 1B-be the substrate portion of building block system fin fin unit; Every kind of its fin of building block system unit and substrate portion all are to extrude simultaneously and have a style of one's own, and the thermal resistance between fin and the substrate portion is littler than embedded; This section bar cross section has only a fin and substrate portion thereof, therefore fin height/thickness ratio is subjected to the restriction of extrusion die intensity very little, each fin bar is easy to be drawn into the lamellar of different shape, the substrate portion that is attached thereto simultaneously also is easy to be drawn into the concaveconvex shape of various uniquenesses, is convenient to be assembled into the finned radiator of all size size; Again with simple mould to the section bar punching of building block system fin fin unit and cut into building block system fin parts, Fig. 5 is exactly the front view of building block system fin fin unit parts, as shown in the figure: the patchhole of 2A-horizontal heat conductive rod or heat pipe, the patchhole of 3A-fastening rivet or screw; Station hole when these holes are combined heat radiator also is a pilot hole, and wherein Zhong Jian hole is used to insert the heat conductive bar (or micro heat pipe) of horizontal heat conduction, and the hole at two ends is used for the rivet (or screw) of fastening building block system finned radiator.
The utility model is to squeeze earlier to shut out building block system finned radiator unit section bar, then to the special-purpose section punching and cut into building block system parts 1; Close building block system fin unit with the station hole sheet array on demand at two ends again, insert heat conduction on demand with hot pin or heat pipe 2, mix the binding clip 4 of both sides, the riveting at fastening good two ends (or spiral shell) nail 3; The pilot hole 5,6,7 that processing is necessary mills flat refrigerating assembly fitting surface at last.
Fig. 7 is the front view of an embodiment of the utility model heat radiator dedicated for semiconductor refrigerating assembly.As can be seen, this utility model radiator only need change the finned radiator that building block system fin cell stripes number just can become all size size with the building block system fin unit splicing of same specification from legend.
Fig. 8 is the vertical view of an embodiment of the utility model heat radiator dedicated for semiconductor refrigerating assembly.From legend, as can be seen, on this utility model radiator, can process the pilot hole of all places and size, be used to assemble semiconductor refrigerating assembly, fan, until whole refrigeration system.
Claims (7)
1, a kind of heat radiator dedicated for semiconductor refrigerating assembly, it comprises the fin fin, it is characterized in that this heat radiator dedicated be by some building block system fin fin units, laterally the rivet of heat conductive rod or heat pipe, binding clip and fastening usefulness or screw and substrate in combination form; Each fin all has a style of one's own with substrate in the described building block system fin fin unit; Described building block system fin fin unit has fastener hole and horizontal thermal hole, and the horizontal thermal hole of building block system fin fin that combines inserts horizontal heat conductive rod or heat pipe; Two supporting binding clips of both sides are with two fastening rivets or screw lock.
2, heat radiator dedicated for semiconductor refrigerating assembly according to claim 1 is characterized in that the horizontal thermal hole in the middle of the described building block system fin fin inserts horizontal heat conductive rod or heat pipe.
3, heat radiator dedicated for semiconductor refrigerating assembly according to claim 1 is characterized in that described rivet or screw two binding clips of fastener hole locking via described building block system fin fin two ends.
4, heat radiator dedicated for semiconductor refrigerating assembly according to claim 1, it is characterized in that described each building block system fin fin unit all is same shape and size, the fin and the substrate of each unit fuse, its cross sectional shape all is that top is rough height and thin fin, be convenient to strengthen area of dissipation, the bottom be concavo-convex join and short and thick substrate, be convenient to be combined into finned radiator as building blocks.
5, heat radiator dedicated for semiconductor refrigerating assembly according to claim 1 is characterized in that on the described real estate pilot hole being set.
6, heat radiator dedicated for semiconductor refrigerating assembly according to claim 1 is characterized in that on the binding clip of described both sides the fan pilot hole being arranged.
7,, it is characterized in that described building block system fin fin and horizontal heat conductive rod are respectively aluminum alloy for squeezing and make according to claim 1; Described horizontal heat pipe then is the inorganic medium heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420029805 CN2769785Y (en) | 2004-09-27 | 2004-09-27 | Special radiator for semiconductor refrigerating assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420029805 CN2769785Y (en) | 2004-09-27 | 2004-09-27 | Special radiator for semiconductor refrigerating assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2769785Y true CN2769785Y (en) | 2006-04-05 |
Family
ID=36690864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420029805 Expired - Fee Related CN2769785Y (en) | 2004-09-27 | 2004-09-27 | Special radiator for semiconductor refrigerating assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2769785Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329832A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat exchange device and semiconductor refrigerator with heat exchange device |
| CN106019785A (en) * | 2016-07-11 | 2016-10-12 | 苏州科勒迪电子有限公司 | Heat pipe type heat dissipation module and optical machine module using same |
| CN106016820A (en) * | 2016-07-06 | 2016-10-12 | 合肥天鹅制冷科技有限公司 | Semiconductor chilling plate radiator |
| CN113280527A (en) * | 2021-07-01 | 2021-08-20 | 哈尔滨商业大学 | Heat exchange device special for semiconductor refrigeration equipment |
-
2004
- 2004-09-27 CN CN 200420029805 patent/CN2769785Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329832A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat exchange device and semiconductor refrigerator with heat exchange device |
| CN104329832B (en) * | 2014-03-28 | 2017-04-26 | 海尔集团公司 | Heat exchange device and semiconductor refrigerator with heat exchange device |
| CN106016820A (en) * | 2016-07-06 | 2016-10-12 | 合肥天鹅制冷科技有限公司 | Semiconductor chilling plate radiator |
| CN106019785A (en) * | 2016-07-11 | 2016-10-12 | 苏州科勒迪电子有限公司 | Heat pipe type heat dissipation module and optical machine module using same |
| CN113280527A (en) * | 2021-07-01 | 2021-08-20 | 哈尔滨商业大学 | Heat exchange device special for semiconductor refrigeration equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |