CN110769658A - Power amplifier module heat abstractor and radar - Google Patents
Power amplifier module heat abstractor and radar Download PDFInfo
- Publication number
- CN110769658A CN110769658A CN201911095287.XA CN201911095287A CN110769658A CN 110769658 A CN110769658 A CN 110769658A CN 201911095287 A CN201911095287 A CN 201911095287A CN 110769658 A CN110769658 A CN 110769658A
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- China
- Prior art keywords
- power amplifier
- amplifier module
- heat
- radiator
- heat sink
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
Abstract
The invention relates to a power amplifier module heat dissipation device and a radar, which comprise a heat conduction device and a radiator, wherein the heat conduction device is fixedly connected with the radiator; an accommodating cavity for accommodating the power amplifier module is formed in the heat conduction device, or the heat conduction device and the radiator enclose an accommodating cavity for accommodating the power amplifier module; when the power amplifier works, heat emitted by the power amplifier module in the accommodating cavity is transferred to the radiator through the heat conduction of the heat conduction device and then is radiated through the radiator; when the power amplifier module is inserted into the accommodating cavity, the contact area between the power amplifier module and the heat conducting device is increased, the heat conducting capacity from the power amplifier module to the radiator is improved, the heat radiating effect is enhanced, and the heat radiating requirement of the high-power amplifier module is met.
Description
Technical Field
The invention relates to the field of heat dissipation devices, in particular to a power amplifier module heat dissipation device and a radar.
Background
The power amplifier module is widely used in the fields of radar, communication and the like and is used for realizing microwave signal power enhancement. The power amplifier module can give off heat at the during operation, need dispel the heat, ensures its temperature normal, guarantees normal work. The existing power amplifier module is generally connected with a radiator by a copper shell to radiate heat by forced convection outwards. The heat dissipation mode has limited effect and poor temperature uniformity, and can not meet the heat dissipation requirement of the high-power amplifier module.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a power amplifier module heat dissipation device and a radar to solve at least one of the above technical problems.
On one hand, the technical scheme for solving the technical problems is as follows: a power amplifier module heat dissipation device comprises a heat conduction device and a radiator, wherein the heat conduction device is fixedly connected with the radiator; be equipped with in the heat-conducting device and be used for holding the chamber that holds of power amplifier module, perhaps, heat-conducting device encloses into the chamber that holds that is used for holding power amplifier module with the radiator.
The invention has the beneficial effects that: when the power amplifier works, heat emitted by the power amplifier module in the accommodating cavity is transferred to the radiator through the heat conduction of the heat conduction device and then is radiated through the radiator; when the power amplifier module is inserted into the accommodating cavity, the contact area between the power amplifier module and the heat conducting device is increased, the heat conducting capacity from the power amplifier module to the radiator is improved, the heat radiating effect is enhanced, and the heat radiating requirement of the high-power amplifier module is met.
On the basis of the technical scheme, the invention can be further improved as follows.
Further, the heat conducting device comprises a temperature equalizing plate, the temperature equalizing plate is fixedly connected with the radiator, and the temperature equalizing plate is enclosed into a containing cavity or is enclosed into a containing cavity with the radiator.
The beneficial effect of adopting the further scheme is that: the heat transfer efficiency of the temperature equalizing plate is high, and therefore the heat dissipation efficiency is improved.
Further, the temperature-equalizing plate is a steam cavity temperature-equalizing plate.
The beneficial effect of adopting the further scheme is that: the steam chambers have high heat content, the heating rate is slow, the heat conduction coefficient of the steam chambers is large, and heat can be quickly transferred to the radiator.
And the cover plate is attached to one side, far away from the radiator, of the temperature-equalizing plate and is fixedly connected with the radiator.
The beneficial effect of adopting the further scheme is that: the cover plate plays a role in fixing, the stability of the whole structure is improved, and meanwhile the temperature-equalizing plate is protected.
Furthermore, the heat conduction device also comprises a base, the base is arranged between the temperature-equalizing plate and the radiator and fixedly connected with the radiator, and the temperature-equalizing plate and the base enclose a containing cavity.
The beneficial effect of adopting the further scheme is that: the base plays the positioning role in the placement of the power amplifier module, and is convenient for the installation of each part.
The heat-insulating plate further comprises a first thermal interface material layer, and the first thermal interface material layer is attached to one side, close to the base, of the heat-insulating plate.
