CN2462543Y - Thin airfoil heat sink - Google Patents
Thin airfoil heat sink Download PDFInfo
- Publication number
- CN2462543Y CN2462543Y CN 01201000 CN01201000U CN2462543Y CN 2462543 Y CN2462543 Y CN 2462543Y CN 01201000 CN01201000 CN 01201000 CN 01201000 U CN01201000 U CN 01201000U CN 2462543 Y CN2462543 Y CN 2462543Y
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- heat
- heat radiation
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 230000005855 radiation Effects 0.000 claims abstract 14
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims 7
- 238000000429 assembly Methods 0.000 claims 7
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
- 230000007306 turnover Effects 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 238000009825 accumulation Methods 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 25
- 238000001816 cooling Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本实用新型属于散热器件领域,涉及一种薄翼型散热片。The utility model belongs to the field of heat dissipation devices and relates to a thin airfoil heat sink.
现有的用于功率晶体散热的散热器件,多采用挤压成型的铝型材散热片,如图1所示,该散热片1是由底端为一平板状的基板11,在其顶端上竖置若干呈平行间隔排列的散热鳍片12构成。利用散热片1的基板11底端面贴附于功率晶体(工作热源)的表面,使其热量经基板至鳍片,并借鳍片加以扩大的散热表面积将热源导出散发,从而得以保征功率晶体在正常温度下稳定工作,提升其运算效能。Existing heat dissipation devices for power crystal heat dissipation mostly adopt extruded aluminum heat sinks. As shown in Figure 1, the heat sink 1 is composed of a flat plate-shaped substrate 11 at the bottom, and vertically on the top. It is composed of a plurality of cooling fins 12 arranged in parallel and spaced apart. The bottom surface of the substrate 11 of the heat sink 1 is attached to the surface of the power crystal (working heat source), so that the heat passes through the substrate to the fins, and the heat source is exported and dissipated by the enlarged heat dissipation surface area of the fins, so as to protect the power crystal. It works stably at normal temperature and improves its computing performance.
但上述散热片1因是由铝型材制成,其散热鳍片的厚度及两鳍片之间的间隔都不可能做得很小,无法使其做成薄片状以增加其与空气的接触面积,因此其散热效能大受限制;再者,若散热片1需制成用于较宽大的散热面积时,必需加大其挤压模具的尺寸,使制作模具成本增加,不符经济要求,也无法达到商品微型化要求。But above-mentioned radiator fin 1 is because of being made of aluminum profile, and the thickness of its radiator fin and the interval between two fins all can't be done very small, can't make it thin sheet shape to increase its contact area with air , so its heat dissipation efficiency is greatly limited; moreover, if the heat sink 1 needs to be made for a wider heat dissipation area, the size of its extrusion die must be increased, which increases the cost of making the die, which does not meet the economic requirements and cannot Meet the miniaturization requirements of commodities.
此外,金属中铜的导热系数远大于铝,目前工业上多用铝合金制造散热器是取其价格远低于铜的价格。但在某些高功率晶体的散热需求下,用铝合金制成的散热片可能需要加大许多表面积才足以提供所需的散热效率,这是因为铝合金的热传导系数较低,在传导热源过程中,会造成某些程度的积热与延迟现象(亦即热源由功率晶体传导至散热片的临界点中产生一定程度的阻碍)。但在目前商品微型化的趋势下,多半没有足够的空间提供加大表面积的散热片,因此采用导热系数较高的金属(如铜金属)来制造散热片似乎已成为商品微型化的唯一选择,但同时又必需要考虑到由此增加的材料成本。In addition, the thermal conductivity of copper in metals is much greater than that of aluminum. At present, aluminum alloys are often used in the industry to make radiators because the price is much lower than that of copper. However, under the heat dissipation requirements of some high-power crystals, the heat sink made of aluminum alloy may need to increase a lot of surface area to provide the required heat dissipation efficiency. This is because the thermal conductivity of aluminum alloy is low. In this process, a certain degree of heat accumulation and delay will be caused (that is, a certain degree of obstruction will be generated at the critical point where the heat source is conducted from the power crystal to the heat sink). However, under the current trend of commodity miniaturization, there is probably not enough space to provide a heat sink with a larger surface area. Therefore, the use of metals with high thermal conductivity (such as copper metal) to manufacture heat sinks seems to have become the only option for commodity miniaturization. At the same time, however, the resulting increased material costs must be taken into account.
