CN211876116U

CN211876116U - Smoke machine

Info

Publication number: CN211876116U
Application number: CN201922356456.2U
Authority: CN
Inventors: 刘文洁; 郑防震; 江晨钟; 薛维军
Original assignee: Midea Group Co Ltd; Guangdong Midea White Goods Technology Innovation Center Co Ltd
Current assignee: Midea Group Co Ltd; Guangdong Midea White Goods Technology Innovation Center Co Ltd
Priority date: 2019-12-23
Filing date: 2019-12-23
Publication date: 2020-11-06
Anticipated expiration: 2029-12-23

Abstract

The application discloses a cigarette machine, which comprises a cigarette machine body, wherein the cigarette machine body comprises a first shell for forming a smoke exhaust channel and a first fan which is positioned in the smoke exhaust channel and is used for forming smoke exhaust airflow in the smoke exhaust channel; the refrigerating device comprises a second shell for forming a refrigerating channel, a semiconductor refrigerating assembly and a second fan for forming refrigerating airflow in the refrigerating channel, wherein the semiconductor refrigerating assembly comprises a semiconductor refrigerating chip provided with a refrigerating end and a heating end; the heating end of the semiconductor refrigeration chip exchanges heat with the smoke exhaust air flow at the downstream of the first fan, and the refrigeration end of the semiconductor refrigeration chip exchanges heat with the refrigeration air flow in the refrigeration channel. The cigarette machine that this application provided can reduce size and reduction in production cost.

Description

Smoke machine

Technical Field

The application relates to the technical field of electric appliances, in particular to a range hood.

Background

The kitchen environment is sultry in summer, which easily causes human discomfort, aiming at the condition, the cigarette machine carrying the refrigerating system appears at present, the cigarette machine carrying the refrigerating system is easy to accept in product form, and can be mutually beneficial and complementary in function realization, so the direction is an important direction for future kitchen environment refrigeration. At present, a refrigerating system carried on the cigarette machine comprises a compressor refrigerating system and a semiconductor refrigerating system, wherein the semiconductor refrigerating system has the advantages of simple structure, light overall weight and the like.

The inventor of the present application finds that although there are many advantages, the semiconductor refrigeration system also has the problems of high cost, large overall size after the power is increased, and the like, and therefore how to further reduce the cost and the overall size is the key to whether the semiconductor refrigeration system can be widely applied.

SUMMERY OF THE UTILITY MODEL

The technical problem that this application mainly solved provides a cigarette machine, can reduce size and reduction in production cost.

In order to solve the technical problem, the application adopts a technical scheme that: there is provided a range hood comprising: a cigarette machine body comprising a first housing for forming a smoke evacuation channel and a first fan located in the smoke evacuation channel for forming a smoke evacuation airflow at the smoke evacuation channel; the refrigerating device comprises a second shell for forming a refrigerating channel, a semiconductor refrigerating assembly and a second fan for forming refrigerating airflow in the refrigerating channel, wherein the semiconductor refrigerating assembly comprises a semiconductor refrigerating chip provided with a refrigerating end and a heating end; the heating end of the semiconductor refrigeration chip exchanges heat with the smoke exhaust airflow at the downstream of the first fan, and the refrigeration end of the semiconductor refrigeration chip exchanges heat with the refrigeration airflow in the refrigeration channel.

The beneficial effect of this application is: the cigarette machine of this application utilizes the induced-draft gas stream in first fan low reaches to dispel the heat for the end that heats of semiconductor refrigeration chip, wherein, first fan is used for forming the induced-draft gas stream in exhaust passage, the necessary fan for general cigarette machine, thereby need not to set up solitary fan for the end that heats of semiconductor refrigeration chip specially, can reduce the size and the reduction in production cost of cigarette machine, the induced-draft gas stream in first fan low reaches simultaneously contains the oil smoke volume fewly, the end that heats that can avoid semiconductor refrigeration chip is wrapped up by the oil smoke and influences its radiating efficiency.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:

FIG. 1 is a schematic diagram of the structure of one embodiment of a cigarette making machine of the present application;

figure 2 is a schematic structural view of the body of the cigarette maker of figure 1;

figure 3 is a schematic view of a portion of the refrigeration unit of the cigarette machine of figure 1 at an angle;

figure 4 is a schematic view of a portion of the refrigeration unit of the cigarette machine of figure 1 at another angle;

FIG. 5 is a schematic diagram of the semiconductor refrigeration assembly of the refrigeration unit of FIG. 3;

fig. 6 is an exploded view of the semiconductor refrigeration assembly of fig. 5.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a cigarette making machine of the present application. The cigarette maker 1000 includes a cigarette maker body 2000 and a refrigerating device 3000.

