WO2012149891A1

WO2012149891A1 - Substrate of high-power electrionic device module and high-power electrionic device module

Info

Publication number: WO2012149891A1
Application number: PCT/CN2012/074967
Authority: WO
Inventors: 李盈贤
Original assignee: 优杰精密机械(苏州)有限公司
Priority date: 2011-05-05
Filing date: 2012-05-02
Publication date: 2012-11-08
Also published as: CN102768998A

Abstract

A substrate of a high-power electronic device module, comprising a metal substrate (1) and a graphite heat conduction block (2) having high heat conductivity, wherein the high-power electronic device module is fixedly mounted on one surface of the metal substrate (1), and the graphite heat conduction block (2) is fixedly connected with the other surface of the metal substrate (1). The graphite heat conduction block (2) with light weight and high heat conductivity is fixedly connected to the metal substrate (1), as the heat conductivity coefficient of the graphite is as high as 700-1000, the heat-conducting property of the whole substrate is good, the weight of the substrate is light, and the cost of the substrate is low.

Description

High power electronic device module substrate

Technical field

The present invention relates to the field of high-power electronic products, and in particular to a substrate for a high-power electronic device module. Background technique

In the electronics industry, high-power communication circuit boards or high-power LED light sources often generate a large amount of heat under normal operation. These heats must be discharged into the environment in time. Otherwise, the temperature of the electronic components will rise and affect their normal operation. Sometimes it is even damaged.

When a high-power communication board or a high-power LED light source is packaged, in order to reduce the cost, the area and thickness of the metal substrate carrying the electronic device are minimized, resulting in a small heat transfer area of the metal substrate.

In order to achieve good heat dissipation, a metal heat sink is usually mounted on a metal substrate. Since the aluminum heat sink has low cost and light weight, it is widely used, but the aluminum heat sink has a thermal conductivity of about 130-140 and a low heat conduction rate. Thermal energy accumulates in the vicinity of the metal substrate, causing the temperature of the electronic device to be too high, which seriously affects its service life. The thermal conductivity of the copper heat sink is 400-420, and the heat conduction is improved, but its weight is high and the cost is high. It is difficult to promote it on a large scale. Summary of the invention

In order to solve the above problems, an object of the present invention is to provide a substrate for a high-power electronic device module having good heat conductivity, light weight, and low cost.

In order to achieve the above object, the technical solution of the present invention is: a substrate for a high-power electronic device module, comprising a high thermal conductivity metal substrate and a graphite thermal block, wherein the high-power electronic device module is fixedly mounted on one side of the metal substrate The other surface of the metal substrate is fixedly connected to the graphite heat conducting block.

Preferably, the surface area of the graphite heat conductive block is larger than a surface of the metal substrate Product.

Preferably, a heat sink is further included, the heat sink is provided with a groove, and the graphite heat conducting block is embedded in the groove.

Preferably, the graphite heat conducting block is a flat block shape, a transverse rectangular parallelepiped, a cube or a vertical rectangular parallelepiped.

Preferably, the graphite heat conducting block is provided with fins, the groove is provided with a fin groove matched with the fin, and the graphite heat conducting block and the fin are respectively embedded in the groove and the fin In the slot.

The beneficial effects of adopting the technical solution are as follows: fixing and connecting the graphite thermal conductive block with light weight and high thermal conductivity on the metal substrate, since the thermal conductivity of the graphite is as high as 700-1 000, the thermal conductivity of the whole substrate is good, the weight is light and the cost is low. . DRAWINGS

1 is a schematic diagram of Embodiment 1 of a substrate for a high-power electronic device module according to the present invention; FIG. 2 is a schematic view showing a second embodiment of a substrate for a high-power electronic device module according to the present invention; A schematic diagram of the substrate of the power electronic device module after the second embodiment is separated.

The names of the corresponding parts represented by numbers and letters in the figure:

1. Metal substrate 2. Graphite thermal block 21. Fin 3. Heat sink 31. Groove 32. Fin groove 4. LED chip

The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

Example 1,

As shown in FIG. 1 , a substrate for a high-power electronic device module includes a highly thermally conductive metal substrate 1 and a graphite thermal block 2 , and a high-power electronic device module such as an LED chip is fixedly mounted on one side of the metal substrate 1 . 4, the other surface of the metal substrate 1 is fixedly connected to the graphite heat conducting block 2. The surface area of the graphite heat conductive block 2 is larger than the surface area of the metal substrate 1. A heat sink 3 is further provided, the heat sink is provided with a recess 31, and the graphite heat conducting block 2 is embedded in the recess 31.

In this embodiment, the graphite heat conducting block 2 is in the form of a flat block, and may also be a rectangular parallelepiped, a cube or a vertical rectangular parallelepiped.

The working principle of this embodiment is that a large amount of thermal energy generated during operation of the LED chip 4 is conducted to the metal substrate 1, and then transferred from the metal substrate 1 to the graphite thermal block 2, since the thermal conductivity of the graphite thermal block 2 is as high as 700 to 1000. Therefore, the heat energy is quickly transferred to the graphite heat conducting block 2, since the graphite heat conducting block 2 is relatively fragile and is not suitable for industrial applications, a metal heat sink 3 is nested outside the graphite heat conducting block 2 to protect the graphite. The function of the heat conducting block 2, on the other hand, since the surface area of the graphite heat conducting block 2 is large, and the contact area of the metal heat sink 3 is also large, the heat conduction efficiency is greatly improved, and the metal substrate 1 and the metal heat sink 3 are directly overcome. The heat retention caused by contact greatly improves the heat dissipation efficiency.

The beneficial effects of adopting the technical solution are as follows: Fixing and connecting the graphite thermal conductive block with light weight and high thermal conductivity on the metal substrate, since the thermal conductivity of the graphite is as high as 700-1000, the thermal conductivity of the whole substrate is good, the weight is light and the cost is low.

Example 2

As shown in FIG. 2 and FIG. 3, the graphite heat conducting block 2 is provided with fins 21, and the groove 31 is provided with a fin groove 32 matching the fin 21, the graphite heat conducting block 2 and the The fins 21 are respectively embedded in the groove 31 and the fin groove 32. This embodiment increases the contact area between the graphite thermal block 2 and the metal heat sink 3, further improving the heat transfer efficiency.

The above is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can make various modifications and improvements without departing from the inventive concept. The scope of protection of the invention.

Claims

A substrate for a high-power electronic device module, comprising: a high thermal conductivity metal substrate and a graphite thermal block, wherein the high-power electronic device module is fixedly mounted on one side of the metal substrate, The other side is fixedly connected to the graphite heat conducting block.

The substrate for a high power electronic device module according to claim 1, wherein a surface area of the graphite heat conductive block is larger than a surface area of the metal substrate.

The substrate for a high-power electronic device module according to claim 1 or 2, further comprising a heat sink, wherein the heat sink is provided with a groove, and the graphite heat conducting block is embedded in the groove in.

The substrate for a high power electronic device module according to claim 3, wherein the graphite heat transfer block is a flat block shape, a rectangular parallelepiped, a cube or a vertical rectangular parallelepiped.

The substrate for a high-power electronic device module according to claim 3, wherein the graphite heat-conducting block is provided with a fin, and the groove is provided with a fin groove matched with the fin. The graphite heat conducting block and the fins are respectively embedded in the groove and the fin groove.