CN110501789A - A kind of optical module - Google Patents

A kind of optical module Download PDF

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Publication number
CN110501789A
CN110501789A CN201910812590.0A CN201910812590A CN110501789A CN 110501789 A CN110501789 A CN 110501789A CN 201910812590 A CN201910812590 A CN 201910812590A CN 110501789 A CN110501789 A CN 110501789A
Authority
CN
China
Prior art keywords
optical
lens subassembly
light
lens
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910812590.0A
Other languages
Chinese (zh)
Inventor
邵乾
刘旭霞
罗成双
宿靖啟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Priority to CN201910812590.0A priority Critical patent/CN110501789A/en
Publication of CN110501789A publication Critical patent/CN110501789A/en
Priority to CN202010048813.3A priority patent/CN112444923A/en
Priority to PCT/CN2020/111499 priority patent/WO2021037085A1/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206Optical features
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4215Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers

Abstract

The invention discloses a kind of optical modules, according to different optical power attenuation requirements, using separated structure, including the first lens subassembly and the second lens subassembly.The top of second lens subassembly is equipped with filter plate, and filter plate is equipped with optical fiber interface far from the side of incidence surface, and the lightray propagation from optical fiber interface is reflected to filter plate, and reflected light travels are in the light-receiving chip array of the second lens subassembly bottom.Reflecting surface is formed on the top of the first lens subassembly, and the lightray propagation that laser chip array issues to reflecting surface generates reflection, and reflected light is projected by light-emitting surface and entered in the optical fiber interface in the second lens subassembly.The optical signal power attenuation degree of first lens subassembly is greater than the optical signal power attenuation degree of the second lens subassembly, first lens subassembly decays to the optical power of the optical signal of laser chip array emitter, it is consistent optical power required by the optical power for being finally coupled into optical fiber interface and optical fiber interface, guarantees optical coupling effect.

Description

A kind of optical module
Technical field
The present invention relates to technical field of optical fiber communication more particularly to a kind of optical modules.
Background technique
COB (chip On board) technique platform in the encapsulation of optical module product has low cost, high density, high frequency The advantages such as performance is good, packaging technology is simple, more and more optical modules will be turned by traditional coaxial or micro-optics technique platform For COB technique platform.Multimode parallel optical fibre encapsulation technology is largely produced using COB production technology platform at present, and For multimode single fiber bi-directional technology or wavelength-division multiplex technique, since cost and technology etc. factor are not solved well Certainly, it is not yet realized on COB technique platform.
In order to realize multimode single fiber bi-directional technology on COB technique platform, using multimode single fiber bi-directional technology In optical module, including laser chip array and light-receiving chip array, the two share an optical fiber interface.Light is realized in optical module During the transmitting-receiving of signal, the optical signal of laser chip array emitter is penetrated after propagating to optical fiber interface by the first lens array Out, the transmitting of optical signal is realized;And the optical signal from optical fiber interface then passes through the second lens array by light-receiving chip array It receives, realizes the reception of optical signal.
The optical module of existing single fiber bi-directional is an integral molding structure, since laser chip array has different luminous function Rate, when the optical signal coupled into optical fibres interface of different optical powers, so that cannot keep one with optical power needed for optical module product It causes, i.e., optical signal power required by the optical signal power and optical fiber interface of coupled into optical fibres interface is inconsistent, and then influences light The optical coupling effect of module.
Summary of the invention
The present invention provides a kind of optical modules, apply optical coupling when on COB technique platform to solve existing optical module The problem of effect difference.
