CN2518146Y - Radiator able to increase radiation efficiency - Google Patents
Radiator able to increase radiation efficiency Download PDFInfo
- Publication number
- CN2518146Y CN2518146Y CN 02204704 CN02204704U CN2518146Y CN 2518146 Y CN2518146 Y CN 2518146Y CN 02204704 CN02204704 CN 02204704 CN 02204704 U CN02204704 U CN 02204704U CN 2518146 Y CN2518146 Y CN 2518146Y
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- heat
- heat radiator
- radiator body
- main body
- abstractor
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat radiating device which can improve the radiation efficiency, and comprise a first heat radiating main body. A plurality of upright heat sinks are integrally extended on the first heat radiating main body, in addition, a second heat radiating main body is arranged, a plurality of heat sinks in the hollow radiating shape are stamped on the second heat radiating main body, to lead to the second heat radiating main body to be embedded and inserted into the first heat radiating main body in a staggering way, the first heat radiating main body and the second heat radiating main body are respectively composed of different heat conduction materials, and one surface of the heat sink as the heat conduction has a certain length; thereby, the utility model adopts the two heat radiating main body with different heat conduction materials to improve the heat conduction efficiency, and the cost of the material can be effectively reduced, at the same time, one surface of the first heat radiating main body and the second heat radiating main body as the heat conduction can take the whole surface as the heat conduction because of the certain length, thereby increasing the heating radiating area that the known technology can not attain, as well as leading to the heat conduction effect of the whole heat radiating device better.
Description
Technical field
The utility model relates to a kind of heat abstractor that improves radiating efficiency, especially refer to that a kind of this heat abstractor that makes is made of the heat radiator body of two kinds of different Heat Conduction Materials, can improve whole heat transfer efficiency, and can effectively reduce material cost, simultaneously, the heat radiator of this heat radiator body has certain length as the one side of heat conduction, can do heat conduction with whole, increase area of dissipation that known technology is beyond one's reach, make the heat-conducting effect of entire heat dissipation device better.
Background technology
But above-mentioned known heat radiator body 6, if reduce the material cost of entire heat dissipation device 20, and use cost is low but the words of the Heat Conduction Material that heat-conducting effect is relatively poor, then the heat transfer efficiency of this heat radiator body 6 just can't improve, lose the real effect of its heat abstractor 20 on the contrary, if but heat transfer efficiency is improved, and use the words of expensive Heat Conduction Material, then can make the material cost of entire heat dissipation device 20 high again, influence its market competitiveness on the contrary; In addition, less no matter the heat radiator of known technology 61 its length or width are all done, so form each heat radiator 61, make its heat-conducting effect not good only for the heat conduction of point.Therefore, how to design a kind of heat abstractor that not only can increase heat transfer efficiency but also can reduce manufacturing cost, be the problem that the personage that knows this technology must solve at present.
Summary of the invention
The purpose of this utility model is to provide a kind of heat abstractor that improves radiating efficiency, mainly is this heat abstractor is made of the heat radiator body of two kinds of different Heat Conduction Materials, so that can improve whole heat transfer efficiency, and can effectively reduce material cost.
Another purpose of the present utility model is to provide a kind of heat abstractor that improves radiating efficiency, being the heat radiator that makes this heat radiator body has certain length as the one side of heat conduction, can do heat conduction with whole, increase area of dissipation that known technology is beyond one's reach, so that make the heat-conducting effect of entire heat dissipation device better.
Above-mentioned purpose of the present utility model is achieved in that a kind of heat abstractor that improves radiating efficiency, and wherein this heat abstractor includes:
One first heat radiator body, described first heat radiator body is the heat radiator that one is extended with a plurality of settings, and has between per two adjacent heat radiator at interval; And,
One second heat radiator body, described second heat radiator body is by what a metal sheet was stamped to form a plurality of heat radiator that are the hollow grating form to be arranged, have equally at interval between per two adjacent heat radiator, second heat radiator body is fixed in described first heat radiator body with the interlace mode intercalation;
Described first heat radiator body is made of different Heat Conduction Material respectively with second heat radiator body.
The heat abstractor that improves radiating efficiency described in the utility model, wherein said first heat radiator body have one and are flat substrate, and one is extended with the heat radiator of a plurality of settings on substrate.
The heat abstractor that improves radiating efficiency described in the utility model, wherein said substrate be provided with two horizontal rows to a plurality of heat radiator, and have at interval between each row's two adjacent heat radiator.
The heat abstractor that improves radiating efficiency described in the utility model, each bottom surface spaced of wherein said first heat radiator body is provided with soldering or heat conduction jointing material.
The heat abstractor that improves radiating efficiency described in the utility model, wherein said heat radiator has certain length as the one side of heat conduction.
The heat abstractor that improves radiating efficiency described in the utility model, wherein said Heat Conduction Material is made of institutes such as aluminium or copper or graphite.
The heat abstractor that improves radiating efficiency described in the utility model, the whole height of wherein said second heat radiator body is a little more than first heat radiator body.
The heat abstractor that improves radiating efficiency described in the utility model, wherein on the described heat radiator of described second heat radiator body, radiator fan is installed, or the electronics of the system's wind system that provides is provided above the described heat radiator of described second heat radiator body.
According to the heat abstractor that improves radiating efficiency described in the utility model, principal character is that this heat abstractor includes one first heat radiator body, one is extended with the heat radiator of a plurality of settings on this first heat radiator body, in addition, be provided with one second heat radiator body, this second heat radiator body has a plurality of heat radiator that are the hollow grating form by a metal sheet punching press, make second heat radiator body with the interlace mode intercalation in this first heat radiator body, and above-mentioned this first heat radiator body and second heat radiator body respectively by different Heat Conduction Materials (as aluminium, copper or graphite) constitute, and described heat radiator has certain length as the one side of heat conduction.
Relevant detailed description of the present utility model and technology contents describe below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the synoptic diagram of known technology;
Fig. 2 is the schematic perspective view that improves the heat abstractor of radiating efficiency described in the utility model;
Fig. 3 is the decomposing state synoptic diagram that improves the heat abstractor of radiating efficiency described in the utility model;
Fig. 4 is the side sectional view that improves the heat abstractor of radiating efficiency described in the utility model;
Fig. 5 is an embodiment synoptic diagram that improves the heat abstractor of radiating efficiency described in the utility model.
Embodiment
The utility model is a kind of heat abstractor that improves radiating efficiency, please refer to Fig. 2, Fig. 3, shown in Figure 4, this heat abstractor 10 can be applicable on the cpu chip, with usefulness as the cpu chip heat radiation, wherein, this heat abstractor 10 includes one first heat radiator body 1, this first heat radiator body 1 has one and is flat substrate 11, one is extended with the heat radiator 12 of a plurality of settings on the substrate 11 again, described heat radiator 12 can be equidistant arrangement, or unequal-interval is arranged, in the present embodiment, be on this substrate 11, be provided with two horizontal rows to a plurality of heat radiator 12, described heat radiator 12 is equidistant arrangement, and each row's two 12 adjacent of heat radiator have interval 13, and each is provided with soldering or heat conduction jointing material 14 every 13 bottom surface again.
Please refer to Fig. 2, shown in Figure 4, in addition, be provided with one second heat radiator body 2, its be with the interlace mode intercalation in this first heat radiator body 1, this second heat radiator body 2 is by a metal sheet punching press a plurality of heat radiator 21 that are the hollow grating form to be arranged, make also to have at interval 22 between per two adjacent heat radiator, and the width at this interval 22 just can make the heat radiator 12 of first heat radiator body 1 be located in this, or this interval 22 is installed with in two of first heat radiator body 1 adjacent heat radiator 12 formed intervals 13.
In the utility model, please refer to shown in Figure 3, above-mentioned this first heat radiator body 1 and second heat radiator body 2 respectively by different Heat Conduction Materials (as aluminium, copper or graphite) formation, and described heat radiator 12,21 one sides as heat conduction are to have certain length A, B, in a most preferred embodiment of the present utility model, first heat radiator body 1 can be made of aluminum, second heat radiator body 2 then can be made of copper product, or constituted by " copper+aluminium " material, be the weight of copper to alleviate second heat radiator body, 2 integral body.
During the utility model assembling, please refer to Fig. 2, shown in Figure 4, a plurality of heat radiator 21 that can make this second heat radiator body 2 with staggered mode intercalation in a plurality of heat radiator 12 of this first heat radiator body 1, after the intercalation, by soldering or heat conduction jointing material 14 solid weldings or the cementation of each on 13 bottom surfaces, second heat radiator body 2 is fixed on first heat radiator body 1, the whole height of this second heat radiator body 2 is a little more than first heat radiator body 1: afterwards, can on these heat radiator 21 of this second heat radiator body 2, radiator fan 3 be installed, or the system's wind that is provided by the electronics system is to heat abstractor 10 heat radiations, so, this heat abstractor 10 can be fastened on the cpu chip with fastener, so that the high temperature that is produced when this heat abstractor 10 makes the cpu chip running can dissipate, to improve its serviceable life.
In the utility model, because this heat abstractor 10 can be by the heat radiator body 1 of two kinds of different Heat Conduction Materials, 2 constitute, so can make the wherein low Heat Conduction Material of a heat radiator body 1 (or 2) use price, and another heat radiator body 2 (or 1) is used the high Heat Conduction Material of heat transfer efficiency, so, both can improve whole heat transfer efficiency, and can effectively reduce material cost: simultaneously, described heat radiator body 1,2 heat radiator 12,21 one sides as heat conduction have certain length, do heat conduction with whole, increase area of dissipation that known technology is beyond one's reach, can make the heat-conducting effect of entire heat dissipation device 10 better.
In sum, the heat abstractor that improves radiating efficiency of the present utility model can pass through above-mentioned described structure really, reaches described effect.
The above is preferred embodiment of the present utility model only, is not to be used for limiting the scope that the utility model is implemented.Be that all equalizations of being done according to the utility model claims change and modification, be all the utility model claim and contain.
Claims (8)
1. the heat abstractor that can improve radiating efficiency is characterized in that, this heat abstractor includes:
One first heat radiator body, described first heat radiator body is the heat radiator that one is extended with a plurality of settings, and has between per two adjacent heat radiator at interval; And,
One second heat radiator body, described second heat radiator body is by what a metal sheet was stamped to form a plurality of heat radiator that are the hollow grating form to be arranged, have equally at interval between per two adjacent heat radiator, second heat radiator body is fixed in described first heat radiator body with the interlace mode intercalation;
Described first heat radiator body is made of different Heat Conduction Material respectively with second heat radiator body.
2. the heat abstractor that improves radiating efficiency as claimed in claim 1 is characterized in that, described first heat radiator body has one and is flat substrate, and one is extended with the heat radiator of a plurality of settings on substrate.
3. the heat abstractor that improves radiating efficiency as claimed in claim 2 is characterized in that, described substrate be provided with two horizontal rows to a plurality of heat radiator, and have at interval between each row's two adjacent heat radiator.
4. the heat abstractor that improves radiating efficiency as claimed in claim 3 is characterized in that, each bottom surface spaced of described first heat radiator body is provided with soldering or heat conduction jointing material.
5. the heat abstractor that improves radiating efficiency as claimed in claim 1 is characterized in that, described heat radiator has certain length as the one side of heat conduction.
6. the heat abstractor that improves radiating efficiency as claimed in claim 1 is characterized in that described Heat Conduction Material is made of institutes such as aluminium or copper or graphite.
7. the heat abstractor that improves radiating efficiency as claimed in claim 1 is characterized in that the whole height of described second heat radiator body is a little more than first heat radiator body.
8. the heat abstractor that improves radiating efficiency as claimed in claim 1, it is characterized in that, on the described heat radiator of described second heat radiator body, radiator fan is installed, or the electronics of the system's wind system that provides is provided above the described heat radiator of described second heat radiator body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02204704 CN2518146Y (en) | 2002-01-22 | 2002-01-22 | Radiator able to increase radiation efficiency |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 02204704 CN2518146Y (en) | 2002-01-22 | 2002-01-22 | Radiator able to increase radiation efficiency |
Publications (1)
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CN2518146Y true CN2518146Y (en) | 2002-10-23 |
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CN 02204704 Expired - Fee Related CN2518146Y (en) | 2002-01-22 | 2002-01-22 | Radiator able to increase radiation efficiency |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012149891A1 (en) * | 2011-05-05 | 2012-11-08 | 优杰精密机械(苏州)有限公司 | Substrate of high-power electrionic device module and high-power electrionic device module |
CN103987231A (en) * | 2013-02-08 | 2014-08-13 | 技嘉科技股份有限公司 | Heat sink and method for manufacturing the same |
CN106705001A (en) * | 2017-03-01 | 2017-05-24 | 深圳盈特创智能科技有限公司 | LED lamp radiator and LED lamp |
CN110121250A (en) * | 2018-02-07 | 2019-08-13 | 上海擎感智能科技有限公司 | Radiator structure and navigation host box |
-
2002
- 2002-01-22 CN CN 02204704 patent/CN2518146Y/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012149891A1 (en) * | 2011-05-05 | 2012-11-08 | 优杰精密机械(苏州)有限公司 | Substrate of high-power electrionic device module and high-power electrionic device module |
CN103987231A (en) * | 2013-02-08 | 2014-08-13 | 技嘉科技股份有限公司 | Heat sink and method for manufacturing the same |
CN103987231B (en) * | 2013-02-08 | 2017-08-01 | 技嘉科技股份有限公司 | Heat sink and method for manufacturing the same |
CN106705001A (en) * | 2017-03-01 | 2017-05-24 | 深圳盈特创智能科技有限公司 | LED lamp radiator and LED lamp |
CN110121250A (en) * | 2018-02-07 | 2019-08-13 | 上海擎感智能科技有限公司 | Radiator structure and navigation host box |
CN110121250B (en) * | 2018-02-07 | 2023-09-26 | 上海擎感智能科技有限公司 | Heat radiation structure and navigation host box |
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GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |