CN104202948A - Heat insulation structure and base material with same - Google Patents
Heat insulation structure and base material with same Download PDFInfo
- Publication number
- CN104202948A CN104202948A CN201410413549.3A CN201410413549A CN104202948A CN 104202948 A CN104202948 A CN 104202948A CN 201410413549 A CN201410413549 A CN 201410413549A CN 104202948 A CN104202948 A CN 104202948A
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- CN
- China
- Prior art keywords
- hollow
- heat insulation
- face
- insulation structural
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 title claims abstract description 79
- 238000009413 insulation Methods 0.000 title claims abstract description 78
- 239000012212 insulator Substances 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 19
- 238000009434 installation Methods 0.000 claims description 22
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 230000001788 irregular Effects 0.000 claims description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 4
- 239000001569 carbon dioxide Substances 0.000 claims description 4
- 239000004005 microsphere Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 22
- 239000000758 substrate Substances 0.000 abstract description 8
- 239000002390 adhesive tape Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000005030 aluminium foil Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010981 drying operation Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 210000003127 knee Anatomy 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 125000001997 phenyl group Chemical class [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
The invention relates to a heat insulation structure and a substrate with the same, wherein the substrate comprises a substrate body and the heat insulation structure, the heat insulation structure comprises a heat insulator formed on one surface of the substrate body, the heat insulator is provided with a glue material and a plurality of hollow heat insulators, the glue material is mixed with the hollow heat insulators, and the hollow heat insulators are positioned between a first end face and a second end face of the heat insulator and are stacked with each other; through the design that the base material has the heat insulation structure, the heat insulation effect can be effectively achieved.
Description
Technical field
The invention relates to a kind of heat insulation structural and have the base material of heat insulation structural, espespecially a kind of have the heat insulation structural that reaches effect of heat insulation and a base material with heat insulation structural.
Background technology
In electronic installation (as pen electricity, mobile phone, panel computer) structure, conventionally can be provided with heat radiation module for its operation processing unit (as CPU), the hot temperature being produced during with loose this operation processing unit running of the row of acceleration.
Yet, the heat conduction position of described heat radiation module is only contacted with a side surface of operation processing unit conventionally, even if the most hot temperature producing when operation processing unit can be operated derives, but the side that operation processing unit does not contact with heat radiation module heat conduction position, but can continue to operate the heat producing because of operation processing unit cannot be exported, and at the product case position of its corresponding connection, have hot clustering phenomena, that is the heat that cannot be exported can be gathered on the product case position of connection.
Wherein take notebook computer as example, although its most use states are to be placed on desktop, but based on surrounding enviroment, limit (as environment such as park, dining room, stations) in some situation, user also may be placed in notebook computer on knee and use, now, hot clustering phenomena will produce harmful effect, because the heat that cannot be exported can be gathered on the position of a motor casing of connection, and directly touch user's knee or shank skin and cause user uncomfortable, cause user cannot continue to use with this posture problem and the scarce fraud of computer.In addition, the position of a motor casing that can be gathered in connection except the heat that cannot be exported is upper outside, and its inner heat of this motor casing also can outwards be come out by keyboard module, to cause the normal time to make user's hand uncomfortable.
Therefore will how to solve above-mentioned existing problem and disappearance, the inventor who is this case desires most ardently to the relevant manufacturer that is engaged in the industry the direction place that research improves.
Summary of the invention
For effectively solving above-mentioned problem, the present invention's main purpose is providing a kind of heat insulation structural that reaches effect of heat insulation that has.
Another object of the present invention is to provide a kind of base material with heat insulation structural that reaches effect of heat insulation that has.
Another object of the present invention is to provide a kind of being applied on an electronic installation, the base material with heat insulation structural of the effect contacting with user with the heat that effectively intercepts electronic installation and produced.
For reaching above-mentioned purpose, the invention provides a kind of heat insulation structural, comprise an insulator, this insulator has a glue material and several hollow heat insulated body, this glue material mixes these hollow heat insulated bodies, this insulator is provided with the second end face of one first end face and contrary this first end face, and these hollow heat insulated bodies are positioned between this first end face and the second end face and stacking setting each other; See through the design of this structure of the present invention, make the effect that effectively reaches heat insulation.
The present invention separately provides a kind of base material with heat insulation structural, comprise a material main body and a heat insulation structural, this material main body cording has the second surface of a first surface and relative this first surface, this heat insulation structural comprises an insulator, this thermal-insulating system is formed on this first surface, and it has a glue material and several hollow heat insulated body, this glue material mixes these hollow heat insulated bodies, this insulator is provided with the second end face of one first end face and contrary this first end face, this second end face is sticked mutually with relative this first surface, and these hollow heat insulated bodies are positioned between this first end face and the second end face and stacking setting each other, the base material with heat insulation structural by the present invention, be applied to the design of an electronic installation (as pen electricity, flat board or mobile phone), in other words the effect that the heat producing while making effectively to intercept electronic installation running contacts with human body, is exactly that the present invention can reach heat insulation effect.
Accompanying drawing explanation
Fig. 1 is the combination schematic perspective view of the first preferred embodiment of the present invention.
Fig. 2 A is the combination generalized section of the first preferred embodiment of the present invention.
Fig. 2 B is the local enlarged diagram of combination section of the first preferred embodiment of the present invention.
Fig. 3 is the exploded perspective schematic diagram of the second preferred embodiment of the present invention.
Fig. 4 A is the decomposition generalized section of the second preferred embodiment of the present invention.
Fig. 4 B is the combination generalized section of the second preferred embodiment of the present invention.
Fig. 4 C is the local enlarged diagram of combination section of the second preferred embodiment of the present invention.
Fig. 5 is that the base material of the second preferred embodiment of the present invention is heat insulation adhesive tape schematic perspective view.
Fig. 6 is the decomposing schematic representation of electronic installation of the present invention's the 3rd preferred embodiment.
Fig. 7 is the combination generalized section of electronic installation of the present invention's the 3rd preferred embodiment.
Heat insulation structural ... 1
Insulator ... 10
Glue material ... 101
Hollow heat insulated body ... 103
The first end face ... 1031
The second end face ... 1032
Gas ... 11
Base material ... 2
Material main body ... 21
First surface ... 211
Second surface ... 212
Electronic installation 3
Display screen 31
Input module 32
Touch module 33
The first housing 34
The second housing 35
Motherboard 36
Heater element 37.
Embodiment
Characteristic in the present invention's above-mentioned purpose and structure thereof and function, is explained the preferred embodiment according to accompanying drawing.
The present invention is to provide a kind of heat insulation structural and has the base material of heat insulation structural, refers to Fig. 1,2A, 2B, is the schematic diagram of solid, section and the local amplification of the first preferred embodiment of demonstration the present invention; This heat insulation structural 1 is to comprise an insulator 10, this insulator 10 has the second end face 1032 of a glue material 101, several hollow heat insulated body 103, one first end face 1031 and contrary this first end face 1031, this glue material 101 is to explain with adhesive in this preferred embodiment, but is not limited to this; When concrete enforcement, adhesive may be selected to be as epoxyn, polyurethane adhesive, polyvinyl acetate adhesive or other adhesive.And described glue material 101 is to mix these hollow heat insulated bodies 103 and described this heat insulation structural 1 of formation.
These hollow heat insulated bodies 103 are between this first end face 1031 and the second end face 1032 and stacking setting each other, that is etc. hollow heat insulated body 103 between this first end face 1031 and the second end face 1032, be each other with the stacking setting of interlace mode, as shown in Fig. 2 A, 2B, these hollow heat insulated bodies 103 are from this second end face 1032 towards the tight stacking setting of the first end face 1031 vertical interlaced, and are with hollow glass ball (Hollow glass microspheres in these hollow heat insulated bodies 103 of this preferred embodiment; Or be called hollow glass micropearl) explain, be not limited to this; When concrete enforcement, also may be selected to be hollow ceramic ball (or being called hollow ceramic microspheres), hollow irregular body ((as hollow irregular glass microballoon or hollow irregular ceramic fine bead)) or hollow square, close first Chen Ming.
And described several hollow heat insulated body 103 to have heat conduction be that number is extremely low and strengthen heat insulation effect, and in the middle of it, be hollow shape, and the several hollow heat insulated body 103 that aforementioned centre is hollow shape contains a gas 11, this gas 11 is to explain with carbon dioxide (CO2) in this preferred embodiment, but be not limited to this, when concrete enforcement, also may be selected to be vacuum gas.The particle diameter of wherein said several hollow heat insulated bodies 103 is the scope of 10 microns (μ m)～150 microns (μ m).
So seeing through several hollow heat insulated body 103 in this heat insulation structural 1 itself has low heat conductivity is good and thermal conductivity is lower gas 11 and for the pass of well insulated layer is, make effectively to intercept first end face 1031 of heat energy (or heat) from the second end face 1032 of this heat insulation structural 1 towards relative top and distribute, use the effect person who reaches heat insulation.
