CN212081683U - Heat exchange device adopting semiconductor refrigeration and air conditioner - Google Patents
Heat exchange device adopting semiconductor refrigeration and air conditioner Download PDFInfo
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- CN212081683U CN212081683U CN202020600905.3U CN202020600905U CN212081683U CN 212081683 U CN212081683 U CN 212081683U CN 202020600905 U CN202020600905 U CN 202020600905U CN 212081683 U CN212081683 U CN 212081683U
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Abstract
The utility model discloses an adopt cryogenic heat transfer device of semiconductor and air conditioner, heat transfer device includes: the inner heat exchanger is annular; the semiconductor refrigerating device is provided with a cold end and a hot end, and the hot end of the semiconductor refrigerating device is attached to the outer peripheral wall of the inner heat exchanger; the outer heat exchanger is annular, the outer heat exchanger is sleeved on the inner heat exchanger, and the cold end of the semiconductor refrigerating device is attached to the inner peripheral wall of the outer heat exchanger. The utility model discloses a heat transfer device, through the heat exchanger outside including with annular outer heat exchanger cover to with semiconductor refrigerating plant setting between the two, thereby can be through interior heat exchanger to the heat dissipation of semiconductor refrigerating plant hot junction, including the temperature of the continuous radiating process of heat exchanger in semiconductor refrigerating plant cold junction follow constantly becoming low, thereby improve refrigeration effect.
Description
Technical Field
The utility model relates to a heat exchanger technical field, concretely relates to adopt cryogenic heat transfer device of semiconductor and air conditioner.
Background
Semiconductor refrigeration, also known as electronic refrigeration or thermoelectric refrigeration, utilizes a P-N junction formed of a special semiconductor material to form a thermocouple pair, which produces the peltier effect, specifically: when an N-type semiconductor material and a P-type semiconductor material are connected into a galvanic couple pair, energy transfer can be generated after direct current is switched on in the circuit, and the current flows to the joint of the P-type element from the N-type element to absorb heat to form a cold end; the junction from the P-type element to the N-type element releases heat to become the hot end. The magnitude of the energy transfer is determined by the magnitude of the current and the log of the elements of semiconductor material N, P.
The semiconductor material and the indoor heat exchanger are utilized, the refrigeration principle is changed, and theoretically, the outdoor unit can be used as an integral body without.
But since the semiconductor itself has electrical resistance, heat is generated when current passes through the semiconductor, thereby affecting heat transfer. The high-efficiency refrigerating capacity of the cold surface can be obtained only by timely and efficiently dissipating the heat of the hot surface, the better the heat dissipation effect of the hot end of the semiconductor heat exchanger is, and the higher the refrigerating efficiency is.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an adopt cryogenic heat transfer device of semiconductor and air conditioner has solved the poor problem of current semiconductor refrigeration effect.
According to an aspect of the utility model, a heat transfer device is disclosed, include: the inner heat exchanger is annular; the semiconductor refrigerating device is provided with a cold end and a hot end, and the hot end of the semiconductor refrigerating device is attached to the outer peripheral wall of the inner heat exchanger; the outer heat exchanger is annular, the outer heat exchanger is sleeved on the inner heat exchanger, and the cold end of the semiconductor refrigerating device is attached to the inner peripheral wall of the outer heat exchanger.
Furthermore, the inner peripheral wall of the inner heat exchanger is enclosed into a heat dissipation channel, and a fan is arranged in the heat dissipation channel.
Further, a plurality of cooling fins are arranged on the inner peripheral wall of the inner heat exchanger at intervals.
Furthermore, a water storage tank is arranged on the inner wall of the inner heat exchanger.
Further, the outer heat exchanger is provided with cooling fins on the periphery, and the cooling fins are obliquely arranged.
Further, the plane of the radiating fin forms an included angle with the axis of the outer heat exchanger.
Furthermore, the radiating fins are in multiple groups, the radiating fins in the same group are arranged at intervals along the circumferential direction of the outer heat exchanger, and the multiple groups of radiating fins are arranged at intervals along the axial direction of the outer heat exchanger.
Furthermore, the radiating fins of two adjacent groups are arranged in a one-to-one correspondence and symmetry mode.
Further, the heat exchange device further comprises: the heat insulation layer is arranged between the inner heat exchanger and the outer heat exchanger, and the semiconductor refrigerating device is embedded in the heat insulation layer.
Further, the semiconductor refrigerating device comprises a semiconductor refrigerating sheet.
According to another aspect of the utility model, an air conditioner is disclosed, including foretell heat transfer device.
Further, the air conditioner further includes: the shell, heat transfer device sets up in the shell.
Further, be provided with the baffle in the casing, the baffle will the casing internal part separates into heat transfer chamber and fan chamber, baffle one end with shells inner wall links to each other, the other end with form between the shells inner wall and overflow the passageway, the heat transfer chamber with the fan chamber passes through overflow the passageway intercommunication, still be provided with on the casing with the air intake of heat transfer chamber intercommunication and with the cold wind export of fan chamber intercommunication, heat transfer device sets up the heat transfer intracavity.
Furthermore, the inner heat exchanger is provided with a heat dissipation channel, the shell is further provided with an air return opening and a hot air outlet, and the air return opening and the hot air outlet are communicated with two ends of the heat dissipation channel.
Further, the air conditioner further includes: the second fan is arranged in the fan cavity, the partition plate is located between the heat exchange device and the second fan and used for guiding cold air and condensed water generated by the outer heat exchanger to enter the fan cavity, and the setting position of the partition plate can prevent the condensed water from dropping on the second fan.
Further, the air conditioner further includes: the water receiving tray is arranged in the fan cavity and used for collecting condensed water entering the fan cavity.
Further, the air conditioner also comprises a water pump, and the water pump is arranged on the water pan; and a water storage tank is arranged on the inner wall of the inner heat exchanger, and the water pump is communicated with the water storage tank arranged on the inner heat exchanger through a pipeline.
The utility model discloses a heat transfer device, through the heat exchanger outside including with annular outer heat exchanger cover to with semiconductor refrigerating plant setting between the two, thereby can be through interior heat exchanger to the heat dissipation of semiconductor refrigerating plant hot junction, including the temperature of the continuous radiating process of heat exchanger in semiconductor refrigerating plant cold junction follow constantly becoming low, thereby improve refrigeration effect.
Drawings
FIG. 1 is a schematic structural diagram of a heat exchange device according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a heat exchange device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an air conditioner according to an embodiment of the present invention;
legend: 10. an inner heat exchanger; 11. a heat dissipation channel; 12. a water storage tank; 20. a semiconductor refrigeration device; 30. an external heat exchanger; 40. a first fan; 50. a heat sink; 60. a heat-insulating layer; 70. a housing; 71. an air inlet; 72. a cold air outlet; 76. a partition plate; 77. a heat exchange cavity; 78. a fan cavity; 79. an overflow channel; 80. a second fan; 91. a water pan; 92. and (4) a water pump.
Detailed Description
The present invention is further illustrated by the following examples, but is not limited to the contents of the specification.
As shown in fig. 1 and fig. 2, the utility model discloses a heat exchange device, include: the heat exchanger comprises an inner heat exchanger 10, a semiconductor refrigerating device 20 and an outer heat exchanger 30, wherein the inner heat exchanger 10 is annular; the semiconductor refrigerating device 20 is provided with a cold end and a hot end, and the hot end of the semiconductor refrigerating device 20 is attached to the outer peripheral wall of the inner heat exchanger 10; the outer heat exchanger 30 is annular, the outer heat exchanger 30 is sleeved on the inner heat exchanger 10, and the cold end of the semiconductor refrigerating device 20 is attached to the inner peripheral wall of the outer heat exchanger 30. The utility model discloses a heat transfer device is through the 30 covers of outer heat exchanger that will be cyclic annular outside at interior heat exchanger 10 outsides to set up semiconductor refrigerating plant 20 between the two, thereby can be through interior heat exchanger 10 to the heat dissipation of semiconductor refrigerating plant 20 hot junction, including the temperature of the continuous radiating process in heat exchanger 10 semiconductor refrigerating plant 20 cold junction follow constantly becoming low, thereby improve refrigeration effect.
In the above embodiment, the inner peripheral wall of the inner heat exchanger 10 is surrounded by the heat dissipation channel 11, and the fan 40 is disposed in the heat dissipation channel 11. The utility model discloses a heat transfer device through with the fan setting in heat dissipation channel 11, can form the forced convection to improve the radiating effect in semiconductor refrigerating plant 20 hot junction, thereby improve the refrigeration effect of cold junction.
In the above embodiment, the inner peripheral wall of the inner heat exchanger 10 is provided with the plurality of fins 50 at intervals. The utility model discloses a heat transfer device is provided with a plurality of fin 50 through the interval on the internal perisporium of heat exchanger 10 including, can improve the heat transfer effect greatly.
In the above embodiment, the outer heat exchanger 30 is provided with the fins 50 on the outer periphery, and the fins 50 are arranged obliquely. The utility model discloses a heat transfer device through setting up the slope of fin 50, when improving heat transfer area, also makes things convenient for the comdenstion water to drip the water collector, prevents ponding, protects outer heat exchanger 30 not corroded by the comdenstion water better, improves life.
In the above embodiment, the plane of the fins 50 forms an angle with the axis of the outer heat exchanger 30. The utility model discloses a heat transfer device when improving heat transfer area, also makes things convenient for the comdenstion water to drip to the water collector, prevents ponding, protects outer heat exchanger 30 not corroded by the comdenstion water better, improves life.
In the above embodiment, the plurality of sets of fins 50 are arranged, the fins 50 in the same set are arranged at intervals along the circumferential direction of the outer heat exchanger 30, and the plurality of sets of fins 50 are arranged at intervals along the axial direction of the outer heat exchanger 30. The utility model discloses a heat transfer device when improving heat transfer area, also makes things convenient for the comdenstion water to drip to the water collector, prevents ponding, protects outer heat exchanger 30 not corroded by the comdenstion water better, improves life.
In the above embodiment, a water storage tank (12) is arranged on the inner wall of the inner heat exchanger (10). The utility model discloses a heat exchange device through setting up aqua storage tank 12, can utilize the internal heat exchanger 10 cooling of cold volume of comdenstion water to improve the radiating effect with comdenstion water drainage to aqua storage tank 12 in.
In the above embodiment, the heat dissipation fins 50 of two adjacent groups are arranged in a one-to-one correspondence and symmetrical manner. The utility model discloses a heat transfer device when improving heat transfer area, also makes things convenient for the comdenstion water to drip to the water collector, prevents ponding, protects outer heat exchanger 30 not corroded by the comdenstion water better, improves life.
In the above embodiment, the heat exchanger further includes: and the insulating layer 60 is arranged between the inner heat exchanger 10 and the outer heat exchanger 30, and the semiconductor refrigerating device 20 is embedded in the insulating layer 60. The utility model discloses a heat transfer device is through setting up heat preservation 60 between heat exchanger 10 and outer heat exchanger 30 including to inlay semiconductor refrigerating plant 20 and establish in heat preservation 60, thereby can carry out the heat exchange through the gap that prevents between heat exchanger 10 and the outer heat exchanger 30 in semiconductor refrigerating plant 20, effectively improved refrigeration effect.
In the above embodiment, the semiconductor cooling device 20 includes the semiconductor cooling fins.
As shown in fig. 3, according to another aspect of the present invention, an air conditioner is further disclosed, which includes the above heat exchange device.
In the above embodiment, the air conditioner further includes: a housing 70, and a heat exchange device disposed within the housing 70. The utility model discloses a heat transfer device through using new refrigeration principle, accomplishes indoor heat exchanger integration through new structural design. The air conditioner installation steps are simplified to the integral type organism, and the whole noise source that reduces behind compressor and the electronic expansion valve that does not have improves user and uses and experience.
In the above embodiment, a partition plate 76 is disposed in the casing 70, the partition plate 76 divides the interior of the casing 70 into a heat exchange chamber 77 and a fan chamber 78, one end of the partition plate 76 is connected to the inner wall of the casing 70, an overflow channel 79 is formed between the other end of the partition plate and the inner wall of the casing 70, the heat exchange chamber 77 is communicated with the fan chamber 78 through the overflow channel 79, the casing 70 is further provided with an air inlet 71 communicated with the heat exchange chamber 77 and a cold air outlet 72 communicated with the fan chamber 78, and the heat exchange device is disposed in the heat exchange chamber 77. The utility model discloses an air conditioner is through setting up air intake 71 and air outlet 72, guarantees to form the stream air duct in the unit. After entering from the air inlet 71, the inlet air exchanges heat with the heat exchange device to form cold air and is discharged from the air outlet 72, and considering that the unit is used in a kitchen, the detachable filter assembly is additionally arranged at the air inlet 72 at the top, which is beneficial to self-cleaning of the unit.
