CN2514400Y - Radiating device for computer - Google Patents

Radiating device for computer Download PDF

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Publication number
CN2514400Y
CN2514400Y CN 01275062 CN01275062U CN2514400Y CN 2514400 Y CN2514400 Y CN 2514400Y CN 01275062 CN01275062 CN 01275062 CN 01275062 U CN01275062 U CN 01275062U CN 2514400 Y CN2514400 Y CN 2514400Y
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CN
China
Prior art keywords
heat
groove
computer
radiating device
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 01275062
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Chinese (zh)
Inventor
唐济海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Molex Interconnect Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Priority to CN 01275062 priority Critical patent/CN2514400Y/en
Application granted granted Critical
Publication of CN2514400Y publication Critical patent/CN2514400Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

A computer cooling device comprises a fan 1, a cooling plate 2, a plurality of U-shaped heat pipes 3 and a heat conducting board 2; wherein, the cooling plate 2 is formed by a plurality of cooling fins arranged in parallel; the open end of the heat pipe 3 is vertically inserted and fixedly connected to the cooling plate 2, and the close end of the heat pipe 3 is connected with the upper end face of the heat conducting board 4; the lower end face of the heat conducting board 4 contacts components and parts. The heat pipe 3 is used for rapidly and evenly leading the heat produced by the central processing unit in operation to the cooling plate 2, and then the heat is eliminated by the cooling plate 2 and the fan 1. Therefore, the cooling fins on different positions have small temperature difference and good cooling effect.

Description

Computer heat radiating device
Technical field
The utility model relates to a kind of computer heat radiating device, particularly a kind of heat abstractor that is used for central processing unit.
Background technology
The electronic devices and components of computer-internal the time can produce heat usually in work, and the components and parts temperature is raise, and can exert an influence to the operate as normal of components and parts.Temperature when wherein, central processing unit is worked is high especially.Therefore, heat abstractor must be installed to guarantee components and parts operate as normal under suitable temperature.
The central processing unit of present employed most PCs all only adopts heat radiator and fan as thermal component, and thermal component directly is contained on the central processing unit.The diverse location of heat radiator has the temperature difference, and it is inhomogeneous to dispel the heat, and influences radiating effect.
Summary of the invention
The purpose of this utility model provides a kind of heat abstractor that utilizes heat pipe, heat radiator and fan to form thermal component, for central processing unit provides better radiating condition.
To achieve the above object, the technical solution of the utility model is as follows:
A kind of computer heat radiating device comprises fan 1, heat radiator 2, some " U " shape heat pipes 3 and heat-conducting plate 4; Heat radiator 2 is made of the radiating fin that several are arranged in parallel; The openend of heat pipe 3 vertically inserts in the heat radiator 2 and is affixed with heat radiator 2, and the blind end of heat pipe 3 is connected with the upper surface of heat-conducting plate 4; The lower surface of heat-conducting plate 4 contacts with components and parts.
The upper surface of described heat-conducting plate 4 is provided with several grooves 5, and the blind end of heat pipe 3 is inlaid in the groove 5.
Be filled with heat-conductive bonding agent in the described groove 5, heat pipe 3 is fixed in the groove 5.
The number of described heat pipe 3 is three.
Described heat-conducting plate 4 is fixed on the top of components and parts by framework 6, and the position corresponding to groove 5 on the framework 6 also is provided with groove 7, and the blind end of heat pipe 3 passes groove 7 and is inlaid in the groove 5.
Described heat abstractor also comprises a housing 8 with air vent, and heat radiator 2 is encapsulated in the housing 8, and fan 1 is contained on the housing 8.
Be equipped with several flow-disturbing holes 9 on each radiating fin of described heat radiator 1.
Owing to adopt above-mentioned scheme, a kind of heat abstractor of brand new is provided, the heat that is produced when utilizing heat pipe 3 that central processing unit is worked guides to heat radiator 2 fast and equably, again by heat radiator 2 and fan 1 ventilation and heat.Like this, the radiating fin of diverse location has a narrow range of temperature, good heat dissipation effect.Simultaneously, leave bigger space between thermal component and the components and parts, and the design in flow-disturbing hole 9 has all guaranteed good ventilation and heat.
Description of drawings
Fig. 1 is the stereographic map of heat abstractor described in the utility model;
Fig. 2 is the decomposing schematic representation of heat abstractor described in the utility model.
Embodiment
Below in conjunction with drawings and Examples the utility model is described in further detail:
Shown in Fig. 1 to 2, a kind of computer heat radiating device comprises fan 1, heat radiator 2, has the housing 8 of air vent, three " U " shape heat pipes 3 and heat-conducting plates 4; Heat radiator 2 is made of the radiating fin that several are arranged in parallel, and radiating fin is provided with several flow-disturbing holes 9, and heat radiator 2 is encapsulated in the housing 8, and fan 1 is contained on the housing 8; The openend of heat pipe 3 vertically inserts in the heat radiator 2 and is affixed with heat radiator 2; The upper surface of heat-conducting plate 4 is provided with several grooves 5, and the blind end of heat pipe 3 is inlaid in the groove 5, is filled with heat-conductive bonding agent in the groove 5, and heat pipe 3 is fixed in the groove 5; The lower surface of heat-conducting plate 4 contacts with central processing unit; Heat-conducting plate 4 is fixed on the top of central processing unit by framework 6, and the position corresponding to groove 5 on the framework 6 also is provided with groove 7, and the blind end of heat pipe 3 passes groove 7 and is inlaid in the groove 5.

