CN114200602A - Optical module - Google Patents

Optical module Download PDF

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Publication number
CN114200602A
CN114200602A CN202010989984.6A CN202010989984A CN114200602A CN 114200602 A CN114200602 A CN 114200602A CN 202010989984 A CN202010989984 A CN 202010989984A CN 114200602 A CN114200602 A CN 114200602A
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CN
China
Prior art keywords
light receiving
prism
light
optical
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010989984.6A
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Chinese (zh)
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CN114200602B (en
Inventor
刘学儒
张洪浩
唐毅
王斌
叶书华
傅钦豪
谢一帆
张加傲
黄绪杰
董本正
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Hisense Broadband Multimedia Technology Co Ltd
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Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Priority to CN202010989984.6A priority Critical patent/CN114200602B/en
Priority to PCT/CN2020/134054 priority patent/WO2022057100A1/en
Publication of CN114200602A publication Critical patent/CN114200602A/en
Priority to US18/122,534 priority patent/US20230228955A1/en
Application granted granted Critical
Publication of CN114200602B publication Critical patent/CN114200602B/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device

Abstract

The application provides an optical module, including: a circuit board; the light receiving secondary module is electrically connected with the circuit board and is used for converting the received signal light into a current signal; the optical receive sub-module includes: the light receiving cavity comprises a bottom plate and a light source, wherein the bottom plate is used for bearing a setting device; the device comprises a reflecting prism and a light receiving assembly, wherein the light receiving assembly comprises a plurality of light receiving chips, and the reflecting prism is covered on the light receiving chips of the light receiving assembly and used for reflecting signal light to the light receiving chips of the light receiving assembly. The application provides an optical module changes the transmission direction of this signal light through reflection prism, makes things convenient for the light receiving chip to receive signal light.

Description

Optical module
Technical Field
The application relates to the technical field of optical fiber communication, in particular to an optical module.
Background
With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.
Generally, to increase the transmission rate of an optical module, increasing the transmission channel in the optical module may be used, such as modifying the conventional optical module including one set of tosa (emitting light of one wavelength) and one set of rosa (receiving light of one wavelength) to include two sets of tosa (each set emitting light of one wavelength) and two sets of rosa (each set receiving light of one wavelength). Therefore, the occupied volumes of the optical transmitting sub-module and the optical receiving sub-module in the optical module are increased continuously, and further the further development of the optical module is not facilitated.
Disclosure of Invention
The embodiment of the application provides an optical module, which is convenient for an optical receiving chip to correspondingly receive optical signals.
In a first aspect, the present application provides an optical module, including:
a circuit board;
the light receiving secondary module is electrically connected with the circuit board and is used for converting the received signal light into a current signal;
the optical receive sub-module includes:
the light receiving cavity comprises a bottom plate and a light source, wherein the bottom plate is used for bearing a setting device;
the device comprises a reflecting prism and a light receiving assembly, wherein the light receiving assembly comprises a plurality of light receiving chips, and the reflecting prism is covered on the light receiving chips of the light receiving assembly and used for reflecting signal light to the light receiving chips of the light receiving assembly.
In a second aspect, the present application provides an optical module, including:
the light receiving secondary module is electrically connected with the circuit board and is used for converting the received signal light into a current signal;
the optical receive sub-module includes:
the light receiving cavity comprises a bottom plate and a light source, wherein the bottom plate is used for bearing a setting device;
the device comprises a first reflecting prism, a second reflecting prism, a first light receiving assembly and a second light receiving assembly; the first light receiving assembly comprises a plurality of light receiving chips, and the second light receiving assembly comprises a plurality of light receiving chips;
the first reflection prism is covered on the light receiving chip of the first light receiving component and used for reflecting signal light to the light receiving chip of the first light receiving component;
the second reflection prism is covered on the light receiving chip of the second light receiving component and reflects the signal light to the light receiving chip of the second light receiving component.
In the optical module that this application provided, light receiving submodule includes the light receiving cavity, sets up reflection prism and light receiving component on the bottom plate of light receiving cavity, including the light receiving chip in the light receiving component, and the reflection prism cover is established on the light receiving chip for treat the signal light reflection of receiving to the light receiving chip with the light receiving chip. In this application, the optical axis of the signal light transmitted to the reflection prism is generally parallel to the photosensitive surface of the light receiving chip, and the transmission direction of the signal light is changed through the reflection prism, so that the light receiving chip can receive the signal light conveniently.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;
FIG. 2 is a schematic diagram of an optical network unit;
fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present application;
fig. 5 is a cross-sectional view of an optical module according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a separation structure of an tosa and an rosa according to an embodiment of the present disclosure;
fig. 7 is a schematic diagram of a DeMUX operation according to an embodiment of the present application;
fig. 8 is a schematic structural diagram of a hidden cover plate in a rosa according to an embodiment of the present disclosure;
FIG. 9 is a partial exploded view at A in FIG. 8;
fig. 10 is a top view of a cover plate in a rosa according to an embodiment of the present disclosure;
FIG. 11 is a transmission optical path diagram of a first lens assembly according to an embodiment of the present disclosure;
fig. 12 is a cross-sectional view of a rosa at a light receiving cavity according to an embodiment of the present disclosure;
fig. 13 is a partially exploded view of an rosa according to an embodiment of the present disclosure;
fig. 14 is a first cross-sectional view of another rosa at a light receiving cavity according to an embodiment of the present disclosure;
fig. 15 is a cross-sectional view of another rosa at a light receiving cavity according to an embodiment of the present disclosure;
fig. 16 is a first schematic structural diagram of a light receiving cavity according to an embodiment of the present disclosure;
fig. 17 is a second schematic structural view of a light receiving cavity according to an embodiment of the present disclosure;
fig. 18 is an assembled use state diagram of a light receiving cavity provided in an embodiment of the present application;
fig. 19 is a sectional view showing an assembled use state of a light receiving cavity according to an embodiment of the present application;
fig. 20 is a sectional view of a light receiving cavity provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.
The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.
Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;
one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.
An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.
The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.
At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.
Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.
Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.
The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.
The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.
Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in an embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, a tosa 400, and a rosa 500.
The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.
The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect with the optical transceiver 400 inside the optical module; the photoelectric devices such as the circuit board 300 and the optical transceiver 400 are positioned in the packaging cavity.
The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the optical transceiver 400 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the optical module; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.
The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.
The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.
The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).
The circuit board connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the functions of power supply, electrical signal transmission, grounding and the like.
The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driver chip and an MCU chip are integrated into one chip, or a laser driver chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is an integrated circuit, but the functions of the circuits do not disappear due to the integration, and only the circuit appears and changes, and the chip still has the circuit form. Therefore, when the circuit board is provided with three independent chips, namely, the MCU, the laser driver chip and the limiting amplifier chip, the scheme is equivalent to that when the circuit board 300 is provided with a single chip with three functions in one.
The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.
A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.
The tosa and the rosa may be collectively referred to as an optical subassembly. As shown in fig. 4, the optical module provided in the embodiment of the present application includes a tosa 400 and a rosa 500, wherein the tosa 400 and the rosa 500 are located at the edge of the circuit board 300, and the tosa 400 and the rosa 500 are stacked up and down. Optionally, the tosa 400 is closer to the upper housing 201 than the tosa 500, but not limited thereto, and the tosa 500 may be closer to the upper housing 201 than the tosa 400.
Alternatively, the tosa 400 and the rosa 500 are physically separated from the circuit board 300 and connected to the circuit board 300 through a flexible circuit board or an electrical connector.
When the tosa 400 is closer to the upper housing 201 than the rosa 500, the tosa 400 and the rosa 500 are disposed in the upper and lower housing forming package cavities. The lower case 202 may support the rosa 500; optionally, the lower housing 202 supports the rosa 500 through a spacer, and the rosa 500 supports the rosa 400.
Fig. 5 is a cross-sectional view of an optical module according to an embodiment of the present disclosure. As shown in fig. 5, an optical module provided in the embodiment of the present application includes a lower housing 202, a circuit board 300, a tosa 400, and a rosa 500. The end of the tosa 400 far away from the circuit board 300 is provided with a first fiber adapter 410, and the first fiber adapter 410 is used for transmitting the signal light generated by the tosa 400 to the outside of the optical module; the optical sub-assembly 500 is provided with a second optical fiber adapter 510 at an end portion away from the circuit board 300, and the second optical fiber adapter 510 is used for transmitting signal light from the outside of the optical module to the inside of the optical sub-assembly 500. The circuit board 300 is electrically connected to the tosa 400 and the rosa 500 through corresponding flexible circuit boards, respectively.
The size of the whole appearance of the optical module is in accordance with the size of an interface of an upper computer and is limited by industry standards, and the tosa 400 and the tosa 500 have large volumes and cannot be arranged on a circuit board, so the tosa is arranged in a manner of being separated from the circuit board, and the electrical connection transfer is realized through a flexible circuit board. As shown in fig. 5, the first fiber optic adapter 410 and the second fiber optic adapter 510 are at the same height as compared to the bottom surface of the lower housing 202. The first fiber adapter 410 and the second fiber adapter 510 are respectively used for connecting with fiber connectors outside the optical module; the optical fiber connector outside the optical module is a standard component commonly used in the industry, and the shape and size of the external optical fiber connector limit the positions of the two optical fiber adapters inside the optical module, so that the first optical fiber adapter 410 and the second optical fiber adapter 510 are arranged on the same height in the product.
Fig. 6 is a schematic structural diagram illustrating a separation structure of an tosa and an rosa according to an embodiment of the present disclosure. As shown in fig. 6, in the embodiment of the present application, the tosa 400 and the rosa 500 are stacked; the light receiving sub-assembly 500 provided by the embodiment of the present application further includes a light receiving cavity 520 and a light receiving cover plate 520a, and the light receiving cover plate 520a covers the light receiving cavity 520 from above. The light receiving cavity 520 is provided therein with devices related to light reception, such as a lens, a light receiving chip, and a transimpedance amplifier. One end of the light receiving cavity 520 is connected to the second optical fiber adapter 510, and receives signal light from the outside of the optical module through the second optical fiber adapter 510, and transmits the received signal light to the light receiving chip through optical devices such as a lens arranged in the light receiving cavity 520; an opening 521 is provided on the side wall of the other end of the light receiving cavity 520 for insertion of the flexible circuit board 310. One end of the flexible circuit is inserted into and fixed in the light receiving cavity 520 and electrically connected to the light receiving chip, the transimpedance amplifier, and other electrical devices, and the other end of the flexible circuit is used for electrically connecting to the circuit board 300. The light receiving cavity 520 and the light receiving cover plate 520a may be made of metal material, such as die-cast or milled metal.
An opening 521 is formed in the side wall of the other end of the light receiving cavity 520, and an electrical connector, such as a metallization circuit formed by a multi-layer substrate, may be disposed at the opening; the flexible circuit board is connected with the electrical connector to electrically connect the circuit board with the rosa 500.
In the optical module provided in the embodiment of the present application, the light receiving sub-module 500 is configured to receive signal lights with multiple different wavelengths, the signal lights with different wavelengths are transmitted into the light receiving cavity 520 through the second optical fiber adapter 510, the beam splitting according to the wavelengths is realized through reflection and refraction of optical devices such as different lenses in the light receiving cavity 520, the signal lights split according to the wavelengths are finally transmitted to the photosensitive surface of the light receiving chip, and the light receiving chip receives the signal lights through the photosensitive surface thereof. Generally, one optical receiving chip is used for receiving signal light of one wavelength, and the optical receiving sub-module 500 provided in the embodiment of the present application includes a plurality of optical receiving chips. For example, when the optical receive sub-module 500 is configured to receive signal lights with 4 different wavelengths, the optical receive sub-module 500 includes 4 optical receive chips for correspondingly receiving the signal lights with 4 wavelengths; when the optical receive sub-module 500 is configured to receive the signal light with 8 different wavelengths, the optical receive sub-module 500 includes 8 optical receive chips for correspondingly receiving the signal light with 8 wavelengths.
In the optical receive sub-module provided in the embodiment of the present application, the optical receive cavity 520 includes optical devices such as a first lens group and a wavelength division multiplexing (DeMUX); the number of DeMUX is usually not unique, and a demultiplexer component group is adopted, for example, a demultiplexer component comprises two DeMUX. The first lens group includes a plurality of lenses, and the signal light transmitted from the second fiber adapter 510 into the light receiving cavity 520 is split according to the wavelength band for the first time, for example, split into two according to the wavelength band. In the embodiments of the present application, the wavelength band typically includes a plurality of wavelengths; as the optical receiving sub-module 500 is used for receiving eight different wavelengths of signal light, λ 1, λ 2, λ 3, λ 4, λ 5, λ 6, λ 7 and λ 8; wherein, the wavelengths of λ 1, λ 2, λ 3 and λ 4 are relatively close and located in the same band (marked as a first band), and the wavelengths of λ 5, λ 6, λ 7 and λ 8 are relatively close and located in the same band (marked as a second band); then the lenses in the first lens assembly cooperate with each other to split the signal light into two beams, i.e., the lenses in the first lens assembly 530 cooperate with each other to split the signal light belonging to the first wavelength band into the first beam of signal light and the signal light belonging to the second wavelength band into the second beam of signal light. Of course, the first lens assembly provided in the embodiment of the present application may also divide the signal light into three beams according to the wavelength band, and the like. The signal light split according to the wave band by the first lens group is correspondingly transmitted to the corresponding DeMUX, the DeMUX carries out secondary beam splitting on the split signal light according to the wavelength, and finally the signal light split according to the wavelength is transmitted to the corresponding light receiving chip.
Fig. 7 is a schematic diagram of a DeMUX operation for splitting a beam including 4 wavelengths (β 1, β 2, β 3, and β 4) according to an embodiment of the present application; the right side of the DeMUX comprises a light inlet used for inputting signal light with various wavelengths, the left side of the DeMUX comprises a plurality of light outlets used for emitting light, and each light outlet is used for emitting signal light with one wavelength. As shown in fig. 7, the signal light enters the DeMUX through the incident light port of the DeMUX, and the β 1 signal light reaches the light exit port of the DeMUX after six different reflections at six different positions of the DeMUX; the beta 2 signal light is reflected for four times to reach the light outlet of the DeMUX at four different positions; the beta 3 signal light is reflected twice differently through two different positions of the DeMUX and reaches the light outlet of the DeMUX; the beta 4 signal light is directly transmitted to the light outlet after being incident to the DeMUX. Therefore, signal light with different wavelengths enters the DeMUX through the same light inlet and is output through different light outlets, and beam splitting of the signal light with different wavelengths is achieved. In the embodiment of the present application, the DeMUX is not limited to use with beam splitting including 4 wavelength beams, and can be selected according to actual needs.
The following describes in detail the optical receive sub-module provided in the embodiment of the present application with reference to a specific example, in this embodiment, the optical receive sub-module is configured to receive signal lights with 8 different wavelengths, where the wavelengths include λ 1, λ 2, λ 3, λ 4, λ 5, λ 6, λ 7, and λ 8.
Fig. 8 is a schematic structural diagram of a cover plate hidden in a rosa according to an embodiment of the present disclosure. As shown in fig. 8, a first through hole 522 is further provided at one end of the light receiving cavity 520, and the first through hole 522 is used for communicating the second fiber adapter 510 and the light receiving cavity 520. As shown in fig. 8, a first lens assembly 530, a first DeMUX540, a second DeMUX550, a first light receiving assembly 580, and a second light receiving assembly 590 are disposed within the light receiving cavity 520. Taking the example of receiving 8 wavelengths of light comprising two bands, a single band comprises 4 wavelengths of light, where: the first lens assembly 530 performs a first beam splitting according to the wavelength band of the signal light, that is, splits into two beams (a first beam of signal light and a second beam of signal light) according to the wavelength band of the signal light; the first signal light is transmitted to the first DeMUX540, and the first signal light is divided into a first four-path signal light by the first DeMUX 540; the second beam of signal light is transmitted to the second DeMUX550, and is divided into a second four-path signal light by the first DeMUX 540; the first four signal lights are transmitted to the first light receiving element 580, and the second four signal lights are transmitted to the second light receiving element 590.
In the embodiment of the present application, the first light receiving element 580 and the second light receiving element 590 are respectively a plurality of light receiving chips, and the light receiving chips are PDs (photo detectors), such as APDs (avalanche photo diodes), PIN-PDs (photo diodes), and the like, and are used for converting received signal light into photocurrent. Optionally, the light receiving chips in the first light receiving element 580 and the second light receiving element 590 are respectively disposed on the surface of the metallized ceramic, the surface of the metallized ceramic forms a circuit pattern which can supply power to the light receiving chips, and then the metallized ceramic provided with the light receiving chips is attached to the flexible circuit board 310; alternatively, the light receiving chip is directly attached to the flexible circuit board 310. Further, the first light receiving element 580 and the second light receiving element 590 respectively include a transimpedance amplifier, which is attached to the flexible circuit board 310, and is connected to the corresponding light receiving chip, and receives the current signal generated by the light receiving chip and converts the received current signal into a voltage signal. The transimpedance amplifier may also be disposed on an electrical connector within the light receiving cavity 520. Alternatively, the transimpedance amplifier is Wire-bonded to the corresponding light receiving chip, for example, by a Gold Wire Bonding (Gold Wire Bonding).
Fig. 9 is a partially exploded view at a in fig. 8. As shown in fig. 9, the first light receiving element 580 includes a first ceramic substrate 581 and a first transimpedance amplifier 582, the first transimpedance amplifier 582 being disposed on one side of the first ceramic substrate 581; wherein, 4 light receiving chips 583 are disposed on the first ceramic substrate 581, and the first ceramic substrate 581 facilitates the installation and installation of the light receiving chips 583. The first ceramic substrate 581 is wire-bonded to the first transimpedance amplifier 582 to connect the light-receiving chip 583 and the first transimpedance amplifier 582. However, when the length of the wire bonding is longer, the inductance generated by the wire bonding is larger, the signal mismatching is also larger, and the signal output by the light receiving chip 583 is a small signal, which may cause the signal quality to be reduced. Therefore, the light receiving chip 583 and the first transimpedance amplifier 582 are as close as possible, the wire bonding length is reduced, the signal transmission quality is ensured, and the first transimpedance amplifier 582 is arranged on one side of the first ceramic substrate 581, so that the first ceramic substrate 581 and the first transimpedance amplifier 582 are close to each other as far as possible. Further, the first ceramic substrate 581 is also used for padding the light receiving chip 583, so that the electrode of the light receiving chip 583 and the pin of the first transimpedance amplifier 582 are on the same plane, and the shortest routing between the light receiving chip 583 and the first transimpedance amplifier 582 is ensured.
Accordingly, as shown in fig. 9, the second light receiving element 590 includes a second ceramic substrate 591 and a second transimpedance amplifier 592, the second transimpedance amplifier 592 being disposed on one side of the second ceramic substrate 591; the second ceramic substrate 591 is provided with 4 light receiving chips 593, and the second ceramic substrate 591 facilitates the installation of the light receiving chips 593. The second ceramic substrate 591 is wire-bonded to the second transimpedance amplifier 592 to realize the connection between the light receiving chip 593 and the second transimpedance amplifier 592. The second ceramic substrate 591 is similar to the first ceramic substrate 581, and is close to the second transimpedance amplifier 592 as much as possible, so that the wire bonding length is reduced; meanwhile, the second ceramic substrate 591 also heightens the light receiving chip 593, so that the electrode of the light receiving chip 593 and the pin on the second transimpedance amplifier 592 are on the same plane, and the shortest routing between the light receiving chip 593 and the second transimpedance amplifier 592 is ensured.
In the embodiment of the present application, the first transimpedance amplifier 582 and the second transimpedance amplifier 592 can be implemented by one transimpedance amplifier chip if the pins of the transimpedance amplifiers are sufficient. Further, 4 light receiving chips 583 and 4 light receiving chips 593 may be provided on one ceramic substrate.
In the present embodiment, a second lens assembly 560 and a third lens assembly 570 are further disposed within the light receiving cavity 520; the second lens assembly 560 is used for adjusting the optical path of the first four-way signal light transmitted to the first light receiving assembly 580, and the third lens assembly 570 is used for adjusting the optical path of the second four-way signal light transmitted to the second light receiving assembly 590.
Generally, the optical axes of the first four signal lights and the second four signal lights are parallel to the bottom surface of the light receiving cavity 520, and the photosensitive surfaces of the light receiving chip 583 and the light receiving chip 593 are also parallel to the bottom surface of the light receiving cavity 520, so that in order to ensure that the light receiving chip 583 and the light receiving chip 593 normally receive the signal lights, as shown in fig. 9, the second lens assembly 560 includes a first reflection prism 561, and the third lens assembly 570 includes a second reflection prism 571. The first reflecting prism 561 is disposed above the first ceramic substrate 581, 4 light receiving chips 583 are disposed on the first ceramic substrate 581 to cover the first ceramic substrate 581, and the optical axis direction of the first four signal lights is changed by the reflecting surface of the first reflecting prism 561, so that the optical axis of the first four signal lights is changed from being parallel to the bottom surface of the light receiving cavity 520 to being perpendicular to the bottom surface of the light receiving cavity 520, and then the first four signal lights are vertically incident on the photosensitive surface of the corresponding light receiving chip 583. Accordingly, the second reflection prism 571 is disposed above the second ceramic substrate 591, 4 light receiving chips 593 are disposed on the second ceramic substrate 591, the optical axis direction of the second four signal lights is changed by the reflection surface of the second reflection prism 571, the optical axis of the second four signal lights is changed from being parallel to the bottom surface of the light receiving cavity 520 to being perpendicular to the bottom surface of the light receiving cavity 520, and the second four signal lights are vertically incident on the photosensitive surface of the corresponding light receiving chip 593.
In the embodiment of the present application, the first reflection prism 561 and the second reflection prism 571 are both 45 ° reflection prisms, that is, the first reflection prism 561 and the second reflection prism 571 each include a 45 ° reflection surface; a 45 ° reflection surface of the first reflection prism 561 covers the first ceramic substrate 581 on which the 4 light receiving chips 583 are disposed, and a 45 ° reflection surface of the second reflection prism 571 covers the second ceramic substrate 591 on which the 4 light receiving chips 593 are disposed.
The first lens component 530 includes a plurality of lenses arranged and combined, and the signal light is divided into a first beam of signal light and a second beam of signal light according to λ 1, λ 2, λ 3 and λ 4 and λ 5, λ 6, λ 7 and λ 8 by the cooperation of the lenses. Optionally, the first lens assembly 530 includes 4 lenses arranged in sequence, and the surfaces of the lenses are coated with films, so as to implement reflection or refraction of signal light in each wavelength band, thereby achieving beam splitting of the signal light according to the wavelength band.
Fig. 10 is a top view of a cover plate in a rosa according to an embodiment of the present disclosure. As shown in fig. 10, the first lens assembly 530 includes a first lens 531, a second lens 532, a third lens 533 and a fourth lens 534 arranged in this order. Fig. 11 is a transmission diagram of a transmission optical path of a first lens assembly according to an embodiment of the present application. With reference to fig. 10 and 11, the wavelengths of the signal light transmitted into the light receiving cavity 520 through the second fiber optic adapter 510 include λ 1, λ 2, λ 3, λ 4, λ 5, λ 6, λ 7 and λ 8, with reference to fig. 10 and 11, the signal light of eight wavelengths is transmitted to the second surface of the first lens 531, the signal light is totally reflected at the surface of the first lens 531, and the first lens 531 changes the transmission direction of the signal light.
The signal light changed in direction by the first lens 531 is transmitted to the second lens 532 and enters the second lens 532, and the signal light entering the second lens 532 is refracted once in sequence on the first surface of the second lens 532 and the second surface of the second lens 532, respectively.
The light beam refracted by the second lens 532 is transmitted to the first surface of the third lens 533, and the signal light of the first wavelength band in the signal light is reflected by the first surface of the third lens 533 to split the first signal light; the signal light of the second wavelength band is incident on the third lens 533 and is refracted at the first surface of the third lens 533, and the second beam of signal light is split.
The first beam of signal light reflected by the first surface of the third lens 533 is retransmitted to the second surface of the second lens 532, and is reflected by the second surface of the second lens 532 to the light inlet of the first DeMUX 540.
The second beam of signal light refracted through the first surface of the third lens 533 is incident into the third lens 533 and refracted out of the third lens 533 through the third lens 533 at the second surface of the third lens 533; the second signal light refracted out of the third lens 533 is transmitted to the fourth lens 534, and then reflected to the light inlet of the second DeMUX550 by the first surface of the fourth lens 534.
Wherein the first surface and the second surface of the lens are only used for distinguishing the main working surfaces on both sides of the lens, in the orientation presented in the embodiment of fig. 10, the surface close to/facing downwards in the lens is the first surface, and the surface close to/facing upwards opposite to the first surface is the second surface.
In the embodiment of the present application, in the orientation shown in fig. 10 in the embodiment of the present application, the signal light is generally incident into the light receiving cavity 520 along the left and right length directions of the light receiving cavity 520, and in order to control the length of the light receiving cavity 520 and thus accomplish the first beam splitting of the signal light in a smaller length space of the light receiving cavity 520, the first lens 531 is mainly used to change the transmission direction of the signal light incident into the light receiving cavity 520, and change the transmission direction of the signal light from the length direction along the light receiving cavity 520 to the width direction along the top and bottom of the light receiving cavity 520; the second lens 532 is used for transmitting the signal light of the first waveband in the forward direction, transmitting the signal light of the second waveband in the second direction and reflecting the signal light of the first waveband in the reverse direction; the third lens 533 is configured to reflect the signal light of the first wavelength band in the forward direction and transmit the signal light of the second wavelength band in the forward direction; the fourth lens 533 serves to reflect the signal light of the second wavelength band in the forward direction. The first lens assembly 530 according to this embodiment of the present application, in combination with the first lens 531, the second lens 532, the third lens 533 and the fourth lens 534, implements the first beam splitting according to the wavelength band of the signal light, and transmits the split signal light to the corresponding DeMUX along the length direction of the light receiving cavity 520.
Optionally: an angle between a normal of the second surface of the first lens 531 and a transmission direction (direction is denoted as r) incident to the light receiving cavity 520 is 45 °, an angle between a normal of the second surface of the first lens 531 and a normal of the first surface of the second lens 532 is 90 °, that is, an angle between a normal of the first plane of the second lens 532 and r is 135 °; the angle between the normal of the second surface of the first lens 531 and the normal of the first surface of the third lens 533 is 37 °, that is, the angle between the normal of the first surface of the third lens 533 and r is 82 °; the normal to the second surface of first lens 531 makes an angle of 180 with the normal to the first plane of fourth lens 534, i.e., the normal to the first surface of fourth lens 534 makes an angle of 45. Meanwhile, by selectively controlling the coating film on the second plane of the second lens 532 and the coating film on the first surface of the third lens 533, the beam splitting of the first waveband signal light and the second waveband signal light in the signal is realized.
In the embodiment of the present application, the first lens group 530 can also be other lens combinations, such as three lenses, for example, a first lens 531 and a fourth lens 534 in fig. 10, wherein a transflective lens is disposed between the first lens 531 and the fourth lens 534; the first surface of the transflective mirror reflects the signal light of the first waveband and transmits the signal light of the second waveband, and the second surface of the transflective mirror transmits the signal light of the second waveband; and the input signal light is split according to the wave band by combining the first lens 531, the transflective lens and the fourth lens 534.
In the embodiment of the present application, as shown in fig. 10, the second lens assembly 560 further includes 4 focusing lenses 562, each focusing lens 562 is correspondingly disposed in an output optical path of the first DeMUX540, and is correspondingly used for focusing the signal light in the corresponding optical path to the first reflection prism 561.
Further, as shown in fig. 10, the third lens assembly 570 further includes 4 focusing lenses 572, each focusing lens 572 is correspondingly disposed in an output optical path of the second DeMUX550, and is correspondingly configured to focus the signal light in the corresponding optical path to the second reflection prism 571.
Fig. 12 is a cross-sectional view of a rosa at a light receiving cavity according to an embodiment of the present disclosure. As shown in fig. 12, the signal light of the first wavelength band transmitted to the first DeMUX540 is transmitted to the corresponding focusing lens 562 through the first DeMUX540 according to the split wavelength, is focused by the focusing lens 562 and is transmitted to the first reflecting prism 561, when the split signal light is transmitted to the reflecting surface of the first reflecting prism 561, the reflection and transmission direction of the reflecting surface of the first reflecting prism 561 is changed from the direction parallel to the length direction of the light receiving cavity to the direction perpendicular to the length direction of the light receiving cavity, and then is transmitted to the corresponding light receiving chip on the first ceramic substrate 581 below the reflecting surface of the first reflecting prism 561.
Further, as shown in fig. 12, a planar light window 523 is provided in the first through hole 522, and the planar light window 523 is obliquely provided in the first through hole 522. The signal light transmitted to the first through hole 522 through the second fiber adapter is transmitted through the planar light window 523, and is transmitted to the second surface of the first lens 531 through the planar light window 523; however, when the signal light is transmitted to the second surface of the first lens 531, there may be a portion of the signal light that is transmitted through the second surface of the first lens 531 and transmitted to the first surface of the first lens 531, and then the portion of the signal light is reflected by the first surface of the first lens 531 and refracted by the second surface of the first lens 531 and transmitted to the first through hole 522 again, and the inclined planar light window 523 effectively prevents the signal light transmitted to the first through hole 522 again from polluting the signal light transmitted to the first through hole 522 through the second fiber adapter. In order to avoid the excessive displacement of the signal light caused by the planar light window 523, the tilt angle of the planar light window 523 should not be in the aisle. Optionally, the inclination angle of the planar light window 523 is 4 to 6 °, that is, the included angle between the optical axis of the planar light window 523 and the central axis of the first through hole 522 is 4 to 6 °; therefore, the purpose of shielding the signal light transmitted to the first through hole 522 again can be achieved, and excessive deviation of the signal light transmitted to the first through hole 522 by the second optical fiber adapter can be effectively avoided. Meanwhile, the planar light window 523 may also be used for sealing the first through hole 522, which facilitates to some extent the sealing of the light receiving cavity 520.
In the optical module provided in the embodiment of the present application, the optical receive sub-module 500 is connected to an external optical fiber through the second optical fiber adapter 510, signal light transmitted in the external optical fiber of the optical module is transmitted to the optical receive cavity 520 through the second optical fiber adapter 510, the optical receive cavity 520 receives the signal light transmitted by the second optical fiber adapter 510 and sequentially performs first beam splitting according to a wavelength band and second beam splitting according to a wavelength through the first lens group 530 and the wavelength division multiplexing component group arranged therein, and the signal light after the two beam splitting is transmitted to the optical receive chip and converted into a current signal through the optical receive chip; furthermore, the optical module provided by the application can receive signal light with multiple wavelengths transmitted in an external optical fiber. The optical module provided by the application is convenient for realizing simultaneous transmission of a plurality of wavelength signal lights in a single optical fiber, and further development of the optical module and an optical communication technology is promoted.
In order to meet the optical module specification requirement, the first fiber adapter 410 and the second fiber adapter 510 are located at the same height, and in the embodiment of the present application, the tosa 400 and the rosa 500 are stacked up and down, so that the transmission height of the signal light transmitted by the second fiber adapter 510 or the height of the signal light output by the tosa 400 to the first fiber adapter 410 needs to be adjusted. Optionally, as shown in fig. 8, the rosa 500 further includes a displacement component 524, and the displacement component 524 includes a displacement prism, and the displacement prism is used for adjusting the height of the optical path of the signal light transmitted through the second fiber adapter 510. In fig. 8, the optical path of the signal light transmitted by the second optical fiber adapter 510 is higher than the preset optical path in the light receiving cavity 520, and the optical path of the signal light transmitted by the second optical fiber adapter 510 is lowered by the shift prism, so that the signal light can be transmitted from the second optical fiber adapter 510 located at a relatively higher position to the light receiving cavity 520 located at a relatively lower position.
Fig. 13 is a partially exploded view of an rosa according to an embodiment of the present disclosure. In some embodiments, as shown in fig. 13, displacement assembly 524 includes a displacement prism 524 a; the shift prism 524a transfers the signal light transmitted at one height to another height by two or more reflections. In an alternative embodiment, the shift prism 524a is a shift prism that includes two 45 ° reflective surfaces, and the signal light transmitted at a relatively high height is transferred to a lower height by two reflections.
In some embodiments of the present application, the displacement assembly 524 further includes a prism cavity 524b and a prism cover plate 524c, the prism cavity 524b is used to facilitate the installation and fixation of the displacement prism 524a and the connection between the second optical fiber adapter 510 and the light receiving cavity 520, and the prism cover plate 524c covers the prism cavity 524 d. In this embodiment, a prism accommodating cavity 524d is disposed inside the prism cavity 524b, and the prism accommodating cavity 524d communicates the second fiber adapter 510 and the first through hole 522; the displacement prism 524a is disposed in the prism accommodating cavity 524d, the prism cover 524c covers the prism accommodating cavity 524d, and the displacement prism 524a is fixed in the prism accommodating cavity 524d in a limited manner, so that the prism accommodating cavity 524d is convenient for improving the installation accuracy of the displacement prism 524 a. Optionally, a support step is arranged in the prism accommodating cavity 524d, so that the limit displacement prism 524a can be supported by the support step; a cover plate slot is further disposed in the prism receiving cavity 524d for facilitating fixing the prism cover plate 524c on the prism cavity 524 b. The prism cover 524c may be fixedly coupled to the prism cavity 524b by glue.
In order to facilitate the connection between the displacement assembly 524 and the light receiving cavity 520, a displacement assembly connector 525 is disposed on the light receiving cavity 520, and the displacement assembly connector 525 is connected with the displacement assembly 524 in a clamping manner. In some embodiments, displacement assembly connector 525 comprises a first connector plate 525a and a second connector plate 525b, wherein an inner side of first connector plate 525a and an inner side of second connector plate 525b are adapted to engage an outer wall of prism cavity 524b, respectively, thereby snap-fixedly positioning prism cavity 524b between first connector plate 525a and second connector plate 525 b. Here, the first connecting plate 525a and the second connecting plate 525b may be two ridge structures formed on the outer wall of the light receiving cavity 520, and are generally integrally formed with the light receiving cavity 520. In order to secure the shear strength of the first connecting plate 525a or the second connecting plate 525b, the side edges of the first connecting plate 525a or the second connecting plate 525b may be provided with a support structure, by which the support area of the first connecting plate 525a or the second connecting plate 525b with the outer wall of the light receiving cavity 520 is increased.
Fig. 14 is a first cross-sectional view of another rosa at a light receiving cavity according to an embodiment of the present disclosure. In some embodiments, as shown in fig. 14, the end of the second fiber adapter 510 is provided with an adapter connection 511, and the prism cavity 524b is provided with an adapter connection hole 524e, the adapter connection hole 524e communicating with the prism accommodation cavity 524 d; the adapter connection portion 511 is fitted in the adapter connection hole 524 e. Further, the output end of the second fiber optic adapter 510 is further provided with a lens 512, and the lens 512 is used for collimating the signal light output through the second fiber optic adapter 510.
As shown in fig. 14, the displacement prism 524a is disposed in the prism housing 524d, the prism cover 524c is sealed to the upper portion of the edge of the prism housing 524d, a second through hole 524f is formed in the lower portion of the edge of the prism housing 524d, and the second through hole 524f communicates with the first through hole 522. Assuming that the signal light transmitted to the second fiber adapter 510 from the outside of the optical module is horizontal light, the signal light with the horizontal optical axis is transmitted along the central axis of the second fiber adapter 510, as shown in fig. 14, which shows the transmission path of the signal light. As shown in fig. 14, the signal light with the horizontal optical axis is transmitted to the lens 512 of the second fiber adapter 510, collimated by the lens 512, and transmitted to the first reflection surface of the shift prism 524 a; the first reflection occurs at the first reflection surface of the shift prism 524a, and the optical axis of the signal light is converted from horizontal to vertical; the signal light with the vertical optical axis is transmitted to the second reflecting surface of the displacement prism 524a, the second reflection occurs on the second reflecting surface of the displacement prism 524a, and the optical axis of the signal light is converted from vertical to horizontal; the optical axis horizontal signal light is transmitted to the first through hole 522 through the second through hole 524f again, and the light-transmitting plane optical window 523 is transmitted into the light receiving cavity 520. Furthermore, in the embodiment of the present application, the displacement prism 524a is used to ensure the optical axis direction of the signal light, and at the same time, the height of the optical axis of the signal light is adjusted, so as to facilitate the implementation of the vertical stacking structure of the tosa 400 and the tosa 500.
Fig. 15 is a cross-sectional view of another rosa at a light receiving cavity according to an embodiment of the present disclosure. As shown in fig. 15, a support projection 524e-1 is provided in the adapter coupling hole 524e, and the support projection 524e-1 is used to support an end surface of the contact adapter coupling portion 511; the support protrusion 524e-1 forms a coupling groove 524e-2 with a sidewall of the adapter coupling hole 524 e. On one hand, the connecting groove 524e-2 is provided to facilitate the machining and forming of the supporting protrusion 524e-1, such as facilitating the tool retracting during the turning of the supporting protrusion 524 e-1; on the other hand, when the second fiber adapter 510 is glued to the connecting prism cavity 524b, the excess glue can flow into the connecting groove 524e-2, thereby preventing the glue from affecting the lens 512 and the like.
Fig. 16 is a first schematic structural diagram of a light receiving cavity according to an embodiment of the present disclosure. As shown in fig. 16, the second connecting plate 525b is provided with a supporting structure 525c at a side edge thereof, and the supporting structure 525c is used for increasing the shearing strength of the second connecting plate 525b and ensuring the connection strength of the prism cavity 524b and the light receiving cavity 520.
In this embodiment, a displacement component 524 is disposed at a connection position between the second optical fiber adapter 510 and the light receiving cavity 520, the signal light output by the second optical fiber adapter 510 is transmitted to the light receiving cavity 520 through the displacement component 524, and the displacement component 524 adjusts a height of an optical path of the signal light output by the second optical fiber adapter 510, thereby adjusting the optical path from the optical path in the second optical fiber adapter 510 to the optical path in the light receiving cavity 520. Therefore, in the optical module provided by the embodiment of the present application, the height of the optical path from the optical path of the second optical fiber adapter 510 to the optical receiving cavity 520 is adjusted, so that the first optical fiber adapter 410 and the second optical fiber adapter 510 are located at the same height, and then the arrangement of stacking the tosa 400 and the tosa 500 is convenient to realize, so that the optical module provided by the embodiment of the present application can adapt to the large volume requirement of the tosa 400 and the tosa 500. In the embodiment of the present application, a displacement component may be further disposed on the tosa 400, and the height adjustment of the optical path in the cavity of the tosa 400 to the optical path of the first fiber adapter 410 may be adjusted by the displacement component.
The light receiving cavity 520 includes a bottom plate and sidewalls surrounding the bottom plate to form a cavity structure for accommodating optical and electrical devices in the light receiving sub-module 500. As shown in fig. 16, a cover fixing glue groove 526a is provided on the top of the sidewall of the light receiving cavity 520, and the light receiving cover 520a may be fixedly coupled to the light receiving cavity 520 by glue. Optionally, the cover plate fixing glue groove 526a forms a closed loop structure at the top of the sidewall of the light receiving cavity 520, so that the glue area of the light receiving cover plate 520a at the top of the sidewall of the light receiving cavity 520 can be increased, and the package reliability at the top of the sidewalls of the light receiving cover plate 520a and the light receiving cavity 520 can be fully ensured. Further, the top of the sidewall of the light receiving cavity 520 is further provided with a rework opening 526b, the rework opening 526b is arranged at the edge of the top of the sidewall of the light receiving cavity 520, and the rework opening 526b is communicated with the cover plate fixing glue groove 526 a. When the internal devices of the light receiving cavity 520 need to be repaired after the light receiving cover plate 520a and the light receiving cavity 520 are packaged, the light receiving cover plate 520a can be detached from the light receiving cavity 520 through the repairing opening 526b, so that the light receiving cover plate 520a can be detached without damaging the light receiving cover plate 520a or the light receiving cavity 520, and the repairing difficulty and cost are reduced.
In some embodiments, as shown in fig. 16, a lens mounting post 527 is provided on the bottom plate of the light receiving cavity 520. Fig. 17 is a schematic structural diagram of a light receiving cavity according to an embodiment of the present application. As shown in fig. 16 and 17, the lens mounting post 527 has a straight prism configuration, such as a triangular prism configuration; the lens mounting post 527 comprises a first lens support surface 527a and a second lens support surface 527b, and the first lens support surface 527a and the second lens support surface 527b form an included angle therebetween, which satisfies the mounting arrangement of the first lens 531 and the second lens 532; the first lens support surface 527a is used for limiting and fixing the first lens 531, and the second lens support surface 527b is used for limiting and fixing the second lens 532. In the present embodiment, providing the lens mounting post 527 including the first and second lens supporting surfaces 527a and 527b facilitates achieving the passive-coupling mounting of the first and second lenses 531 and 532, facilitating improving the mounting efficiency and mounting accuracy of the first and second lenses 531 and 532.
Further, in the claimed embodiment, a lens groove 527c is further provided on the bottom plate of the light receiving cavity 520, and the lens groove 527c is provided at the side of the first and second lens supporting surfaces 527a and 527b of the lens mounting post 527 in contact with the first and second lens supporting surfaces 527a and 527 b. On the one hand, the lens groove 527c facilitates the machining of the first lens support surface 527a and the second lens support surface 527b on the lens mounting post 527, such as facilitating the tool retracting during the lathe machining of the lens mounting post 527; on the other hand, the first lens 531 and the second lens 532 are ensured to be in sufficient contact with the first lens support surface 527a and the second lens support surface 527b, respectively; on the other hand, when the first lens 531 and the second lens 532 are spot-bonded to the bottom plate of the light receiving cavity 520, the excess glue can flow into the lens groove 527c, thereby preventing the glue from affecting the mounting accuracy of the first lens 531 and the second lens 532.
In some embodiments, as shown in fig. 16 and 17, the bottom plate of the light receiving cavity 520 is further provided with a wavelength division multiplexing (DeMUX) mounting post 502 in a straight prism structure, such as a quadrangular prism structure; the DeMUX mounting column 502 includes a first DeMUX mounting surface 502a and a second DeMUX mounting surface 502b, the first DeMUX mounting surface 502a is used for limiting and fixedly mounting the first DeMUX540, and the second DeMUX mounting surface 502b is used for limiting and fixedly mounting the second DeMUX 550. Optionally, the first DeMUX mounting surface 502a is parallel to the first DeMUX mounting surface 502 b. In this embodiment, the arrangement of the DeMUX mounting posts 502 including the first DeMUX mounting surface 502a and the second DeMUX mounting surface 502b facilitates the implementation of the passive coupling mounting of the first DeMUX540 and the second DeMUX550, and facilitates the improvement of the mounting efficiency and the mounting accuracy of the first DeMUX540 and the second DeMUX 550.
Further, in the embodiment of the present application, a first DeMUX slot 502c is disposed on a side of the first DeMUX mounting surface 502a, and the first DeMUX slot 502c contacts with the first DeMUX mounting surface 502 a; a second DeMUX slot 502d is disposed at a side of the second DeMUX mounting surface 502b, and the second DeMUX slot 502d contacts the second DeMUX mounting surface 502 b. On one hand, the first DeMUX slot 502c and the second DeMUX slot 502d facilitate the machining and forming of the first DeMUX mounting surface 502a and the first DeMUX mounting surface 502b on the DeMUX mounting column 502, for example, facilitate the tool retracting when the first DeMUX mounting surface 502a and the first DeMUX mounting surface 502b are turned; on the other hand, the arc chamfer is prevented from occurring at the contact part of the first DeMUX mounting surface 502a and the first DeMUX mounting surface 502b with the bottom plate of the light receiving cavity 520, so that the first DeMUX540 and the second DeMUX550 can not be fully contacted with the first DeMUX mounting surface 502a and the first DeMUX mounting surface 502b respectively, and the mounting precision of the first DeMUX540 and the second DeMUX550 is not influenced; in another aspect, when the first DeMUX540 and the second DeMUX550 are glued to the bottom plate DeMUX mounting post 502 connected to the light receiving cavity 520, the excess glue may flow into the first DeMUX slot 502c and the second DeMUX slot 502d, so as to prevent the glue from affecting the mounting accuracy of the first DeMUX540 and the second DeMUX 550.
In some embodiments, as shown in fig. 16, a first DeMUX fixing glue groove 528 and a second DeMUX fixing glue groove 529 are further disposed on the bottom plate of the light receiving cavity 520, and the first DeMUX fixing glue groove 528 and the second DeMUX fixing glue groove 529 are respectively used for containing glue. For example, when it is required to fix first DeMUX540 and second DeMUX550, glue is dispensed in first DeMUX fixing glue groove 528 and second DeMUX fixing glue groove 529, respectively, and then first DeMUX540 and second DeMUX550 are mounted and placed on first DeMUX fixing glue groove 528 and second DeMUX fixing glue groove 529, respectively, and the glue is solidified to complete the fixing of first DeMUX540 and second DeMUX550 on the bottom plate.
Further, as shown in fig. 17, the first DeMUX fixing glue groove 528 includes a first glue dispensing groove 528a and a first glue overflow groove 528b, the first glue dispensing groove 528a and the first glue overflow groove 528b are usually formed by sinking the top surface of the bottom plate of the light receiving cavity 520, and the first glue dispensing groove 528a and the first glue overflow groove 528b are separated by a sidewall. Alternatively, the first dispensing groove 528a is a circular structure, and the first glue overflow groove 528b is a circular ring structure surrounding the first dispensing groove 528a, but the present application is not limited to this structure. In specific use, the glue is dispensed in the first glue dispensing groove 528a, the glue dispensing is sufficient, the first glue dispensing groove 528a is generally overflowed, the first DeMUX540 is covered and placed above the first glue dispensing groove 528a, and the redundant glue in the first glue dispensing groove 528a overflows to the first glue overflowing groove 528b, so that the influence of insufficient glue quantity on the firmness of the first DeMUX540 can be effectively prevented, and the glue overflowing everywhere when the glue is excessive and the insufficient installation accuracy of the first DeMUX540 can be prevented.
Accordingly, as shown in fig. 17, the second DeMUX fixing glue groove 529 includes a second glue dispensing groove 529a and a first glue overflowing groove 529b, the second glue dispensing groove 529a and the second glue overflowing groove 529b may be generally formed by sinking the top surface of the bottom plate of the light receiving cavity 520, and the second glue dispensing groove 529a and the second glue overflowing groove 529b are separated by a side wall. Optionally, the second dispensing groove 529a has a circular structure, and the second glue overflow groove 529b has a circular structure surrounding the side of the second dispensing groove 529a, but the present application is not limited to this structure. Specific use of the second DeMUX retaining glue slot 529 can be seen with respect to the first DeMUX retaining glue slot 528.
In some embodiments, as shown in fig. 16, a first prism mounting post 503a, a second prism mounting post 503b, and a third prism mounting post 503c are further disposed on the bottom plate of the light receiving cavity 520, and the first prism mounting post 503a, the second prism mounting post 503b, and the third prism mounting post 503c are disposed at intervals. Wherein: on the one hand, the first prism mounting post 503a, the second prism mounting post 503b and the third prism mounting post 503c are used for mounting and limiting the first reflection prism 561 and the second reflection prism 571; on the other hand, the first prism mounting post 503a and the second prism mounting post 503b are fitted to fix the side of the first reflection prism 561, and the second prism mounting post 503b and the third prism mounting post 503c are fitted to fix the side of the second reflection prism 571. Optionally, a first reflecting prism mounting surface 503d is disposed between the first prism mounting post 503a and the second prism mounting post 503b, and the first reflecting prism mounting surface 503d is used for supporting the bottom surface of the first reflecting prism 561; second reflecting prism mounting surface 503e is provided between second prism mounting pillar 503b and third prism mounting pillar 503c, and second reflecting prism mounting surface 503e supports the bottom surface of second reflecting prism 571.
In some embodiments, as shown in fig. 16, the bottom plate of the light receiving cavity 520 includes a first bottom surface 501a and a second bottom surface 501b, and a step surface 501c is formed between the first bottom surface 501a and the second bottom surface 501 b. The first bottom surface 501a is provided with a lens mounting post 527, a DeMUX mounting post 502, a first DeMUX fixing glue groove 528, a second DeMUX fixing glue groove 529 and the like, and the second bottom surface 501b is used for bearing the flexible circuit board 310 extending into the light receiving cavity 520. The step surface 501c realizes the division of the height of the bottom surface of the light receiving cavity 520; on the one hand, a step surface 501c is formed between the first bottom surface 501a and the second bottom surface 501b, and the first bottom surface 501a can relatively raise the heights of the first reflecting prism mounting surface 503d and the second reflecting prism mounting surface 503e, so as to raise the heights of the first reflecting prism 561 and the second reflecting prism 571, and thus, the first reflecting prism 561 and the second reflecting prism 571 can be conveniently assembled with the first light receiving assembly 580 and the second light receiving assembly 590; on the other hand, the stepped surface 501c may also be used for limiting the flexible circuit board 310 extending into the light receiving cavity 520.
Fig. 18 is an assembly use state diagram of a light receiving cavity according to an embodiment of the present disclosure, and fig. 18 illustrates a use state of the lens mounting post 527, the DeMUX mounting post 502, the first DeMUX fixing glue groove 528, the second DeMUX fixing glue groove 529, and the like. As shown in fig. 18, the side surface of the first lens 531 abuts against the first lens support surface 527a of the lens mounting post 527, and the side surface of the second lens 532 abuts against the second lens support surface 527b of the lens mounting post 527; the side surface of the first DeMUX540 is attached to the first DeMUX mounting surface 502a of the DeMUX mounting post 502, and the first DeMUX540 covers the first DeMUX fixing glue groove 528; the side surface of the second DeMUX550 is attached to the second DeMUX mounting surface 502b of the DeMUX mounting post 502, and the second DeMUX550 covers the second DeMUX fixing glue groove 529; the first reflection prism 561 is interposed between the first prism mounting post 503a and the second prism mounting post 503b, and the second reflection prism 571 is interposed between the second prism mounting post 503b and the third prism mounting post 503 c.
Fig. 19 is a sectional view showing an assembled use state of a light receiving cavity according to an embodiment of the present application. As shown in fig. 19, after the side surface of the second lens 532 is fixed to the second lens support surface 527b of the lens mounting post 527, the second lens 532 covers the lens groove 527 c; when the first DeMUX540 is assembled to the bottom plate of the light receiving cavity 520, the first DeMUX540 covers the first glue dispensing groove 528a and the first glue overflowing groove 528b of the first DeMUX fixing glue groove 528; the first bottom surface 501a raises the first DeMUX540, so that a certain height difference exists between the bottom of the first DeMUX540 and the second bottom surface 501b, which is convenient for the installation of devices in the first light receiving assembly 580; the end surface of the flexible circuit board 310 abuts against the step surface 501c, and the step surface 501c is used for limiting the end surface of the flexible circuit board 310. In the embodiment of the present application, the flexible circuit board 310 extending into the light receiving cavity 520 may be fixed to the second bottom surface 501b by a thermal conductive adhesive or the like.
Fig. 20 is a sectional view of a light receiving cavity provided in an embodiment of the present application. As shown in fig. 20, a cover plate fixing glue groove 526a is formed in the top of the light receiving cavity 520, a cover plate protrusion 520b is formed at a position corresponding to the cover plate fixing glue groove 526a on the edge of the light receiving cover plate 520a, and the cover plate protrusion 520b is fittingly disposed in the cover plate fixing glue groove 526 a. Thus, when the light receiving cavity 520 and the light receiving cover plate 520a are fixedly connected by using glue, the cover plate fixing glue groove 526a and the cover plate protrusion 520b are matched to increase the glue area, so that the light receiving cover plate 520a and the light receiving cavity 520 are sufficiently sealed.
Further, as shown in fig. 20, a third through hole 526c is further provided on the side wall of the light receiving cavity 520, and the third through hole 526c communicates with the inner cavity of the light receiving cavity 520; a sealing plug 526d is provided in the third through hole 526c, and the sealing plug 526d is used to seal the third through hole 526 c. In the production process of the light receiving sub-module 500, heating and baking are usually required, and the third through hole 526c is further provided to facilitate air circulation in the light receiving cavity 520, and after the heating and baking are completed, the sealing plug 526d is used to seal the third through hole 526c, so as to prevent air outside the light receiving cavity 520 from entering the inner cavity of the light receiving cavity 520 through the third through hole 526 c.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (10)

1. A light module, comprising:
a circuit board;
the light receiving secondary module is electrically connected with the circuit board and is used for converting the received signal light into a current signal;
the optical receive sub-module includes:
the light receiving cavity comprises a bottom plate and a light source, wherein the bottom plate is used for bearing a setting device;
the device comprises a reflecting prism and a light receiving assembly, wherein the light receiving assembly comprises a plurality of light receiving chips, and the reflecting prism is covered on the light receiving chips of the light receiving assembly and used for reflecting signal light to the light receiving chips of the light receiving assembly.
2. The optical module of claim 1, wherein the optical receiving module further comprises a ceramic substrate and a transimpedance amplifier, the optical receiving chip is disposed on the ceramic substrate, and an electrode of the optical receiving chip is at the same height as a pin of the transimpedance amplifier.
3. The optical module according to claim 1, wherein the reflection prism includes a 45 ° reflection surface, and the 45 ° reflection surface is disposed over a light receiving chip of the light receiving module.
4. The optical module according to claim 1, wherein the reflection prism includes a first reflection prism and a second reflection prism; the bottom plate comprises a first bottom surface and a second bottom surface, and a step surface is formed between the first bottom surface and the second bottom surface;
the first bottom surface supports and connects the first reflection prism and the second reflection prism, and the second bottom surface supports the light receiving component.
5. The optical module of claim 4, wherein an opening is formed in a side wall of the light receiving cavity, a flexible circuit board is inserted into the opening, one end of the flexible circuit board abuts against the step surface, the other end of the flexible circuit board is connected to the circuit board, and the light receiving module is electrically connected to the flexible circuit board.
6. The optical module of claim 4, wherein the first bottom surface has a first prism mounting post, a second prism mounting post, and a third prism mounting post disposed thereon;
the side surface of the first reflecting prism is connected with the first prism mounting column and the second prism mounting column in a matched mode, and the side surface of the second reflecting prism is connected with the second prism mounting column and the third prism mounting column in a matched mode.
7. The optical module of claim 6, wherein a first reflective prism mounting surface is disposed between the first prism mounting post and the second prism mounting post, the first reflective prism mounting surface supporting the first reflective prism;
and a second reflecting prism mounting surface is arranged between the second prism mounting column and the third prism mounting column, and supports the second reflecting prism.
8. The light module as claimed in claim 4, wherein the light receiving member comprises a first light receiving member and a second light receiving member;
the first light receiving component comprises a first ceramic substrate, and a plurality of light receiving chips are arranged on the first ceramic substrate; the second light receiving component comprises a second ceramic substrate, and a plurality of light receiving chips are arranged on the second ceramic substrate;
the first reflective prism covers the first ceramic substrate and the second reflective prism covers the second ceramic substrate.
9. An optical module, characterized by a circuit board;
the light receiving secondary module is electrically connected with the circuit board and is used for converting the received signal light into a current signal;
the optical receive sub-module includes:
the light receiving cavity comprises a bottom plate and a light source, wherein the bottom plate is used for bearing a setting device;
the device comprises a first reflecting prism, a second reflecting prism, a first light receiving assembly and a second light receiving assembly; the first light receiving assembly comprises a plurality of light receiving chips, and the second light receiving assembly comprises a plurality of light receiving chips;
the first reflection prism is covered on the light receiving chip of the first light receiving component and used for reflecting signal light to the light receiving chip of the first light receiving component;
the second reflection prism is covered on the light receiving chip of the second light receiving component and reflects the signal light to the light receiving chip of the second light receiving component.
10. The optical module as claimed in claim 9, wherein an opening is disposed on a sidewall of the light receiving cavity, an electrical connector is disposed through the opening, the first light receiving element and the second light receiving element are disposed on the electrical connector, and the electrical connector is connected to the circuit board through a flexible circuit board.
CN202010989984.6A 2020-09-18 2020-09-18 Optical module Active CN114200602B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202010989984.6A CN114200602B (en) 2020-09-18 2020-09-18 Optical module
PCT/CN2020/134054 WO2022057100A1 (en) 2020-09-18 2020-12-04 Optical module
US18/122,534 US20230228955A1 (en) 2020-09-18 2023-03-16 Optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010989984.6A CN114200602B (en) 2020-09-18 2020-09-18 Optical module

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CN114200602B CN114200602B (en) 2023-04-14

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Citations (5)

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Publication number Priority date Publication date Assignee Title
CN107132626A (en) * 2017-05-18 2017-09-05 青岛海信宽带多媒体技术有限公司 A kind of optical module
CN108267821A (en) * 2018-03-12 2018-07-10 四川新易盛通信技术有限公司 A kind of boxlike optical device structural member and optical device, the optical module using the optical device structural member
CN110471148A (en) * 2019-09-02 2019-11-19 青岛海信宽带多媒体技术有限公司 A kind of optical module
CN110488433A (en) * 2019-08-16 2019-11-22 青岛海信宽带多媒体技术有限公司 A kind of optical module
CN210775927U (en) * 2019-10-22 2020-06-16 青岛海信宽带多媒体技术有限公司 Optical module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107132626A (en) * 2017-05-18 2017-09-05 青岛海信宽带多媒体技术有限公司 A kind of optical module
CN108267821A (en) * 2018-03-12 2018-07-10 四川新易盛通信技术有限公司 A kind of boxlike optical device structural member and optical device, the optical module using the optical device structural member
CN110488433A (en) * 2019-08-16 2019-11-22 青岛海信宽带多媒体技术有限公司 A kind of optical module
CN110471148A (en) * 2019-09-02 2019-11-19 青岛海信宽带多媒体技术有限公司 A kind of optical module
CN210775927U (en) * 2019-10-22 2020-06-16 青岛海信宽带多媒体技术有限公司 Optical module

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