本实用新型的目的在于提供一种薄翼型散热片,它可大幅增加其与空气接触的散热表面积,并可降低热源传导临界阻碍所造成的积热与延迟现象,有效提升其散热效率。The purpose of this utility model is to provide a thin airfoil heat sink, which can greatly increase the heat dissipation surface area in contact with the air, and can reduce the heat accumulation and delay caused by the critical obstruction of heat source conduction, and effectively improve its heat dissipation efficiency.
实现上述目的的技术方案是:薄翼型散热片,包括有数排散热薄片,其特征在于,还包括有其数量与散热薄片匹配的支撑片及一可作为基片的金属薄片,所述散热薄片与支撑片相互交错间隔排列,并各制有位置对应的通孔及穿孔,供二者由铆钉串接铆合,成型为呈间隔叠层状的散热薄片组件,在此散热薄片组件底部,结合上述可作为基片的其导热系数大于散热薄片组件的金属薄片。The technical solution to achieve the above object is: a thin airfoil heat sink, including several rows of heat dissipation fins, characterized in that it also includes a support sheet whose number matches the heat dissipation fins and a metal sheet that can be used as a substrate, and the heat dissipation fins The supporting sheet is alternately arranged at intervals, and each is provided with through holes and perforations corresponding to the positions, for the two to be riveted in series by rivets, and formed into a heat dissipation sheet assembly in a spaced stack. At the bottom of the heat dissipation sheet assembly, combined The metal sheet whose thermal conductivity is greater than that of the heat-dissipating sheet assembly can be used as the substrate.
实现本实用新型的进一步的技术方案是散热薄片与支撑片的材料是铝合金,金属薄片的材料是铜金属。A further technical solution for realizing the utility model is that the material of the heat dissipation sheet and the supporting sheet is aluminum alloy, and the material of the metal sheet is copper metal.
图1是现有惯用的铝挤型散热片结构示意图;Fig. 1 is a structural schematic diagram of an existing customary aluminum extruded heat sink;
图2是本实用新型实施例1分解立体图;Fig. 2 is an exploded perspective view of Embodiment 1 of the present utility model;
图3是本实用新型实施例1局部分解立体图;Fig. 3 is a partially exploded perspective view of Embodiment 1 of the present utility model;
图4是本实用新型实施例1组合分解立体图;Fig. 4 is a combined exploded perspective view of Embodiment 1 of the utility model;
图5是本实用新型图4的侧面剖视图;Fig. 5 is a side sectional view of Fig. 4 of the present utility model;
图6是本实用新型实施例2的分解立体图。Fig. 6 is an exploded perspective view of
以下结合附图及实施例对本实用新型作进一步说明:Below in conjunction with accompanying drawing and embodiment the utility model is further described:
实施例1:如图2、3、4所示,散热薄片组件2,由用铝合金制成的数片散热片21与支撑片22和铆钉23组成,该散热薄片21是采用铝合金板材,经模具冲压而作成薄片状,在底端部冲制有数个穿孔212,其表面还冲压形成有数个向内翻折的翼片211。该支撑片22亦同样采用铝合金板材经模具冲压而成,呈一长条片状,于片体上与散热薄片对应位置处有通孔222;此外至少在最靠外侧面支撑片表面制有数个扣槽221。铆钉23可经上述各散热薄片21与支撑片22的穿孔212及通孔222予以铆合成一体形成散热片组件。金属薄片24是采用热传导系数较大于铝合金的铜金属冲压制作,其两侧皆形成向上翻折的侧片241,该侧片241表面冲压形成数个向内斜翻的扣片242。组装上述散热片组件2时,是将数块散热薄片21及数块支撑片22采取交错间隔排列设置,并令其所冲设的穿孔212及222均呈相对应状,以使铆钉得以贯穿各孔将数块散热薄片及支撑片相铆合固定,组成散热薄片组件(翼型散热片的粗胚)。将上述组件研磨修正平面后,即可接续组装金属薄片24。组装前可于组件底部或金属薄片顶面涂布导热胶25(如图5所示),再将该金属薄片24贴于散热薄片组件底面,并利用其侧扣片242扣接于两支撑片22的扣槽221,而形成组装固定。Embodiment 1: As shown in Figures 2, 3, and 4, the heat
实施例2:散热器组件21、22、23、组成与金属薄片24的组装,还可以采用螺纹连接的方式,如图6所示,可将散热片组件两侧的支撑片22表面制以数个螺孔222,而金属薄片24两侧片241表面则对应制有过孔243,利用螺钉244连接固定。为增加螺钉244的连接强度,可在散热片21表面对应冲制穿孔,加长螺钉244的锁定长度。Embodiment 2:
由于采用上述方案,本实用新型与现有相关技术对比,具有以下特点:Due to the adoption of the above scheme, the utility model has the following characteristics compared with the existing related technology:
一、本实用新型用于功率晶体3(图5),由于散热片可极薄,间距可极小,在相同使用空间内散热片数量增多,散热面积增大,散热功率大为提高。1. The utility model is used in the power crystal 3 (Fig. 5). Since the cooling fins can be extremely thin and the spacing can be extremely small, the number of cooling fins increases in the same use space, the cooling area increases, and the cooling power is greatly improved.
