CN2462543Y - Thin-wing type radiating fin - Google Patents
Thin-wing type radiating fin Download PDFInfo
- Publication number
- CN2462543Y CN2462543Y CN 01201000 CN01201000U CN2462543Y CN 2462543 Y CN2462543 Y CN 2462543Y CN 01201000 CN01201000 CN 01201000 CN 01201000 U CN01201000 U CN 01201000U CN 2462543 Y CN2462543 Y CN 2462543Y
- Authority
- CN
- China
- Prior art keywords
- heat radiation
- thin
- heat
- sheet metal
- wafer assemblies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 230000005855 radiation Effects 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 238000004080 punching Methods 0.000 claims abstract description 6
- 230000000712 assembly Effects 0.000 claims description 13
- 238000000429 assembly Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 230000007306 turnover Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 5
- 238000009825 accumulation Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 description 4
- 208000007101 Muscle Cramp Diseases 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000002650 habitual effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 210000001161 mammalian embryo Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a thin-wing type radiating fin which belongs to the field of heat radiation devices. A heat radiation thin sheet which is formed by the punching of aluminum alloy and a supporting sheet are arranged at intervals in the staggered mode to be riveted and connected into a heat radiation thin sheet assembly. The bottom of the heat radiation thin sheet assembly is combined with a metal thin sheet which is made of copper metal with a bigger heating conductive coefficient to form the thin-wing type radiating fin. Corresponding to the existing aluminum section radiating fin, the heat radiation area of the surface of the radiating fin can be increased. The conductive rate of a heat source can be accelerated when the thin-wing type radiating fin is applied to the heat radiation of a power crystal. The phenomena of heat accumulation and delay which are caused by the critical obstruction of the conduction of the heat source are reduced. The heat radiation efficiency is relatively and effectively improved. The utility model is suitable for the heat radiation of the power crystal, particularly the crystal with high power.
Description
The utility model belongs to the radiating element field, relates to a kind of thin airfoil fin.
The existing radiating element that is used for power crystal heat radiation adopts the aluminium section bar fin of extrusion modling more, and as shown in Figure 1, this fin 1 is to be a flat substrate 11 by the bottom, and perpendicular putting somely is the radiating fins 12 that parallel interval arranges and constitutes on its top.Utilize substrate 11 bottom faces of fin 1 to be attached at the surface of power crystal (work thermal source), make its heat through substrate to fin, and the cooling surface area of borrowing fin to be enlarged derives thermal source and distributes, and levied power crystal steady operation under normal temperature thereby protect, and promotes its operation efficiency.
But above-mentioned fin 1 is because of being to be made by aluminium section bar, and the interval between the thickness of its radiating fin and two fins all can not be done very for a short time, can't make its shape that fries batter in a thin layer increasing the contact area of itself and air, so its heat dissipation is restricted greatly; Moreover if fin 1 need be made when being used for more roomy area of dissipation, the essential size that strengthens its extrusion die makes and makes the die cost increase, is not inconsistent economic requirement, also can't reach the microminiaturized requirement of commodity.
In addition, the conductive coefficient of copper is much larger than aluminium in the metal, and at present industrial many to make radiator with aluminium alloy be to get the price of its price far below copper.But under the radiating requirements of some high power crystal, the fin made from aluminium alloy may need to strengthen many surface areas and just be enough to the radiating efficiency that provides required, this is because the coefficient of heat conduction of aluminium alloy is lower, in the conduction heat sources process, can cause the long-pending heat of some degree and delay phenomenon (that is thermal source is conducted to the obstruction that produces in the critical point of fin to a certain degree by the power crystal).But under the trend of commodity microminiaturization at present, mostly there are not enough spaces that the fin that adds high surface area is provided, therefore adopt the higher metal of conductive coefficient (as the copper metal) to make the unique selection that as if fin become the commodity microminiaturization, but must will consider the material cost that increases thus simultaneously again.
The purpose of this utility model is to provide a kind of thin airfoil fin, and it can significantly increase the cooling surface area that it contacts with air, and can reduce thermal source and conduct long-pending heat and the delay phenomenon that critical obstruction causes, and effectively promotes its radiating efficiency.
The technical scheme that realizes above-mentioned purpose is: the thin airfoil fin, include number row heat radiation thin slice, it is characterized in that, the support chip and one that also includes its quantity and heat radiation thin slice coupling can be used as the sheet metal of substrate, described heat radiation thin slice and support chip is interlaced is spaced, and respectively be shaped on the through hole and the perforation of position correspondence, be connected in series riveted for the two by rivet, be shaped to the heat radiation wafer assemblies that is the spacer stack shape, in this heat radiation wafer assemblies bottom, in conjunction with the above-mentioned sheet metal that can be used as its conductive coefficient of substrate greater than the heat radiation wafer assemblies.
Realize that further technical scheme of the present utility model is that the material of heat radiation thin slice and support chip is an aluminium alloy, the material of sheet metal is the copper metal.
Fig. 1 is existing habitual aluminium extruded type heat radiating fin structure schematic diagram;
Fig. 2 is the utility model embodiment 1 exploded perspective view;
Fig. 3 is the utility model embodiment 1 exploded stereogram;
Fig. 4 is the utility model embodiment 1 combination exploded perspective view;
Fig. 5 is the side sectional view of the utility model Fig. 4;
Fig. 6 is the exploded perspective view of the utility model embodiment 2.
The utility model is described in further detail below in conjunction with drawings and Examples:
Embodiment 1: shown in Fig. 2,3,4, heat radiation wafer assemblies 2, form with support chip 22 and rivet 23 by several pieces fin 21 made from aluminium alloy, this heat radiation thin slice 21 is to adopt aluminum alloy plate materials, make laminar through die stamping, in the bottom punching out several perforation 212 are arranged, its surface also punching press is formed with several inwardly fins 211 of turnover.This support chip 22 also adopts aluminum alloy plate materials to form through die stamping equally, is a rectangular sheet, with heat radiation thin slice corresponding position through hole 222 is arranged on lamellar body; At least be shaped on several catching grooves 221 on outermost lateral support sheet surface in addition.Rivet 23 can give riveted through the perforation 212 of above-mentioned respectively dispel the heat thin slice 21 and support chip 22 and through hole 222 and be integrally formed heat sink assembly.Sheet metal 24 is to adopt the coefficient of heat conduction to make greater than the copper metal stamping of aluminium alloy, and its both sides all form the upwards lateral plate 241 of turnover, and these lateral plate 241 surperficial punching presses form several cramps that inwardly tiltedly turns over 242.When assembling above-mentioned heat sink assembly 2, be that dispel the heat thin slice 21 and several piece support chip 22 of several piece taked the staggered setting that is spaced, and make it dash the perforation 212 and 222 of establishing all being corresponding shape, so that rivet is run through each hole dispel the heat thin slice and support chip phase riveted of several piece fixed, formed heat radiation wafer assemblies (the thick embryo of aerofoil profile fin).Behind said modules grinding correction plane, assembling sheet metal 24 can continue.Can be before the assembling or sheet metal end face coating heat-conducting glue 25 (as shown in Figure 5) in assembly bottom, again this sheet metal 24 is affixed on heat radiation wafer assemblies bottom surface, and utilizes its side cramp 242 to be buckled in the catching groove 221 of two support chips 22, fix and form assembling.
Embodiment 2: the assembling of heat sink assembly 21,22,23, composition and sheet metal 24, can also adopt the mode that is threaded, as shown in Figure 6, support chip 22 surfaces of heat sink assembly both sides can be made with several screws 222,24 liang of lateral plate 241 surfaces of sheet metal then correspondence are shaped on via hole 243, utilize screw 244 to be connected and fixed.For increasing the bonding strength of screw 244, can add the locked lengths of long spiro nail 244 in fin 21 surperficial corresponding punching out perforation.
Owing to adopt such scheme, the utility model and the contrast of existing correlation technique have following characteristics:
One, the utility model is used for power crystal 3 (Fig. 5), because fin can be as thin as a wafer, spacing can be minimum, and fin quantity increases in identical usage space, and area of dissipation increases, and heat radiation power greatly improves.
Two, owing to use the copper metal, can effectively promote radiator integral efficient, reduce thermal source and conduct long-pending heat and the delay phenomenon that critical obstruction causes as substrate.And, only be a thin slice, so unlikely increase great amount of cost because copper consumption is very little.
Three, since heat radiation thin slice system assemble, changeable according to need of work, only need to change its assembling sheet number and get final product, need not open and make the different size mould, thereby save production cost greatly, be one to have the major reform of value.
Claims (9)
1, a kind of thin airfoil fin, include number row heat radiation thin slice, it is characterized in that, the support chip and one that also includes its quantity and heat radiation thin slice coupling can be used as the sheet metal of substrate, described heat radiation thin slice and support chip is interlaced is spaced, and respectively be shaped on the through hole and the perforation of position correspondence, be connected in series riveted for the two by rivet, be shaped to the heat radiation wafer assemblies that is the spacer stack shape, in this heat radiation wafer assemblies bottom, in conjunction with the above-mentioned sheet metal that can be used as its conductive coefficient of substrate greater than the heat radiation wafer assemblies.