The present invention provides a kind of optical modules, comprising: circuit board, and, the first lens being attached on the circuit board Component and the second lens subassembly, the light-emitting surface of first lens subassembly are opposite with the incidence surface of second lens subassembly;
The top of second lens subassembly is equipped with inclined filter plate, and the bottom of second lens subassembly connects equipped with light Receive chip array;The light-receiving chip array is placed on the circuit board, and is located at the circuit board and described second thoroughly Between mirror assembly;The side far from the incidence surface of the filter plate is equipped with optical fiber interface, the light from the optical fiber interface Signal reflects after traveling to the filter plate, in the reflected light travels to the light-receiving chip array of formation;
Inclined reflecting surface is formed on the top of first lens subassembly, and the bottom of first lens subassembly is equipped with laser Chip array, the laser chip array are placed on the circuit board, and are located at the circuit board and second lens group Between part;Generate and reflect after the lightray propagation to the reflecting surface that the laser chip array issues, the reflected light of formation by The light-emitting surface projects, then enters in the optical fiber interface in second lens subassembly via the incidence surface;
The material of first lens subassembly is different with the material of second lens subassembly, first lens subassembly Optical signal power attenuation degree is greater than the optical signal power attenuation degree of second lens subassembly.
From the above technical scheme, a kind of optical module provided in an embodiment of the present invention, according to different optical power attenuations It is required that specifically including the first lens subassembly and the second lens subassembly using separated structure.The top of second lens subassembly is equipped with filter The side of wave plate, the separate incidence surface of filter plate is equipped with optical fiber interface, after the lightray propagation to filter plate from optical fiber interface It reflects, the reflected light travels of formation are in the light-receiving chip array of the second lens subassembly bottom.First lens group Reflecting surface is formed on the top of part, generates reflection, the reflection of formation after the lightray propagation to reflecting surface that laser chip array issues Light is projected by light-emitting surface and is entered in the optical fiber interface in the second lens subassembly.The optical signal power decaying journey of first lens subassembly Degree is greater than the optical signal power attenuation degree of the second lens subassembly, enables the first lens subassembly to laser chip array emitter The optical power of optical signal decay, make light function required by the optical power for being finally coupled into optical fiber interface and optical fiber interface Rate is consistent, and guarantees optical coupling effect.
Detailed description of the invention
In order to illustrate more clearly of technical solution of the present invention, letter will be made to attached drawing needed in the embodiment below Singly introduce, it should be apparent that, for those of ordinary skills, without any creative labor, It is also possible to obtain other drawings based on these drawings.
Fig. 1 is optical communication terminal connection relationship diagram;
Fig. 2 is optical network unit structural schematic diagram;
Fig. 3 is a kind of optical module structure schematic diagram provided in an embodiment of the present invention;
Fig. 4 provides optical module decomposition texture schematic diagram for the embodiment of the present invention;
Fig. 5 is the three-dimensional structure diagram of optical module provided in an embodiment of the present invention;
Fig. 6 is the exploded side figure of optical module provided in an embodiment of the present invention;
Fig. 7 is the structural schematic diagram of the second lens subassembly provided in an embodiment of the present invention;
Fig. 8 is the structure schematic diagram of the second lens subassembly provided in an embodiment of the present invention;
Fig. 9 is the index path of optical module provided in an embodiment of the present invention;
Figure 10 is the decomposition chart of optical module provided in an embodiment of the present invention;
Figure 11 is the section view decomposition texture schematic diagram of optical module provided in an embodiment of the present invention;
Figure 12 is the cross-sectional view of optical module provided in an embodiment of the present invention;
Figure 13 is the structure schematic diagram of the first lens subassembly provided in an embodiment of the present invention;
Figure 14 is the patch relative position angle of laser chip array provided in an embodiment of the present invention and light-receiving chip array Spend the biggish schematic diagram of deviation;
Figure 15 is signal when light-receiving chip array provided in an embodiment of the present invention and the second lens subassembly are coupled and aligned Figure;
Figure 16 is schematic diagram when laser chip array provided in an embodiment of the present invention and the first lens subassembly are coupled and aligned.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
The core link of fiber optic communication first is that the conversion of photosignal.Fiber optic communication is existed using the optical signal for carrying information It is transmitted in optical fiber/optical waveguide, low cost may be implemented using the passive transmission characteristic of light in a fiber, low-loss information passes It is defeated.And the information processing equipments such as computer are using electric signal, this just need to realize in signals transmission electric signal with The mutual conversion of optical signal.
Optical module realizes above-mentioned photoelectric converting function in technical field of optical fiber communication, and optical signal and the mutual of electric signal turn Change be optical module core function.Optical module realizes being electrically connected between external host computer by the golden finger on circuit board, Main electrical connection includes power supply, I2C signal, transmission data-signal and ground connection etc., and the electric connection mode that golden finger is realized is Through becoming the standard mode of optical module industry, based on this, circuit board is technical characteristic indispensable in most of optical module.
Fig. 1 is optical communication terminal connection relationship diagram.As shown in Figure 1, the connection of optical communication terminal mainly includes light net Network unit 100, optical module 200, optical fiber 101 and cable 103;
One end of optical fiber connects remote server, and one end of cable connects local information processing equipment, local information processing The connection of equipment and remote server is completed by the connection of optical fiber and cable;And the connection between optical fiber and cable is by with optical mode The optical network unit of block is completed.
The optical port of optical module 200 is connect with optical fiber 101, is established two-way optical signal with optical fiber and is connect;The electricity of optical module 200 In mouth access optical network unit 100, two-way electric signal is established with optical network unit and is connect;Optical module realizes optical signal and telecommunications Number mutual conversion, thus realize connection is established between optical fiber and optical network unit;Specifically, from the optical signals of optical fiber Optical module is input in optical network unit 100 after being converted to electric signal, and the electric signal from optical network unit 100 is turned by optical module Optical signal is changed to be input in optical fiber.Optical module 200 is the tool realizing photosignal and mutually converting, without processing data Function, in above-mentioned photoelectric conversion process, information does not change.
Optical network unit has optical module interface 102, for accessing optical module, establishes two-way electric signal with optical module and connects It connects;There is optical network unit cable interface 104 to establish two-way electric signal for accessing cable with cable and connect;Optical module with Connection is established by optical network unit between cable, specifically, the signal from optical module is passed to cable by optical network unit, Signal from cable is passed into optical module, work of the optical network unit as the ipc monitor optical module of optical module.
So far, remote server is by optical fiber, optical module, optical network unit and cable, with local information processing equipment it Between establish two-way signal transmission channels.
Common information processing equipment includes router, interchanger, electronic computer etc.;Optical network unit is optical module Host computer provides data-signal to optical module, and receives the data-signal from optical module, and common optical module host computer is also Optical line terminal etc..
Fig. 2 is optical network unit structural schematic diagram.As shown in Fig. 2, having circuit board 105, In in optical network unit 100 Cage 106 is arranged in the surface of circuit board 105;It is provided with electric connector in cage 106, for accessing the optical modules such as golden finger electricity Mouthful;Radiator 107 is provided on cage 106, radiator 107 has the bulge-structures such as the fin of increasing heat radiation area.
Optical module 200 is inserted into optical network unit, specially the electric connector in the power port insertion cage 106 of optical module, The optical port of optical module is connect with optical fiber 101.
Cage 106 is located on circuit board, and the electric connector on circuit board is wrapped in cage;Optical module is inserted into cage In, by the fixed optical module of cage, the heat that optical module generates is conducted to cage by optical module shell, eventually by cage Radiator 107 is diffused.
Fig. 3 is a kind of optical module structure schematic diagram provided in an embodiment of the present invention, and Fig. 4 provides optical mode for the embodiment of the present invention Block decomposition texture schematic diagram.As shown in Figure 3, Figure 4, optical module 200 provided in an embodiment of the present invention includes upper housing 201, lower casing Body 202, release lever 203, circuit board 300 and lens subassembly 400.