The beneficial effect of adopting the further scheme is that: the first thermal interface material layer is attached to one side, close to the base, of the temperature equalizing plate, so that the purpose of reducing thermal contact resistance between the temperature equalizing plate and the base and between the temperature equalizing plate and the power amplifier module is achieved, and the heat dissipation performance is improved.
And the base is attached to one side of the base close to the temperature equalizing plate.
The beneficial effect of adopting the further scheme is that: the second thermal interface material layer is attached to one side, close to the temperature equalizing plate, of the base, so that the purpose of reducing thermal contact resistance between the base and the power amplifier module is achieved, and the heat dissipation performance is improved.
Further, a third thermal interface material layer is arranged between the base and the radiator.
The beneficial effect of adopting the further scheme is that: the third thermal interface material layer is arranged between the base and the radiator, so that the purpose of reducing the thermal contact resistance between the base and the radiator is realized, and the radiating performance is improved.
Further, the radiator comprises a radiator body and a fan, and the fan is fixedly connected with the radiator body; the radiator body is fixedly connected with the heat conducting device.
The beneficial effect of adopting the further scheme is that: the radiator body transmits the absorbed heat to the air, the air absorbing the heat is taken away by the fan, and the heat dissipation efficiency is improved.
On the other hand, the invention provides a radar which comprises a power amplifier module and the power amplifier module heat dissipation device, wherein the power amplifier module is inserted into the accommodating cavity.
The beneficial effect of this scheme of adoption is: this scheme has above-mentioned a power amplifier module heat abstractor's whole beneficial effect, just no longer gives unnecessary details here.
Drawings
Fig. 1 is a schematic diagram of a power amplifier module heat dissipation device according to the present invention;
fig. 2 is a cross-sectional view of a power amplifier module heat dissipation device of the present invention;
fig. 3 is a cross-sectional view of a heat dissipation device of a power amplifier module according to the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. the heat radiator comprises a cover plate, 2, a temperature equalizing plate, 31, a first thermal interface material layer, 32, a second thermal interface material layer, 33, a third thermal interface material layer, 4, a power amplifier module, 5, a base, 6, a heat radiator body, 7 and a fan.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
Example 1
As shown in fig. 1-3, a power amplifier module heat dissipation device includes a heat conduction device and a heat sink, wherein the heat conduction device is fixedly connected to the heat sink; be equipped with in the heat-conducting device and be used for holding power amplifier module 4 hold the chamber, perhaps, heat-conducting device encloses into the chamber that holds that is used for holding power amplifier module 4 with the radiator.
When the power amplifier works, heat emitted by the power amplifier module 4 in the accommodating cavity is transferred to the radiator through the heat conduction of the heat conduction device and then is radiated through the radiator; when the power amplifier module 4 is inserted into the accommodating cavity, the contact area between the power amplifier module 4 and the heat conducting device is increased, the heat conducting capacity from the power amplifier module 4 to the radiator is improved, the heat radiating effect is enhanced, and the heat radiating requirement of the high-power amplifier module 4 is met.
As shown in fig. 1-3, a heat dissipation device of a power amplifier module includes a temperature-uniforming plate 2, the temperature-uniforming plate 2 is fixedly connected to a heat sink, and the temperature-uniforming plate 2 defines a receiving cavity by itself or by defining a receiving cavity by the heat sink.
The heat transfer efficiency of the temperature equalizing plate 2 is high, and further the heat dissipation efficiency is improved.
Preferably, the temperature-uniforming plate 2 is a steam cavity temperature-uniforming plate 2.
The steam chambers have high heat content, the heating rate is slow, the heat conduction coefficient of the steam chambers is large, and heat can be quickly transferred to the radiator.
In particular, the vapor chamber 2 technology is similar in principle to heat pipes, but differs in the manner of conduction. The heat pipe is one-dimensional linear heat conduction, and the heat in the vapor cavity temperature-equalizing plate 2 is conducted on a two-dimensional surface, so that the efficiency is higher.
Specifically, after absorbing the heat of the chip, the liquid in the vapor cavity on the side close to the heat source (usually the lower side) evaporates and diffuses into the vapor cavity, conducts the heat to the heat sink, and then condenses into liquid to return to the side close to the heat source. The evaporation and condensation process of the air conditioner similar to a refrigerator is quickly circulated in the steam cavity, so that high heat dissipation efficiency is realized.
Specifically, the steam cavity temperature-uniforming plate 2 is made of aluminum.
As shown in fig. 1-3, the power amplifier module heat dissipation device further includes a cover plate 1, wherein the cover plate 1 is attached to one side of the temperature equalizing plate 2, which is far away from the heat sink, and is fixedly connected with the heat sink.