2, thin airfoil fin according to claim 1 is characterized in that, is coated with between described sheet metal and the heat sink assembly in order to keep the two to contact closely smooth and to quicken its heat conducting heat-conducting glue.
3, thin airfoil fin according to claim 1, it is characterized in that, described both sides of foil is all made and is upwards rolled over the lateral plate that turns over, this lateral plate surface has the cramp that inwardly tiltedly turns over, and being interlocked in order to the catching groove with heat radiation wafer assemblies supported on both sides sheet surface forms combining of heat radiation wafer assemblies and sheet metal.
4, according to claim 1 or 3 described thin airfoil fin, it is characterized in that, respectively be shaped at least 2 perforation on the lateral plate that upwards folding turns over of the both sides of sheet metal.
5, thin airfoil fin according to claim 1 is characterized in that, the support chip surface in heat radiation wafer assemblies both sides, and the perforation on the corresponding sheet metal lateral plate is shaped on the screw for the screw connection of the two.
6, thin airfoil fin according to claim 1 is characterized in that, the support chip surface in heat radiation wafer assemblies both sides, and the perforation on the corresponding sheet metal lateral plate is shaped on the positioning jack of pegging graft for the latch of the two.
7, thin airfoil fin according to claim 1 is characterized in that, each sheet surface that dispels the heat has the little fin of the inside turnover of several punching presses formation.
8, thin airfoil fin according to claim 1 is characterized in that, the material of heat radiation thin slice and support chip is an aluminium alloy.
9, thin airfoil fin according to claim 1 is characterized in that, the material of sheet metal is the copper metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01201000 CN2462543Y (en) | 2001-01-12 | 2001-01-12 | Thin-wing type radiating fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01201000 CN2462543Y (en) | 2001-01-12 | 2001-01-12 | Thin-wing type radiating fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2462543Y true CN2462543Y (en) | 2001-11-28 |
Family
ID=33623166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01201000 Expired - Lifetime CN2462543Y (en) | 2001-01-12 | 2001-01-12 | Thin-wing type radiating fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2462543Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102353026A (en) * | 2011-08-23 | 2012-02-15 | 北京觉明光电科技有限公司 | Led light source radiator |
| CN102410517A (en) * | 2011-11-29 | 2012-04-11 | 青岛信控电子技术有限公司 | High-power laminated radiator and manufacturing method thereof |
| CN102984917A (en) * | 2011-09-02 | 2013-03-20 | 技嘉科技股份有限公司 | Method for manufacturing heat sink |
| CN103228120A (en) * | 2012-01-31 | 2013-07-31 | 曼埃利康有限公司 | Heat radiation sheet |
-
2001
- 2001-01-12 CN CN 01201000 patent/CN2462543Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102353026A (en) * | 2011-08-23 | 2012-02-15 | 北京觉明光电科技有限公司 | Led light source radiator |
| CN102984917A (en) * | 2011-09-02 | 2013-03-20 | 技嘉科技股份有限公司 | Method for manufacturing heat sink |
| CN102984917B (en) * | 2011-09-02 | 2017-03-22 | 技嘉科技股份有限公司 | Method for manufacturing heat sink |
| CN102410517A (en) * | 2011-11-29 | 2012-04-11 | 青岛信控电子技术有限公司 | High-power laminated radiator and manufacturing method thereof |
| CN103228120A (en) * | 2012-01-31 | 2013-07-31 | 曼埃利康有限公司 | Heat radiation sheet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BEIYIDE SCIENCE AND TECHNOLOGY CO.,LTD. Free format text: FORMER OWNER: XU LINGBO Effective date: 20040827 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20040827 Address after: Taipei city of Taiwan Province Patentee after: Bei Yide Polytron Technologies Inc Address before: Taipei city of Taiwan Province Patentee before: Xu Lingbo |
|
| C56 | Change in the name or address of the patentee |
Owner name: BEIYI SCIENCE & TECHNOLOGY CO., LTD. Free format text: FORMER NAME OR ADDRESS: BEIYIDE SCIENCE AND TECHNOLOGY CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Taipei city of Taiwan Province Patentee after: VETTE CORP. Address before: Taipei city of Taiwan Province Patentee before: Bei Yide Polytron Technologies Inc |
|
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20110112 Granted publication date: 20011128 |