Upper housing and lower case form tool there are two the package cavity being open, and specifically can be and open at unidirectional both ends Mouth (204,205) is also possible to be open at two in different directions;One of opening is power port 204, for being inserted into light net In the host computers such as network unit, another opening is optical port 205, is accessed for external fiber to connect internal optical fiber, circuit board 300, the photoelectric devices such as lens subassembly 400 and fiber adapter 500 are located in package cavity.
Upper housing and lower case generally use metal material, are conducive to realize electromagnetic shielding and heat dissipation;Using upper housing, under The shell of optical module will not be generally made by the assembly method that shell combines convenient for the devices such as circuit board are installed in shell Integral structure, in this way in devices such as wiring harness plates, positioning element, heat dissipation and electromagnetic armouring structure can not be installed, also not Conducive to production automation.
Release lever 203 is located at the outer wall of package cavity/lower case 202, pulls the end of release lever that can make to solve Handle is locked to relatively move in outer wall surface;Optical module is fixed on the cage of host computer by optical module by release lever when being inserted into host computer In son, by pulling release lever to release the snap-fit relationship of optical module and host computer, so as to by optical module from host computer Cage in extract out.
Be provided on circuit board 300 light emitting chip, the driving chip of light emitting chip, light-receiving chip, across resistance amplify Chip, limited range enlargement chip and microprocessor chip etc., wherein light emitting chip and light-receiving chip are directly mounted on optical module Circuit board on, such form in the industry be known as COB (chip on board) encapsulation.
Lens subassembly 400 is arranged on the circuit board 300, and the top of optical chip, lens are arranged in by the way of being provide with formula Component 400 and circuit board 300 form the cavity of the optical chips such as package light emitting chip, light-receiving chip.Light emitting chip issues Light after lens subassembly reflects enter optical fiber in, the light from optical fiber after lens subassembly reflects enter light-receiving chip in, Lens subassembly not only acts as the effect of sealing optical chip, while also establishing the light connects between optical chip and optical fiber.
High speed data transfers require closely to be arranged between optical chip and its driving/matching chip, with shorten chip it Between line, reduce the loss of signal caused by line, and lens subassembly 400 is located at the top of optical chip, so lens subassembly Generally optical chip and its driving/matching chip are provide with simultaneously.So the driving chip of light emitting chip and light emitting chip Closely it is arranged, lens subassembly is provide with the driving chip of light emitting chip Yu light emitting chip;Light-receiving chip amplifies with across resistance Chip is closely arranged, and lens subassembly is provide with light-receiving chip and across resistance amplification chip.
The general very little of the size of optical chip, and driving/matching chip size of optical chip is generally very big, especially realizes Driving/matching chip of 100G or more rate, and the size of lens subassembly is limited, optical chip and its driving/matching chip are set There are certain limitation, not too many spatial degrees of freedom for seated position.
In order to realize multimode single fiber bi-directional technology on COB technique platform, and it can guarantee optical coupling effect, this hair Bright embodiment provides a kind of optical module of single fiber bi-directional, the optical texture of the optical module is separated into two structures, using note It moulds technique and forms two independent lens subassemblies, the patch precision of laser chip array and light-receiving chip array is wanted in reduction Ask, between laser chip array and light-receiving chip array relative position and angle requirement it is more loose, avoid optical path from occurring inclined Coupling effect that is poor and influencing optical module.Meanwhile decaying to the optical power of the optical signal of laser chip array emitter, make most The optical power for being coupled into optical fiber interface eventually is consistent, and is further ensured that optical coupling effect.
Optical module provided in an embodiment of the present invention uses Shooting Technique to its optical texture, easy to produce, at low cost;And When being produced using the optical texture in optical module provided in an embodiment of the present invention for COB light engine, simple production process is improved Production yield.The beneficial effect that the optical module provided for the embodiment of the present invention will be further explained can obtain, according to following implementations The content of example is illustrated the specific structure of optical module.