In the above embodiment, the inner heat exchanger 10 has the heat dissipation channel 11, and the casing 70 is further provided with the air return opening and the hot air outlet, which are communicated with both ends of the heat dissipation channel 11. The return air inlet is provided with a screen plate which mainly plays a role in protection and prevents the fan running at high speed from accidentally injuring a user,
in the above embodiment, the air conditioner further includes: the second fan 80 is arranged in the fan cavity 78, the partition plate 76 is located between the heat exchange device and the second fan 80, the partition plate 76 is used for guiding cold air and condensed water generated by the outer heat exchanger 30 to enter the fan cavity 78, and the position of the partition plate 76 can prevent the condensed water from dropping on the second fan 80. The utility model discloses an air conditioner can be discharged cold wind from air outlet 72 through setting up second fan 80, and baffle 76 plays two effects, forms after first linking to each other with the shell and cuts off, guarantees that the comdenstion water can not directly fall to second fan 80's return air central zone, prevents that the unit from blowing water when moving. The second function is to control the wind direction flow in the cold air cavity by the corner design of the tail end of the clapboard 76 and the wall attachment effect, and the device belongs to multiple purposes.
In the above embodiment, the air conditioner further includes: and the water receiving tray 91 is arranged in the fan cavity 78, and the water receiving tray 91 is used for collecting condensed water entering the fan cavity 78.
In the above embodiment, the air conditioner further includes a water pump 92, and the water pump 92 is disposed on the water pan 91; a water storage tank is arranged on the inner wall of the inner heat exchanger 10, and the water pump 92 is communicated with the water storage tank arranged on the inner heat exchanger 10 through a pipeline.
The utility model discloses a heat dissipation channel 11 of heat exchanger 10 in air conditioner does not communicate with cold wind chamber, only passes through return air inlet and hot air outlet and indoor, outdoor intercommunication. After the air conditioner is started, the first motor rotates to drive indoor air to flow outdoors. The surface heat of the inner heat exchanger 10 is brought outdoors, the heat of the hot surface is timely and efficiently dissipated, the efficient refrigerating capacity of the cold surface can be obtained, and the refrigerating efficiency is higher. Two small holes are formed in the horizontal plane of the inner heat exchanger 10, so that a water outlet pipe of the water pump can extend into a part, the inner heat exchanger 10 is provided with a groove at the extending part of the water outlet pipe of the water pump, low-temperature condensate water flows to a water storage tank at the bottom along the surface of the inner heat exchanger 10, and heat of a hot surface is taken away through partial evaporation in the process.
Under the action of the water pump, the condensed water flowing into the water receiving tray 91 is pumped out and then flows into the inner heat exchanger 10, and the condensed water in the water storage tank is ensured not to overflow by controlling the width of the tank and the power of the water pump. Through the cyclic utilization mode, the maximum refrigerating capacity and the energy efficiency of the heat exchanger are improved.
The utility model discloses a heat transfer device through using new refrigeration principle, accomplishes indoor heat exchanger integration through new structural design. The air conditioner installation step is simplified to the integral type organism, reduces the noise source behind whole no compressor and the electronic expansion valve, improves user's use and experiences, and the otter board mainly plays the guard action moreover, prevents that high-speed moving fan from accidentally injuring the user. After air flows through the filter assembly of the air inlet 71 at the top of the shell 70, the air flows to the cold air cavity at the bottom along the annular outer heat exchanger 30, in the process, the outer heat exchanger 30 and the shell 70 are in a symmetrical structure, and the air flow can uniformly flow through the left end and the right end of the outer heat exchanger 30. Water vapor in the indoor air is condensed on the surface of the outer heat exchanger 30 after passing through the outer heat exchanger 30. Thereby realizing heat exchange refrigeration.
In the above embodiment, the air conditioner is used in a kitchen.
It is to be understood that the above-described embodiments of the present invention are merely examples provided for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. Not all embodiments are exhaustive. All obvious changes or variations led out by the technical scheme of the utility model are still in the protection scope of the utility model.
Claims (17)
1. A heat exchange device, comprising:
the heat exchanger comprises an inner heat exchanger (10), wherein the inner heat exchanger (10) is annular;
the semiconductor refrigerating device (20) is provided with a cold end and a hot end, and the hot end of the semiconductor refrigerating device (20) is attached to the outer peripheral wall of the inner heat exchanger (10);
the outer heat exchanger (30), outer heat exchanger (30) are cyclic annular, outer heat exchanger (30) cover is established on interior heat exchanger (10), the cold junction subsides of semiconductor refrigeration device (20) are established on the internal perisporium of outer heat exchanger (30).
2. The heat exchange device of claim 1,
the heat dissipation device is characterized in that a heat dissipation channel (11) is formed by surrounding the inner peripheral wall of the inner heat exchanger (10), and a first fan (40) is arranged in the heat dissipation channel (11).
3. The heat exchange device of claim 1,
a plurality of cooling fins (50) are arranged on the inner peripheral wall of the inner heat exchanger (10) at intervals.
4. The heat exchange device of claim 1,
and a water storage tank is arranged on the inner wall of the inner heat exchanger (10).
5. The heat exchange device of claim 1,
and the periphery of the outer heat exchanger (30) is provided with cooling fins (50), and the cooling fins (50) are obliquely arranged.
6. The heat exchange device of claim 5,
the plane of the radiating fins (50) forms an included angle with the axis of the outer heat exchanger (30).
7. The heat exchange device of claim 5,
the radiating fins (50) are multiple groups, the radiating fins (50) in the same group are arranged at intervals along the circumferential direction of the outer heat exchanger (30), and the multiple groups of radiating fins (50) are arranged at intervals along the axial direction of the outer heat exchanger (30).
8. The heat exchange device of claim 7,
the radiating fins (50) of the two adjacent groups are arranged in a one-to-one correspondence and symmetry mode.
9. The heat exchange device of claim 1, further comprising:
the heat insulation layer (60) is arranged between the inner heat exchanger (10) and the outer heat exchanger (30), and the semiconductor refrigerating device (20) is embedded in the heat insulation layer (60).
10. The heat exchange device of claim 1,
the semiconductor refrigerating device (20) comprises a semiconductor refrigerating sheet.
11. An air conditioner characterized by comprising the heat exchange device of any one of claims 1 to 10.
12. The air conditioner according to claim 11, further comprising:
a housing (70), the heat exchange device being disposed within the housing (70).
13. The air conditioner according to claim 12,
be provided with baffle (76) in casing (70), baffle (76) will casing (70) internal partitioning is heat transfer chamber (77) and fan chamber (78), baffle (76) one end with casing (70) inner wall links to each other, the other end with form between casing (70) the inner wall and overflow passageway (79), heat transfer chamber (77) with fan chamber (78) pass through overflow passageway (79) intercommunication, still be provided with on casing (70) with air intake (71) of heat transfer chamber (77) intercommunication and with cold wind export (72) of fan chamber (78) intercommunication, heat transfer device sets up in heat transfer chamber (77).
14. The air conditioner according to claim 13,
the inner heat exchanger (10) is provided with a heat dissipation channel (11), the shell (70) is further provided with an air return opening and a hot air outlet, and the air return opening and the hot air outlet are communicated with two ends of the heat dissipation channel (11).
15. The air conditioner according to claim 13, further comprising:
the second fan (80), second fan (80) set up in fan chamber (78), baffle (76) are located heat transfer device with between second fan (80), baffle (76) are used for leading cold wind and the comdenstion water that outer heat exchanger (30) produced to get into fan chamber (78), the position of setting up of baffle (76) can prevent that the comdenstion water from dripping on second fan (80).
16. The air conditioner according to claim 15, further comprising:
the water collecting tray (91) is arranged in the fan cavity (78), and the water collecting tray (91) is used for collecting condensed water entering the fan cavity (78).
17. The air conditioner according to claim 16, further comprising a water pump (92), wherein the water pump (92) is disposed on the water pan (91); a water storage tank is arranged on the inner wall of the inner heat exchanger (10), and the water pump (92) is communicated with the water storage tank arranged on the inner heat exchanger (10) through a pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020600905.3U CN212081683U (en) | 2020-04-20 | 2020-04-20 | Heat exchange device adopting semiconductor refrigeration and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020600905.3U CN212081683U (en) | 2020-04-20 | 2020-04-20 | Heat exchange device adopting semiconductor refrigeration and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212081683U true CN212081683U (en) | 2020-12-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020600905.3U Active CN212081683U (en) | 2020-04-20 | 2020-04-20 | Heat exchange device adopting semiconductor refrigeration and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212081683U (en) |
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2020
- 2020-04-20 CN CN202020600905.3U patent/CN212081683U/en active Active
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