CN110488433A - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
- Publication number
- CN110488433A CN110488433A CN201910758693.3A CN201910758693A CN110488433A CN 110488433 A CN110488433 A CN 110488433A CN 201910758693 A CN201910758693 A CN 201910758693A CN 110488433 A CN110488433 A CN 110488433A
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- China
- Prior art keywords
- light
- optical
- optical fiber
- reflection surface
- circuit board
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
Abstract
The embodiment of the invention discloses a kind of optical modules, belong to fiber optic communication field.In optical module provided in an embodiment of the present invention, optical fiber and collimation lens are located in optical fiber connector, Optical Demultiplexing component is between light reflection surface and optical fiber connector, light-receiving chip array is between light reflection surface and circuit board, light beam from optical fiber is transmitted in Optical Demultiplexing component by collimation lens, Optical Demultiplexing component is transmitted to light reflection surface after light beam is divided into multi-beam, light reflection surface reflects light to light-receiving chip array direction, to realize that light successively passes through collimation lens from optical fiber, after Optical Demultiplexing component and light reflection surface, it reaches in light-receiving chip array；The light beam that optical fiber transmits forms multi-beam through Optical Demultiplexing component, reaches in light-receiving chip array, realize reception of the optical module to light.
Description
Technical field
The present invention relates to fiber optic communication field more particularly to a kind of optical modules.
Background technique
Optical module realizes the function of photoelectric conversion in technical field of optical fiber communication.In optical module using light-receiving chip into
Traveling optical signal receives, and then converts optical signals to electric signal.After light outside optical module enters inside optical module, pass through one
Train of optical elements reaches light-receiving chip later by one section of optical path, and light is during optical module internal transmission, light
Transmission Insertion Loss and mould spot metamorphosis can be influenced by optical element, optical path, finally directly affect light-receiving chip
The quality of reception.
Summary of the invention
Optical module provided in an embodiment of the present invention discloses the conceptual design that light is received in a kind of optical module.
In order to achieve the above-mentioned object of the invention, the embodiment of the present invention adopts the following technical scheme that
The embodiment of the present invention provides a kind of optical module, including circuit board and is located at the optical fiber of circuit board surface, optical fiber connection
Device, collimation lens, Optical Demultiplexing component, light reflection surface, light-receiving chip array；Optical fiber and collimation lens are located at optical fiber company
It connects in device；Optical Demultiplexing component is between light reflection surface and optical fiber connector；Light-receiving chip array be located at light reflection surface with
Between circuit board；Light beam from optical fiber is transmitted in Optical Demultiplexing component by collimation lens, and Optical Demultiplexing component will be a branch of
Light is transmitted to light reflection surface after being divided into multi-beam, and light reflection surface reflects light to light-receiving chip array direction.
In optical module disclosed by the embodiments of the present invention, optical fiber and collimation lens are located in optical fiber connector, and photodissociation is multiple
With component between light reflection surface and optical fiber connector, light-receiving chip array is quasi- between light reflection surface and circuit board
Light beam from optical fiber is transmitted in Optical Demultiplexing component by straight lens, after light beam is divided into multi-beam by Optical Demultiplexing component
It is transmitted to light reflection surface, light reflection surface reflects light to light-receiving chip array direction, to realize that light successively passes through from optical fiber
After collimation lens, Optical Demultiplexing component and light reflection surface, reach in light-receiving chip array；The light beam that optical fiber transmits, through light
It demultiplexes component and forms the light that multi beam has different wave length, reach in light-receiving chip array, realize optical module to multiple waves
The reception of long light.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be in embodiment or description of the prior art
Required attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some realities of the invention
Example is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is optical communication terminal connection relationship diagram；
Fig. 2 is optical network unit structural schematic diagram；
Fig. 3 is a kind of optical module structure schematic diagram provided in an embodiment of the present invention；
Fig. 4 is a kind of optical module structure perspective view of the explosion provided in an embodiment of the present invention；
Fig. 5 is a kind of optical module structure sectional view provided in an embodiment of the present invention；
Fig. 6 is light-receiving sub-module structure schematic diagram provided in an embodiment of the present invention；
Fig. 7 is light-receiving secondary module decomposition texture schematic diagram provided in an embodiment of the present invention；
Fig. 8 is that light-receiving secondary module provided in an embodiment of the present invention decomposes sectional structure chart；
Fig. 9 is light-receiving secondary module partial structural diagram provided in an embodiment of the present invention；
Figure 10 is light-receiving secondary module exploded structural schematic diagram provided in an embodiment of the present invention；
Figure 11 is light-receiving secondary module partial enlarged view provided in an embodiment of the present invention；
Figure 12 is fibre-optic connector structure schematic diagram provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Optic communication, which is realized, transmits signal using electricity and the two different carriers of light.Fiber optic communication uses carrying letter
The optical signal of breath transmits in optical waveguide, using passive transmission characteristic of the light in the optical waveguides such as optical fiber may be implemented low cost,
Low-loss information transmission；And the information processing equipments such as computer, using electric signal, this is just needed in optical fiber telecommunications system
The middle mutual conversion for realizing electric signal and optical signal.
Fig. 1 is optical communication terminal connection relationship diagram.As shown in Figure 1, the connection of optical communication terminal mainly includes light net
Network unit 100, optical module 200, optical fiber 101 and cable 103；
One end of optical fiber 101 connects remote server, and one end of cable 103 connects local information processing equipment, at local information
The connection for managing equipment and remote server is completed by the connection of optical fiber 101 and cable 103；And between optical fiber 101 and cable 103
Connection is completed by the optical network unit 100 with optical module 200.
The optical port of optical module 200 is connect with optical fiber 101, is established two-way optical signal with optical fiber and is connect；
In the power port access optical network unit 100 of optical module 200, two-way electric signal is established with optical network unit and is connect；
Optical module realizes the mutual conversion of optical signal and electric signal, builds between optical fiber 101 and optical network unit 100 to realize
Vertical connection；
Specifically, the optical signals optical module from optical fiber is input in optical network unit 100 after being converted to electric signal, comes from light
The electric signal of network unit 100 is converted to optical signal by optical module and is input in optical fiber 101.Optical module 200 is to realize optical telecommunications
Number tool mutually converted, the function without processing data, in above-mentioned photoelectric conversion process, the carrier of information is in light and electricity
Between convert, but information itself does not change.
There is optical network unit 100 optical module interface 102 to establish with optical module 200 two-way for accessing optical module 200
Electric signal connection；
There is optical network unit cable interface 104 to establish two-way electric signal for accessing cable 103 with cable 103 and connect；
Connection is established by optical network unit between optical module 200 and cable 103；
Specifically, the signal from optical module is passed to cable by optical network unit, and the signal from cable is passed to optical mode
Block, work of the optical network unit as the ipc monitor optical module of optical module.
So far, remote server passes sequentially through optical fiber 101, optical module 200, optical network unit 100 and cable 103, with this
Two-way signal transmission channels are established between ground information processing equipment.
Common information processing equipment includes router, interchanger, electronic computer etc.；
Optical network unit is the host computer of optical module, provides data-signal to optical module, and receives the data letter from optical module
Number, there are also optical line terminal OLTs etc. for common optical module host computer.
Fig. 2 is optical network unit structural schematic diagram.As shown in Fig. 2, having circuit board 105, In in optical network unit 100
Cage 106 is arranged in the surface of circuit board 105；The electric connector connecting with circuit board 105 is provided in cage 106, for connecing
Enter the optical modules power port such as golden finger；Radiator 107 is provided on cage 106, radiator 107 has the wing of increasing heat radiation area
The bulge-structures such as piece.
Optical module 200 is inserted into optical network unit 100, specially the electrical connection in the power port insertion cage 106 of optical module
The optical port of device, optical module is connect with optical fiber 101.
Cage 106 is located on the circuit board 105 of optical network unit 100, and the electric connector on circuit board 105 is wrapped in cage
In son；Optical module is inserted into cage, and by the fixed optical module of cage, the heat that optical module generates is conducted to cage by optical module shell
Son is diffused eventually by the radiator 107 on cage.
Fig. 3 is a kind of optical module structure schematic diagram provided in an embodiment of the present invention, and Fig. 4 is provided in an embodiment of the present invention one
Kind optical module structure perspective view of the explosion, as shown in Figure 3, Figure 4, optical module 200 provided in an embodiment of the present invention include upper housing
201, lower case 202, release lever 203, circuit board 300, light emitting secondary module 400, light-receiving secondary module 500 and fiber-optical socket
502。
Upper housing 201 and lower case 202 form tool there are two the package cavity of port, specifically can be unidirectional
Two-port (204,205), is also possible to port at two in different directions；One of port is power port 204, for being inserted into
In the host computers such as optical network unit；Another port is optical port 205, for connecting external fiber 101；Circuit board 300, light emitting
The photoelectric devices such as secondary module 400 and light-receiving secondary module 500 are located in the package cavity of upper and lower casing formation.
Upper housing and lower case generally use metal material, are conducive to realize electromagnetic shielding and heat dissipation；Using upper housing, under
The shell of optical module will not be generally made by the assembly method that shell combines convenient for the devices such as circuit board are installed in shell
Integral structure, in this way in devices such as wiring harness plates, positioning element, heat dissipation and electromagnetic armouring structure are not easy to install, no
Conducive to production automation.
Release lever 203 is located at the outer wall of package cavity/lower case 202, pulls the end of release lever that can make to solve
Handle is locked to relatively move in outer wall surface；Cage 106 is engaged by release lever 203 when optical module is inserted into host computer, thus by light
Module is fixed in host computer；By pulling release lever to release the snap-fit relationship of optical module 200 Yu cage 106, so as to
Optical module to be extracted out from host computer.
Circuit board 300 be located at by upper, shell is formed wrap up cavity in, circuit board 300 respectively with light emitting secondary module 400 and
Light-receiving secondary module 500 is electrically connected, and is provided with the electrical parts such as chip, capacitor, resistance on circuit board.It is selected according to the demand of product
Corresponding chip, common chip include Micro-processor MCV, clock and data recovery chip CDR, laser-driven chip, put across resistance
Big device TIA chip, limiting amplifier LA chip, power management chip etc.；Wherein trans-impedance amplifier is closely closed with light detecting chip
Trans-impedance amplifier and light detecting chip can be packaged together by connection, portioned product, such as be encapsulated in same TO shell or same outer
In shell；Light detecting chip can also separately be dispensed with trans-impedance amplifier, on circuit boards by trans-impedance amplifier setting.
Chip on circuit board 300 can be multi-functional unification chip, for example laser-driven chip is merged with MCU chip
For a chip, laser-driven chip, limiting amplifier chip and MCU can also be permeated a chip, and chip is circuit
It is integrated, but the function of each circuit, there is no disappearing because of set, only circuit presentation form changes, in chip still
So there is the circuit form.So when being provided with MCU, laser-driven chip and limiting amplifier chip three on circuit board solely
Vertical chip, this and the one single chips of three functional unifications is set on circuit board 300, scheme is equivalent.
300 end surface of circuit board has golden finger, and golden finger is made of mutually independent pin one by one, circuit board
It is inserted into the electric connector in cage, connection is connected with the clamping elastic slice in electric connector by golden finger；It can be only in circuit board
A side surface be arranged golden finger, it is contemplated that pin number demand is larger, generally can be respectively provided with gold in lower surface on circuit boards
Finger；Golden finger is used to be electrically connected with host computer foundation, and specific electrical connection can be power supply, ground connection, I2C signal, communication number
It is believed that number etc..
Optical module further includes light emitting secondary module and light-receiving secondary module, and light emitting secondary module and light-receiving secondary module can be with
It is referred to as optical secondary module.As shown in figure 4, optical module provided in an embodiment of the present invention includes that light emitting secondary module 400 and light connect
Secondary module 500 is received, light emitting secondary module 400 is located at the edge of circuit board 300, light emitting secondary module 400 and light-receiving secondary module
500 are arranged in a staggered manner on 300 surface of circuit board, are conducive to realize more preferably effectiveness.
The setting of light emitting secondary module 400 is on 300 surface of circuit board, in another common packaged type, light emitting time
Module and circuit board physical separation are realized by flexible board and are electrically connected；Light-receiving secondary module 500 is arranged on 300 surface of circuit board,
In another common packaged type, light-receiving secondary module and circuit board physical separation are realized by flexible board and are electrically connected.
Light emitting secondary module be located at by upper and lower casing is formed wrap up cavity in, as shown in figure 4, circuit board 300 be provided with it is scarce
Mouth 301, for placing light emitting secondary module；The notch 301 can be set in the centre of circuit board, also can be set in circuit board
Edge；Light emitting secondary module is arranged in the notch 301 of circuit board by way of insertion, protrudes into light emitting convenient for circuit board
It is same to be convenient for for light emitting secondary module being fixed together with circuit board inside secondary module.
Fig. 5 is a kind of optical module structure sectional view provided in an embodiment of the present invention.As shown in Figure 5, the embodiment of the present invention mentions
The optical module of confession includes lower case 202, circuit board 300, light emitting secondary module 400, light-receiving secondary module 500 and fiber-optical socket
510, light emitting secondary module 400 and light-receiving secondary module 500 are located on circuit board 300；Fiber-optical socket 510 by optical fiber 502 with
Light-receiving secondary module 500 connects.
Lower case 202 is used for bearer circuit plate 300 and fiber-optical socket 510, and circuit board 300 carries light emitting secondary module 400
And light-receiving secondary module 500.
Specifically, lower case 202 has card slot 202a, and card slot 206 can be lower shell surface and raise upward to be formed；Light
Fine socket 510 realizes that assembly is fixed with the card slot 202a in lower case 202；
Lower case is divided into two regions by card slot, and circuit board 300 is disposed therein in a region, the lower casing in this region
Body surface face forms pillar with fixing circuit board 300；Light emitting secondary module is fixed together with circuit board 300, passes through fixed circuit
Plate 300 realizes light emitting secondary module and is fixed in lower case；Certainly, light emitting secondary module can also be directly anchored to lower casing
On body, do not need indirectly to be fixed by circuit board 300；
Fiber-optical socket is disposed therein in another region, and external Optical fiber plug is protruded into another one region and inserted with optical fiber
Seat docking.Circuit board 300 and fiber-optical socket are separately fixed in lower case as a result, i.e. light emitting secondary module 400 and fiber-optical socket
510 position is relatively fixed.
The embodiment of the present invention is provided in optical module, and light-receiving secondary module 500 is connect by optical fiber 502 with fiber-optical socket 510,
The light transmitted outside optical module is accessed in light-receiving secondary module 500 by fiber-optical socket 510, optical fiber 502.Fig. 6 is that the present invention is real
The light-receiving sub-module structure schematic diagram of example offer is applied, Fig. 7 is light-receiving secondary module decomposition texture provided in an embodiment of the present invention
Schematic diagram, Fig. 8 are that light-receiving secondary module provided in an embodiment of the present invention decomposes sectional structure chart.As shown in Fig. 6, Fig. 7, Fig. 8, this
The light-receiving secondary module 500 that inventive embodiments provide includes lid 501, optical fiber connector 503, collimation lens 504, Optical Demultiplexing
Component 505, plus lens array 506, light reflection surface 507 and light-receiving chip 508.Multiple light-receiving chips form light-receiving core
Chip arrays.
Optical fiber connector 503, Optical Demultiplexing component 505, plus lens array 506 and light reflection surface 507 are located at electricity
On road plate 300, due to being established between the optical elements such as optical fiber connector 503, Optical Demultiplexing component 505, plus lens array 506
Light connects, the alignment accuracy of optical path directly affects the loss of optical power, and the surface of circuit board 300 does not have higher plane essence
Degree, so the higher substrate of a surface accuracy is placed between the optical elements such as circuit board 300 and optical fiber connector 503, in addition,
Substrate also improves the difference in height between light reflection surface and light-receiving chip array, so that between light reflection surface and circuit board surface
With the space for placing light-receiving chip array, light-receiving chip array is placed on circuit board surface；Certainly, light reflection surface can
There are other designs, substrate auxiliary is not needed, the space for placing light-receiving chip can also be formed together with circuit board；Specifically
Ground, as shown in Fig. 6, Fig. 7, Fig. 8, in the optics such as optical fiber connector 503, Optical Demultiplexing component 505 and plus lens array 506 member
Part and circuit board are provided with ceramic substrate 509 between 300 surface.
The bottom surface of light-receiving chip 508 is mounted on 300 surface of circuit board, the photosurface direction on 508 surface of light-receiving chip
Light reflection surface 507；In one end incoming fiber optic connector 503 that optical fiber 502 passes through optical fiber connector 503, collimation lens 504 passes through
In the other end incoming fiber optic connector 503 of optical fiber connector 503；Optical Demultiplexing component 505 is located at collimation lens 504 and convergence
Between lens array 506, plus lens array 506 is between Optical Demultiplexing component 505 and light reflection surface 507；By prism
Inclined surface forms the light reflection surface 507 in this programme.
The packaged type of light-receiving secondary module 500 and the packaged type of light emitting secondary module are very different, although light
Road is reversible, but light-receiving secondary module 500 is not the simple transformation of light emitting secondary module, but there are different structures to set
Meter.
In addition, the packaged type of scheme provided by the embodiments of the present application and other existing light-receiving secondary modules, such as optical fiber
Array, array waveguide grating AWG etc. are also different, and scheme provided by the embodiments of the present application can reduce the coupling differential loss of optical path, change
The mould spot uniformity of kind hot spot, conducive to the received optical power for improving light-receiving chip.
Specifically, lid 501 is combined with circuit board 300, and then it is saturating to cover in a part of optical fiber connector 503, collimation
Mirror 504, Optical Demultiplexing component 505, plus lens array 506, light reflection surface 507 and light-receiving chip 508.Light-receiving chip is
It is multiple, form light-receiving chip array.Lid 501 has the limited block 501a towards circuit board 300, has on circuit board 300
For the jack 301 of limited block 501a insertion, lid 501 and circuit board are implemented in combination with by limited block 501a and jack 301
300 fixation；
Optical fiber connector 503 establishes the light connects between optical fiber 502 and collimation lens 504, due to the sufficiently flexible fibre of optical fiber 502
Carefully, it can not directly be fixedly connected with collimation lens 504, be connected so using optical fiber in optical module provided in an embodiment of the present invention
Device 503, optical fiber connector 503 can be a kind of tubular body, and optical fiber 502 is protruded into from one end of 503 tube body of optical fiber connector；
In order to be combined with optical fiber 502 and optical fiber connector 503, optical module provided in an embodiment of the present invention uses column collimation lens
504, one end of column is ground into lens form 504a, by the other end of column from the another of 503 tube body of optical fiber connector
One end is protruded into；Being reliably fixed for optical fiber 502 and collimation lens 504 is realized by optical fiber connector 503；Light passes through optical fiber 502
Into in collimation lens 504, projected by one end that collimation lens 504 is ground into lens form, so that a branch of collimated light is formed,
Collimated light can keep lesser light energy to be lost in long range communication process, by the long range of Optical Demultiplexing component 505
Propagation can retain biggish optical power.
Light enters in Optical Demultiplexing component 505 after the injection of collimation lens 504, and the light in optical fiber 502 includes multiple
Light beam can be separated into multi-beam according to the difference of wavelength, pass through Optical Demultiplexing component by wavelength, Optical Demultiplexing component 505
Multiple positions of 505 sides are projected, and multi-beam is formed；
Multi-beam passes through plus lens array 506 respectively and is converged；Plus lens array can be multiple separate lenses and be formed
Array combination, be also possible to the combination of integrated poly-lens；Multiple separate lenses can bring the complexity of coupling technique, still
It may be implemented for the separately adjustable of single lens, conducive to the efficiency for improving coupling；Although integrated poly-lens combination does not have
The advantage of coupling efficiency, but can simplify the complexity of coupling technique；
It has selected integrated poly-lens to combine in scheme provided by the embodiments of the present application, can have been set after the combination of integrated poly-lens
Focusing lens array is set, to make up coupling efficiency.
Multi-beam after the plus lens in plus lens array 506 is converged, is reflected towards light through reflecting surface 507 respectively
Receive chip 508.The direction of propagation that light enters photosurface is different from the direction of propagation of the light in optical fiber 502, thus need using
The direction of propagation of the change light of light reflection surface 507.In concrete scheme provided in an embodiment of the present invention, reflecting surface is triangle body prism
Inclined-plane.
Condenser lens is provided between light reflection surface and light-receiving chip, specifically, as shown in fig. 7, reflecting surface 507 is
The inclined-plane of triangle body prism (is schemed in triangle body prism towards formation focusing lens array on the bottom surface of light-receiving chip array 508
In be not shown), triangle body prism inclined-plane formed light reflection surface；Focusing lens array can be when making triangle body prism one
Body is formed, and independent condenser lens can also be mounted on bottom surface to form array；Focusing lens array can be used for more
Filling mining coupling efficiency caused by convergence lens array detracts.The inclined-plane of triangle body prism is the interface of different medium, is had
The performance of reflected light, while the effect of emergency light reflex can also be increased in inclined-plane plated film.
Specifically, as shown in fig. 7, light-receiving chip 508 is 4, collimation lens 504 is passed to by optical fiber 502 by light
In, it including 4 wavelength in a branch of directional light for be emitted by collimation lens 504, after which enters Optical Demultiplexing component 505,
4 beam light are emitted from Optical Demultiplexing component 505,4 beam light form 4 beam convergence light after passing through plus lens array 506 respectively, and 4 beams converge
Optically focused respectively enters in 4 light-receiving chips 508 after the reflection of light reflection surface 507.
As shown in figure 8, showing the specific structure that optical fiber establishes light connects by optical fiber connector and collimation lens.In light
It include fiber stub 502a and collimation lens 504 in the tube body of fiber connector 503.The optical fiber that fiber stub 502a is wrapped up by ceramics
502 form, and ceramic material is harder, for wrapping up soft optical fiber；Higher machining accuracy, Jin Erke may be implemented in ceramic material
To realize higher 502 alignment accuracy of optical fiber；There are gaps between collimation lens 504 and fiber stub 502a.
Fig. 9 is light-receiving secondary module partial structural diagram provided in an embodiment of the present invention, and Figure 10 is the embodiment of the present invention
The light-receiving secondary module exploded structural schematic diagram of offer, Figure 11 are light-receiving secondary module part provided in an embodiment of the present invention
Enlarged drawing.As shown in Fig. 9, Figure 10, Figure 11,502 one end of optical fiber connects fiber-optical socket 510, and the other end forms fiber stub 502a；
Fiber stub 502a is protruded into from one end of 503 tube body of optical fiber connector, and cylinder collimation lens 504 is from 503 tube body of optical fiber connector
The other end protrude into；
There are gap between fiber stub 502a and collimation lens 504, which become the medium for propagating light by optical fiber 502
For air, become collimation lens 504 again, the variation of this propagation medium is easy to reflect at dielectric interface, causes light
Transmit the loss of energy；In order to reduce reflection, the end face that fiber stub 502a goes out the end face of light and collimation lens 504 enters light is set
It is set to inclined-plane, for light after inclined-plane outgoing, reflected light will not enter optical fiber, but on inclined-plane again to the direction of non-optical fiber
Reflection prevents reflected light to be again introduced into optical fiber, causes optical crosstalk；Furthermore, it is possible to going out on light inclined-plane in fiber stub
Plate extinction film or anti-reflection film.
Figure 12 is fibre-optic connector structure schematic diagram provided in an embodiment of the present invention, as shown in figure 12, the embodiment of the present invention
The bottom surface of the optical fiber connector of offer is plane, and for being placed on 509 surface of substrate, the profile appearance of arc is formed on bottom surface
Face；The inner cavity of optical fiber connector is the aperture of intermediate perforation, and fiber stub 502a and column collimation lens 504 are located at the aperture
In.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (9)
1. a kind of optical module, which is characterized in that including circuit board and be located at the optical fiber of the circuit board surface, optical fiber connection
Device, collimation lens, Optical Demultiplexing component, light reflection surface, light-receiving chip array；
The optical fiber and the collimation lens are located in the optical fiber connector；
The Optical Demultiplexing component is between the light reflection surface and the optical fiber connector；
The light-receiving chip array is between the light reflection surface and the circuit board；
Light beam from the optical fiber is transmitted in the Optical Demultiplexing component by the collimation lens, the Optical Demultiplexing group
The light beam is divided into after multi-beam by part is transmitted to the light reflection surface, and the light reflection surface is by light to the light-receiving chip
Array direction reflection.
2. optical module as described in claim 1, which is characterized in that the optical fiber connector forms fiber stub, and the collimation is saturating
Mirror is cylindrical body, and the inner cavity of the optical fiber connector is the aperture of intermediate perforation, the one end of the fiber stub from the aperture
It protrudes into, the collimation lens is protruded into from the other end in the aperture.
3. optical module as described in claim 1, which is characterized in that further include lid, the lid has limited block, the electricity
Road plate has jack, and the limited block is inserted into the jack, has the light-receiving between the lid and the circuit board
Chip array.
4. optical module as claimed in claim 2, which is characterized in that the end of the fiber stub is inclined-plane；The collimation is saturating
The cylindrical body of mirror is inclined-plane towards one end of the fiber stub, and the other end is lens.
5. optical module as described in claim 1, which is characterized in that it further include the substrate positioned at the circuit board surface, it is described
Optical fiber connector, the Optical Demultiplexing component and the light reflection surface are located at the substrate surface.
6. optical module as described in claim 1, which is characterized in that it further include plus lens array, the plus lens array
Between the Optical Demultiplexing component and the light reflection surface.
7. optical module as claimed in claim 6, which is characterized in that it further include focusing lens array, the focusing lens array
Between the light reflection surface and the light-receiving chip array.
8. optical module as claimed in claim 7, which is characterized in that it further include triangle body prism, the bottom of the triangle body prism
Face has the focusing lens array, and the inclined-plane of the triangle body prism forms the light reflection surface.
9. optical module as claimed in claim 5, which is characterized in that the bottom surface of the optical fiber connector is plane, the bottom surface
On formed arc wheel profile surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910758693.3A CN110488433A (en) | 2019-08-16 | 2019-08-16 | A kind of optical module |
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Cited By (13)
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| CN111239930A (en) * | 2020-03-12 | 2020-06-05 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2020253534A1 (en) * | 2019-06-20 | 2020-12-24 | 福州高意光学有限公司 | Miniaturized wavelength-division-multiplexing optical receiving assembly and assembly method therefor |
| WO2021212849A1 (en) * | 2020-04-21 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021232716A1 (en) * | 2020-05-22 | 2021-11-25 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114200594A (en) * | 2020-09-18 | 2022-03-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114200602A (en) * | 2020-09-18 | 2022-03-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114200601A (en) * | 2020-09-18 | 2022-03-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114200597A (en) * | 2020-09-18 | 2022-03-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2022057100A1 (en) * | 2020-09-18 | 2022-03-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114384644A (en) * | 2020-10-19 | 2022-04-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2022142848A1 (en) * | 2020-12-29 | 2022-07-07 | 华为技术有限公司 | Optical cage assembly, optical module connector, and fabrication method for optical cage assembly |
| CN115004071A (en) * | 2020-03-05 | 2022-09-02 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| CN115004071B (en) * | 2020-03-05 | 2023-08-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN115004071A (en) * | 2020-03-05 | 2022-09-02 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN111239930A (en) * | 2020-03-12 | 2020-06-05 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021212849A1 (en) * | 2020-04-21 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021232716A1 (en) * | 2020-05-22 | 2021-11-25 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2022057100A1 (en) * | 2020-09-18 | 2022-03-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114200597A (en) * | 2020-09-18 | 2022-03-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114200601A (en) * | 2020-09-18 | 2022-03-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114200594B (en) * | 2020-09-18 | 2022-12-13 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114200601B (en) * | 2020-09-18 | 2023-01-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114200602B (en) * | 2020-09-18 | 2023-04-14 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114200602A (en) * | 2020-09-18 | 2022-03-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| CN114384644A (en) * | 2020-10-19 | 2022-04-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2022142848A1 (en) * | 2020-12-29 | 2022-07-07 | 华为技术有限公司 | Optical cage assembly, optical module connector, and fabrication method for optical cage assembly |
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