Fig. 5 is the three-dimensional structure diagram of optical module provided in an embodiment of the present invention, and Fig. 6 is optical mode provided in an embodiment of the present invention The exploded side figure of block, Fig. 7 are the structural schematic diagram of the second lens subassembly provided in an embodiment of the present invention.
Referring to Fig. 5, Fig. 6 and Fig. 7, in order to realize that multimode single fiber bi-directional technology, the present invention are real on COB technique platform A kind of optical module of example offer is provided, comprising: circuit board 7, and, the first lens subassembly 1 and second being attached on circuit board 7 is saturating Mirror assembly 2.Optical module provided in this embodiment will realize that optical signal receives and the optical texture of transmitting is separated into two structures, Respectively the first lens subassembly 1 and the second lens subassembly 2, by the first lens subassembly 1 for realizing the transmitting of optical signal, by second Lens subassembly 2 for realizing optical signal reception.
Since the optical texture in optical module provided in this embodiment no longer uses integrally formed structure, but uses and divide From structure, therefore, for the optical texture for guaranteeing two separation, i.e. the first lens subassembly 1 and the second lens subassembly 2 are able to carry out light The propagation of signal, the incidence surface 25 of the light-emitting surface 15 of the first lens subassembly 1 and the second lens subassembly 2 is opposite, so that by first The optical signal that lens subassembly 1 projects is able to enter in the second lens subassembly 2, and by the optical fiber interface 31 in the second lens subassembly 2 It receives.
The reception of optical signal is realized in second lens subassembly 2, the top of the second lens subassembly 2 is equipped with inclined filter plate 21, specifically, forming the bracket 22 with tilt angle at the top of the second lens subassembly 2, filter plate 21 is fixed on bracket On 22, the mode of glue bonding can be used, so that filter plate 21 is heeling condition, filter plate 21 is for realizing the anti-of optical signal It penetrates.The bottom of second lens subassembly 2 is equipped with light-receiving chip array 23, and light-receiving chip array 23 is placed on circuit board 7, and Between circuit board 7 and the second lens subassembly 2.For realize optical signal reception, light-receiving chip array 23 and for realizing The amplifying circuit for receiving optical signal is located at the underface of filter plate 21, and is fitted on circuit board 7, so that light-receiving chip array 23 optical path is corresponding with the optical path of filter plate 21.
As the optical module of single fiber bi-directional, the reception and transmitting of optical signal are realized by an optical fiber, i.e. the optical fiber both received Optical signal from the first lens subassembly 1, but the light-receiving chip array 23 into the second lens subassembly 2 emits optical signal, with It is received by light-receiving chip array 23.For this purpose, optical fiber interface 31 is arranged in the second lens subassembly 2 in the present embodiment.It is filtering The side of the separate incidence surface 25 of wave plate 21 is equipped with optical fiber interface 31, and the light-emitting window of optical fiber interface 31 and the light of filter plate 21 reflect Face is opposite, reflects after the lightray propagation from optical fiber interface 31 to filter plate 21, and the reflected light travels of formation connect to light It receives in chip array 23.
Filter plate 21 is tilted along the direction of 31 to the first lens subassembly 1 of optical fiber interface, and tilt angle can be 40 ° to 50 °, is come Reflection is generated from after the lightray propagation to the filter plate 21 being obliquely installed of optical fiber interface 31, optical path turns 90 °, and reflection direction court To 23 direction of light-receiving chip array, the reflected light for enabling optical path to turn 90 ° is received by light-receiving chip array 23.
Since the optical signal from optical fiber interface 41 is diverging light, to guarantee optical coupling effect, light loss is avoided the occurrence of, this In embodiment, the third lens array 4 is equipped between optical fiber interface 31 and filter plate 21.Two optical ports of the third lens array 4 (light inlet and light-emitting window) is opposite with the light receiving surface of the light-emitting window of optical fiber interface 31 and filter plate 21 respectively, by the third lens battle array Column 4 collimate the optical signal from optical fiber interface 41, and the directional light made is propagated to the direction of filter plate 21.
The direction of propagation of optical signal from optical fiber interface 31 is horizontal direction, to guarantee that the third lens array 4 can be right Optical signal from optical fiber interface 31 is collimated, and in the present embodiment, the third lens array 4 is vertically arranged, so that coming from light The optical signal of fine interface 31 can pass through the third lens array 4.
Fig. 8 is the structure schematic diagram of the second lens subassembly provided in an embodiment of the present invention.Optical signal is in filter plate 21 Place is when reflecting, and to avoid optical signal from dissipating, influences optical coupling effect, in the present embodiment, as shown in Figure 6 and Figure 8, connects in light It receives and is equipped with the second lens array 24 between chip array 23 and filter plate 21, the light inlet and filter plate 21 of the second lens array 24 Relatively, the light-emitting window of the second lens array 24 and light-receiving chip array 23 are opposite.Second lens array 24 is in filter plate 21 Generation reflection is propagated through the optical signal come and is assembled, so that converging light travels in light-receiving chip array 23.
In the present embodiment, the second lens array 24 can be integrally formed by the second lens subassembly 2, the setting of the second lens array 24 At the back side of the second lens subassembly 2, light-receiving chip array 23 is fitted in by the back side of the second lens subassembly 2 towards circuit board 7 On circuit board 7, and make the light sensation of light-receiving chip array 23 facing towards the second lens array 24, so that light-receiving chip array 23 The optical signal after being assembled by the second lens array 24 can be received.
The index path of optical module shown in Figure 9, such as the lightray propagation path of a length of λ 2 of figure medium wave, in the second lens Lightray propagation path in component 2 are as follows: after the optical signal from optical fiber interface 31 is collimated via the third lens array 4, formed Parallel light propagation to filter plate 21 after reflect, optical path turns 90 °, and the reflected light of formation is by the convergence of the second lens array 24 Afterwards, the light-receiving chip array 23 for being located at 24 lower section of the second lens array receives.
The propagation of optical signal and the installation of optical fiber interface 31 can be achieved at the same time in second lens subassembly 2, for this purpose, can be by second thoroughly Mirror assembly 2 is separated into two parts, propagation of the part for realizing optical signal, the peace of another part realization optical fiber interface 31 Dress.
Figure 10 is the decomposition chart of optical module provided in an embodiment of the present invention, and Figure 11 is light provided in an embodiment of the present invention The section view decomposition texture schematic diagram of module, Figure 12 are the cross-sectional view of optical module provided in an embodiment of the present invention.
Referring to Figure 10, Figure 11 and Figure 12, in the present embodiment, it is equipped with fixed frame 5 in the second lens subassembly 2, fixed frame 5 is along hanging down Directly it is arranged in the direction of paths, the second lens subassembly 2 is separated into paths cavity 210 and optical fiber fixed cavity 220, paths cavity 210 for realizing propagation of the optical signal from the first lens subassembly 1 in the second lens subassembly 2 and The propagation of optical signal from optical fiber interface 31, optical fiber fixed cavity 220 is for fixing optical fiber interface 31.
For realizing the received device of optical signal (light-receiving chip array 23, filter plate 21, the second lens array 24 and Three lens arrays 4) it is located in paths cavity 210, and optical fiber interface 31 and its fixed structure are located at optical fiber fixed cavity 220 It is interior.
Fixation of the fixed frame 5 for realizing the third lens array 4, the light-emitting window of the third lens array 4 and optical fiber interface 31 It is corresponding, to enable the optical signal from optical fiber interface 31 to travel to the third lens array 4, in the present embodiment, on fixed frame 5 Equipped with paths mouth 6, the third lens array 4 is mounted on paths mouth 6, so that the third lens array 4 is passed by optical path It is corresponding with the light-emitting window of optical fiber interface 31 to broadcast mouth 6.
For optical fiber interface 31 is fixed, in the present embodiment, fiber retention structures are equipped in optical fiber fixed cavity 220 3, optical fiber interface 31 is installed in fiber retention structures 3.When installing optical fiber interface 31, can be opened up in fiber retention structures 3 Multiple V-grooves 33, each V-groove 33 is for fixing an optical fiber interface 31.The fixed form of optical fiber interface 31 and V-groove 33 can By the way of glue bonding, optical fiber interface 31 is sticked in corresponding V-groove 33.
As shown in figure 12, when fiber retention structures 3 are fixed in optical fiber fixed cavity 220, fiber retention structures 3 with Fixed frame 5 is bonded, and the gap formed between fiber retention structures 3 and fixed frame 5 is paths mouth 6, for realizing light letter Number propagation.Optical fiber interface 31 and the third lens array 4 and non-direct contact, the optical signal from optical fiber interface 31 is first in optical fiber It is propagated in fixed structure 3, then 3 backward light path of output fiber fixed structure is propagated mouth 6 and propagated, that is to say, that come from optical fiber interface 31 optical signal enters back into the third lens array 4 after need to propagating stretch diameter in air, and optical signal is propagated in air Region be that paths mouth 6 is formed by region.
For the fixation for realizing fiber retention structures 3, avoid fiber retention structures 3 are unstable optical fiber interface 31 is caused to issue There is deviation in the propagation path of optical signal, influences optical coupling effect, and in the present embodiment, two light are symmetrically arranged on fixed frame 5 Fine fixing piece 32.Two optical fiber fixing pieces 32 are located in optical fiber fixed cavity 220, fiber retention structures 3 towards fixed frame 5 One end is symmetrically arranged with two mounting hole (not shown)s, optical fiber fixing piece 32 is embedded in the mounting hole of fiber retention structures 3, To fix fiber retention structures 3.
In second lens subassembly 2 provided in an embodiment of the present invention, the second lens array 24 and the third lens array 4 can be adopted It is integrally formed with the mode of injection molding, filter plate 21 is then fixed in the second lens subassembly 2 by the way of glue bonding.Second thoroughly The 23 received optical signal of institute of light-receiving chip array comes from optical fiber interface 31, the optical signal from optical fiber interface 31 in mirror assembly 2 The optical power that is required closer to optical module of optical power the light function to optical signal is not therefore needed in the second lens subassembly 2 Rate decays, and the optical signal from optical fiber interface 31 is directly reflected into light-receiving chip array 23.
For this purpose, hollow structure, i.e. paths can be used in the part for realizing lightray propagation of the second lens subassembly 2 Cavity 210 is hollow structure.And the first lens subassembly 1 realizes that the device of transmitting optical signal is for realizing the transmitting of optical signal Laser chip array 13 is higher than required by optical module in general, the optical power for the optical signal that laser chip array 13 emits is higher Optical power.Therefore, it is the consistency of the optical power of guarantee optical module, that is, guarantees the optical signal power of coupled into optical fibres interface 31 It is consistent with optical power required by optical fiber interface 31, need the optical power for emitting laser chip array 13 optical signal to decline Subtract.
In the present embodiment, for enable the first lens subassembly 1 to laser chip array 13 emit optical signal optical power into Row decaying, in such a way that the material of the first lens subassembly 1 and the material of the second lens subassembly 2 are different, makes the first lens subassembly 1 Optical signal power attenuation degree be greater than the second lens subassembly 2 optical signal power attenuation degree.
It specifically, is the optical signal power attenuation degree for improving the first lens subassembly 1, the first lens subassembly 1 can be solid Structure, and other substances are adulterated in the injected plastics material of the first lens subassembly 1, which can be used for the optical power that decays, such as stone Ink.By adjusting the doping ratio of addition graphite in the injected plastics material of the first lens subassembly 1, difference is realized to adjust optical module The optical power attenuation of degree makes final so that the optical power of the optical signal of the first lens subassembly 1 transmitting meets the demand of optical module The optical power for being coupled into optical fiber interface 31 is consistent, and guarantees optical coupling effect.