Claims (7)

1, a kind of computer heat radiating device comprises fan (1), heat radiator (2), and heat radiator (2) is made of the radiating fin that several are arranged in parallel; It is characterized in that: also comprise some " U " shape heat pipes (3) and heat-conducting plate (4); The openend of heat pipe (3) vertically inserts in the heat radiator (2) and is affixed with heat radiator (2), and the blind end of heat pipe (3) is connected with the upper surface of heat-conducting plate (4); The lower surface of heat-conducting plate (4) contacts with components and parts.
2, computer heat radiating device according to claim 1 is characterized in that the upper surface of described heat-conducting plate (4) is provided with several grooves (5), and the blind end of heat pipe (3) is inlaid in the groove (5).
3, computer heat radiating device according to claim 2 is characterized in that being filled with heat-conductive bonding agent in the described groove (5), and heat pipe (3) is fixed in the groove (5).
4, computer heat radiating device according to claim 1, the number that it is characterized in that described heat pipe (3) is three.
5, computer heat radiating device according to claim 1, it is characterized in that described heat-conducting plate (4) is fixed on the top of components and parts by framework (6), the position that framework (6) is gone up corresponding to groove (5) also is provided with groove (7), and the blind end of heat pipe (3) passes groove (7) and is inlaid in the groove (5).
6, computer heat radiating device according to claim 1 is characterized in that also comprising a housing (8) with air vent, and heat radiator (2) is encapsulated in the housing (8), and fan (1) is contained on the housing (8).
7, computer heat radiating device according to claim 1 is characterized in that each radiating fin of described heat radiator (2) is provided with several flow-disturbing holes (9).
CN 01275062 2001-11-26 2001-11-26 Radiating device for computer Expired - Lifetime CN2514400Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 01275062 CN2514400Y (en) 2001-11-26 2001-11-26 Radiating device for computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 01275062 CN2514400Y (en) 2001-11-26 2001-11-26 Radiating device for computer

Publications (1)

Publication Number Publication Date
CN2514400Y true CN2514400Y (en) 2002-10-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 01275062 Expired - Lifetime CN2514400Y (en) 2001-11-26 2001-11-26 Radiating device for computer

Country Status (1)

Country Link
CN (1) CN2514400Y (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7363966B2 (en) 2004-12-30 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US7401642B2 (en) 2003-12-19 2008-07-22 Hon Hai Precision Industry Co., Ltd. Heat sink with heat pipes
CN101090619B (en) * 2006-06-16 2010-05-12 富准精密工业(深圳)有限公司 Heat sink device
CN101026943B (en) * 2006-02-17 2011-09-28 富准精密工业(深圳)有限公司 Guided radiating device
CN103037667A (en) * 2012-06-30 2013-04-10 广东华信海通信息技术有限公司 Handset
CN110603418A (en) * 2017-05-10 2019-12-20 Abb瑞士股份有限公司 Electrical device with improved heat removal

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7401642B2 (en) 2003-12-19 2008-07-22 Hon Hai Precision Industry Co., Ltd. Heat sink with heat pipes
US7363966B2 (en) 2004-12-30 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
CN101026943B (en) * 2006-02-17 2011-09-28 富准精密工业(深圳)有限公司 Guided radiating device
CN101090619B (en) * 2006-06-16 2010-05-12 富准精密工业(深圳)有限公司 Heat sink device
CN103037667A (en) * 2012-06-30 2013-04-10 广东华信海通信息技术有限公司 Handset
CN103037667B (en) * 2012-06-30 2015-09-16 广东华信金溢信息技术有限公司 A kind of hand-held set
CN110603418A (en) * 2017-05-10 2019-12-20 Abb瑞士股份有限公司 Electrical device with improved heat removal
US12062478B2 (en) 2017-05-10 2024-08-13 Hitachi Energy Ltd Electrical device having heat generating components with improved heat removal using turbulent flow

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: TANG JIHAI

Free format text: FORMER OWNER: ZONG MIN

Owner name: NONE

Free format text: FORMER OWNER: TANG JIHAI

Effective date: 20031107

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20031107

Address after: 518031, room 512, Zhonglian building, 402 Zhenhua Road, Shenzhen, Guangdong, Futian District 52, China

Patentee after: Tang Jihai

Address before: 518031, room 512, Zhonglian building, 402 Zhenhua Road, Shenzhen, Guangdong, Futian District 52, China

Co-patentee before: Tang Jihai

Patentee before: Zong Min

ASS Succession or assignment of patent right

Owner name: DONGGUAN MOLEX CONNECTOR CO., LTD.

Free format text: FORMER OWNER: TANG JIHAI

Effective date: 20040716

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20040716

Address after: 523000 Shijie Town, Dongguan, Guangdong

Patentee after: Dongguan Molex Connector Co., Ltd.

Address before: 518031, room 512, Zhonglian building, 402 Zhenhua Road, Shenzhen, Guangdong, Futian District 52, China

Patentee before: Tang Jihai

C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20111126

Granted publication date: 20021002