二、由于使用铜金属作为基片,可有效提升散热器整体效率,降低热源传导临界阻碍所造成的积热与延迟现象。并且由于用铜量很小,仅是一薄片,故不致增加大量成本。2. Because copper metal is used as the substrate, the overall efficiency of the radiator can be effectively improved, and the heat accumulation and delay caused by the critical obstruction of heat source conduction can be reduced. And because the amount of copper used is very small, only a thin piece, so it will not increase a lot of cost.
三、由于散热薄片系组装而成,根据工作需要可大可小,惟需改变其组装片数即可,不需开制不同规格模具,因而大大节省了生产成本,是一极具利用价值的重大改革。3. Since the heat dissipation sheet is assembled, it can be large or small according to the needs of the work. It is only necessary to change the number of assembled pieces, and there is no need to make molds of different specifications, thus greatly saving production costs. It is a very valuable tool major reforms.
Claims (9)
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CN 01201000 CN2462543Y (en) | 2001-01-12 | 2001-01-12 | Thin airfoil heat sink |
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CN 01201000 CN2462543Y (en) | 2001-01-12 | 2001-01-12 | Thin airfoil heat sink |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100482057C (en) * | 2004-12-09 | 2009-04-22 | 奇鋐科技股份有限公司 | Structure of heat dissipation device |
CN102353026A (en) * | 2011-08-23 | 2012-02-15 | 北京觉明光电科技有限公司 | Led light source radiator |
CN102410517A (en) * | 2011-11-29 | 2012-04-11 | 青岛信控电子技术有限公司 | High-power laminated radiator and manufacturing method thereof |
CN102984917A (en) * | 2011-09-02 | 2013-03-20 | 技嘉科技股份有限公司 | Method for manufacturing heat sink |
CN103228120A (en) * | 2012-01-31 | 2013-07-31 | 曼埃利康有限公司 | Heat radiation sheet |
CN116583945A (en) * | 2020-11-27 | 2023-08-11 | 艾美科株式会社 | Heat sink device using graphite sheets as fins |
-
2001
- 2001-01-12 CN CN 01201000 patent/CN2462543Y/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100482057C (en) * | 2004-12-09 | 2009-04-22 | 奇鋐科技股份有限公司 | Structure of heat dissipation device |
CN102353026A (en) * | 2011-08-23 | 2012-02-15 | 北京觉明光电科技有限公司 | Led light source radiator |
CN102984917A (en) * | 2011-09-02 | 2013-03-20 | 技嘉科技股份有限公司 | Method for manufacturing heat sink |
CN102984917B (en) * | 2011-09-02 | 2017-03-22 | 技嘉科技股份有限公司 | Method for manufacturing heat sink |
CN102410517A (en) * | 2011-11-29 | 2012-04-11 | 青岛信控电子技术有限公司 | High-power laminated radiator and manufacturing method thereof |
CN103228120A (en) * | 2012-01-31 | 2013-07-31 | 曼埃利康有限公司 | Heat radiation sheet |
CN116583945A (en) * | 2020-11-27 | 2023-08-11 | 艾美科株式会社 | Heat sink device using graphite sheets as fins |
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C14 | Grant of patent or utility model | ||
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ASS | Succession or assignment of patent right |
Owner name: BEIYIDE SCIENCE AND TECHNOLOGY CO.,LTD. Free format text: FORMER OWNER: XU LINGBO Effective date: 20040827 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20040827 Address after: Taipei city of Taiwan Province Patentee after: Bei Yide Polytron Technologies Inc Address before: Taipei city of Taiwan Province Patentee before: Xu Lingbo |
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Owner name: BEIYI SCIENCE & TECHNOLOGY CO., LTD. Free format text: FORMER NAME OR ADDRESS: BEIYIDE SCIENCE AND TECHNOLOGY CO.,LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Taipei city of Taiwan Province Patentee after: VETTE CORP. Address before: Taipei city of Taiwan Province Patentee before: Bei Yide Polytron Technologies Inc |
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CX01 | Expiry of patent term |
Expiration termination date: 20110112 Granted publication date: 20011128 |