The body 2000 of the range hood is used to perform basic functions of a general range hood, for example, to rapidly exhaust wastes generated by burning of a range and soot harmful to a human body generated during cooking, and to discharge the same to the outside. With reference to figure 2, the cigarette maker body 2000 comprises a first housing 2100 and a first blower (not shown).

The first housing 2100 is used to form a smoke evacuation channel 2110, and the first fan is located in the smoke evacuation channel 2110 and is used to create a smoke evacuation flow in the smoke evacuation channel 2110. Specifically, when the range hood 1000 is in operation, the first fan rotates to draw air containing soot outside the range hood 1000 into the smoke evacuation channel 2110 to form an exhaust airflow, which is finally exhausted through the smoke evacuation channel 2110 to discharge the soot out of the room.

The refrigerating device 3000 is used to realize a refrigerating function and reduce the temperature of the kitchen. Referring to fig. 3 and 4, the cooling device 3000 includes a second housing 3100, a semiconductor cooling module 3200, and a second fan 3300.

Second housing 3100 is used for forming refrigerating duct 3110, and second fan 3300 is used for forming refrigerating airflow in refrigerating duct 3110, and with reference to fig. 5 and 6, semiconductor refrigerating module 3200 includes semiconductor refrigerating chip 3210, and semiconductor refrigerating chip 3210 includes refrigerating end 3211 and heating end 3212.

Specifically, a refrigerating end 3211 and a heating end 3212 of the semiconductor refrigerating chip 3210 are disposed opposite to each other, and when the semiconductor refrigerating chip 3210 operates, heat is transferred between the refrigerating end 3211 and the heating end 3212: heat is transferred from cold side 3211 to hot side 3212, whereby the temperature of cold side 3211 decreases and the temperature of hot side 3212 increases.

Meanwhile, in this embodiment, the heating end 3212 of the semiconductor refrigeration chip 3210 exchanges heat with the exhaust airflow downstream of the first fan, and the cooling end 3211 of the semiconductor refrigeration chip 3210 exchanges heat with the cooling airflow in the cooling passage 3110.

Specifically, when the cigarette maker 1000 operates, the second fan 3300 generates a cooling air flow in the cooling passage 3110, the cooling air flow is cooled after heat exchange with the cooling end 3211 of the semiconductor chip 3210, and then the cooling air flow with the cooled temperature is discharged from the cooling passage 3110 and blown to the outside of the cigarette maker 1000, thereby reducing the temperature of the kitchen, and at the same time, the first fan forms a smoke exhaust air flow in the smoke exhaust passage 2110, the smoke exhaust air flow is heat exchanged with the heating end 3212 of the semiconductor chip 3210 after reaching the downstream of the first fan, that is, after passing through the first fan, and then the temperature of the smoke exhaust air flow is raised and discharged from the smoke exhaust passage 2110.

Specifically, in the present embodiment, the exhaust airflow downstream of the first fan dissipates heat to the heating end 3212 of the semiconductor refrigeration chip 3210, and the following advantages are provided: the first fan is used for forming smoke exhaust airflow, and for general cigarette making machines, the first fan is a necessary fan, and each cigarette making machine is provided with the first fan, so that the first fan is used for radiating heat of the heating end 3212 of the semiconductor refrigeration chip 3210, no additional fan is needed, the size of the cigarette making machine 1000 can be reduced, and the production cost can also be reduced; meanwhile, for a common smoke machine, the air volume and the back pressure of a fan forming the smoke exhaust airflow are high, and the heat dissipation effect of the smoke exhaust airflow is incomparable with that of other conventional fans, so that the smoke exhaust airflow formed by the first fan is utilized to dissipate heat for the heating end 3212 of the semiconductor refrigeration chip 3210, and the heat dissipation effect can be improved; in addition, for a general range hood, the oil smoke separation rate of the fan for forming the exhaust gas flow is more than 90%, so that the exhaust gas flow at the downstream of the first fan is used for radiating heat of the heating end 3212 of the semiconductor refrigeration chip 3210, and compared with the exhaust gas flow at the upstream of the first fan for radiating heat of the heating end 3212 of the semiconductor refrigeration chip 3210, the influence on the radiating effect caused by the fact that the heating end 3212 of the semiconductor refrigeration chip 3210 is wrapped by the oil smoke after long-time operation can be avoided.

With continued reference to fig. 1-2, the smoke evacuation channel 2110 is provided with a smoke evacuation inlet (not shown) and a smoke evacuation outlet 2111.

The smoke exhaust inlet is located at the bottom of the cigarette machine body 2000, the smoke exhaust outlet 2111 is located at the top of the cigarette machine body 2000, when the cigarette machine 1000 is installed and used normally, the bottom of the cigarette machine body 2000 is close to a user, the top of the cigarette machine body 2000 is far away from the user, meanwhile, air containing smoke outside the cigarette machine 1000 is input into the smoke exhaust channel 2110 through the smoke exhaust inlet, and flows to the smoke exhaust outlet 2111 after being centrifugally separated by the first fan, and therefore the smoke generated in the cooking process can be exhausted outdoors. Meanwhile, the heating end 3212 of the semiconductor refrigeration chip 3210 exchanges heat with the smoke exhaust flow at the smoke exhaust outlet 2111.

Specifically, the exhaust gas flow at the exhaust outlet has a larger wind speed than the exhaust gas flow at other positions, so that the heating end 3212 of the semiconductor cooling chip 3210 is arranged to exchange heat with the exhaust gas flow at the exhaust outlet 2111, thereby further improving the heat dissipation effect.

With continued reference to fig. 3 to 6, the semiconductor cooling module 3200 includes a first heat sink 3220 and a second heat sink 3230 in addition to the semiconductor cooling chip 3210.

The first heat radiator 3220 is arranged in the refrigeration channel 3110 and is in contact with the refrigeration end 3211 of the semiconductor refrigeration chip 3210; the second heat sink 3230 is disposed at the smoke outlet 2111 of the smoke evacuation channel 2110 and contacts the heating terminal 3212 of the semiconductor cooling chip 3210.

Specifically, the first radiator 3220 and the second radiator 3230 are arranged to respectively enlarge a heat exchange area between the cooling airflow and the cooling end 3211 of the semiconductor cooling chip 3210 and a heat exchange area between the exhaust airflow and the heating end 3212 of the semiconductor cooling chip 3210, so as to ensure a cooling effect and a heat dissipation effect.

Meanwhile, for the semiconductor refrigeration chip 3210, the heat quantity at the heating end 3212 is approximately equal to the sum of the cold quantity at the refrigeration end 3211 and the input electric power, so in this embodiment, in order to improve the heat dissipation effect, the heat dissipation efficiency of the second heat sink 3230 is set to be greater than the heat dissipation efficiency of the first heat sink 3220.

Meanwhile, in the present embodiment, the first heat sink 3220 is a tooth-relief heat sink, and the second heat sink 3230 is a heat pipe heat sink, and referring to fig. 5 to 6, the second heat sink 3230 includes a substrate 3231, a heat dissipation fin 3232, and a heat pipe 3233.

The substrate 3231 is in contact with a heating end 3212 of the semiconductor refrigeration chip 3210; the plurality of radiating fins 3232 are arranged at the smoke exhaust outlet 2111 of the smoke exhaust channel 2110 at intervals, and the extending direction of the plurality of radiating fins 3232 is parallel to the flow direction of the smoke exhaust flow; the heat pipe 3233 connects the substrate 3231 and the plurality of heat dissipation fins 3232.

Specifically, the heat pipe 3233 can transmit heat generated by the heating end 3212 of the semiconductor refrigeration chip 3210 to the heat dissipation fins 3232 through a phase change process of liquid in the heat pipe, and then the heat is taken away by exhaust airflow, so that heat dissipation performance is improved.

In other embodiments, the heat pipe 3233 may be replaced by a water pipe, which can also improve the heat dissipation performance of the semiconductor refrigeration chip 3210.

The substrate 3231 may be connected to the heating end 3212 of the semiconductor cooling chip 3210 by an adhesive, such as glue, and the connection manner between the heat pipe 3233 and the substrate 3231 and the heat dissipation fins 3232 may be a non-detachable connection manner, such as an interference fit connection manner, or a detachable connection manner, such as a welding connection manner.

The extending direction of the cooling fins 3232 is parallel to the flow direction of the exhaust airflow, so that the contact area between the exhaust airflow and the cooling fins 3232 can be increased, and the cooling efficiency of the cooling device 3000 can be further improved.

With continued reference to fig. 6, to facilitate installation of the plurality of heat dissipating fins 3232, the second heat sink 3230 further includes a cylinder 3234, the plurality of heat dissipating fins 3232 are disposed on an inner wall of the cylinder 3234 and spaced apart from each other along a circumferential direction of the cylinder 3234, and the exhaust gas flows along an axial direction of the cylinder 3234 inside the cylinder 3234.

The cylinder 3234 is a cylindrical cylinder or a square cylinder, the shape of the cylinder is not limited, and meanwhile, for maintenance, the plurality of radiating fins 3232 can be detachably arranged on the inner wall of the cylinder 3234, so that the cylinder 3234 can be replaced in time when the middle radiating fins 3232 are damaged. In an application scenario, a plurality of slots (not shown) are disposed on an inner wall of the cylinder 3234, and the plurality of fins 3232 are respectively clamped in the plurality of slots. Of course, the plurality of heat dissipating fins 3232 may also be non-detachably disposed on the inner wall of the cylinder 3234, for example, the plurality of heat dissipating fins 3232 are disposed on the inner wall of the cylinder 3234 by welding.

Meanwhile, referring to fig. 6, one end of the plurality of heat pipes 3233 connected to the plurality of heat radiating fins 3232 is connected to an outer wall of the cylinder 3234.

With continued reference to fig. 1, the cylinder 3234 is connected to the smoke evacuation channel 2110 to allow the smoke evacuation flow to exit the smoke evacuation outlet 2111 and enter the cylinder 3234, or the cylinder 3234 is disposed within the smoke evacuation channel 2110.

Specifically, the cylinder 3234 is provided with the smoke exhaust port 2111 and connected to the smoke exhaust channel 2110, wherein the cylinder 3234 may be provided inside the smoke exhaust channel 2110 or outside the smoke exhaust channel 2210, and when the cylinder 3234 is provided outside the smoke exhaust channel 2210, not only the smoke exhaust flow can radiate the heat of the heat dissipation fins 3232, but also the outside air can radiate the heat of the heat dissipation fins 3232, so as to further improve the heat dissipation effect of the semiconductor refrigeration chip 3210.

Continuing to refer to fig. 3, cooling duct 3110 is provided with cooling inlet 3111 and cooling outlet 3112, semiconductor cooling module 3200 is disposed between cooling inlet 3111 and cooling outlet 3112, second fan 3300 blows air from cooling inlet 3111 to cooling outlet 3112 in a blowing manner, and cooling end 3211 of semiconductor cooling chip 3210 exchanges heat with the cooling air flow downstream of second fan 3300.

Specifically, the refrigerating end 3211 of the semiconductor refrigerating chip 3210 is arranged to exchange heat with the refrigerating airflow downstream of the second fan 3300, that is, the refrigerating airflow passes through the second fan 3300 and then passes through the refrigerating end 3211 of the semiconductor refrigerating chip 3210, so that the loss of cold energy can be reduced, and the consumption of cold energy by the second fan 3300 itself can be avoided.

Referring to fig. 1 and 3, in the present embodiment, a smoke exhaust inlet (not shown) is provided adjacent to the cooling outlet 3112, and a smoke exhaust outlet 2111 is provided adjacent to the cooling inlet 3111.

Specifically, the smoke exhaust inlet (not shown in the figure) and the refrigeration outlet 3112 are both arranged at the bottom of the cigarette machine body 2000, the smoke exhaust outlet 2111 and the refrigeration inlet 3111 are both arranged at the top of the cigarette machine body 2000, when the cigarette machine 1000 is installed and then used normally, the refrigeration outlet 3112 and the smoke exhaust inlet are arranged close to a user, the smoke exhaust outlet 2111 and the refrigeration inlet 3111 are arranged far away from the user, on one hand, the discharged refrigeration airflow can be guaranteed to blow towards the user, therefore, the temperature of the surrounding environment of the user is reduced, the comfort is improved, and on the other hand, the temperature of the surrounding environment of the user can be prevented from being raised again by the discharged.

In this embodiment, the number of the semiconductor cooling modules 3200 may be one, or may be multiple, for example, two, three or more (for example, the number of the semiconductor cooling modules 3200 is three in fig. 3), wherein when the number of the semiconductor cooling modules 3200 is multiple, with reference to fig. 1, 3 and 4, the cooling air flow exchanges heat with the cooling end 3211 of each semiconductor cooling chip 3210 at the same time, and the exhaust air flow downstream of the first fan exchanges heat with the heating end 3212 of each semiconductor cooling chip 3210 at the same time.

Specifically, the refrigeration efficiency of the refrigeration device 3000 can be improved by providing a plurality of semiconductor refrigeration assemblies 3200, wherein the plurality of heat dissipation fins 3232 of each second heat sink 3230 are all disposed on the inner wall of the cylinder 3234 and are circumferentially spaced along the cylinder 3234, and the first heat sinks 3220 are arranged in parallel along the direction perpendicular to the flow direction of the refrigeration airflow.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A range hood, characterized in that said range hood comprises:

a cigarette machine body comprising a first housing for forming a smoke evacuation channel and a first fan located in the smoke evacuation channel for forming a smoke evacuation airflow at the smoke evacuation channel;

the refrigerating device comprises a second shell for forming a refrigerating channel, a semiconductor refrigerating assembly and a second fan for forming refrigerating airflow in the refrigerating channel, wherein the semiconductor refrigerating assembly comprises a semiconductor refrigerating chip provided with a refrigerating end and a heating end;

the heating end of the semiconductor refrigeration chip exchanges heat with the smoke exhaust airflow at the downstream of the first fan, and the refrigeration end of the semiconductor refrigeration chip exchanges heat with the refrigeration airflow in the refrigeration channel.

2. The cigarette machine as claimed in claim 1, wherein the smoke exhaust channel is provided with a smoke exhaust inlet and a smoke exhaust outlet, air outside the cigarette machine is input into the smoke exhaust channel through the smoke exhaust inlet, flows to the smoke exhaust outlet after being centrifugally separated by the first fan, and the heating end of the semiconductor refrigeration chip exchanges heat with smoke exhaust airflow at the smoke exhaust outlet.

3. The machine as claimed in claim 2, wherein said semiconductor refrigeration assembly comprises:

a first heat sink disposed in the refrigeration channel and in contact with the refrigeration end of the semiconductor refrigeration chip;

and the second radiator is arranged at the smoke exhaust outlet of the smoke exhaust channel and is in contact with the heating end of the semiconductor refrigeration chip.

4. The machine as claimed in claim 3, wherein said first heat sink is a tooth-relieved heat sink and said second heat sink is a heatpipe heat sink, said heatpipe heat sink comprising:

the substrate is in contact with the heating end of the semiconductor refrigeration chip;

the plurality of radiating fins are arranged at the smoke exhaust outlet of the smoke exhaust channel at intervals, and the extending direction of the plurality of radiating fins is parallel to the flow direction of the smoke exhaust airflow;

and the heat pipe is used for connecting the substrate and the plurality of radiating fins.

5. A machine as claimed in claim 4, wherein said heat pipe radiator further comprises a cylinder, said plurality of fins are disposed on the inner wall of said cylinder and spaced circumferentially of said cylinder, and said smoke exhaust stream flows axially of said cylinder inside said cylinder.

6. A machine as claimed in claim 5, wherein said cylinder is connected to said smoke evacuation channel such that said smoke evacuation airflow is output from said smoke evacuation outlet and enters said cylinder or said cylinder is disposed within said smoke evacuation channel.

7. A machine as claimed in claim 3, wherein the heat dissipation efficiency of said second heat sink is greater than the heat dissipation efficiency of said first heat sink.

8. The machine of claim 2, wherein said cooling tunnel is provided with a cooling inlet and a cooling outlet, said semiconductor cooling module is disposed between said cooling inlet and said cooling outlet, said second fan blows air from said cooling inlet to said cooling outlet in a blowing manner, and a cooling end of said semiconductor cooling chip is in heat exchange with said cooling air stream downstream of said second fan.

9. A machine as claimed in claim 8, wherein said smoke evacuation inlet is located adjacent said refrigerated outlet and said smoke evacuation outlet is located adjacent said refrigerated inlet.

10. The cigarette machine as claimed in claim 1, wherein the number of the semiconductor refrigeration components is at least two, the refrigeration airflow is in heat exchange with the refrigeration end of each semiconductor refrigeration chip simultaneously, and the smoke exhaust airflow downstream of the first fan is in heat exchange with the heating end of each semiconductor refrigeration chip simultaneously.