CN2462543Y - Thin airfoil heat sink - Google Patents

Thin airfoil heat sink Download PDF

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Publication number
CN2462543Y
CN2462543Y CN 01201000 CN01201000U CN2462543Y CN 2462543 Y CN2462543 Y CN 2462543Y CN 01201000 CN01201000 CN 01201000 CN 01201000 U CN01201000 U CN 01201000U CN 2462543 Y CN2462543 Y CN 2462543Y
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heat
heat radiation
thin
sheet metal
sheet
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许凌波
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VETTE CORP
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Abstract

Thin wing section fin belongs to the heat abstractor field. The heat radiating sheet punched by aluminum alloy and the supporting sheet are arranged in a staggered and spaced manner and riveted to form a heat radiating sheet assembly, and the bottom of the heat radiating sheet assembly is combined with a metal sheet which has a higher heat conductivity and is made of copper metal to form the thin-wing-type heat radiating fin. Compared with the existing aluminum profile radiating fin, the aluminum profile radiating fin can increase the surface radiating area of the radiating fin, and can accelerate the heat source conduction speed, reduce the heat accumulation and delay phenomena caused by heat source conduction critical obstruction when being applied to the heat radiation of the power crystal, relatively effectively improve the heat radiation efficiency, and is suitable for the heat radiation of the power crystal, particularly the high-power crystal.

Description

薄翼型散热片Thin airfoil heat sink

本实用新型属于散热器件领域,涉及一种薄翼型散热片。The utility model belongs to the field of heat dissipation devices and relates to a thin airfoil heat sink.

现有的用于功率晶体散热的散热器件,多采用挤压成型的铝型材散热片,如图1所示,该散热片1是由底端为一平板状的基板11,在其顶端上竖置若干呈平行间隔排列的散热鳍片12构成。利用散热片1的基板11底端面贴附于功率晶体(工作热源)的表面,使其热量经基板至鳍片,并借鳍片加以扩大的散热表面积将热源导出散发,从而得以保征功率晶体在正常温度下稳定工作,提升其运算效能。Existing heat dissipation devices for power crystal heat dissipation mostly adopt extruded aluminum heat sinks. As shown in Figure 1, the heat sink 1 is composed of a flat plate-shaped substrate 11 at the bottom, and vertically on the top. It is composed of a plurality of cooling fins 12 arranged in parallel and spaced apart. The bottom surface of the substrate 11 of the heat sink 1 is attached to the surface of the power crystal (working heat source), so that the heat passes through the substrate to the fins, and the heat source is exported and dissipated by the enlarged heat dissipation surface area of the fins, so as to protect the power crystal. It works stably at normal temperature and improves its computing performance.

但上述散热片1因是由铝型材制成,其散热鳍片的厚度及两鳍片之间的间隔都不可能做得很小,无法使其做成薄片状以增加其与空气的接触面积,因此其散热效能大受限制;再者,若散热片1需制成用于较宽大的散热面积时,必需加大其挤压模具的尺寸,使制作模具成本增加,不符经济要求,也无法达到商品微型化要求。But above-mentioned radiator fin 1 is because of being made of aluminum profile, and the thickness of its radiator fin and the interval between two fins all can't be done very small, can't make it thin sheet shape to increase its contact area with air , so its heat dissipation efficiency is greatly limited; moreover, if the heat sink 1 needs to be made for a wider heat dissipation area, the size of its extrusion die must be increased, which increases the cost of making the die, which does not meet the economic requirements and cannot Meet the miniaturization requirements of commodities.

此外,金属中铜的导热系数远大于铝,目前工业上多用铝合金制造散热器是取其价格远低于铜的价格。但在某些高功率晶体的散热需求下,用铝合金制成的散热片可能需要加大许多表面积才足以提供所需的散热效率,这是因为铝合金的热传导系数较低,在传导热源过程中,会造成某些程度的积热与延迟现象(亦即热源由功率晶体传导至散热片的临界点中产生一定程度的阻碍)。但在目前商品微型化的趋势下,多半没有足够的空间提供加大表面积的散热片,因此采用导热系数较高的金属(如铜金属)来制造散热片似乎已成为商品微型化的唯一选择,但同时又必需要考虑到由此增加的材料成本。In addition, the thermal conductivity of copper in metals is much greater than that of aluminum. At present, aluminum alloys are often used in the industry to make radiators because the price is much lower than that of copper. However, under the heat dissipation requirements of some high-power crystals, the heat sink made of aluminum alloy may need to increase a lot of surface area to provide the required heat dissipation efficiency. This is because the thermal conductivity of aluminum alloy is low. In this process, a certain degree of heat accumulation and delay will be caused (that is, a certain degree of obstruction will be generated at the critical point where the heat source is conducted from the power crystal to the heat sink). However, under the current trend of commodity miniaturization, there is probably not enough space to provide a heat sink with a larger surface area. Therefore, the use of metals with high thermal conductivity (such as copper metal) to manufacture heat sinks seems to have become the only option for commodity miniaturization. At the same time, however, the resulting increased material costs must be taken into account.

