CN211233443U - Reagent dish refrigerating plant - Google Patents
Reagent dish refrigerating plant Download PDFInfo
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- CN211233443U CN211233443U CN201922127938.0U CN201922127938U CN211233443U CN 211233443 U CN211233443 U CN 211233443U CN 201922127938 U CN201922127938 U CN 201922127938U CN 211233443 U CN211233443 U CN 211233443U
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- heat
- refrigerating
- conducting plate
- reagent
- water cooling
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- Removal Of Water From Condensation And Defrosting (AREA)
Abstract
The utility model relates to a reagent dish refrigerating plant, including refrigeration storehouse, cang gai, heat-conducting plate, semiconductor refrigeration piece, water-cooling head, cooling fluid reservoir, refrigeration circulating pump and water-cooling row, refrigeration storehouse upper end is through bolt fixed connection the cang gai, refrigeration storehouse bottom connection the heat-conducting plate, the centre of heat-conducting plate is equipped with the tray, the tray upper end is through bolted connection reagent dish, semiconductor refrigeration piece up end hugs closely heat-conducting plate lower terminal surface, the up end of water-cooling head with the lower terminal surface of semiconductor refrigeration piece hugs closely; the lower end of the cooling liquid tank is connected with the refrigeration circulating pump through a pipeline, the refrigeration circulating pump is connected with the water cooling head through a pipeline, the water cooling head is connected with the water cooling bar through a pipeline, the water cooling bar is connected with the upper end of the cooling liquid tank through a pipeline, the reagent tray refrigerating device can quickly and uniformly refrigerate and preserve heat of the reagent tray, and the reagent tray refrigerating device is high in heat dissipation efficiency and uniform in heat dissipation.
Description
Technical Field
The utility model relates to a reagent dish refrigerating plant belongs to external diagnostic device technical field.
Background
In a chemiluminescent detection system, magnetic beads and reagents are required, which, due to their inherent characteristics, need to be stored in a specific isothermal environment. Most of existing reagent dish refrigeration bins adopt cooling fins and fans for heat dissipation, the heat dissipation mode is low in efficiency and uneven in heat dissipation, the heat conduction effect of internal air is poor, the cooling speed is low, a temperature gradient exists, and the stability and the accuracy of reagent storage are affected.
SUMMERY OF THE UTILITY MODEL
The utility model discloses not enough to prior art exists provides a reagent dish refrigerating plant, can be fast and even refrigerate the heat preservation to the reagent dish.
The utility model provides an above-mentioned technical problem's technical scheme as follows: a reagent tray refrigerating device comprises a refrigerating bin, a bin cover, a heat conducting plate, a semiconductor refrigerating sheet, a water cooling head, a cooling liquid tank, a refrigerating circulating pump and a water cooling drain, wherein the upper end of the refrigerating bin is fixedly connected with the bin cover through a bolt, the bottom of the refrigerating bin is fixedly connected with the heat conducting plate, a tray is arranged in the middle of the heat conducting plate, the upper end of the tray is connected with the reagent tray through a bolt, the upper end surface of the semiconductor refrigerating sheet is tightly attached to the lower end surface of the heat conducting plate, the lower end surface of the semiconductor refrigerating sheet is a heating surface, and the upper end surface of the water cooling head is tightly attached to the lower end surface of the semiconductor refrigerating sheet; the lower end of the cooling liquid tank is connected with the refrigeration circulating pump through a pipeline, the refrigeration circulating pump is connected with the water-cooling head through a pipeline, the water-cooling head is connected with the water-cooling bar through a pipeline, and the water-cooling bar is connected with the upper end of the cooling liquid tank through a pipeline. .
The utility model has the advantages that: the coolant liquid in the coolant liquid jar passes through the water-cooling head and absorbs the heat that semiconductor refrigeration piece produced to carry the water-cooling through refrigeration circulating pump and pipeline and arrange, the water-cooling is arranged and is dispelled the heat to the coolant liquid, constantly with this circulation, cools down semiconductor refrigeration piece. Reagent dish refrigerating plant can be fast and even refrigerate the heat preservation to the reagent dish, and the radiating efficiency is high and the heat dissipation is even, guarantees in the refrigeration storehouse constancy of temperature, even, ensures the stability and the accuracy that reagent was preserved.
On the basis of the technical scheme, the utility model discloses can also do following improvement.
Further, a fan is installed at the upper end of the heat conducting plate.
The beneficial effect of adopting the further scheme is that: the arrangement of the fan can accelerate the temperature diffusion on the heat conducting plate and keep the temperature in the refrigerating bin uniform.
Furthermore, the refrigeration bin is composed of three layers of materials, wherein the middle layer is made of heat insulation cotton, and the other two layers are made of ABS resin.
The beneficial effect of adopting the further scheme is that: by adopting the structure, external heat can be isolated, and constant temperature in the refrigeration bin can be kept.
Furthermore, the bin cover is made of three layers of materials, the middle layer is made of heat insulation cotton, and the other two layers are made of ABS resin materials.
The beneficial effect of adopting the further scheme is that: by adopting the structure, external heat can be isolated, and constant temperature in the refrigeration bin can be kept.
Furthermore, drain holes are formed in the heat conduction plate and the refrigerating bin and are connected with the waste liquid barrel through pipelines.
The beneficial effect of adopting the further scheme is that: the arrangement of the drain hole can smoothly drain the condensed water in the refrigeration bin.
Furthermore, heat-conducting silicone grease is coated on the close contact position of the heating surfaces of the water cooling head and the semiconductor refrigerating sheet.
The beneficial effect of adopting the further scheme is that: the water cooling head is in contact with the heating surface of the semiconductor refrigerating sheet, and the contact surface is coated with heat-conducting silicone grease, so that heat generated by the semiconductor refrigerating sheet can be quickly led out.
Furthermore, a plurality of grooves are formed in the upper end of the heat conducting plate.
The beneficial effect of adopting the further scheme is that: the arrangement of the groove can effectively increase the contact area between the heat conducting plate and the air in the refrigerating bin, effectively increase the heat exchange area and accelerate the heat conduction of the semiconductor refrigerating sheet in the refrigerating bin.
Furthermore, a plurality of fins are arranged at the upper end of the heat conducting plate.
The beneficial effect of adopting the further scheme is that: the arrangement of the fins can increase the heat exchange area and is more beneficial to heat exchange and heat dissipation.
Drawings
FIG. 1 is a schematic structural diagram of a refrigerating device of a reagent tray in an embodiment;
FIG. 2 is a top view of the heat-conducting plate in the embodiment;
FIG. 3 is a partial enlarged view of the reagent disk in the example;
FIG. 4 is a perspective view of the heat conducting plate in the embodiment;
in the figure, 1 refrigerating bin, 2 bin cover, 3 heat conducting plate, 4 semiconductor refrigerating sheet, 5 water cooling head, 6 cooling liquid tank, 7 refrigerating circulating pump, 8 water cooling row, 9 tray, 10 reagent tray, 11 fan, 12 heat preservation cotton, 13 drain hole, 14 groove, 15 pipeline, 16 fin.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in the figure, the reagent tray refrigerating device 10 comprises a refrigerating bin 1, a bin cover 2, a heat conducting plate 3, a semiconductor refrigerating sheet 4, a water cooling head 5, a cooling liquid tank 6, a refrigerating circulating pump 7 and a water cooling discharge 8, the upper end of the refrigerating bin 1 is fixedly connected with the bin cover 2 through a bolt, the bottom of the refrigerating bin 1 is fixedly connected with the heat conducting plate 3, a tray 9 is arranged in the middle of the heat conducting plate 3, the upper end of the tray 9 is connected with a reagent tray 10 through a bolt, the upper end surface of the semiconductor refrigerating sheet 4 is a refrigerating surface, the upper end surface of the semiconductor refrigerating sheet 4 is tightly attached to the lower end surface of the heat conducting plate 3, and takes away the heat generated by the semiconductor refrigerating sheet 4, the heat conducting plate 3 is used for accelerating the conduction of the semiconductor refrigerating sheet 4 to the heat in the refrigerating bin 1, the lower end face of the semiconductor refrigerating sheet 4 is a heating face, and the upper end face of the water cooling head 5 is tightly attached to the lower end face of the semiconductor refrigerating sheet 4; the lower end of the cooling liquid tank 6 is connected with the refrigeration circulating pump 7 through a pipeline 15, the refrigeration circulating pump 7 is connected with the water cooling head 5 through a pipeline 15, the water cooling head 5 is connected with the water cooling row 8 through a pipeline 15, the water cooling row 8 is connected with the upper end of the cooling liquid tank 6 through a pipeline 15, and the water cooling row 8 can dissipate heat of cooling liquid, so that the circulating heat dissipation of the refrigeration bin 1 is realized through the structure, and the temperature in the refrigeration bin 1 is kept constant and uniform.
The fan 11 is arranged at the upper end of the heat conducting plate 3 and blows cold air upwards, so that the temperature in the refrigerating bin 1 is quickly and uniformly reduced. The refrigeration bin 1 is composed of three layers of materials, wherein the middle layer is made of heat insulation cotton 12, and the other two layers are made of ABS resin. The bin cover 2 is made of three layers of materials, the middle layer is made of heat insulation cotton 12, and the other two layers are made of ABS resin. The heat conducting plate 3 and the refrigerating bin 1 are provided with drain holes 13, and the drain holes 13 are connected with the waste liquid barrel through a pipeline 15 and used for draining condensed water in the refrigerating bin 1. And heat-conducting silicone grease is coated at the close contact position of the heating surfaces of the water cooling head 5 and the semiconductor refrigerating sheet 4. The heat-conducting plate 3 upper end is equipped with a plurality of slots 14, the heat-conducting plate upper end is equipped with a plurality of fins 16, can effectively increase the area of contact of heat-conducting plate 3 and the interior air of refrigeration storehouse 1, has effectively increased heat transfer area for semiconductor refrigeration piece 4 is to the thermal derivation speed in the refrigeration storehouse.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (8)
1. A reagent tray refrigerating device is characterized in that the reagent tray (10) refrigerating device comprises a refrigerating bin (1), a bin cover (2), a heat conducting plate (3), a semiconductor refrigerating sheet (4), a water cooling head (5), a cooling liquid tank (6), a refrigerating circulating pump (7) and a water cooling row (8), the upper end of the refrigerating bin (1) is fixedly connected with the bin cover (2) through a bolt, the bottom of the refrigeration bin (1) is fixedly connected with the heat conducting plate (3), a tray (9) is arranged in the middle of the heat conducting plate (3), the upper end of the tray (9) is connected with a reagent tray (10) through a bolt, the upper end surface of the semiconductor refrigeration sheet (4) is tightly attached to the lower end surface of the heat conduction plate (3), the lower end face of the semiconductor refrigeration piece (4) is a heating face, and the upper end face of the water cooling head (5) is tightly attached to the lower end face of the semiconductor refrigeration piece (4); the lower end of the cooling liquid tank (6) is connected with the refrigeration circulating pump (7) through a pipeline (15), the refrigeration circulating pump (7) is connected with the water cooling head (5) through the pipeline (15), the water cooling head (5) is connected with the water cooling bar (8) through the pipeline (15), and the water cooling bar (8) is connected with the upper end of the cooling liquid tank (6) through the pipeline (15).
2. A reagent disk cold producing device according to claim 1, wherein the heat conducting plate (3) is provided with a fan (11) at the upper end.
3. The reagent tray refrigerating device according to claim 1, wherein the refrigerating chamber (1) is made of three layers of materials, the middle layer is made of heat insulation cotton (12), and the other two layers are made of ABS resin.
4. A reagent tray cold appliance according to claim 1, wherein the cover (2) is made of three layers, the middle layer is heat insulation cotton (12), and the other two layers are made of ABS resin.
5. A reagent disk refrigerating device according to claim 1, wherein the heat conducting plate (3) and the refrigerating chamber (1) are provided with drain holes (13), and the drain holes (13) are connected with the waste liquid barrel through a pipeline (15).
6. The reagent disk refrigerating device as claimed in claim 1, wherein the heat-conducting silicone grease is coated on the close contact positions of the heat-generating surfaces of the water cooling head (5) and the semiconductor refrigerating sheet (4).
7. A reagent disk cold producing device according to claim 1, wherein said heat conducting plate (3) is provided with grooves (14) at its upper end.
8. A reagent disk refrigerating device according to claim 1, characterized in that the heat conducting plate (3) is provided with a plurality of fins (16) at the upper end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922127938.0U CN211233443U (en) | 2019-12-03 | 2019-12-03 | Reagent dish refrigerating plant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922127938.0U CN211233443U (en) | 2019-12-03 | 2019-12-03 | Reagent dish refrigerating plant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211233443U true CN211233443U (en) | 2020-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922127938.0U Active CN211233443U (en) | 2019-12-03 | 2019-12-03 | Reagent dish refrigerating plant |
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| CN (1) | CN211233443U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112896737A (en) * | 2021-02-03 | 2021-06-04 | 青岛大学附属医院 | Detect BRAF gene mutation detect reagent storage device |
| CN113280527A (en) * | 2021-07-01 | 2021-08-20 | 哈尔滨商业大学 | Heat exchange device special for semiconductor refrigeration equipment |
-
2019
- 2019-12-03 CN CN201922127938.0U patent/CN211233443U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112896737A (en) * | 2021-02-03 | 2021-06-04 | 青岛大学附属医院 | Detect BRAF gene mutation detect reagent storage device |
| CN113280527A (en) * | 2021-07-01 | 2021-08-20 | 哈尔滨商业大学 | Heat exchange device special for semiconductor refrigeration equipment |
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| CP03 | "change of name, title or address" |
Address after: 102200, Beijing Changping District science and Technology Park, super Road, No. 37 Patentee after: Beijing Lepu Diagnostic Technology Co., Ltd Address before: 102200, Beijing, Changping District, super Road, No. 7-1, building 37 Patentee before: BEIJING LEPU MEDICAL TECHNOLOGY Co.,Ltd. |