Therefore,, by the design of heat insulation structural 1 of the present invention, obtain effectively heat insulation effect.In addition, heat insulation structural 1 of the present invention is to can be applicable on an electronic installation (as notebook computer, computer, mobile phone or panel computer), that is this heat insulation structural 1 is can directly be coated on the outside or inner side of this electronic installation, use the effect that reaches heat insulation.
Referring to shown in Fig. 3, is the exploded perspective schematic diagram that shows the second preferred embodiment of the present invention, and be aided with consult Fig. 4 A, 4B, 4C shows; This this preferred embodiment is mainly that the heat insulation structural of aforementioned the first preferred embodiment 1 is applied to explain on a base material 2, that is this base material 2 comprises a material main body 21 and a heat insulation structural 1, this material main body 21 is formed with flexible materials, material main body 21 in this preferred embodiment is for PE release film explains, but is not limited to this; When the actual enforcement of the present invention, this material main body 21 also may be selected to be release liners, Copper Foil or aluminium foil.
Aforementioned substrates body 21 is the second surfaces 212 with a first surface 211 and relative this first surface 211.The structure of the heat insulation structural 1 of this this preferred embodiment and link to close be and effect roughly identical with the heat insulation structural 1 of aforementioned the first preferred embodiment, therefore again do not repeat at this.And aforementioned insulator 10 is formed on the first surface 211 of relative this material main body 21, that is insulator 10 is to be formed on the first surface 211 of this material main body 21 with coating method, make the second end face 1032 of this insulator 10 be sticked mutually with the first surface 211 of relative this material main body 21.Wherein the thickness with base material 2 integral body of heat insulation structural of the present invention is 0.05 millimeter～0.5 millimeter.
So there is the design of the base material 2 of heat insulation structural described in seeing through, effectively intercept 21 its upper receptions of this material main body first end face 1031 of heat energy (or heat) from the second end face 1032 of this heat insulation structural 1 towards relative top distribute, use and reach better heat insulation effect person.
And the base material 2 of this this preferred embodiment is to explain for heat insulation adhesive tape (as Fig. 5 shows), but do not regard it as and be limited, when concrete enforcement, the material that user can select according to this material main body 21 is as the demand of release liners, Copper Foil or aluminium foil, design the base material that difference has heat insulation structural, as there is the copper foil tape of heat insulation structural or there is the aluminum foil and adhesive tape of heat insulation structural.And the step of the manufacture method of aforementioned substrates 2 of the present invention is, first by several hollow heat insulated bodies 103 with appropriate wet with solvent, make solvent destroy the surface of these hollow heat insulated bodies 103, allow being blended in aforementioned glue material 101 that these hollow heat insulated bodies 103 can be full and uniform, then these the hollow heat insulated bodies 103 with moistening are mixed with glue material 101 uniformly, and in the process of mix and blend, add an appropriate sclerosis additive to continue uniform stirring, then after aforementioned mixed glue material 101 being utilized a coating machine (not shown) to be coated on the first surface 211 of this material main body 21, through a hot-air oven (not shown), the aforementioned material main body 21 that is coated with epoxy glue material 101 is being carried out to drying operation, after dry, just form described heat insulation adhesive tape (being aforementioned substrates 2), finally can to facilitate, transport heat insulation adhesive tape winding.Wherein aforementioned solvents is to may be selected to be benzene class or alcohols solvent.
In addition, when the actual enforcement of the present invention, aforementioned glue material 101 can be changed and is designed to an ink, exactly ink is mixed to these hollow heat insulated bodies 103 and form heat insulation structural 1, then utilize mode of printing that heat insulation structural 1 (being heat insulation ink) is printed in this material main body 2, the step of the manufacture method of base material 2 of the present invention is, first by several hollow heat insulated bodies 103 with appropriate wet with solvent, make solvent destroy the surface of these hollow heat insulated bodies 103, allow being blended in aforementioned ink that these hollow heat insulated bodies 103 can be full and uniform, then these the hollow heat insulated bodies 103 with moistening are mixed with ink uniformly, then utilize mode of printing to be printed on the first surface of this material main body 21 in the ink after aforementioned mixing with these hollow heat insulated bodies 103, treat that the aforementioned material main body 21 that is printed with mixed ink carries out drying operation, after dry, just form described heat insulation base material 2.
Referring to shown in Fig. 6,7, is the electronic installation schematic perspective view that shows the 3rd preferred embodiment of the present invention, and be aided with consult Fig. 4 A, 4B, 4C shows; This this preferred embodiment is mainly that the base material with heat insulation structural 2 of aforementioned the second preferred embodiment is applied on an electronic installation 3 (as notebook computer, computer, mobile phone or panel computer), and this electronic installation 3 is to explain with notebook computer in this preferred embodiment, but is not limited to this; This electronic installation 3 comprises a display screen 31, an input module 32, a touch module 33, one first housing 34, one second housing 35 and aforementioned substrates 2, these the first housing 34 1 sides are to be pivoted mutually with relative this second housing 35, this display screen 31 is to be located in this first housing 34, this input module 32 is to be a keyboard group, itself and touch module 33 is adjacent one another are is located in this second housing 35, and one motherboard 36 be to be located in this second housing 35, and relatively this input module 32 bottom side.
And the structure of the base material 2 of this this preferred embodiment and link to close be and effect roughly the base material 2 of aforementioned the second preferred embodiment is identical, therefore again do not repeat at this.And the second surface 212 of the material main body 21 of base material 2 is to have the viscosity of aforementioned glue material 101 own, see through and make second surface 212 stickups of this material main body 21 be located on the bottom side of relative input module 32, and 1031 of the first end faces of this insulator 10 to should motherboard 36 with its on a heater element 37 (as central processing unit or drawing wafer), so when heater element 37 produces heat energy (or heat), seeing through this material main body 21 aforementioned heat energy that the several hollow heat insulated body 103 in insulator 10 can effectively intercept in (or stopping) this second housing 35 on it outwards distributes from the Chao Qi top side, bottom side of this input module 32, effectively to reach heat insulation effect, and then because having stopped that aforementioned heat energy is by distributing on this input module 32, allow user in using this input module 32 can reach the preferably effect of comfort.
In addition, when concrete enforcement, user can also be by sticky this base material 2 that is provided with on the bottom side, inside of the second housing 35 of notebook computer (being electronic installation 3), the aforementioned heat energy of using in effective obstruct (or stopping) the second housing 35 distributes towards its outside bottom side from these the second housing 35 inside, and then also allow the outside bottom side of this second housing 35 not have hot polymerization collection, the outside bottom side of (or paste touch) this second housing 35 that makes user's shank directly contact, can effectively reach the effect person that the heat energy in this second housing 35 can not contact with user's shank, and allow user when using, reach comfort.
Therefore, by the base material 2 (being heat insulation adhesive tape) with heat insulation structural of the present invention, be applied to the design on electronic installation 3, make this base material there is preferably effect of heat insulation, and then can effectively stop the effect that heat energy that this electronic installation 3 produces contacts with human body (being user).
The above, the present invention has a following advantage compared to existing:
1. there is heat insulation effect.
2. can effectively stop the effect that heat energy that this electronic installation produces contacts with human body (being user).
Just above-described, be only better feasible embodiment of the present invention, such as utilize the above-mentioned method of the present invention, shape, structure, device to change for it, all should be contained in the interest field of invention.
Claims (13)
1. a heat insulation structural, it is characterized in that, it comprises: an insulator, this insulator has a glue material, several hollow heat insulated body, one first end face and one second end face, this glue material mixes these hollow heat insulated bodies, and this contrary this second end face of the first end face system, and these hollow heat insulated bodies are positioned between this first end face and the second end face and stacking setting each other.
2. heat insulation structural according to claim 1, is characterized in that, is hollow shape in the middle of these hollow heat insulated bodies, and it contains a gas, and this gas is vacuum gas or carbon dioxide.
3. heat insulation structural according to claim 2, is characterized in that, the particle diameter of this hollow heat insulated body is 10 microns～150 microns.
4. heat insulation structural according to claim 3, is characterized in that, these hollow heat insulated bodies are positioned between this first end face and the second end face and each other with the stacking setting of interlace mode.
5. heat insulation structural according to claim 2, is characterized in that, this hollow heat insulated body is hollow glass micropearl, hollow ceramic microspheres, hollow irregular body or hollow square.
6. heat insulation structural according to claim 3, is characterized in that, is to be applied on electronic installation, and this electronic installation is notebook computer, computer, mobile phone or panel computer.
7. a base material with heat insulation structural, is characterized in that, comprising:
One material main body, has the second surface of a first surface and relative this first surface; And
One heat insulation structural, comprise an insulator, this thermal-insulating system is formed on this first surface, and it has a glue material, several hollow heat insulated body, one first end face and one second end face, this glue material mixes these hollow heat insulated bodies, and first contrary this second end face of end face system, this second end face is sticked mutually with relative this first surface, and these hollow heat insulated bodies are positioned between this first end face and the second end face and stacking setting each other.
8. the base material with heat insulation structural according to claim 7, is characterized in that, the thickness of integral body is 0.05 millimeter～0.5 millimeter.
9. the base material with heat insulation structural according to claim 7, is characterized in that, is hollow shape in the middle of these hollow heat insulated bodies, and it contains a gas, and this gas is vacuum gas or carbon dioxide.
10. the base material with heat insulation structural according to claim 9, is characterized in that, the particle diameter of this hollow heat insulated body is 10 microns～150 microns.
11. base materials with heat insulation structural according to claim 9, is characterized in that, this material main body system is formed with flexible materials, and these hollow heat insulated bodies are positioned between this first end face and the second end face and each other with the stacking setting of interlace mode.
12. base materials with heat insulation structural according to claim 10, is characterized in that, this hollow heat insulated body is hollow glass micropearl, hollow ceramic microspheres, hollow irregular body or hollow square.
13. base materials with heat insulation structural according to claim 10, is characterized in that, are to be applied on an electronic installation, and this electronic installation is notebook computer, mobile phone or panel computer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103212657 | 2014-07-16 | ||
| TW103212657U TWM489869U (en) | 2014-07-16 | 2014-07-16 | Heat insulation adhesive structure and substrate having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104202948A true CN104202948A (en) | 2014-12-10 |
Family
ID=52088149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410413549.3A Pending CN104202948A (en) | 2014-07-16 | 2014-08-21 | Heat insulation structure and base material with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104202948A (en) |
| TW (1) | TWM489869U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107416419A (en) * | 2017-04-27 | 2017-12-01 | 山东隆源橡胶有限公司 | Heat-resisting composite cover glue adds a layer conveyer belt |
| CN109483975A (en) * | 2018-12-27 | 2019-03-19 | 苏州逸峰新材料科技有限公司 | A kind of new and effective antibacterial, heat insulating composite pad |
| CN110753462A (en) * | 2018-07-23 | 2020-02-04 | 宏碁股份有限公司 | Case structure and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002319652A (en) * | 2002-03-25 | 2002-10-31 | Kitagawa Ind Co Ltd | Internal structure for electrical/electronic appliance |
| CN202425274U (en) * | 2011-12-12 | 2012-09-05 | 苏州聚力电机有限公司 | Surface-mounted composite sheet for isolating and removing hot spots of electronic equipment |
| CN103158306A (en) * | 2013-03-18 | 2013-06-19 | 杭州威廉姆投资管理有限公司 | Novel ceramic heat insulating coat and preparation process thereof |
| CN103228120A (en) * | 2012-01-31 | 2013-07-31 | 曼埃利康有限公司 | Heat radiation sheet |
-
2014
- 2014-07-16 TW TW103212657U patent/TWM489869U/en not_active IP Right Cessation
- 2014-08-21 CN CN201410413549.3A patent/CN104202948A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002319652A (en) * | 2002-03-25 | 2002-10-31 | Kitagawa Ind Co Ltd | Internal structure for electrical/electronic appliance |
| CN202425274U (en) * | 2011-12-12 | 2012-09-05 | 苏州聚力电机有限公司 | Surface-mounted composite sheet for isolating and removing hot spots of electronic equipment |
| CN103228120A (en) * | 2012-01-31 | 2013-07-31 | 曼埃利康有限公司 | Heat radiation sheet |
| CN103158306A (en) * | 2013-03-18 | 2013-06-19 | 杭州威廉姆投资管理有限公司 | Novel ceramic heat insulating coat and preparation process thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107416419A (en) * | 2017-04-27 | 2017-12-01 | 山东隆源橡胶有限公司 | Heat-resisting composite cover glue adds a layer conveyer belt |
| CN110753462A (en) * | 2018-07-23 | 2020-02-04 | 宏碁股份有限公司 | Case structure and manufacturing method thereof |
| CN109483975A (en) * | 2018-12-27 | 2019-03-19 | 苏州逸峰新材料科技有限公司 | A kind of new and effective antibacterial, heat insulating composite pad |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM489869U (en) | 2014-11-11 |
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| PB01 | Publication | ||
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Application publication date: 20141210 |