Specifically, the cover plate 1 is made of aluminum or copper, the cover plate 1 plays a role in fixing, the stability of the whole structure is improved, and meanwhile the temperature equalizing plate 2 is protected.
As shown in fig. 1-3, a power amplifier module heat dissipation device, the heat conduction device further includes a base 5, the base 5 is disposed between the vapor chamber 2 and the heat sink and is fixedly connected to the heat sink, and the vapor chamber 2 and the base 5 enclose an accommodation cavity.
Specifically, the base 5 is made of copper, and the base 5 plays a role in positioning the power amplifier module 4, so that the power amplifier module is convenient to install.
As shown in fig. 1-3, a power amplifier module heat dissipation device further includes a first thermal interface material layer 31, where the first thermal interface material layer 31 is attached to one side of the vapor chamber 2 close to the base 5.
The first thermal interface material layer 31 is attached to one side of the temperature-uniforming plate 2 close to the base 5, so that the purpose of reducing the thermal contact resistance between the temperature-uniforming plate 2 and the base 5, and between the temperature-uniforming plate 2 and the power amplifier module 4 is achieved, and the heat dissipation performance is improved.
As shown in fig. 1-3, a power amplifier module heat dissipation device further includes a second thermal interface material layer 32, wherein the second thermal interface material layer 32 is attached to one side of the base 5 close to the vapor chamber 2.
The second thermal interface material layer 32 is attached to one side of the base 5 close to the vapor chamber 2, so that the purpose of reducing the thermal contact resistance between the base 5 and the power amplifier module 4 is achieved, and the heat dissipation performance is improved.
As shown in fig. 1-3, a heat dissipation device for power amplifier module, a third thermal interface material layer 33 is disposed between a base 5 and a heat sink.
The third thermal interface material layer 33 is disposed between the base 5 and the heat sink, so as to reduce thermal contact resistance between the base 5 and the heat sink and improve heat dissipation performance.
As shown in fig. 1-3, a power amplifier module heat dissipation device, the heat sink includes a heat sink body 6 and a fan 7, the fan 7 is fixedly connected to the heat sink body 6; the radiator body 6 is fixedly connected with the heat conducting device.
Preferably, the radiator body 6 is a finned temperature-equalizing plate 2 radiator, and the material of the radiator is aluminum or copper; the fan 7 is an axial flow fan 7 and is fixed on the radiator through a screw; the radiator body 6 transfers the absorbed heat to air, and the air absorbed with the heat is taken away by the fan 7, so that the heat dissipation efficiency is improved.
Specifically, the cover plate 1 fixes the steam cavity temperature equalizing plate 2, the power amplifier module 4 and the base 5 on the radiator body 6 through screws.
Specifically, the first thermal interface material layer, the second thermal interface material layer and the third thermal interface material layer are formed by coating thermal interface materials.
The beneficial effect of this embodiment is: when the power amplifier works, heat emitted by the power amplifier module 4 is conducted and transferred to the radiator through the steam cavity temperature equalizing plate 2 and the base 5, and then is transferred to air through the fins of the radiator, and the air absorbing the heat is taken away by the fan 7; this embodiment adopts steam chamber temperature equalization board 2 to hug closely power amplifier module 4 to fan 7 drive air dispels the heat to power amplifier module 4 through 2 radiators of temperature equalization board, has both increased power amplifier module 4's the temperature equalization ability along axial and circumference, has improved power amplifier module 4 heat-conducting ability to the radiator again, has strengthened its radiating effect, has guaranteed high power amplifier module 4's heat dissipation demand.
Example 2
A radar comprises a power amplifier module 4 and the power amplifier module heat dissipation device, wherein the power amplifier module 4 is inserted into a containing cavity.
The beneficial effect of this embodiment is: this embodiment has all the advantages of embodiment 1, and will not be described herein again.
In the description herein, reference to the terms "embodiment one," "embodiment two," "example," "specific example," or "some examples," etc., means that a particular method, apparatus, or feature described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, methods, apparatuses, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A power amplifier module heat dissipation device is characterized by comprising a heat conduction device and a heat radiator, wherein the heat conduction device is fixedly connected with the heat radiator; the heat conduction device is internally provided with a containing cavity used for containing the power amplifier module, or the heat conduction device and the radiator enclose the containing cavity used for containing the power amplifier module.
2. The power amplifier module heat dissipation device of claim 1, wherein the heat conduction device comprises a vapor chamber, the vapor chamber is fixedly connected to the heat sink, and the vapor chamber is enclosed by the vapor chamber or enclosed by the vapor chamber and the heat sink.
3. The power amplifier module heat dissipation device of claim 2, wherein the vapor chamber is a vapor chamber.
4. The power amplifier module heat dissipation device of claim 2, further comprising a cover plate, wherein the cover plate is attached to one side of the temperature equalization plate, which is far away from the heat sink, and is fixedly connected with the heat sink.
5. The power amplifier module heat dissipation device of any one of claims 2-4, wherein the heat conduction device further comprises a base, the base is disposed between the vapor chamber and the heat sink and is fixedly connected to the heat sink, and the vapor chamber and the base enclose the accommodation cavity.
6. The power amplifier module heat sink of claim 5, further comprising a first thermal interface material layer attached to a side of the vapor chamber adjacent to the base.
7. The power amplifier module heat sink of claim 5, further comprising a second thermal interface material layer, wherein the second thermal interface material layer is attached to one side of the base close to the vapor chamber.
8. The power amplifier module heat sink of claim 5, wherein a third thermal interface material layer is disposed between the base and the heat sink.
9. The power amplifier module heat dissipation device of any one of claims 1-4 and 6-8, wherein the heat sink comprises a heat sink body and a fan, and the fan is fixedly connected with the heat sink body; the radiator body is fixedly connected with the heat conduction device.
10. A radar comprising a power amplifier module and a heat sink according to any one of claims 1 to 9, wherein the power amplifier module is inserted into the receiving cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911095287.XA CN110769658B (en) | 2019-11-11 | 2019-11-11 | Power amplifier module heat abstractor and radar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911095287.XA CN110769658B (en) | 2019-11-11 | 2019-11-11 | Power amplifier module heat abstractor and radar |
Publications (2)
| Publication Number | Publication Date |
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| CN110769658A true CN110769658A (en) | 2020-02-07 |
| CN110769658B CN110769658B (en) | 2020-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911095287.XA Active CN110769658B (en) | 2019-11-11 | 2019-11-11 | Power amplifier module heat abstractor and radar |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112739153A (en) * | 2020-12-09 | 2021-04-30 | 合肥应为电子科技有限公司 | Space synthesis power amplifier and heat dissipation device thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN205030040U (en) * | 2015-10-26 | 2016-02-10 | 浙江迅捷电气科技有限公司 | Novel liquid cooling shell |
| CN206674427U (en) * | 2017-04-26 | 2017-11-24 | 中国海洋大学 | High power device heat abstractor in a kind of underwater sealing cabin |
| CN207149549U (en) * | 2017-08-01 | 2018-03-27 | 徐州整流汽车元件有限公司 | A kind of heat dissipation shell for automobile rectifier diodes |
| CN108184320A (en) * | 2017-12-30 | 2018-06-19 | 广州程星通信科技有限公司 | A kind of radiator for power amplifier |
| CN208001266U (en) * | 2018-02-01 | 2018-10-23 | 广州市俊豪音响制造有限公司 | A kind of power amplifier cooling equipment |
-
2019
- 2019-11-11 CN CN201911095287.XA patent/CN110769658B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205030040U (en) * | 2015-10-26 | 2016-02-10 | 浙江迅捷电气科技有限公司 | Novel liquid cooling shell |
| CN206674427U (en) * | 2017-04-26 | 2017-11-24 | 中国海洋大学 | High power device heat abstractor in a kind of underwater sealing cabin |
| CN207149549U (en) * | 2017-08-01 | 2018-03-27 | 徐州整流汽车元件有限公司 | A kind of heat dissipation shell for automobile rectifier diodes |
| CN108184320A (en) * | 2017-12-30 | 2018-06-19 | 广州程星通信科技有限公司 | A kind of radiator for power amplifier |
| CN208001266U (en) * | 2018-02-01 | 2018-10-23 | 广州市俊豪音响制造有限公司 | A kind of power amplifier cooling equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112739153A (en) * | 2020-12-09 | 2021-04-30 | 合肥应为电子科技有限公司 | Space synthesis power amplifier and heat dissipation device thereof |
| CN112739153B (en) * | 2020-12-09 | 2023-06-23 | 合肥应为电子科技有限公司 | Space synthesis power amplifier and heat dissipation device thereof |
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| Publication number | Publication date |
|---|---|
| CN110769658B (en) | 2020-11-03 |
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