CN106016820A - Semiconductor chilling plate radiator - Google Patents
Semiconductor chilling plate radiator Download PDFInfo
- Publication number
- CN106016820A CN106016820A CN201610527304.2A CN201610527304A CN106016820A CN 106016820 A CN106016820 A CN 106016820A CN 201610527304 A CN201610527304 A CN 201610527304A CN 106016820 A CN106016820 A CN 106016820A
- Authority
- CN
- China
- Prior art keywords
- chilling plate
- substrate
- liquid inlet
- base plate
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a semiconductor chilling plate radiator. The semiconductor chilling plate radiator comprises a base plate and a plurality of fins which are integrally connected to the back face of the base plate. An opening used for attaching a chilling plate is formed in the front face of the base plate. A liquid inlet and a liquid outlet are formed in the upper end and the lower end of one side of the base plate. The liquid inlet and the liquid outlet transversely extend to the inside of the base plate. A plurality of flow passes which communicate with the liquid inlet and the liquid outlet are vertically arranged inside the base plate. The semiconductor chilling plate radiator is simple in structure, the structure of the chilling plate is combined with that of the fins, the cooling face or heating face of the chilling plate can be subjected to liquid heat exchange and air heat exchange, and thus the application range is wider.
Description
Technical field
The present invention relates to radiator and technical field of heat exchange, specifically a kind of semiconductor refrigerating sheet heat radiator.
Background technology
During semiconductor chilling plate work, one side heating, one side refrigeration, it usually needs heat and the cold on cooling piece surface are taken away by radiator, and the form of radiator generally uses cold drawing, fin plate, heat pipe etc., the medium of flowing is usually liquid or air, does not has the radiator that two media uses simultaneously.
Summary of the invention
It is an object of the invention to provide a kind of semiconductor refrigerating sheet heat radiator, can use liquid and air that cooling piece is carried out heat exchange simultaneously.
Technical scheme is as follows:
A kind of semiconductor refrigerating sheet heat radiator, include substrate and be integrally attached to multiple fins of substrate back, it is characterized in that: the front of described substrate is provided with the opening for mounting cooling piece, the upper and lower end of substrate side is respectively equipped with liquid inlet and outlet, described liquid inlet and outlet extends transverse to the inside of described substrate respectively, and the inside of described substrate is respectively equipped with and is respectively connected with logical and vertically arranged multiple runners with described liquid inlet and outlet.
Described semiconductor refrigerating sheet heat radiator, it is characterised in that: between the most corresponding adjacent two fins in the plurality of fin of the plurality of runner.
Beneficial effects of the present invention:
Present configuration is simple, cold drawing structure is be combined with each other with fin plate structure, the refrigeration of cooling piece or the face that heats can be carried out liquid heat exchange and air heat-exchange, and purposes is wider.
Accompanying drawing explanation
Fig. 1 is external structure schematic diagram of the present invention.
Fig. 2 is internal structure schematic diagram of the present invention.
Fig. 3 is fin and the position relationship schematic diagram of runner in the present invention.
Detailed description of the invention
See accompanying drawing, a kind of semiconductor refrigerating sheet heat radiator, include substrate 1 and be integrally attached to multiple fins 2 at substrate 1 back side, the front of substrate 1 is provided with the smooth areas 3 for mounting cooling piece, the upper and lower end of substrate 1 side is respectively equipped with liquid inlet and outlet 4,5, liquid inlet and outlet 4,5 extends transverse to the inside of substrate 1 respectively, and the inside of substrate 1 is respectively equipped with and is respectively connected with logical and vertically arranged multiple runners 6 with liquid inlet and outlet 4,5.
In the present invention, between the most corresponding adjacent two fins in multiple fins 2 of multiple runners 6, to weaken the capacity of heat transmission of fin after avoiding runner processing.
The front of substrate 1 polishes flat by cooling piece specification, to facilitate the attachment of cooling piece.Multiple runners 6 are concentrated mainly on the pasting area of cooling piece, to improve heat exchange efficiency and the effect of cooling piece.
Claims (2)
1. a semiconductor refrigerating sheet heat radiator, include substrate and be integrally attached to multiple fins of substrate back, it is characterized in that: the front of described substrate is provided with the opening for mounting cooling piece, the upper and lower end of substrate side is respectively equipped with liquid inlet and outlet, described liquid inlet and outlet extends transverse to the inside of described substrate respectively, and the inside of described substrate is respectively equipped with and is respectively connected with logical and vertically arranged multiple runners with described liquid inlet and outlet.
Semiconductor refrigerating sheet heat radiator the most according to claim 1, it is characterised in that: between the most corresponding adjacent two fins in the plurality of fin of the plurality of runner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610527304.2A CN106016820A (en) | 2016-07-06 | 2016-07-06 | Semiconductor chilling plate radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610527304.2A CN106016820A (en) | 2016-07-06 | 2016-07-06 | Semiconductor chilling plate radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106016820A true CN106016820A (en) | 2016-10-12 |
Family
ID=57107500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610527304.2A Pending CN106016820A (en) | 2016-07-06 | 2016-07-06 | Semiconductor chilling plate radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106016820A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113048812A (en) * | 2021-04-25 | 2021-06-29 | 珠海格力电器股份有限公司 | Radiator and refrigeration equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2769785Y (en) * | 2004-09-27 | 2006-04-05 | 赵厚福 | Special radiator for semiconductor refrigerating assembly |
| CN202310432U (en) * | 2011-10-28 | 2012-07-04 | 杨旭明 | Cooler for anti-explosion electric control cabinet |
-
2016
- 2016-07-06 CN CN201610527304.2A patent/CN106016820A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2769785Y (en) * | 2004-09-27 | 2006-04-05 | 赵厚福 | Special radiator for semiconductor refrigerating assembly |
| CN202310432U (en) * | 2011-10-28 | 2012-07-04 | 杨旭明 | Cooler for anti-explosion electric control cabinet |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113048812A (en) * | 2021-04-25 | 2021-06-29 | 珠海格力电器股份有限公司 | Radiator and refrigeration equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |