CN103228120A - Heat radiation sheet - Google Patents

Heat radiation sheet Download PDF

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Publication number
CN103228120A
CN103228120A CN201310011559XA CN201310011559A CN103228120A CN 103228120 A CN103228120 A CN 103228120A CN 201310011559X A CN201310011559X A CN 201310011559XA CN 201310011559 A CN201310011559 A CN 201310011559A CN 103228120 A CN103228120 A CN 103228120A
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CN
China
Prior art keywords
adhesive linkage
heat
heat insulation
diffusion layer
thermal diffusion
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Pending
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CN201310011559XA
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Chinese (zh)
Inventor
尹一九
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MAIN ELECOM CO Ltd
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MAIN ELECOM CO Ltd
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Publication of CN103228120A publication Critical patent/CN103228120A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F28D20/023—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/06—Coatings; Surface treatments having particular radiating, reflecting or absorbing features, e.g. for improving heat transfer by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
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  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
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  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Disclosed is a heat radiation sheet, including a thermoconductive adhesive layer, a thermal diffusion layer, an adiabatic adhesive layer formed on the thermal diffusion layer, and a graphite layer. The thermoconductive adhesive layer is formed by mixing a metal powder with a nonconductive resin adhesive, the thermal diffusion layer is formed of metal foil, and the adiabatic adhesive layer is formed by mixing a metal powder with a nonconductive resin adhesive. The heat radiation sheet is effective in that high-temperature heat generated from heat sources of various kinds of electronic appliances is rapidly absorbed by a thermoconductive adhesive layer and a thermal diffusion layer, and the absorbed heat rapidly spreads over the entire area of the heat radiation sheet, is stored, and is then slowly discharged to prevent the external temperature of the electronic appliance from rapidly increasing, preventing the deterioration of reliability attributable to the high-temperature heat.

Description

Utilize the delay fin of latent heat
Technical field
The present invention relates to fin that the heat that is produced by various electronic units such as light parts or power semiconductor LED or electronics and electric component or communication equipment and electronic equipment is cooled off, more specifically, relate to such delay fin: by by the heat conduction adhesive linkage, thermal diffusion layer, the delay fin that heat insulation adhesive linkage and graphite flake layer constitute, not only the hot gas of the high temperature that will be produced by the thermal source of various device absorbs rapidly, and when evenly spreading, the hot gas that will absorb also suitably contains, thereby realize delay heat radiation to the outside, therefore in the cooling effect of giving full play to the script of thermal source, prevent that the hot gas of high temperature from discharging to device external.
Background technology
Because the integrated increase of the IC circuit that causes along with the industry tipped, under the labyrinth of enclosed type integrated circuits such as hybrid packed and multimode, LED, electronic equipment, ultra-thin and trend toward miniaturization, the caloric value of various electronic units also increases thereupon.
Therefore, because the increase of caloric value, how effectively to discharge the heat in the small space and prevent that the misoperation of electronic unit and the damage of parts from having become important problem, in addition, also since emphasis the heat radiation on, therefore cause the heat of equipment periphery to rise, can feel the problem of more heat transfer from the outside.In addition, as mentioned above, along with heat dispersion is improved, on the contrary from external sensation to heating temp rise, so the user is owing to the inconvenience of the heating of high temperature on feeling to use, or often thinks the abnormal operation of equipment by mistake.
To this, efficiently radiates heat for such electronic equipment, as heat dissipation, the main conductive sheet of using the good native graphite compressed tablet of conductibility or copper sheet or aluminium heating panel, sheet metal, compressed metal powder, with the resin sheet of conductibility good metal powder and mixed with resin etc., and above-mentioned resin sheet heat is in the horizontal direction transmitted insufficient, and the operation of sheet metal is effective inadequately, though the heat conduction on the level is good, but the thermal conductivity on above-below direction also rises thereupon, cause thus transmitting, cause that external temperature is overheated to the heat rapidly on surface.
Under situation as the native graphite compressed tablet of another fin, the thermal conductivity that has 300W/mk in the horizontal direction, therefore can access cooling effect rapidly to the thermal source of electronic equipment, but it is owing to the high strength compressed tablet reduces flexibility, and can not make as film, still cause the problem of the external temperature rising of equipment.
In addition, as above-mentioned existing embodiment for the graphite radiating sheet in, register in patent and to disclose the thermal conductivity bonding agent that dimethione and silicones and thermal conductivity filler is mixed in the coating of a side of graphite radiating sheet in 10-0755014 number, at another side coating methylmethacrylate-leucoaurin TMOS copolymer coating fluid, thereby coating have on display bonding easily in thermal conductivity be improved and the manufacture method of the graphite radiating sheet of the thermal conductivity bonding agent of the feature of the graphite powder that can not disperse, though but as above-mentioned graphite radiating sheet have cooling effect rapidly to thermal source, but owing to have too excellent vertical heat transfer degree, the problem that therefore exists the hot gas of high temperature too to discharge partly to the outside.
In addition, the bonding agent that discloses excellent thermal conductivity in publication 10-2011-0094635 number is applied to graphite flake and improves thermal conductivity, in the past pressing mold operation and bonding agent painting process shortened to single operation and make the fin of bonding agent fin, that comprise excellent thermal conductivity, but this is still because heat radiation and heat conductivility excellence on the vertical direction, though therefore have the radiating effect that improves thermal source, the problem that the external temperature of electronic equipment too rises partly.
Summary of the invention
The present invention improves as above problem and establishes, and the object of the present invention is to provide a kind of delay fin that utilizes latent heat, it is characterized in that by constituting as the lower part: the heat conduction adhesive linkage, and it can directly be attached to the thermal source of various electronic equipments and use; Thermal diffusion layer, it spreads the hot gas that absorbs from described heat conduction adhesive linkage rapidly and widely; Heat insulation adhesive linkage, it is used to absorb from the hot gas of described thermal diffusion layer diffusion and with hot gas contains certain hour; And graphite flake layer, the hot gas that absorption provides from described heat insulation adhesive linkage and postpone to discharge, because the hot gas of the high temperature that will be produced by the thermal source of various electronic equipments absorbs rapidly, so cooling effect excellence, the hot gas that absorbs slowly postpones to discharge by diffusion and latent heat, therefore can prevent that the external temperature of various electronic equipments from sharply rising, make the consumer improve reliability greatly product.
To achieve the above object, the present invention stacks gradually as the lower part and forms: the heat conduction adhesive linkage, and it is attached with barrier paper in the bottom surface; Thermal diffusion layer, it is formed at the top of described heat conduction adhesive linkage; Heat insulation adhesive linkage, it is formed at the top of described thermal diffusion layer; And graphite flake layer, it is formed at the top of described heat insulation adhesive linkage, and wherein, described heat conduction adhesive linkage mixes the non-conductor resin and forms in bonding agent, thermal diffusion layer is made of sheet metal, and heat insulation adhesive linkage mixes the non-conductor resin and forms in bonding agent.
The present invention is by heat conduction adhesive linkage and thermal diffusion plate, the hot gas of the high temperature that the thermal source by various electronic equipments can be produced absorbs rapidly, can prevent that thus the performance of electronic equipment or efficient are owing to the hot gas of high temperature descends, and the hot gas that absorbs is when the whole area of fin spreads rapidly, the hot gas of diffusion is contained, it is slowly discharged, the external temperature that can prevent various electronic equipments sharply rises thus, therefore make that the consumer can prevent to descend owing to the reliability that the high temperature heating causes, owing to may bring the misoperation of the inconvenient or suspection equipment in the use from the high temperature heating of device external to the consumer, therefore along with preventing such high temperature heating, has the effect that can further improve to the reliability of equipment.
Description of drawings
Fig. 1 is the profile according to delay fin of the present invention.
Fig. 2 is the profile of expression according to another embodiment of delay fin of the present invention.
Fig. 3 is the profile of expression according to another embodiment of delay fin of the present invention.
Symbol description
10: barrier paper
20: the heat conduction adhesive linkage
30,30': thermal diffusion layer
40,40': heat insulation adhesive linkage
41,41': latent heat material
50: graphite flake layer
Embodiment
Term that uses in this specification and claims book or word should be only for being interpreted as the common meaning or the meaning on the dictionary, the inventor is for the invention with the best way explanation oneself, based on the principle that the notion of term suitably can be defined, be interpreted as the meaning and the notion of technological thought according to the invention.
Below, specify the preferred embodiments of the present invention with reference to accompanying drawing.
Fig. 1 is the profile according to delay fin of the present invention.
As shown in the figure, delay fin according to the present invention is from bottom by constituting as the lower part: have barrier paper 10 heat conduction adhesive linkage 20, as described in the thermal diffusion layer 30 that forms of the top of heat conduction adhesive linkage 20, as described in the heat insulation adhesive linkage 40 that forms of the top of thermal diffusion layer 30 and as described in the graphite flake layer 50 that forms of the top of heat insulation adhesive linkage 40.
At this moment, described barrier paper 10 and thermal diffusion layer 30 are attached to each other by heat conduction adhesive linkage 20, and described thermal diffusion layer 30 and graphite flake layer 50 are attached to each other by heat insulation adhesive linkage 40.
In addition; described barrier paper 10 has the purpose that is used to protect according to the heat conduction adhesive linkage 20 of delay fin of the present invention; to postpone to remove described barrier paper 10 before fin is attached to the thermal source of various electronic equipments, and heat conduction adhesive linkage 20 directly is attached to thermal source and will be using.
In addition, described heat conduction adhesive linkage 20 is that mixed metal powder forms in common bonding agent, and described bonding agent has acrylamide or urethane system or polyamide-based, silicon system etc. usually.Such heat conduction adhesive linkage 20 has the hot gas that slowly absorbs the high temperature that is produced by thermal source and the purpose transmitted to the thermal diffusion layer 30 on top, be that nickel or the metal dusts such as silver or aluminium oxide that mix 20～30 weight % in bonding agent 60～70 weight % form, thereby described metal dust is from absorbing the hot gas of thermal source as idioelectric bonding agent and transmitting to top.
At this, the combined amount of described metal dust is decided according to the purpose that the hot gas with thermal source absorbs rapidly, under the too small situation of content, the heat-absorbing action meeting is weakened, and under the excessive situation of content, bond degree can descend.
At this moment, the thickness of described heat conduction adhesive linkage 20 is preferably 20～50 μ m, under the thin excessively situation of thickness, cementability descends, the problem that existence weakens the degree of fixation of thermal source, under the thickness of described heat conduction adhesive linkage 20 was situation more than the desirable value, thermal conductivity descended, the problem that exists the radiating effect to thermal source to reduce.
In addition, the hot gas of the thermal source that absorbs by described heat conduction adhesive linkage 20 is by the thermal diffusion layer 30 on heat conduction adhesive linkage 20 tops, heat is diffused into wide in range area rapidly, as described thermal diffusion layer 30, most preferably be and utilize aluminium film or copper film, as above-mentioned aluminium film or copper film thermal conductivity excellence not only, but also be processability and the outstanding material of economy.
The thickness of such heat conduction adhesive linkage 20 is preferably 10～100 μ m, under the situation of thin thickness, though heat diffusivity rises, but the excessive velocities of transmitting to the heat insulation adhesive linkage 40 of upside, cause the local temperature of thermal source periphery to rise, under the wide situation of thickness, though can eliminate the problem that local temperature rises, but because Speed of diffusion is slow excessively, existence can not realize the problem of efficiently radiates heat.
Thus, the hot gas that broadly spreads by described thermal diffusion layer 30 transmits to the heat insulation adhesive linkage 40 of upside, described heat insulation adhesive linkage 40 is by mixing bonding agent and metal dust, and the main purpose of heat insulation adhesive linkage 40 is to form the latent heat effect that will temporarily contain by the hot gas that thermal diffusion layer 30 spreads.
Promptly, described heat insulation adhesive linkage 40 is to be to mix the nickel of 15～25 weight % or silver or alumina metals powder among bonding agent 75～85 weight % to form as the acrylamide of non-conductor resin or urethane system, polyamide-based, silicon, with above-mentioned heat conduction adhesive linkage 20 in the same manner, the non-conductor resin is a main material, but the metal dust that mixes in bonding agent is few relatively, therefore compare with heat conduction adhesive linkage 20, thermal conductivity can descend.
Thus, by described heat insulation adhesive linkage 40, the latent heat effect of transmitting to compare with the heat-transfer rate of heat conduction adhesive linkage 20 and thermal diffusion layer 30 thermal conductivity that how much reduces realizes that heat transmission to top, its result, described heat insulation adhesive linkage 40 carry out that the hot gas that makes thermal source postpones to top.
In addition, spread once more by graphite flake layer 50 again and postponed to upside diffusion and the hot gas that transmits, finally be delivered to the housing of electronic equipment by the metal dusts in the above-mentioned heat insulation adhesive linkage 40.
At this moment, the thickness of described heat insulation adhesive linkage 40 is preferably 20～50 μ m, under the thin excessively situation of thickness, cementability descends, the problem that exists the degree of being adhesively fixed of thermal diffusion layer 30 and graphite flake layer 50 to be weakened, under the thickness of described heat conduction adhesive linkage 20 was situation more than the desirable value, thermal conductivity descended, the problem that exists the radiating effect to thermal source excessively to reduce.
At this, described heat conduction adhesive linkage 20 and thermal diffusion layer 30 play rapid absorption of hot gas of the high temperature that will be produced by thermal source and prevent the effect that thermal source is overheated, described heat insulation adhesive linkage 40 and graphite flake layer 50 receive the hot gas that absorbs, it slowly is discharged to the outside, thereby plays the external temperature effect of rising rapidly partly that prevents various electronic equipments.
In addition, described graphite flake layer 50 is carried out and is absorbed the hot gas of discharging by described heat insulation adhesive linkage 40 and postpone the effect of discharge to top, owing to sheet resistance is 10 4Level makes the electric energy that is absorbed by the outside be converted to heat energy or the influence that thus temperature produced minimizes.
Such graphite flake layer 50 preferably has the thickness of 20～50 μ m, under the situation of thin thickness, the heat radiation carryover effects is reduced, under the blocked up situation of thickness, because there is the problem that the thermolysis of internal heat resource is produced bad influence in excessive delay thermolysis.
Thus, have as the delay fin of the present invention of above-mentioned structure with in the past heat shield when similarly forming efficiently radiates heat to the thermal source of various electronic equipments, to besiege and slowly discharge by the hot gas that thermal source absorbs, its result can prevent that the external temperature of electronic equipment from sharply rising or local situation with the high temperature heating, can prevent thus that the user from thinking abnormal operation by mistake or be brought inconvenience in the use by the high temperature heating.
In addition, as another embodiment of the present invention, for heat insulation adhesive linkage 40 as above-mentioned delay fin, together mixed foaming agent and the described heat insulation adhesive linkage 40 of foaming in the past bonding agent and metal dust, described thus heat insulation adhesive linkage 40 is at the numerous pore of surperficial and inner formation, thereby further increase thermal insulation, and the raising of such thermal insulation produces the feature that improves the latent heat effect of containing hot gas in pore the most at last.
At this; the content of described blowing agent is preferably 2～5% with respect to the combined amount of bonding agent and metal dust; the heat insulation adhesive linkage 40 of foaming possesses the cushion effect of regulation by numerous pore by the mixing of described blowing agent, and therefore described cushion effect also has the built-in material of protection electronic equipment and thermal source concurrently and is not subjected to effect from the impact of the outside of electronic equipment.
In addition, as another embodiment of the present invention, for heat insulation adhesive linkage 40 as above-mentioned delay fin, the latent heat material of making mixing a certain amount of firmly sintering stone flour 41,41' and forming under the situation of heat insulation adhesive linkage 40, the effect of containing by excellent in heat insulating performance and with heat absorption is the influence of outstanding stone flour also, can further improve the effect of heat insulation adhesive linkage 40, combined amount with respect to bonding agent and metal dust, described latent heat material 41, the content of 41' preferably is about 5～10%.
Further, can form above-mentioned thermal diffusion layer 30 and heat insulation adhesive linkage 40 in multiple mode according to delay fin of the present invention and bring into play heat radiation and the latent heat effect that further improves, form 1st thermal diffusion layer 30 on the top of the heat conduction adhesive linkage 20 with barrier paper this moment, form on the top of described the 1st thermal diffusion layer 30 under the state of the 1st heat insulation adhesive linkage 40, form the 2nd thermal diffusion layer 30' on the top of the described the 1st heat insulation adhesive linkage 40, after the 2nd heat insulation adhesive linkage 40' is formed at the top of described the 2nd thermal diffusion layer 30', form graphite flake layer 50 on the top of the described the 2nd heat insulation adhesive linkage 40' and get final product.
Thus, from multiple thermal diffusion layer 30,30' and heat insulation adhesive linkage 40,40' not only realizes excellent heat absorption and thermolysis, can also bring into play the latent heat effect that doubles, when using various electronic equipment, the user slowly experiences the hot gas of internal heat resource from outer surface, and the hot gas of such thermal source is also slowly discharged when the not use of electronic equipment, thereby the consumer's that the high temperature heating by the surface can be caused misidentification and inconvenience minimize.
The embodiment of above-described record in this manual and the structure shown in the accompanying drawing be a most preferred embodiment of the present invention only, do not represent all technological thoughts of the present invention, therefore should be appreciated that to have various equipollents and the variation that is used to replace these.

Claims (7)

1. delay fin that utilizes latent heat is characterized in that it stacks gradually as the lower part and forms: heat conduction adhesive linkage (20), and it is attached with barrier paper (10) in the bottom surface; Thermal diffusion layer (30), it is formed at the top of described heat conduction adhesive linkage (20); Heat insulation adhesive linkage (40), it is formed at the top of described thermal diffusion layer (30); And graphite flake layer (50), it is formed at the top of described heat insulation adhesive linkage (40),
Described heat conduction adhesive linkage (20) is that mixed metal powder forms in the bonding agent that is made of the non-conductor resin, thermal diffusion layer (30) is made of sheet metal, and heat insulation adhesive linkage (40) is that mixed metal powder forms in the bonding agent that is made of the non-conductor resin.
2. the delay fin that utilizes latent heat according to claim 1 is characterized in that,
The bonding agent of heat conduction adhesive linkage (20) is that the more than one metal dust 20 weight %～30 weight % that select in mixing by nickel or silver or aluminium oxide among the more than one bonding agent 60 weight %～70 weight % that select in by acrylamide or urethane system, polyamide-based and silicon system form.
3. the delay fin that utilizes latent heat according to claim 1 is characterized in that,
The bonding agent of heat insulation adhesive linkage (20) is that the more than one metal dust 15 weight %～25 weight % that select in mixing by nickel or silver or aluminium oxide among the more than one bonding agent 75 weight %～85 weight % that select in by acrylamide or urethane system, polyamide-based and silicon system form.
4. the delay fin that utilizes latent heat according to claim 3 is characterized in that,
The bonding agent of heat insulation adhesive linkage (20) is that the bonding agent that will be made of the non-conductor resin and metal dust and blowing agent mix.
5. the delay fin that utilizes latent heat according to claim 1 is characterized in that,
Heat insulation adhesive linkage (40) be to the latent heat material (41,41') mix, this latent heat material (41,41') stone flour is carried out sintering and forms.
6. the delay fin that utilizes latent heat according to claim 1 is characterized in that,
Between heat insulation adhesive linkage (40) and graphite flake layer (50), also be formed with other thermal diffusion layer (30') and heat insulation adhesive linkage (40').
7. the delay fin that utilizes latent heat according to claim 1 is characterized in that,
The thickness of heat conduction adhesive linkage (20) is 20 μ m～50 μ m, described thermal diffusion layer (30) is formed the thickness of 10 μ m～100 μ m by a kind of material of selecting from copper or aluminium, the thickness of described heat insulation adhesive linkage (40) is 4 μ m～50 μ m, and the thickness of described graphite flake layer is 20 μ m～50 μ m.
CN201310011559XA 2012-01-31 2013-01-11 Heat radiation sheet Pending CN103228120A (en)

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