CN217587686U

CN217587686U - Optical module

Info

Publication number: CN217587686U
Application number: CN202221233108.1U
Authority: CN
Inventors: 邵乾; 罗成双; 宿靖啟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-05-19
Filing date: 2022-05-19
Publication date: 2022-10-14
Anticipated expiration: 2032-05-19

Abstract

The application provides an optical module, includes: a circuit board; the optical chip is arranged on the circuit board and used for transmitting optical signals or receiving optical signals; the lens component is covered on the optical chip and used for changing the transmission direction of the optical signal; the optical fiber assembly comprises an optical fiber ribbon, the optical fiber ribbon comprises a plurality of optical fibers, one end of each optical fiber is optically connected with the lens assembly, and the end face of one end of each optical fiber is an inclined face, so that the end face of each optical fiber is not perpendicular to the central axis of the corresponding optical fiber; the lens assembly is provided with a reflecting surface, the reflecting surface inclines towards the direction of the optical fiber assembly, the reflecting surface is used for reflecting the transmitting optical signal from the optical chip or reflecting the optical signal to be received by the optical chip to the optical chip, and the sum of the inclination angle of the reflecting surface and the inclination angle of the end face of the optical fiber is larger than 50 degrees or smaller than 45 degrees. The interference of the reflected optical signal to the original optical signal is effectively reduced.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

At present, optical modules are in various packaging forms, and an optical module in a COB (Chip on Board) packaging form is a common one of the optical modules. In the COB package type optical module, an optical chip is usually disposed on a circuit board, and a lens assembly is covered above the optical chip and used for transmitting optical signals between the optical chip and an optical port of the optical module and controlling a transmission optical path of the optical signals. In the specific use of the optical module in the form of COB package, it is found that when optical signals are transmitted between the optical chip and the lens assembly, a part of the optical signals are returned to the original transmission optical path, and the reflected optical signals will interfere with the original transmission signals, so that the transmission quality of the optical signals is visualized.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical module, which can reduce signal interference caused by the fact that an optical signal between an optical chip and a lens assembly is reflected back to an original transmission optical path.

The application provides an optical module, includes:

a circuit board;

the optical chip is arranged on the circuit board and used for transmitting optical signals or receiving optical signals;

the lens component irradiates on the optical chip and is used for changing the transmission direction of the optical signal;

the optical fiber assembly comprises an optical fiber ribbon, the optical fiber ribbon comprises a plurality of optical fibers, one end of each optical fiber is optically connected with the lens assembly, and the end face of one end of each optical fiber is an inclined face, so that the end face of each optical fiber is not perpendicular to the central axis of the corresponding optical fiber;

the lens assembly is provided with a reflecting surface, the reflecting surface inclines towards the direction of the optical fiber assembly, the reflecting surface is used for reflecting the transmitting optical signal from the optical chip or reflecting the optical signal to be received by the optical chip to the optical chip, and the sum of the inclination angle of the reflecting surface and the inclination angle of the end face of the optical fiber is larger than 50 degrees or smaller than 45 degrees.

In the optical module that this application provided, the optical chip sets up on the circuit board, and the lens subassembly cover is established on the optical chip, sets up the plane of reflection on the lens subassembly, and the plane of reflection is used for reflecting the transmission light signal that comes from the optical chip or treats the received light signal reflection to the optical chip with the optical chip. In the application, when the optical chip is used for emitting the optical signal, since the sum of the inclination angle of the reflecting surface and the inclination angle of the end surface of the optical fiber is greater than 50 ° or less than 45 °, the coupling efficiency of the reflected optical signal on the transmission optical path of the emitted optical signal to the optical chip is low, and then the reflected optical signal enters the optical chip less, so that the interference of the reflected optical signal to the original optical signal is reduced; when the optical chip is used for receiving an optical signal, because the sum of the inclination angle of the reflecting surface and the inclination angle of the end face of the optical fiber is greater than 50 degrees or less than 45 degrees, the optical signal reflected back by the optical chip rarely enters the optical path of the original transmission optical signal, and the interference of the reflected optical signal on the original optical signal is further reduced.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be considered as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments;

figure 2 is a block diagram of an optical network terminal provided in accordance with some embodiments;

fig. 3 is a schematic structural diagram of an optical module according to some embodiments;