本实用新型的目的在于提供一种薄翼型散热片,它可大幅增加其与空气接触的散热表面积,并可降低热源传导临界阻碍所造成的积热与延迟现象,有效提升其散热效率。The purpose of this utility model is to provide a thin airfoil heat sink, which can greatly increase the heat dissipation surface area in contact with the air, and can reduce the heat accumulation and delay caused by the critical obstruction of heat source conduction, and effectively improve its heat dissipation efficiency.

实现上述目的的技术方案是:薄翼型散热片,包括有数排散热薄片,其特征在于,还包括有其数量与散热薄片匹配的支撑片及一可作为基片的金属薄片,所述散热薄片与支撑片相互交错间隔排列,并各制有位置对应的通孔及穿孔,供二者由铆钉串接铆合,成型为呈间隔叠层状的散热薄片组件,在此散热薄片组件底部,结合上述可作为基片的其导热系数大于散热薄片组件的金属薄片。The technical solution to achieve the above object is: a thin airfoil heat sink, including several rows of heat dissipation fins, characterized in that it also includes a support sheet whose number matches the heat dissipation fins and a metal sheet that can be used as a substrate, and the heat dissipation fins The supporting sheet is alternately arranged at intervals, and each is provided with through holes and perforations corresponding to the positions, for the two to be riveted in series by rivets, and formed into a heat dissipation sheet assembly in a spaced stack. At the bottom of the heat dissipation sheet assembly, combined The metal sheet whose thermal conductivity is greater than that of the heat-dissipating sheet assembly can be used as the substrate.

实现本实用新型的进一步的技术方案是散热薄片与支撑片的材料是铝合金,金属薄片的材料是铜金属。A further technical solution for realizing the utility model is that the material of the heat dissipation sheet and the supporting sheet is aluminum alloy, and the material of the metal sheet is copper metal.

图1是现有惯用的铝挤型散热片结构示意图;Fig. 1 is a structural schematic diagram of an existing customary aluminum extruded heat sink;

图2是本实用新型实施例1分解立体图;Fig. 2 is an exploded perspective view of Embodiment 1 of the present utility model;

图3是本实用新型实施例1局部分解立体图;Fig. 3 is a partially exploded perspective view of Embodiment 1 of the present utility model;

图4是本实用新型实施例1组合分解立体图;Fig. 4 is a combined exploded perspective view of Embodiment 1 of the utility model;

图5是本实用新型图4的侧面剖视图;Fig. 5 is a side sectional view of Fig. 4 of the present utility model;

图6是本实用新型实施例2的分解立体图。Fig. 6 is an exploded perspective view of Embodiment 2 of the present utility model.

以下结合附图及实施例对本实用新型作进一步说明:Below in conjunction with accompanying drawing and embodiment the utility model is further described:

实施例1:如图2、3、4所示,散热薄片组件2,由用铝合金制成的数片散热片21与支撑片22和铆钉23组成,该散热薄片21是采用铝合金板材,经模具冲压而作成薄片状,在底端部冲制有数个穿孔212,其表面还冲压形成有数个向内翻折的翼片211。该支撑片22亦同样采用铝合金板材经模具冲压而成,呈一长条片状,于片体上与散热薄片对应位置处有通孔222;此外至少在最靠外侧面支撑片表面制有数个扣槽221。铆钉23可经上述各散热薄片21与支撑片22的穿孔212及通孔222予以铆合成一体形成散热片组件。金属薄片24是采用热传导系数较大于铝合金的铜金属冲压制作,其两侧皆形成向上翻折的侧片241,该侧片241表面冲压形成数个向内斜翻的扣片242。组装上述散热片组件2时,是将数块散热薄片21及数块支撑片22采取交错间隔排列设置,并令其所冲设的穿孔212及222均呈相对应状,以使铆钉得以贯穿各孔将数块散热薄片及支撑片相铆合固定,组成散热薄片组件(翼型散热片的粗胚)。将上述组件研磨修正平面后,即可接续组装金属薄片24。组装前可于组件底部或金属薄片顶面涂布导热胶25(如图5所示),再将该金属薄片24贴于散热薄片组件底面,并利用其侧扣片242扣接于两支撑片22的扣槽221,而形成组装固定。Embodiment 1: As shown in Figures 2, 3, and 4, the heat dissipation sheet assembly 2 is composed of several heat dissipation sheets 21 made of aluminum alloy, support sheets 22 and rivets 23, and the heat dissipation sheet 21 is made of an aluminum alloy plate. It is made into a sheet shape by punching with a die, and several perforations 212 are punched at the bottom end, and several flaps 211 turned inwards are punched and formed on the surface. The support piece 22 is also made of an aluminum alloy plate through die stamping, and is in the shape of a long strip. There are through holes 222 on the sheet body corresponding to the position of the heat dissipation sheet; A buckle groove 221. The rivets 23 can be riveted together through the through-holes 212 and through-holes 222 of the cooling fins 21 and the supporting sheet 22 to form a cooling fin assembly. The metal sheet 24 is made of copper stamping with a higher thermal conductivity than aluminum alloy. Both sides of the metal sheet 24 are formed with upwardly folded side pieces 241 . When assembling the above-mentioned heat sink assembly 2, several pieces of heat dissipation sheets 21 and several pieces of support sheets 22 are arranged in a staggered interval, and the punched holes 212 and 222 are all in a corresponding shape, so that the rivets can penetrate each The holes rivet and fix several heat dissipation sheets and support sheets to form a heat dissipation sheet assembly (rough blank of airfoil heat sink). After the above-mentioned components are ground and corrected, the metal sheet 24 can be assembled continuously. Before assembly, thermal conductive adhesive 25 can be applied to the bottom of the component or the top surface of the metal sheet (as shown in Figure 5), and then the metal sheet 24 is attached to the bottom surface of the heat dissipation sheet component, and the side buckle 242 is used to fasten it to the two supporting pieces 22 of the buckle groove 221 to form a fixed assembly.

实施例2:散热器组件21、22、23、组成与金属薄片24的组装,还可以采用螺纹连接的方式,如图6所示,可将散热片组件两侧的支撑片22表面制以数个螺孔222,而金属薄片24两侧片241表面则对应制有过孔243,利用螺钉244连接固定。为增加螺钉244的连接强度,可在散热片21表面对应冲制穿孔,加长螺钉244的锁定长度。Embodiment 2: Radiator assembly 21,22,23, composition and the assembling of sheet metal 24, can also adopt the mode of threaded connection, as shown in Figure 6, can make the surface of support sheet 22 on both sides of radiator assembly with several There are two screw holes 222, and the surface of the two side sheets 241 of the metal sheet 24 is correspondingly formed with via holes 243, which are connected and fixed by screws 244. In order to increase the connection strength of the screw 244 , corresponding punching holes can be punched on the surface of the heat sink 21 to lengthen the locking length of the screw 244 .

由于采用上述方案,本实用新型与现有相关技术对比,具有以下特点:Due to the adoption of the above scheme, the utility model has the following characteristics compared with the existing related technology:

一、本实用新型用于功率晶体3(图5),由于散热片可极薄,间距可极小,在相同使用空间内散热片数量增多,散热面积增大,散热功率大为提高。1. The utility model is used in the power crystal 3 (Fig. 5). Since the cooling fins can be extremely thin and the spacing can be extremely small, the number of cooling fins increases in the same use space, the cooling area increases, and the cooling power is greatly improved.

二、由于使用铜金属作为基片,可有效提升散热器整体效率,降低热源传导临界阻碍所造成的积热与延迟现象。并且由于用铜量很小,仅是一薄片,故不致增加大量成本。2. Because copper metal is used as the substrate, the overall efficiency of the radiator can be effectively improved, and the heat accumulation and delay caused by the critical obstruction of heat source conduction can be reduced. And because the amount of copper used is very small, only a thin piece, so it will not increase a lot of cost.

三、由于散热薄片系组装而成,根据工作需要可大可小,惟需改变其组装片数即可,不需开制不同规格模具,因而大大节省了生产成本,是一极具利用价值的重大改革。3. Since the heat dissipation sheet is assembled, it can be large or small according to the needs of the work. It is only necessary to change the number of assembled pieces, and there is no need to make molds of different specifications, thus greatly saving production costs. It is a very valuable tool major reforms.

Claims (9)

1, a kind of thin airfoil fin, include number row heat radiation thin slice, it is characterized in that, the support chip and one that also includes its quantity and heat radiation thin slice coupling can be used as the sheet metal of substrate, described heat radiation thin slice and support chip is interlaced is spaced, and respectively be shaped on the through hole and the perforation of position correspondence, be connected in series riveted for the two by rivet, be shaped to the heat radiation wafer assemblies that is the spacer stack shape, in this heat radiation wafer assemblies bottom, in conjunction with the above-mentioned sheet metal that can be used as its conductive coefficient of substrate greater than the heat radiation wafer assemblies.
2, thin airfoil fin according to claim 1 is characterized in that, is coated with between described sheet metal and the heat sink assembly in order to keep the two to contact closely smooth and to quicken its heat conducting heat-conducting glue.
3, thin airfoil fin according to claim 1, it is characterized in that, described both sides of foil is all made and is upwards rolled over the lateral plate that turns over, this lateral plate surface has the cramp that inwardly tiltedly turns over, and being interlocked in order to the catching groove with heat radiation wafer assemblies supported on both sides sheet surface forms combining of heat radiation wafer assemblies and sheet metal.
4, according to claim 1 or 3 described thin airfoil fin, it is characterized in that, respectively be shaped at least 2 perforation on the lateral plate that upwards folding turns over of the both sides of sheet metal.
5, thin airfoil fin according to claim 1 is characterized in that, the support chip surface in heat radiation wafer assemblies both sides, and the perforation on the corresponding sheet metal lateral plate is shaped on the screw for the screw connection of the two.
6, thin airfoil fin according to claim 1 is characterized in that, the support chip surface in heat radiation wafer assemblies both sides, and the perforation on the corresponding sheet metal lateral plate is shaped on the positioning jack of pegging graft for the latch of the two.
7, thin airfoil fin according to claim 1 is characterized in that, each sheet surface that dispels the heat has the little fin of the inside turnover of several punching presses formation.
8, thin airfoil fin according to claim 1 is characterized in that, the material of heat radiation thin slice and support chip is an aluminium alloy.
9, thin airfoil fin according to claim 1 is characterized in that, the material of sheet metal is the copper metal.
CN 01201000 2001-01-12 2001-01-12 Thin airfoil heat sink Expired - Lifetime CN2462543Y (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100482057C (en) * 2004-12-09 2009-04-22 奇鋐科技股份有限公司 Structure of heat dissipation device
CN102353026A (en) * 2011-08-23 2012-02-15 北京觉明光电科技有限公司 Led light source radiator
CN102410517A (en) * 2011-11-29 2012-04-11 青岛信控电子技术有限公司 High-power laminated radiator and manufacturing method thereof
CN102984917A (en) * 2011-09-02 2013-03-20 技嘉科技股份有限公司 Method for manufacturing heat sink
CN103228120A (en) * 2012-01-31 2013-07-31 曼埃利康有限公司 Heat radiation sheet
CN116583945A (en) * 2020-11-27 2023-08-11 艾美科株式会社 Heat sink device using graphite sheets as fins

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100482057C (en) * 2004-12-09 2009-04-22 奇鋐科技股份有限公司 Structure of heat dissipation device
CN102353026A (en) * 2011-08-23 2012-02-15 北京觉明光电科技有限公司 Led light source radiator
CN102984917A (en) * 2011-09-02 2013-03-20 技嘉科技股份有限公司 Method for manufacturing heat sink
CN102984917B (en) * 2011-09-02 2017-03-22 技嘉科技股份有限公司 Method for manufacturing heat sink
CN102410517A (en) * 2011-11-29 2012-04-11 青岛信控电子技术有限公司 High-power laminated radiator and manufacturing method thereof
CN103228120A (en) * 2012-01-31 2013-07-31 曼埃利康有限公司 Heat radiation sheet
CN116583945A (en) * 2020-11-27 2023-08-11 艾美科株式会社 Heat sink device using graphite sheets as fins

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