CN102437278A - Heat radiating device for LED (Light-Emitting Diode) - Google Patents
Heat radiating device for LED (Light-Emitting Diode) Download PDFInfo
- Publication number
- CN102437278A CN102437278A CN201010500554XA CN201010500554A CN102437278A CN 102437278 A CN102437278 A CN 102437278A CN 201010500554X A CN201010500554X A CN 201010500554XA CN 201010500554 A CN201010500554 A CN 201010500554A CN 102437278 A CN102437278 A CN 102437278A
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- heat
- led
- conducting layer
- substrate
- heat radiating
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Abstract
The invention discloses a heat radiating device for an LED (Light-Emitting Diode), belonging to the field of heat radiation. The heat radiating device comprises a substrate, a heat radiating plate, a heat conducting layer (12) and LEDs, wherein at least one of the LEDs is arranged on the upper surface of the substrate; the heat conducting layer is arranged on the lower surface of the substrate; the heat radiating plate is arranged on the lower surface of the heat conducting layer (12); the substrate is made of one of ceramics, copper, aluminum and aluminum magnesium alloy; the heat conducting layer is made of one of graphite and carbon fiber; and the substrate, the heat conducting layer and the heat radiating plate are combined in a clamping way. The heat radiating device has the beneficial effects that the rapid heat radiation of the LED is realized by a simple structure, the brightness of the LED is increased, and the service life of the LED is prolonged.
Description
Technical field
The present invention relates to a kind of heat abstractor, specifically is the heat abstractor of a kind of LED of being used for, belongs to the heat radiation field.
Background technology
In recent years, the application of LED very extensively.Along with the raising of LED brightness, LED just has been applied to lighting field, like module backlight of car light, desk lamp or display unit etc.; Yet, when electric current through the time, LED makes the rising of LED temperature then because electric energy is failed to convert luminous energy effectively to and produced great amount of heat, causes LED brightness decline, the lost of life etc.Therefore, LED as the suitable heat abstractor of the product needed of light source, otherwise can be unfavorable for the work of LED.
At present, the LED encapsulating structure mainly is to utilize printed circuit board (PCB) as the heat conduction media.Yet, though but conventional printed circuit board (PCB) heat conduction can not conduct to heating panel fast with heat.Therefore, LED can't be provided with the mode of highly dense intensity and use.
Summary of the invention
The objective of the invention is provides the heat abstractor of a kind of LED of being used in order to overcome above-mentioned deficiency of the prior art, has overcome the shortcoming of traditional approach to the LED heat radiation.
The technical scheme that the present invention adopts is: the heat abstractor of a kind of LED of being used for; It is characterized in that comprising substrate, heating panel, heat-conducting layer and LED; Upper surface of base plate is provided with at least one LED, and base lower surface is provided with heat-conducting layer, and heating panel is arranged on the lower surface of heat-conducting layer; Substrate is by a kind of formation the in pottery, copper, aluminium or the almag; Heat-conducting layer is by a kind of formation the in graphite and the carbon fiber; Substrate, heat-conducting layer and heating panel combine with the clamping mode.
The invention has the beneficial effects as follows the quick heat radiating of having realized LED with simple structure, improved the brightness of LED and prolonged its life-span.
Description of drawings
Fig. 1 is the cross-sectional of heat abstractor of the present invention
Fig. 2 is the cross-sectional after heat abstractor of the present invention connects
Among the figure: 10, substrate, 12, heat-conducting layer, 14, heating panel, 16, LED, 20, metal coating.
Embodiment
To combine accompanying drawing that the present invention is described further below.
Like Fig. 1, shown in Figure 2, a kind of heat abstractor that is used for LED comprises substrate 10, heat-conducting layer 12, heating panel 14 and LED16, and substrate 10 is provided with a plurality of LED16, and heat-conducting layer 12 is arranged between substrate 10 and the heating panel 14; In addition, heat-conducting layer 12 is processed by graphite or carbon fiber, and base version 10 is processed by pottery, copper, aluminium or almag with heating panel 14; Substrate 10, heat-conducting plate 12, heating panel 14 closely combine into heat abstractor through the clamping mode; The metal coating 20 on heat-conducting layer 12 surfaces combines with substrate 10 and heating panel 14 through welding; Metal coating 20 forms through chemical deposition, vapor deposition or electroplating technology.
When LED16 was luminous, owing to the efficiency loss in the electric energy conversion luminous energy is generated heat, heat was at first absorbed by substrate 10, by heat-conducting layer 12 heat is passed in the heating panel 14 fast, and heating panel 14 is dispersed into heat in the air with LED16 more again.
The present invention is spread the heat that LED16 produced rapidly and equably through heat-conducting layer 12, by each diffusion into the surface of heating panel 14 and LED16, the temperature of LED16 is reduced, and then LED16 brightness is improved and the life-span prolongation.
Claims (4)
1. heat abstractor that is used for LED; It is characterized in that comprising substrate (10), heating panel (14), heat-conducting layer (12) and LED (16); Substrate (10) upper surface is provided with at least one LED (16); Substrate (10) lower surface is provided with heat-conducting layer (12), and heating panel (14) is arranged on the lower surface of heat-conducting layer (12).
2. a kind of heat abstractor that is used for LED according to claim 1 is characterized in that substrate (10) is by a kind of formation the in pottery, copper, aluminium or the almag.
3. a kind of heat abstractor that is used for LED according to claim 1 is characterized in that heat-conducting layer (12) is by a kind of formation the in graphite and the carbon fiber.
4. a kind of heat abstractor that is used for LED according to claim 1 is characterized in that substrate (10), heat-conducting layer (12) and heating panel (14) combine with the clamping mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010500554XA CN102437278A (en) | 2010-09-29 | 2010-09-29 | Heat radiating device for LED (Light-Emitting Diode) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010500554XA CN102437278A (en) | 2010-09-29 | 2010-09-29 | Heat radiating device for LED (Light-Emitting Diode) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102437278A true CN102437278A (en) | 2012-05-02 |
Family
ID=45985248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010500554XA Pending CN102437278A (en) | 2010-09-29 | 2010-09-29 | Heat radiating device for LED (Light-Emitting Diode) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102437278A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102737554A (en) * | 2012-06-29 | 2012-10-17 | 北京金立翔艺彩科技股份有限公司 | Supporting substrate manufacturing method and light emitting diode (LED) display device |
| WO2012149891A1 (en) * | 2011-05-05 | 2012-11-08 | 优杰精密机械(苏州)有限公司 | Substrate of high-power electrionic device module and high-power electrionic device module |
| CN103594614A (en) * | 2012-08-15 | 2014-02-19 | 品元企业股份有限公司 | Chip (wafer) heat radiation double metal post used for light source |
-
2010
- 2010-09-29 CN CN201010500554XA patent/CN102437278A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012149891A1 (en) * | 2011-05-05 | 2012-11-08 | 优杰精密机械(苏州)有限公司 | Substrate of high-power electrionic device module and high-power electrionic device module |
| CN102737554A (en) * | 2012-06-29 | 2012-10-17 | 北京金立翔艺彩科技股份有限公司 | Supporting substrate manufacturing method and light emitting diode (LED) display device |
| US9945521B2 (en) | 2012-06-29 | 2018-04-17 | Beijing Glux Creative Technology Co., Ltd. | Manufacturing method for support substrate, and LED display device |
| CN103594614A (en) * | 2012-08-15 | 2014-02-19 | 品元企业股份有限公司 | Chip (wafer) heat radiation double metal post used for light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120502 |