FIG. 4 is an exploded view of a light module provided in accordance with some embodiments;

fig. 5 is a schematic diagram of an internal structure of a light module according to some embodiments;

FIG. 6 is an exploded view of the internal structure of a light module provided in accordance with some embodiments;

FIG. 7 is a schematic view of an assembly structure of a lens assembly and an optical fiber assembly according to some embodiments;

FIG. 8 is an exploded view of a lens assembly and a fiber optic assembly according to some embodiments;

FIG. 9 is a schematic structural diagram of a lens assembly provided in accordance with some embodiments;

FIG. 10 is a cross-sectional view of a lens assembly provided in accordance with some embodiments;

FIG. 11 is a cross-sectional view of the interior of a light module according to some embodiments;

FIG. 12 is a simplified schematic diagram of the optical path corresponding to FIG. 11;

FIG. 13 is a second cross-sectional view of the interior of a light module according to some embodiments;

FIG. 14 is a simplified schematic diagram of the optical path corresponding to FIG. 13;

fig. 15 is a cross-sectional view three of the interior of a light module provided in accordance with some embodiments;

FIG. 16 is a schematic diagram of another arrangement of a first reflective surface and an optical fiber according to some embodiments;

fig. 17 is a schematic diagram of another arrangement of a second reflective surface and an optical fiber according to some embodiments.

Detailed Description

The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the word "comprise" and its other forms, such as "comprises" and "comprising", will be interpreted as open, inclusive meaning that the word "comprise" and "comprises" will be interpreted as meaning "including, but not limited to", in the singular. In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be included in any suitable manner in any one or more embodiments or examples.

In the field of optical fiber communication technology, signals transmitted by information transmission devices such as optical fibers or optical waveguides are optical signals, and signals that can be recognized and processed by information processing devices such as computers are electrical signals, so that the optical signals and the electrical signals need to be converted into each other by using optical modules.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, a bidirectional optical communication system is established between a remote server 1000 and a local information processing device 2000 through an optical fiber 101, an optical module 200, an optical network terminal 100, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100.

The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

In the optical module 200, an optical port is configured to be connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100.

The optical network terminal 100 is provided with an optical module interface 102 and a network cable interface 104. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

Fig. 2 is a block diagram of an optical network terminal according to some embodiments, and as shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and the optical module 200 establishes a bidirectional electrical signal connection with the onu 100.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, an unlocking member 203 disposed on the housing, a circuit board 300 disposed in the housing, and a lens assembly 400. Of course, the structure of the optical module in the embodiment of the present application is not limited to the structure shown in fig. 3 and 4.

The shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two

openings

204 and 205; the outer contour of the housing generally appears square.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. Wherein, the opening 204 is an electric port, and the golden finger of the circuit board 300 extends out of the electric port 204 and is inserted into the upper computer; the opening 205 is an optical port configured to receive the external optical fiber 101 so that the optical fiber 101 is connected to the inside of the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that devices such as the circuit board 300 can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the light module 200 further includes an unlocking feature located on an outer wall of its housing. When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is clamped in the cage of the upper computer by the clamping component of the unlocking component; when the unlocking member is pulled, the engaging member of the unlocking member moves along with the unlocking member, so that the connection relationship between the engaging member and the upper computer is changed, and the engagement between the optical module 200 and the upper computer is released.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the upper computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The golden finger is configured to establish an electrical connection with the upper computer so as to realize power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, the flexible circuit board may be used with the circuit board 300 in some optical modules.

In the specific use of the optical module, since the direction of the optical signal emitted by the optical chip and the direction of the optical signal output by the optical port of the optical module are not on the same straight line or even on the same plane, the lens assembly 400 is used to change the transmission direction of the optical signal emitted by the optical chip; accordingly, the plane of the optical chip for receiving the optical signal is not perpendicular to or even parallel to the direction of the optical signal input to the optical port of the optical module, so that the lens assembly 400 is used to change the transmission direction of the optical signal to be received by the optical receiving chip.

Fig. 5 is a schematic diagram of an internal structure of an optical module according to some embodiments. As shown in fig. 4 and 5, in some embodiments of the present application, the optical module 200 further includes an optical fiber assembly 500 inside, the optical fiber assembly 500 includes an optical fiber ribbon 510 and an optical fiber stub 520, the optical fiber stub 520 is disposed at an end of the optical fiber ribbon 510, the optical fiber stub 520 is connected to the lens assembly 400, and then the optical fiber ribbon 510 is optically connected to the lens assembly 400 through the optical fiber stub 520, so as to establish optical signal transmission between the optical fiber ribbon 510 and the lens assembly 400. Illustratively, when the optical chip is an optical chip for emitting an optical signal, the optical signal emitted by the optical chip is transmitted to the lens assembly 400, and is coupled and transmitted to the optical fiber ribbon 510 after the transmission direction is changed by the lens assembly 400; when the optical chip is used for receiving an optical signal, the optical signal outside the optical module is transmitted to the optical fiber ribbon 510, coupled to the lens assembly 400 through the optical fiber ribbon 510, and finally transmitted to the optical chip through the lens assembly 400, and the optical chip receives the optical signal. In some embodiments, fiber optic ribbons 510 typically include a plurality of optical fibers, but in the present embodiment, fiber optic assembly 500 is not limited to the use of fiber optic ribbons 510 and may use a single optical fiber, with the particular choice being selected according to the particular needs of the optical chip. Of course, in some optical modules provided in the embodiments of the present application, the optical fiber ribbon or the optical fiber may not be disposed inside, for example, the lens assembly 400 is disposed at an end of the circuit board 300, and the lens assembly 400 directly abuts against an optical fiber connector outside the optical module, so as to directly establish optical connection between the external optical fiber and the lens assembly 400.

Fig. 6 is an exploded view of the internal structure of a light module according to some embodiments. As shown in FIG. 6, the photonic chip 310 is disposed on the circuit board 300, and the lens assembly 400 is disposed over the photonic chip 310. In some embodiments, the optical chip 310 includes several light emitting chips or/and several light receiving chips; illustratively, the optical chip 310 includes several light emitting chips 311 and several light receiving chips 312, such as 4 light emitting chips or 4 light receiving chips.

Fig. 7 is a schematic view of an assembly structure of a lens assembly and an optical fiber assembly according to some embodiments, and fig. 8 is an exploded schematic view of a lens assembly and an optical fiber assembly according to some embodiments. As shown in fig. 7 and 8, in some embodiments of the present application, a clamping groove 410 is disposed on the lens assembly 400, the clamping groove 410 is disposed at an end of the lens assembly 400 near the optical port, and an optical fiber connector 520 is connected to the lens assembly 400 through the clamping groove 410. The optical fibers in optical fiber ribbon 510 extend through optical fiber connector 520 with the end faces of the optical fibers positioned outside of optical fiber connector 520 to facilitate optical coupling between the optical fibers and lens assembly 400.

Further, in order to ensure the use safety of the end face of the optical fiber and facilitate the optical coupling between the lens assembly 400 and the optical fiber, the holding groove 420 is disposed at one side of the clamping groove 410 away from the optical fiber connector 520 along the extending direction of the optical fiber, as shown in fig. 8, the holding groove 420 is disposed at the right end of the clamping groove 410, and the end of the optical fiber extends into the holding groove 420. In some embodiments of the present application, lenses, such as a matrix of lenses, are disposed on the sides of receiving groove 420 to facilitate optical coupling between fiber ribbon 510 and lens assembly 400.

In some embodiments of the present application, the lens assembly 400 is provided with a reflective surface 430, and the reflective surface 430 is inclined toward the optical fiber ribbon 510 for reflecting the optical signal to change the transmission direction of the optical signal, so that the optical signal can be transmitted between the optical fiber ribbon 510 and the optical chip 310 at different heights and transmission directions. The method comprises the following steps: when the optical chip is used for emitting optical signals, the reflecting surface is used for reflecting and transmitting the optical signals transmitted to the reflecting surface to the optical fiber; when the optical chip is used for receiving optical signals, the reflecting surface is used for reflecting the optical signals input through the optical fibers to the optical chip.

In order to prevent the reflection surface 430 from reflecting the optical signal reflected back in the transmission optical path of the optical signal of the optical module to the optical chip or preventing the optical signal reflected by the optical chip from entering the transmission optical path of the optical signal of the optical module, the sum of the incident angle and the reflection angle of the optical signal on the reflection surface 430 is not 90 °, and further the included angle between the reflection surface 430 and the optical axis of the optical chip 310 is not 45 °, and the included angle between the incidence surface 430 and the optical axis of the optical chip 310 can be selected from any angle among 43 ° -44 °, 46 ° -48 °, and the like, and can be specifically selected by combining with the actual needs of the optical chip. Thus, when the optical chip 310 is an optical chip for emitting an optical signal, since the included angle between the reflective surface and the optical axis of the optical chip 310 is not 45 °, the coupling efficiency of the optical signal reflected back on the transmission optical path of the emitted optical signal to the optical chip 310 is relatively low, and further the optical signal entering the optical chip 310 is relatively less, thereby reducing the interference of the reflected optical signal to the original optical signal; when the optical chip 310 is used for receiving optical signals, because the included angle between the reflecting surface and the optical axis of the optical chip 310 is not 45 °, optical signals reflected back by the optical chip 310 rarely enter the optical path of the original transmission optical signals, thereby reducing the interference of the reflected optical signals to the original optical signals.

In some embodiments of the present application, the top of the lens assembly 400 is provided with a first recess 440, and the bottom of the first recess 440 forms a reflective surface 430, so as to facilitate the provision of the reflective surface 430 and the adjustment of the inclination angle of the reflective surface 430, thereby facilitating the guarantee of the angle between the reflective surface 430 and the optical axis of the optical chip 310.

In some embodiments of the present application, to further prevent the optical signal reflected back in the optical signal transmission optical path from interfering with the optical signal to be transmitted in the optical signal transmission optical path, the end face of the optical fiber is not perpendicular to the central axis of the optical fiber, that is, the end face of the optical fiber is an inclined plane, for example, the inclined angle may be any angle between 3 ° and 8 °, and of course, may also be any angle between 4 ° and 10 °. Illustratively, the end faces of the optical fibers in optical fiber ribbon 510 are not perpendicular to the central axis of the optical fibers, and the angle of inclination of the end faces of the optical fibers may be 6 °, 7 °, 8 °, 10 °, and so on. Furthermore, in the embodiment of the present application, by combining the inclination angle of the reflection surface 430 and the inclination angle of the end surface of the optical fiber, the optical signal reflected back in the optical signal transmission optical path is prevented from interfering with the optical signal to be transmitted in the optical signal transmission optical path. In combination with the transmission performance of the optical signal in the lens assembly 400 and the optical fiber and the refraction and reflection principles of light, the inclination angle of the reflective surface 430 and the inclination angle of the end face of the optical fiber are inclined, and the sum of the inclination angle of the reflective surface 430 and the inclination angle of the end face of the optical fiber is greater than 50 degrees or less than 45 degrees.

Fig. 9 is a schematic structural diagram of a lens assembly provided in accordance with some embodiments, and fig. 10 is a cross-sectional view of a lens assembly in accordance with some embodiments. An accommodating groove 420 is provided on the right end side of the clamping groove 410, and a lens is provided on the side of the accommodating groove 420. Illustratively, the sides of the receiving groove 420 are arranged in rows of a lens matrix.

In some embodiments of the present application, to facilitate covering the optical chip 310, as shown in fig. 10, a second recess 450 is further disposed at the bottom of the lens assembly 400, and the second recess 450 and the circuit board 300 form a receiving cavity to receive the optical chip 310 and other devices. A lens is disposed on the top of the second recess 450 to collimate the optical signal emitted from the optical chip 310 or to converge the optical signal toward the optical chip 310.

Fig. 11 is a cross-sectional view of an interior of a light module according to some embodiments. As shown in fig. 11, the optical chip 310 includes a plurality of light emitting chips 311, the lens assembly 400 covers the plurality of light emitting chips 311, a first reflective surface 431 is formed at the bottom of the first recess 440, an inclination angle of the first reflective surface 431 is not 45 °, an included angle between the first reflective surface 431 and an optical axis of the light emitting chip 311 is not 45 °, and the first reflective surface 431 is used for reflecting an optical signal emitted by the light emitting chip 311. Illustratively, the bottom of the lens assembly 400 is connected to the circuit board 300, the projection of the first reflective surface 431 on the circuit board 300 covers the light emitting chip 311, the optical axis of the light emitting chip 311 forms an included angle perpendicular to the circuit board 300, the inclination angle of the first reflective surface 431 is 46.9 °, and the included angle between the first reflective surface 431 and the optical axis of the light emitting chip 311 is 43.1 °. In some embodiments of the present application, the light chip 310 includes 4 light emitting chips 311, but is not limited to 4, and may also include 1, 2, 8, and so on.

