CN2465235Y

CN2465235Y - Chipset heat sink assembly

Info

Publication number: CN2465235Y
Application number: CN 01205602
Authority: CN
Inventors: 陈玉霖; 江贵凤
Original assignee: Mitac International Corp
Current assignee: Mitac International Corp
Priority date: 2001-02-20
Filing date: 2001-02-20
Publication date: 2001-12-12
Anticipated expiration: 2011-02-20

Abstract

The utility model provides a radiating fin assembly which aims to effectively utilize space and increase the radiating efficiency. The utility model changes the shape construction of a radiating fin assembly which is connected with a heating chip in a heat conducting mode so that an actual radiating part can be extended to a proper position far away the heating chip. Besides, the construction of the fin increases the radiating efficiency and reduces the heat resistance.

Description

The chipset heat sink assembly

The utility model relates to a kind of heat sink assembly, particularly relates to a kind of heat sink assembly that is used for chipset.

Because computer is compact day by day, the usage space in the casing reduces thereupon; Yet along with speeding of computer running time clock, the heat energy that all makes chip produce significantly increases, simultaneously, along with compact demand is pursued in product design, can reduce in order to the space that heating radiator is installed, radiating requirements but oppositely strengthens, become undoubtedly and be responsible for the shade that thermal treatment engineering person can't get rid of in mind.

A kind of heating radiator 1 of prior art, shown in Figure 1A to 1C, be to form heat conduction with forging type to be connected to and to desire one of heat radiation chip and connect substrate 10, the vertical symmetry of multi-disc and be erected at the heat radiator 12 that heat radiator 11 and a slice on the aforementioned connection substrate 10 is positioned at the substrate centre position, has through hole 120; Through cross cutting, form many symmetrical grooves 13 again, each

heat radiator

11,12 is divided into short a plurality of independent heat radiator again, to increase area of dissipation.

Yet desire is installed this kind heating radiator, must keep enough spaces above chip; To cooperate in the chipset that for example the PentiumII central processing unit uses, it for example is example with the north bridge chips, base thermal value height, but can obviously not apply aforementioned heating radiator for the height that heating radiator is installed uses required, in fact, only there is the width of 6mm in the space that this chipset can Gong be installed and used, narrow space like this, and how radiating effect well imagines.

Moreover each independent heat radiator stands in great numbers based on the spacing of the space of 11,12 of each heat radiator and groove 13 is narrow, no matter has or not the air flow of forced heat radiation, all produces turbulent flow and eddy current unavoidably, thereby causes the phenomenon of heat bag, causing heating to be difficult for effectively removing.

Because existing heating radiator is big at the ad-hoc location installation footprint, radiating effect is not good again, the utility model is intended to solve these problems of the prior art.

Fundamental purpose of the present utility model provides a kind of heat sink assembly, effectively to utilize the space and to improve radiating efficiency.

For achieving the above object, heat sink assembly of the present utility model comprises an a junction and an extension.Wherein, this connecting portion heat conduction is connected to the said chip group; This extension then extends bending from this connecting portion and forms, and also has a plurality of heat-dissipating fins on it.

Of the present utility model by changing the shape structure that heat conduction is connected in heat sink assembly on the euthermic chip, make actual heat radiation position may extend to a appropriate location away from said chip, and by the structure of fin, lifting radiating efficiency, reduction thermal resistance.

Below in conjunction with accompanying drawing preferred embodiment of the present utility model is described.In the accompanying drawing:

Figure 1A to 1C is the view of three directions of existing heating radiator;

Fig. 2 is the stereographic map of preferred embodiment of the present utility model; And

Fig. 3 is the side view of the embodiment of Fig. 2.

Label declaration:

1... heating radiator 2... heat sink assembly

10... connect

substrate

11,12... heat radiator

13... groove 20... connecting portion

21... extension 120... through hole

210... fin 211... perforation

Please refer to Fig. 2 and 3, heat sink assembly 2 of the present utility model comprises: an a junction and an extension.

Wherein, these connecting portion 20 heat conduction are connected to the said chip group, and in this example, for purposes of illustration, this connecting portion 20 is made by single sheet metal with extension 21, and this extension 21 is to extend vertical bending from this connecting portion 20, on it and have a plurality of heat-dissipating fins 210.And easy for what make, the formation of this fin 210 can be selected to obtain by this extension 21 of punching press, forms a plurality of perforation 211 in be stamped out the position of this fin 210 of this extension 21 simultaneously.This fin 210 preferably stretches out with these extension 21 inclinations.In a preferred mode, 21 one-tenth miter angles of fin 210 and extension.

The heat that chip is sent out can be smoothly in the open place heat radiation of comparing with existing heating radiator further from this chip via the conduction of this connecting portion 20 with extension 21.And based on this fin 210 is to be the oblique angle from this extension 21 to stretch out, and this fin 210 is interconnected, causes in the face of the airflow from all directions, all can form bigger wind surface, makes the extension 21 of same length and width can possess bigger efficiently radiates heat area.Especially this fin 210 is to stamp out from this extension 21, and in a plurality of perforation 211 of former extension 21 surface formation, for lateral airflow this perforation 211 of flowing through, increase the effect of airflow convection effect more, simultaneously also can increase area of dissipation significantly, also can promote to some extent at the radiating effect of general positive draft.

By aforesaid way, can improve existing heating radiator next-door neighbour said chip smoothly, can the space be narrow and small for installing and using, situation such as radiating efficiency Yin Rebao and eddy current and low problem.Find after tested, according to the made sample of the utility model preferred embodiment, under same test condition, can really thermal resistance be reduced to 4.5 ℃/W by the about 6 ℃/W of existing heating radiator, as be installed on the above-mentioned north bridge chips, reduce about 10 ℃ effect just can produce than prior art.

In sum, chipset heat sink assembly of the present utility model can reach its intended purposes and effect by above-mentioned structure, device.

Though disclosed the utility model in conjunction with the preferred embodiments, inevitable and it is not in order to limit scope of the present utility model.Those skilled in the art can make various changes and retouching on this basis, but still falls within the protection domain of the present utility model.

Claims

1. a chipset heat sink assembly is characterized in that, described assembly comprises: an a junction and an extension, and wherein, described connecting portion heat conduction is connected to the said chip group; Described extension extends bending from described connecting portion and forms, and also has a plurality of heat-dissipating fins on it.

2. chipset heat sink assembly as claimed in claim 1 is characterized in that described extension is approximately perpendicular to described connecting portion.

3. chipset heat sink assembly as claimed in claim 1 is characterized in that described heat-dissipating fin becomes interconnected.

4. chipset heat sink assembly as claimed in claim 1 is characterized in that described heat-dissipating fin is for being stamped to form.

5. chipset heat sink assembly as claimed in claim 4 is characterized in that the described extension described heat-dissipating fin place that is stamped out is the perforation shape, is beneficial to increase radiating effect.

6. chipset heat sink assembly as claimed in claim 1 is characterized in that described heat-dissipating fin and described extension oblique arrangement.

7. chipset heat sink assembly as claimed in claim 6 is characterized in that described heat-dissipating fin becomes miter angle to tilt with described extension.

8. chipset heat sink assembly as claimed in claim 1 is characterized in that described connecting portion, extension and fin are stamped to form by single sheet metal.