CN106642835A - Compressor air conditioner semiconductor thermoelectric power generation device - Google Patents
Compressor air conditioner semiconductor thermoelectric power generation device Download PDFInfo
- Publication number
- CN106642835A CN106642835A CN201710029600.4A CN201710029600A CN106642835A CN 106642835 A CN106642835 A CN 106642835A CN 201710029600 A CN201710029600 A CN 201710029600A CN 106642835 A CN106642835 A CN 106642835A
- Authority
- CN
- China
- Prior art keywords
- electric generation
- compressor air
- generation apparatus
- power generation
- conditioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/04—Condensers
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/04—Details of condensers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to the field of air conditioners, and provides a compressor air conditioner semiconductor thermoelectric power generation device for solving the problem of waste of heat energy of an existing air conditioner compressor condenser. The compressor air conditioner semiconductor thermoelectric power generation device comprises a compressor, a condenser heat exchange device and an evaporator which are connected through an air conditioner pipeline, at least one face of the condenser heat exchange device is connected with a semiconductor thermoelectric power generation chip, and the semiconductor thermoelectric power generation chip is electrically connected with an electric appliance or a storage battery. A power generation chip radiating device is arranged outside the semiconductor thermoelectric power generation chip. The power generation chip radiating device is connected with a radiator through a radiating pipeline, and a radiating circulating pump is connected to the radiating pipeline. According to the compressor air conditioner semiconductor thermoelectric power generation device, the structure is simple, the heat energy of the condenser heat exchange device can be converted into electric energy so as to be recycled due to the fact that the thermoelectric power generation chip is connected to the radiating surface of the condenser heat exchange device, and therefore the air conditioner product saves more energy and is more environmentally friendly.
Description
Technical field
The invention belongs to field of air conditioning, more particularly to a kind of compressor air-conditioning semiconductor thermo-electric generation apparatus.
Background technology
Condenser is the parts of refrigeration system, belongs to one kind of heat exchanger, gas or steam can be transformed into liquid, will manage
Heat in son, in the way of quickly, in the air passed near pipe.Condenser working process is the process of heat release, institute
All it is higher with condenser temperature.This results in the waste of heat energy, therefore in the urgent need to a kind of device can be by the heat energy profit
The device for using, because the efficiency of semiconductor chip has also been greatly improved so that the practical application of the present invention becomes can
Can, the present invention is exactly to arise at the historic moment in this context.
The content of the invention
The present invention seeks to a kind of compressor air-conditioning for being directed to existing compressor of air conditioner condenser thermal waste and providing
Semiconductor thermo-electric generation apparatus.
The present invention is achieved by the following technical solution:
Compressor air-conditioning semiconductor thermo-electric generation apparatus, including compressor, the condenser heat exchange dress of Jing air-conditioning ducts connection
Put and evaporimeter, at least a piece of semiconductor temperature differential generating chip is installed at least one side of condenser heat exchanger, this is partly led
Body temperature difference electricity generation device is connected with electrical appliance or storage battery.
Heat abstractor is provided with semiconductor temperature differential generating chip exterior.
Power-generating chip heat abstractor connects radiator by hot channel, the connection radiating circulating pump on hot channel.
Described radiator internal memory contains coolant, and coolant is dissipated by radiating circulating pump in hot channel and power-generating chip
Constantly circulate in thermal.
Described semiconductor temperature differential generating chip includes a piece of and arrangement superposition above.
Temperature-uniforming plate is housed between described thermo-electric generation sheet stacking.
Described temperature-uniforming plate is made using high-thermal conductive metal material or phase-change material or inorganic heat superconductor or Graphene etc.
Into.
The material of the preferred aluminum material of described temperature-uniforming plate or copper material or inorganic heat superconduction and metal composite.
Described superposition generating piece and the generating piece or temperature-uniforming plate of temperature-uniforming plate is outgoing equipped with radiator.
The temperature-uniforming plate is shaped as pyramid or "L" shaped or " U " font or polygonized structure.
Insulating barrier is provided with the thermo-electric generation chip and/or temperature-uniforming plate, line layer is provided with insulating barrier.
The line layer at least includes solderable position and electrical connection distribution.
The generating piece, the fixed form between temperature-uniforming plate, heat-exchanger rig are welding and/or adhesive solidification.
Beneficial effects of the present invention:Present configuration is simple, and the present invention connects in the heat-delivery surface of condenser heat exchanger
Thermo-electric generation chip so that the heat energy of condenser heat exchanger can reconvert into electric energy, so as to recycle, make air-conditioning products more
Plus energy-conserving and environment-protective.
Description of the drawings
Fig. 1 is the structural representation of the embodiment of the present invention one;
Fig. 2 is the attachment structure schematic diagram without temperature-uniforming plate in the case of multiple semiconductor temperature differential generating chip superpositions of the invention;
Fig. 3 is the attachment structure schematic diagram for having temperature-uniforming plate in the case of multiple semiconductor temperature differential generating chip superpositions of the invention;
Fig. 4 is the structural representation of the embodiment of the present invention two;
Fig. 5 is the structural representation of the embodiment of the present invention three;
Fig. 6 is the structural representation of the embodiment of the present invention four;
Fig. 7 is the structural representation of the embodiment of the present invention five.
Specific embodiment
With reference to embodiment, the invention will be further described.
Embodiment one
As shown in figure 1, compressor air-conditioning semiconductor thermo-electric generation apparatus, including the compressor 1, cold of Jing air-conditioning ducts connection
Condenser device 2, condenser heat exchanger 10 and evaporator 4, pass through between compressor, condenser device, evaporator
Capillary 3 connects, and described condenser heat exchanger is fin made by metal material, it should be noted that changed in condenser
At least one side connection semiconductor temperature differential generating chip 8 of thermal, the semiconductor thermo-electric generation apparatus and electrical appliance or battery
Electrical connection.Power-generating chip heat abstractor 6 is provided with semiconductor temperature differential generating chip exterior.The heat abstractor be water courage, generating core
Piece heat abstractor connects radiator 7 by hot channel 9, the connection radiating circulating pump 5 on hot channel.In described radiator
Be stored with coolant, and coolant is constantly circulated by radiating circulating pump in hot channel and power-generating chip heat abstractor.
As shown in Figures 2 and 3, it is further noted that the installation of described semiconductor temperature differential generating chip include to
Few a piece of planar alignment and three-dimensional superposition, equipped with or be not equipped with temperature-uniforming plate.
Embodiment two
As shown in figure 4, the present embodiment is with the difference of embodiment one:Condenser heat exchanger is in the present embodiment
Liquid heat exchange device, condenser is immersed in the liquid heat exchange device, and the liquid heat exchange device is joined end to end by cooling tube 21,
And it is connected with coolant recirculation pump 22 on cooling tube.
Embodiment three
As shown in figure 5, the present embodiment is with the difference of embodiment one:Described semiconductor temperature differential generating chip is
Multilayer, connects soaking plate 31, in outermost semiconductor temperature differential generating chip between adjacent two semiconductor temperature differential generatings chip
Outer surface connection power-generating chip heat abstractor.
Example IV
As shown in fig. 6, the present embodiment is with the difference of embodiment one:Power-generating chip heat abstractor in the present embodiment
For heat-pipe radiator, the heat-pipe radiator includes a heat sink, and multiple radiating tubes are provided with heat sink, is provided with cold in radiating tube
But liquid, the coolant in the radiating tube is flowing.
Embodiment five
As shown in fig. 7, the present embodiment is with the difference of embodiment one:Described condenser is spiral helicine pipe
Road, in the outside of the condenser cylindrical shape or polygon heat-exchanger rig are provided with, and in the periphery of the heat-exchanger rig semiconductor temperature is provided with
Difference power-generating chip, in semiconductor temperature differential generating chip exterior water of radiation courage is provided with, and the coolant of flowing is provided with water of radiation courage.
General principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel it should be appreciated that the present invention is not restricted to the described embodiments, the simply explanation described in above-described embodiment and specification this
The principle of invention, without departing from the spirit and scope of the present invention, the simple change of those ordinary skill in the art
All it is within protection scope of the present invention with replacing.
Claims (10)
1. compressor, the condenser heat exchanger of compressor air-conditioning semiconductor thermo-electric generation apparatus, including Jing air-conditioning duct connection
And evaporimeter, it is characterised in that:At least a piece of semiconductor temperature differential generating core is installed at least one side of condenser heat exchanger
Piece, the semiconductor thermo-electric generation apparatus are connected with electrical appliance or storage battery.
2. compressor air-conditioning semiconductor thermo-electric generation apparatus according to claim 1, it is characterised in that:In semiconductor temperature difference
Heat abstractor is provided with outside power-generating chip.
3. compressor air-conditioning semiconductor thermo-electric generation apparatus according to claim 2, it is characterised in that:Power-generating chip radiates
Device connects radiator by hot channel, the connection radiating circulating pump on hot channel.
4. compressor air-conditioning semiconductor thermo-electric generation apparatus according to claim 3, it is characterised in that:Described radiator
Internal memory contains coolant, and coolant is constantly circulated by radiating circulating pump in hot channel and power-generating chip heat abstractor.
5. compressor air-conditioning semiconductor thermo-electric generation apparatus according to any one claim in claim 1-3, its
It is characterised by:Described semiconductor temperature differential generating chip includes a piece of and arrangement superposition above.
6. compressor air-conditioning semiconductor thermo-electric generation apparatus according to claim 5, it is characterised in that:The described temperature difference is sent out
Temperature-uniforming plate is housed between electric piece stacking.
7. compressor air-conditioning semiconductor thermo-electric generation apparatus according to claim 6, it is characterised in that:Described temperature-uniforming plate
Made using high-thermal conductive metal material or phase-change material or inorganic heat superconductor or Graphene.
8. compressor air-conditioning semiconductor thermo-electric generation apparatus according to claim 7, it is characterised in that:Described temperature-uniforming plate
It is preferred that the material of aluminum material or copper material or inorganic heat superconduction and metal composite.
9. compressor air-conditioning semiconductor thermo-electric generation apparatus according to claim 8, it is characterised in that:The samming plate shape
Shape is pyramid or "L" shaped or " U " font or polygonized structure.
10. compressor air-conditioning semiconductor thermo-electric generation apparatus according to claim 10, it is characterised in that the thermo-electric generation
Insulating barrier is provided with chip and/or temperature-uniforming plate, line layer is provided with insulating barrier, the line layer at least includes solderable
Position and electrical connection distribution, the generating piece, the fixed form between temperature-uniforming plate, heat-exchanger rig are for welding and/or bond solid
Change.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710029600.4A CN106642835A (en) | 2017-01-16 | 2017-01-16 | Compressor air conditioner semiconductor thermoelectric power generation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710029600.4A CN106642835A (en) | 2017-01-16 | 2017-01-16 | Compressor air conditioner semiconductor thermoelectric power generation device |
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CN106642835A true CN106642835A (en) | 2017-05-10 |
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CN201710029600.4A Pending CN106642835A (en) | 2017-01-16 | 2017-01-16 | Compressor air conditioner semiconductor thermoelectric power generation device |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107101299A (en) * | 2017-05-17 | 2017-08-29 | 广东美的制冷设备有限公司 | Air conditioner and its control method |
CN107166692A (en) * | 2017-05-17 | 2017-09-15 | 广东美的制冷设备有限公司 | Air-conditioning system |
CN112803835A (en) * | 2021-03-18 | 2021-05-14 | 重庆大学 | Domestic portable thermoelectric generation device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105871256A (en) * | 2016-06-01 | 2016-08-17 | 浙江聚珖科技股份有限公司 | Heat pump cold-hot temperature difference power generation device |
CN205792308U (en) * | 2016-05-27 | 2016-12-07 | 浙江聚珖科技股份有限公司 | Condenser thermal source temperature difference electricity generation device |
CN205828436U (en) * | 2016-04-23 | 2016-12-21 | 浙江聚珖科技股份有限公司 | Novel semi-conductor thermo-electric generation chip structure |
CN206556309U (en) * | 2017-01-16 | 2017-10-13 | 浙江聚珖科技股份有限公司 | Compressor air-conditioning semiconductor thermo-electric generation apparatus |
-
2017
- 2017-01-16 CN CN201710029600.4A patent/CN106642835A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN205828436U (en) * | 2016-04-23 | 2016-12-21 | 浙江聚珖科技股份有限公司 | Novel semi-conductor thermo-electric generation chip structure |
CN205792308U (en) * | 2016-05-27 | 2016-12-07 | 浙江聚珖科技股份有限公司 | Condenser thermal source temperature difference electricity generation device |
CN105871256A (en) * | 2016-06-01 | 2016-08-17 | 浙江聚珖科技股份有限公司 | Heat pump cold-hot temperature difference power generation device |
CN206556309U (en) * | 2017-01-16 | 2017-10-13 | 浙江聚珖科技股份有限公司 | Compressor air-conditioning semiconductor thermo-electric generation apparatus |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107101299A (en) * | 2017-05-17 | 2017-08-29 | 广东美的制冷设备有限公司 | Air conditioner and its control method |
CN107166692A (en) * | 2017-05-17 | 2017-09-15 | 广东美的制冷设备有限公司 | Air-conditioning system |
CN107101299B (en) * | 2017-05-17 | 2020-06-05 | 广东美的制冷设备有限公司 | Air conditioner and control method thereof |
CN112803835A (en) * | 2021-03-18 | 2021-05-14 | 重庆大学 | Domestic portable thermoelectric generation device |
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Application publication date: 20170510 |
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