In some embodiments of the present application, as shown in fig. 11, a first lens matrix 421 is disposed on a side surface of the accommodating groove 420, and lenses in the first lens matrix 421 are used for converging the optical signals reflected by the first reflecting surface 431, so as to ensure the coupling efficiency of the optical signals reflected by the first reflecting surface 431 into the optical fibers. The number of lenses in the first lens matrix 421 generally corresponds to the number of light emitting chips 311.

In some embodiments of the present application, as shown in fig. 11, a third lens matrix 451 is disposed on the top of the second recess 450, and lenses in the third lens matrix 451 are used for collimating the light signals emitted from the light emitting chip 311. The third lens matrix 451 includes a number of lenses, the number of lenses being generally equal to the number of light emitting chips 311, each lens being for collimating the light signal emitted from one light emitting chip correspondingly. Illustratively, the focal points of the lenses in the third lens matrix 451 are located on the corresponding light emitting chips 311.

Fig. 12 is a simplified optical path schematic diagram corresponding to fig. 11, showing only the transmission path of the main optical axis of an optical signal, wherein the slope of the end faces of the optical fibers in optical fiber ribbon 510 is 8 °, and the sum of the slope angle of first reflective surface 431 and the slope angle of the end faces of the optical fibers is greater than 50 °. In the embodiment of the present application, in order to ensure the coupling efficiency of the optical signal, in combination with the refraction and reflection principle of light, when the inclination of the optical fiber end surface is 8 °, the main reflection optical axis of the first reflection surface 431 is perpendicular to the optical fiber end surface (the main reflection optical axis of the first reflection surface 431 is perpendicular to the normal of the optical fiber end surface), and the optimal angle of incidence to the optical fiber is about 3.8 ° from the central axis of the optical fiber. Based on the same conditions, when the end face of the optical fiber has a slope of 6 °, the optimum angle of incidence to the optical fiber is about 2.8 ° from the central axis of the optical fiber, in combination with the principles of refraction and reflection of light. Therefore, when the optical signal generated by the optical transmitting chip 311 is transmitted to the end face of the optical fiber and reflected, the main optical axis of the reflected optical signal does not coincide with the original transmission optical path, thereby effectively reducing interference on the optical signal generated by modulation of the optical transmitting chip 311 as the reflected optical signal is retransmitted to the optical transmitting chip 311 along the original transmission optical path.

Further, the main reflective optical axis of the first reflective surface 431 is perpendicular to the main plane of the first lens matrix 421, i.e. the main plane of the first lens matrix 421 is inclined 3.8 ° in the direction perpendicular to the central axis of the optical fiber, and the main plane of the first lens matrix 421 is inclined 3.8 ° to the left as shown in fig. 12. So make the optical axis coincidence through the optical axis of the primary optical axis of first plane of reflection 431 reflected light signal and lens in first lens matrix 421, and then make the distribution that first plane of reflection 431 reflected light signal can be even in the both sides of lens optical axis, be convenient for guarantee the effect of assembling of light signal, avoid because the facula leads to the problem that optical coupling efficiency is low, and then guarantee the coupling effect of light signal to the optic fibre.

Fig. 13 is a second cross-sectional view of the interior of an optical module according to some embodiments. As shown in fig. 13, the optical chip 310 includes a plurality of light receiving chips 312, the lens assembly 400 is disposed on the plurality of light receiving chips 312 in a covering manner, a second reflecting surface 432 is formed at the bottom of the first recess 440, and a main optical axis of a light signal reflected by the second reflecting surface 432 is not perpendicular to a receiving optical axis of the light receiving chip 312, so that a main optical axis of the light signal reflected by the second reflecting surface 432 toward the light receiving chip 312 and a main optical axis of the light signal reflected by the light receiving chip 312 form a certain included angle, so as to avoid the main optical axis of the reflected light signal from being overlapped with the main optical axis of the light signal reflected by the second reflecting surface 432 toward the light receiving chip 312. For example, the bottom of the lens assembly 400 is connected to the circuit board 300, the projection of the second reflection surface 432 on the circuit board 300 covers the light receiving chip 312, the optical axis of the light receiving chip 312 is perpendicular to the circuit board 300, the inclination angle of the second reflection surface 432 is 33.3 °, the main optical axis of the light signal reflected by the second reflection surface 432 is not parallel to the optical axis of the light receiving chip 312, and the like, even if the main optical axis of the light signal reflected by the second reflection surface 432 is not perpendicular to the light receiving surface of the light receiving chip 312. In some embodiments of the present application, the optical chip 310 includes 4 light receiving chips 312, but is not limited to 4, and may also include 1, 2, 8, etc.

In some embodiments of the present application, as shown in fig. 13, a second lens matrix 422 is disposed on a side surface of the accommodating groove 420, and lenses in the second lens matrix 422 are used for collimating an optical signal output from an optical fiber and transmitting the collimated optical signal to an optical signal reflected by a second reflecting surface 432, so as to ensure the coupling efficiency of the optical signal output from the optical fiber to the second reflecting surface 432. The number of lenses in the second lens matrix 422 generally corresponds to the number of light-receiving chips 312.

In some embodiments of the present application, as shown in fig. 13, a fourth lens matrix 452 is disposed on the top of the second recess 450, and lenses in the fourth lens matrix 452 are used for collecting the optical signals reflected by the second reflecting surface 432. The fourth lens matrix 452 includes a number of lenses, the number of lenses is generally equal to the number of light receiving chips 312, and each lens is used for correspondingly converging the optical signal to one light receiving chip 312. Illustratively, the focal points of the lenses in the fourth lens matrix 452 are located on the corresponding light-receiving chip 312, so as to further ensure the coupling efficiency of the optical signals to the light-receiving chip 312.

Fig. 14 is a simplified optical path diagram corresponding to fig. 13, showing only the transmission path of the main optical axis of an optical signal, wherein the slope of the end faces of the optical fibers in optical fiber ribbon 510 is 8 °, and the sum of the slope angle of first reflective surface 431 and the slope angle of the end faces of the optical fibers is less than 45 °. In the embodiment of the present application, in order to ensure the coupling efficiency of the optical signal, and combine the refraction and reflection principles of light, when the inclination of the end surface of the optical fiber is 8 °, the incident main optical axis of the second reflection surface 432 is perpendicular to the end surface of the optical fiber (the incident main optical axis of the second reflection surface 432 is perpendicular to the normal of the end surface of the optical fiber), and the included angle between the main optical axis of the output optical signal in the optical fiber and the central axis of the optical fiber is about 3.8 °.

Further, the incident main optical axis of the second reflecting surface 432 is perpendicular to the main plane of the second lens matrix 422, that is, the main plane of the second lens matrix 422 is inclined 3.8 ° perpendicular to the central axis of the optical fiber, and the main plane of the second lens matrix 422 is inclined 3.8 ° to the left as shown in fig. 14. So make the optical axis coincidence of the optical axis of the optical signal of output through optic fibre and lens in the second lens matrix 422, and then the distribution that makes the optical signal of output in the optic fibre can be even is in the both sides of lens optical axis, be convenient for guarantee the collimation effect of optical signal, the coupling efficiency of output optical signal to lens subassembly 400 in the optic fibre.

In some embodiments of the present application, a main reflective optical axis of the second reflective surface 432 is perpendicular to a main plane of the fourth lens matrix 452, such that the main reflective optical axis of the second reflective surface 432 coincides with an optical axis of a lens in the fourth lens matrix 452, and thus an optical signal reflected by the second reflective surface 432 can be uniformly dispersed on two sides of the optical axis of the lens in the fourth lens matrix 452, so as to ensure a converging effect of the lenses in the fourth lens matrix 452. Meanwhile, the main reflection optical axis of the second reflection surface 432 is perpendicular to the main plane of the fourth lens matrix 452, and it can be ensured that the optical signal converged by the lenses in the fourth lens matrix 452 can also be obliquely incident into the optical receiving chip 312, so that the difference between the transmission path of the optical signal reflected by the optical receiving chip 312 and the path of the incident optical signal is relatively large, the transmission path of the optical signal reflected by the optical receiving chip 312 entering the incident optical signal is effectively reduced, and the crosstalk of the reflected optical signal to the incident optical signal and the ratio of the reflected optical signal to the opposite-end optical transmitting chip are greatly reduced. Illustratively, the included angle between the main reflection optical axis of the second reflection surface 432 and the optical axis of the light receiving chip 312 is any angle from 3 ° to 15 °, which not only ensures the coupling efficiency of the light signals emitted by the second reflection surface 432 to the light receiving chip 312, but also has a good anti-emission effect.

Fig. 15 is a third cross-sectional view of the interior of an optical module provided in accordance with some embodiments. As shown in fig. 15, the optical chip 310 includes a plurality of light emitting chips 311 and a plurality of light receiving chips 312, the lens assembly 400 covers the plurality of light emitting chips 311 and the plurality of light receiving chips 312, and a first reflecting surface 431 and a second reflecting surface 432 are formed at the bottom of the first recess 440; the inclination angle of the first reflecting surface 431 is not 45 °, so that the included angle between the first reflecting surface 431 and the optical axis of the light emitting chip 311 is not 45 °, and the first reflecting surface 431 is used for reflecting the optical signal emitted by the light emitting chip 311; the main optical axis of the light signal reflected by the second reflection surface 432 is not perpendicular to the receiving optical axis of the light receiving chip 312, so that a certain included angle exists between the main optical axis of the light signal reflected by the second reflection surface 432 toward the light receiving chip 312 and the main optical axis of the light signal reflected by the light receiving chip 312. Illustratively, the angle of inclination of the first reflective surface 431 is 46.9 °, and the angle of inclination of the second reflective surface 432 is 33.3 °. In some embodiments of the present application, the optical chip 310 includes 4 light emitting chips 311 and 4 light receiving chips 312, which are not limited to 4 each, and can be selected according to the requirement.

In some embodiments of the present application, as shown in fig. 15, a first lens matrix 421 and a second lens matrix 422 are disposed on a side surface of the accommodating groove 420, lenses in the first lens matrix 421 are used for converging the optical signal reflected by the first reflecting surface 431, and lenses in the second lens matrix 422 are used for collimating the optical signal output from the optical fiber and transmitting the collimated optical signal to the optical signal reflected by the second reflecting surface 432.

Of course, in some embodiments of the present application, the first recess 440 and the third recess different from the first recess may be disposed on the top of the lens assembly 400, the bottom of the first recess 440 forms the first reflective surface 431, the bottom of the third recess forms the second reflective surface 432, or the bottom of the first recess 440 forms the second reflective surface 432, and the bottom of the third recess forms the first reflective surface 431.

In the present embodiment, the tilt angles of the reflective surfaces 430 on the lens assembly 400, the tilt angles of the fiber end surfaces of the optical fiber ribbons 510, and the tilt directions are not limited to those shown in the above embodiments, and may be changed. Such as selecting the tilt angle and tilt direction of the fiber end faces in the fiber optic ribbon 510, adapting the tilt angle of the reflective surface 430, etc.

FIG. 16 is a schematic diagram illustrating another arrangement of a first reflective surface and an optical fiber according to some embodiments. As shown in fig. 16, the inclined direction of the end face of the optical fiber in the optical fiber ribbon 510 is changed from that of the end face of the optical fiber in fig. 12, and in order to ensure the coupling efficiency in the optical signal transmission process, the included angle between the first reflective surface 431 and the optical axis of the light emitting chip 311 is adaptively adjusted, for example, the included angle between the first reflective surface 431 and the optical axis of the light emitting chip 311 is 43.1 °, the inclined angle of the first reflective surface 431 is 46.9 °, and the sum of the inclined angle of the first reflective surface 431 and the inclined angle of the end face of the optical fiber is greater than 50 °.

Fig. 17 is a schematic diagram of another arrangement of a second reflective surface and an optical fiber according to some embodiments. As shown in fig. 17, the inclined angle of the end face of the optical fiber in the optical fiber ribbon 510 is changed from that of the second reflecting surface in fig. 14, and the position of the second reflecting surface 432 and the optical axis position of the lens in the fourth lens matrix 452 are adaptively adjusted to ensure the coupling efficiency during the optical signal transmission process. Illustratively, the inclination angle of the second reflecting surface 432 is 42.5 °, and the sum of the inclination angle of the second reflecting surface 432 and the inclination angle of the end face of the optical fiber is greater than 50 °, but the position of the light receiving chip 312 and the position of the fourth lens matrix 452 in the structure shown in fig. 17 are changed compared to the structure shown in fig. 14.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

a circuit board;

the lens component is covered on the optical chip and used for changing the transmission direction of the optical signal;

2. The optical module of claim 1, wherein the reflective surface comprises a first reflective surface, a top portion of the lens assembly is provided with a first recess, and a bottom portion of the first recess forms the first reflective surface;

the optical chip comprises a light emitting chip, the projection of the first reflecting surface on the circuit board covers the light emitting chip, and the sum of the inclination angle of the first reflecting surface and the inclination angle of the end face of the optical fiber is larger than 50 degrees.

3. The optical module of claim 1, wherein the reflective surface comprises a second reflective surface, a top portion of the lens assembly is provided with a first recess, and a bottom portion of the first recess forms the second reflective surface;

the optical chip comprises an optical receiving chip, the projection of the second reflecting surface on the circuit board covers the optical receiving chip, and the sum of the inclination angle of the second reflecting surface and the inclination angle of the end face of the optical fiber is less than 45 degrees.

4. The optical module of claim 1, wherein the optical fiber assembly includes an optical fiber ribbon and an optical fiber stub, the optical fiber stub being disposed at one end of the optical fiber ribbon, an end face of an optical fiber in the optical fiber ribbon being non-perpendicular to a central axis of the optical fiber;

the lens assembly is provided with a clamping groove, and the optical fiber connector is connected with the clamping groove.

5. The optical module of claim 2, wherein a side surface of the lens assembly is provided with a first lens matrix, and a reflection principal optical axis of the first reflection surface is perpendicular to a principal plane of the first lens matrix.

6. The optical module of claim 3, wherein a second lens matrix is disposed on a side surface of the lens assembly, and an incident main optical axis of the second reflecting surface is perpendicular to a main plane of the second lens matrix.

7. The optical module according to claim 4, wherein the optical fiber penetrates through the optical fiber connector, an end surface of the optical fiber is located outside the optical fiber connector, the clamping groove is provided with a receiving groove along a side of the optical fiber extending direction and away from the optical fiber connector, and an end of the optical fiber penetrates into the receiving groove.

8. The optical module according to claim 7, wherein a first lens matrix and a second lens matrix are disposed on a side wall of the accommodating groove, and the reflective surface includes a first reflective surface and a second reflective surface; a first recess is formed in the top of the lens assembly, the bottom of the first recess forms a first reflecting surface and a second reflecting surface, a main reflection optical axis of the first reflecting surface is parallel to an optical axis of the first lens matrix, and a normal of an end face of the optical fiber is parallel to an optical axis of the second lens matrix;

the optical chip comprises a light emitting chip and a light receiving chip, the projection of the first reflecting surface on the circuit board covers the light emitting chip, the projection of the second reflecting surface on the circuit board covers the light receiving chip, the sum of the inclination angle of the first reflecting surface and the inclination angle of the end face of the optical fiber is larger than 50 degrees, and the sum of the inclination angle of the second reflecting surface and the inclination angle of the end face of the optical fiber is smaller than 45 degrees.

9. The light module of claim 2, wherein a bottom of the lens assembly is provided with a second recess, a top of the second recess is provided with a third lens matrix, and a projection of the third lens matrix on the circuit board covers the light emitting chip;

and/or the focal point of the third lens matrix is located on the light emitting chip.

10. The optical module as claimed in claim 3, wherein the bottom of the lens assembly is provided with a second recess, the top of the second recess is provided with a fourth lens matrix, and the projection of the fourth lens matrix on the circuit board covers the light receiving chip; a reflection main optical axis of the second reflection surface is vertical to a main plane of the fourth lens matrix;

and/or the focal point of the fourth lens matrix is positioned on the light receiving chip.