CN212411141U - Novel closed circulation radiator - Google Patents
Novel closed circulation radiator Download PDFInfo
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- CN212411141U CN212411141U CN202020933952.XU CN202020933952U CN212411141U CN 212411141 U CN212411141 U CN 212411141U CN 202020933952 U CN202020933952 U CN 202020933952U CN 212411141 U CN212411141 U CN 212411141U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The application discloses novel closed circulation radiator is applicable to the CPU heat dissipation, and this radiator includes: the first temperature-equalizing plate is arranged above the CPU, and after the first temperature-equalizing plate absorbs the heat on the surface of the CPU, the working medium in the first temperature-equalizing plate is changed from a liquid state to a gas state; the first fins are arranged above the first temperature-equalizing plate and used for increasing the heat dissipation area of the first temperature-equalizing plate; the first pipeline and the second pipeline are connected in series between the second temperature-uniforming plate and the first temperature-uniforming plate, the first pipeline is used for guiding gaseous working media into the second temperature-uniforming plate so that the gaseous working media are converted into liquid in the second temperature-uniforming plate through heat dissipation, a capillary fiber structure is arranged in the second pipeline, and the second pipeline is used for guiding the liquid working media in the second temperature-uniforming plate into the first temperature-uniforming plate under the action of capillary force. Through the technical scheme in this application, adjust the base plate of CPU contact, improve the heat-sinking capability of server, satisfy the heat dissipation demand of high-power consumption server.
Description
Technical Field
The application relates to the technical field of server heat dissipation, in particular to a novel closed circulation radiator.
Background
With the increasing power consumption of servers, the problem of heat dissipation has become an irremediable problem, and particularly for CPUs, the performance, the service life and the over-frequency experience of users of the CPUs are directly affected by the working temperature. For system heat dissipation, the first critical step is how to conduct the heat of the CPU out quickly, and since the heat conduction capability of the heat pipe far exceeds that of all the metals at present, the heat pipe is widely applied to the field of heat dissipation of electronic devices.
In the prior art, the heat pipe is usually welded on the substrate, and then the substrate is contacted with the CPU to absorb the heat generated by the CPU. And to the special server that highly receives the restriction, like 1U server, under the certain circumstances of whole high space, owing to set up the base plate on the one hand, when the welding heat pipe, not only need flatten the heat pipe in order to satisfy high demand, also can not all fill the heat pipe in addition on the base plate, lead to having following problem:
1. after the heat pipe is flattened, the heat conduction efficiency of the heat pipe is reduced to different degrees;
2. the welding part between the substrate and the heat pipe increases the contact thermal resistance, so that the heat conduction efficiency of the heat pipe is reduced;
3. the temperature of the heat dissipation area on the surface of the CPU is inconsistent, and the temperature difference exists between the area below the heat pipe and the area without welding the heat pipe, so that the stable operation of the CPU is not facilitated.
On the other hand, because the substrate needs to occupy a space on a part of height, fins cannot be arranged above the heat pipe, or only fins with lower height can be arranged, so that the heat dissipation area of the heat radiator is smaller, and the heat dissipation requirement after the power consumption of the server is increased cannot be met.
SUMMERY OF THE UTILITY MODEL
The purpose of this application lies in: the substrate contacted with the CPU is adjusted, so that the heat dissipation capacity of the server is improved, and the heat dissipation requirement of the high-power-consumption server is met.
The technical scheme of the application is as follows: the utility model provides a novel closed circulation radiator is applicable to the CPU heat dissipation, and this radiator includes: the first temperature equalizing plate, the second temperature equalizing plate and the first fin; the first temperature-equalizing plate is arranged above the CPU, and after the first temperature-equalizing plate absorbs the heat on the surface of the CPU, the working medium in the first temperature-equalizing plate is changed from a liquid state to a gas state; the first fins are arranged above the first temperature-equalizing plate and used for increasing the heat dissipation area of the first temperature-equalizing plate; the first pipeline and the second pipeline are connected in series between the second temperature-uniforming plate and the first temperature-uniforming plate, the first pipeline is used for guiding gaseous working media into the second temperature-uniforming plate so that the gaseous working media are converted into liquid in the second temperature-uniforming plate through heat dissipation, a capillary fiber structure is arranged in the second pipeline, the second pipeline is used for guiding the liquid working media in the second temperature-uniforming plate into the first temperature-uniforming plate under the action of capillary force, and the first temperature-uniforming plate and the second temperature-uniforming plate are in a vacuum state.
In any of the above technical solutions, further, the capillary fiber structure is a multi-layer copper mesh structure.
In any one of the above technical solutions, further, the heat sink further includes: a second fin; the second fins are arranged above the second temperature-uniforming plate and used for increasing the heat dissipation area of the second temperature-uniforming plate.
In any one of the above technical solutions, further, the first temperature equalization plate further includes: four positioning holes; the four positioning holes are arranged at four vertexes of the first temperature equalizing plate, are through holes and are used for fixing the first temperature equalizing plate above the CPU.
The beneficial effect of this application is:
technical scheme in this application, through setting up the VC soaking pit, including setting up first temperature-uniforming plate on CPU and the second temperature-uniforming plate that links to each other with first temperature-uniforming plate, replaced original "base plate and heat pipe" structure, under the high certain circumstances in radiator overall space for can welded fin height on the VC soaking pit is higher, and then has increased the heat radiating area of radiator, has improved the radiating efficiency to CPU. And the first temperature equalizing plate is directly contacted with the CPU, and the contact thermal resistance between the first temperature equalizing plate and the CPU is consistent, so that the phenomenon of uneven temperature on the surface of the CPU is avoided.
Drawings
The advantages of the above and/or additional aspects of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of a novel closed cycle radiator according to one embodiment of the present application;
FIG. 2 is a schematic illustration of a fin installation according to an embodiment of the present application.
The structure comprises a base, a plurality of fins, a plurality of temperature equalization plates, a plurality of positioning holes, a plurality of first pipelines, a plurality of second temperature equalization plates, a plurality of second fins, a plurality of first heat equalization plates, a plurality of second heat equalization plates and a plurality of second heat equalization plates, wherein the base comprises the following components, 10-the first temperature equalization plates, 11-the first fins, 12.
Detailed Description
In order that the above objects, features and advantages of the present application can be more clearly understood, the present application will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, however, the present application may be practiced in other ways than those described herein, and therefore the scope of the present application is not limited by the specific embodiments disclosed below.
As shown in fig. 1 and fig. 2, the present embodiment provides a novel closed-cycle heat sink, which is suitable for CPU heat dissipation, and the heat sink includes: the first temperature equalizing plate 10, the second temperature equalizing plate 20 and the first fin 11; the first temperature equalizing plate 10 is arranged above the CPU, and is in contact with the upper surface of the CPU, and the CPU generates heat continuously in a work process, so that a temperature difference exists between the first temperature equalizing plate 10 and the CPU, and therefore, the first temperature equalizing plate 10 absorbs heat on the surface of the CPU through contact heat transfer, and since the surface temperature of the CPU is about 80 degrees celsius, the working medium in this embodiment is deionized water, and therefore, the first temperature equalizing plate 10 needs to be subjected to vacuum treatment.
After the first temperature-uniforming plate 10 absorbs the heat on the surface of the CPU, the working medium in the first temperature-uniforming plate 10 changes from a liquid state to a gas state in a vacuum state, absorbs the heat in the first temperature-uniforming plate 10, and diffuses around.
In order to increase the heat dissipation area of the first temperature equalizing plate 10, a first fin 11 is arranged above the first temperature equalizing plate 10, and the height of the first fin 11 is determined by the height of the heat sink and the height of the first temperature equalizing plate 10.
It should be noted that, because the first temperature-uniforming plate 10 is adopted to replace the original "base plate heat pipe" structure, the first fins 11 with sufficient height can be arranged on the first temperature-uniforming plate 10, and then the heat dissipation of the first temperature-uniforming plate 10 is accelerated by combining the cold sources in the heat sink, such as the refrigerant and the fan.
Similarly, in order to dissipate and liquefy the gasified working medium in the first temperature equalizing plate, a second temperature equalizing plate 20 is further provided in this embodiment. A first pipeline 12 and a second pipeline 13 are connected in series between the second temperature equalizing plate 20 and the first temperature equalizing plate 10, the working medium after being diffused and gasified flows to the first pipeline 12, the gaseous working medium is guided into the second temperature equalizing plate 20 by the first pipeline 12, so that the gaseous working medium is converted into liquid state by heat dissipation in the second temperature equalizing plate 20, the conversion of the working medium state is accelerated, and the gaseous working medium is supplemented into the first temperature equalizing plate 10. Meanwhile, the second vapor chamber 20, the first pipe 12 and the second pipe 13 are subjected to vacuum treatment
The second pipe 13 is provided with a capillary fiber structure, and the first pipe 12 is not provided with a capillary fiber structure, which results in a smaller resistance in the gas flowing process in the first pipe 12, which is also the reason why the gaseous working medium can flow into the first pipe 12.
In a vacuum state, the working medium liquefied in the second temperature-uniforming plate 20 passes through the second pipeline 13 provided with the capillary fiber structure, and is retained back to the first temperature-uniforming plate 10 again under the action of capillary force to form a circulation, and the liquid working medium and the gaseous working medium have respective channels, so that the overall flow resistance of the working medium between the first temperature-uniforming plate 10 and the second temperature-uniforming plate 20 is lower, wherein the capillary fiber structure can be a multi-layer copper mesh structure.
Further, in order to accelerate the heat dissipation efficiency of the second temperature equalizing plate 20 to the gaseous working medium, the heat sink further includes: the second fin 21; the second fins 21 are disposed above the second temperature-uniforming plate 20, and in combination with a cold source disposed in the heat dissipation process, the second fins 21 are utilized to increase the heat dissipation area of the second temperature-uniforming plate 20, thereby accelerating the conversion of the gaseous working medium in the second temperature-uniforming plate 20 into the liquid working medium.
Further, the first vapor chamber 10 further includes: four positioning holes 14; four positioning holes 14 are disposed at four vertices of the first temperature-uniforming plate 10, the four positioning holes 14 are through holes, and the four positioning holes 14 are used for fixing the first temperature-uniforming plate 10 above the CPU.
The technical scheme of this application has been explained in detail in the above combination with the figure, and this application has proposed a novel closed circulation radiator, is applicable to the CPU heat dissipation, and this radiator includes: the first temperature-equalizing plate is arranged above the CPU, and after the first temperature-equalizing plate absorbs the heat on the surface of the CPU, the working medium in the first temperature-equalizing plate is changed from a liquid state to a gas state; the first fins are arranged above the first temperature-equalizing plate and used for increasing the heat dissipation area of the first temperature-equalizing plate; the first pipeline and the second pipeline are connected in series between the second temperature-uniforming plate and the first temperature-uniforming plate, the first pipeline is used for guiding gaseous working media into the second temperature-uniforming plate so that the gaseous working media are converted into liquid in the second temperature-uniforming plate through heat dissipation, a capillary fiber structure is arranged in the second pipeline, and the second pipeline is used for guiding the liquid working media in the second temperature-uniforming plate into the first temperature-uniforming plate under the action of capillary force. Through the technical scheme in this application, adjust the base plate of CPU contact, improve the heat-sinking capability of server, satisfy the heat dissipation demand of high-power consumption server.
In the present application, the terms "mounted," "connected," "fixed," and the like are used in a broad sense, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The shapes of the various elements in the drawings are illustrative and do not preclude the existence of certain differences from the actual shapes, and the drawings are used for the purpose of illustrating the principles of the present application and are not intended to limit the present application.
Although the present application has been disclosed in detail with reference to the accompanying drawings, it is to be understood that such description is merely illustrative and not restrictive of the application of the present application. The scope of the present application is defined by the appended claims and may include various modifications, adaptations, and equivalents of the subject application without departing from the scope and spirit of the present application.
Claims (4)
1. The utility model provides a novel closed circulation radiator which characterized in that is applicable to the CPU heat dissipation, and this radiator includes: the heat exchanger comprises a first temperature-equalizing plate (10), a second temperature-equalizing plate (20) and a first fin (11);
the first temperature equalizing plate (10) is arranged above the CPU, and after the first temperature equalizing plate (10) absorbs the heat on the surface of the CPU, the working medium in the first temperature equalizing plate (10) is changed from a liquid state to a gas state;
the first fins (11) are arranged above the first temperature equalizing plate (10), and the first fins (11) are used for increasing the heat dissipation area of the first temperature equalizing plate (10);
a first pipeline (12) and a second pipeline (13) are connected in series between the second temperature-uniforming plate (20) and the first temperature-uniforming plate (10), the first pipeline (12) is used for guiding the gaseous working medium into the second temperature-uniforming plate (20) so as to ensure that the gaseous working medium is converted into liquid state through heat dissipation in the second temperature-uniforming plate (20),
a capillary fiber structure is arranged in the second pipeline (13), the second pipeline (13) is used for guiding the liquid working medium in the second temperature-uniforming plate (20) into the first temperature-uniforming plate (10) under the action of capillary force,
wherein the first temperature-uniforming plate (10) and the second temperature-uniforming plate (20) are in a vacuum state.
2. The novel closed cycle heat sink of claim 1 wherein the capillary fiber structure is a multi-layer copper mesh structure.
3. The new closed cycle radiator of claim 1 wherein said radiator further comprises: a second fin (21);
the second fins (21) are arranged above the second temperature equalizing plate (20), and the second fins (21) are used for increasing the heat dissipation area of the second temperature equalizing plate (20).
4. A new closed cycle radiator as claimed in claim 1, characterized in that said first vapor-deposited plate (10) further comprises: four positioning holes (14);
the four positioning holes (14) are arranged at four vertexes of the first temperature-uniforming plate (10), the four positioning holes (14) are through holes, and the four positioning holes (14) are used for fixing the first temperature-uniforming plate (10) above the CPU.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020933952.XU CN212411141U (en) | 2020-05-28 | 2020-05-28 | Novel closed circulation radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020933952.XU CN212411141U (en) | 2020-05-28 | 2020-05-28 | Novel closed circulation radiator |
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| CN212411141U true CN212411141U (en) | 2021-01-26 |
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| CN202020933952.XU Active CN212411141U (en) | 2020-05-28 | 2020-05-28 | Novel closed circulation radiator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225990A (en) * | 2021-04-30 | 2021-08-06 | 苏州汇川技术有限公司 | Phase change heat sink and electronic device |
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2020
- 2020-05-28 CN CN202020933952.XU patent/CN212411141U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225990A (en) * | 2021-04-30 | 2021-08-06 | 苏州汇川技术有限公司 | Phase change heat sink and electronic device |
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