For realizing the transmitting of optical signal in first lens subassembly 1, referring again to Fig. 5 and Fig. 6, the first lens subassembly 1 Inclined reflecting surface 12 is formed on top.Since the first lens subassembly 1 is solid construction, the mode for forming reflecting surface 12 can To dig a groove 11 downwards at the top of the first lens subassembly 1, a face of groove 11 is inclined-plane, the inclined direction on the inclined-plane To be tilted down along close to the second lens subassembly 2 to the direction far from the second lens subassembly 2.The inclined-plane is reflecting surface 12, instead It penetrates face 12 to be obliquely installed, for realizing the reflection of optical signal, optical path is made to turn 90 °.
The bottom of first lens subassembly 1 is equipped with laser chip array 13, and laser chip array 13 is placed on circuit board 7, And between circuit board 7 and the second lens subassembly 2.For the transmitting for realizing optical signal, by laser chip array 13 and it is used to drive The laser circuit driving of dynamic laser chip array 13 is fitted on circuit board 7, and is located at the underface of reflecting surface 12, so that swashing The light-emitting window of optical chip array 13 is corresponding with reflecting surface 12, and the optical signal emitted convenient for laser chip array 13 can travel to instead It penetrates on face 12.
Due to the optical module that optical module provided in this embodiment is single fiber bi-directional, the reception of optical signal is realized by an optical fiber And transmitting.And the optical fiber interface 31 for being used to receive optical signal is arranged in the second lens subassembly 2, therefore, it is necessary to the first lens groups The optical module that part 1 emits can travel in the optical fiber interface 31 in the second lens subassembly 2.
In the present embodiment, the first lens subassembly 1 and the second lens subassembly 2 are relatively independent optical texture, the first lens The incidence surface 25 of the light-emitting surface 15 of component 1 and the second lens subassembly 2 is opposite, and the two is fitted on circuit board 7, but at a distance of one section Distance, so that the optical signal projected by the first lens subassembly 1 enters back into the second lens group after need to propagating a distance in air In part 2.And in the first lens subassembly 1, lightray propagation path are as follows: the lightray propagation that laser chip array 13 issues is to instead Reflection is generated after penetrating face 12, optical path turns 90 °, and the direction where reflection direction towards the second lens subassembly 2, so that optical path turns 90 ° of reflected light is projected by light-emitting surface 15, then is entered in the optical fiber interface 31 in the second lens subassembly 2 via incidence surface 25.
In the second lens subassembly 2, due to optical fiber interface 31 light inlet respectively with filter plate 21 and the third lens array 4 It relatively, need to be by filter plate 21 and the so that the optical signal that launches of the first lens subassembly 1 is before entering optical fiber interface 31 Three lens arrays 4, the at this time effect of filter plate 21 are that the optical signal for allowing the first lens subassembly 1 to launch penetrates, using The third lens array 4 enters optical fiber interface 31 after assembling.
Figure 13 is the structure schematic diagram of the first lens subassembly provided in an embodiment of the present invention.Due to laser chip array 13 optical signals issued are diverging light, to guarantee optical coupling effect, light loss are avoided the occurrence of, in the present embodiment, such as Fig. 6 and Figure 13 It is shown, the first lens array 14 is equipped between laser chip array 13 and reflecting surface 12.The light inlet of first lens array 14 Opposite with the light-emitting window of laser chip array 13, the light-emitting window and reflecting surface 12 of the first lens array 14 are opposite, by the first lens The optical signal that array 14 emits laser chip array 13 is assembled, and the converging light made is passed to the direction of reflecting surface 12 It broadcasts.
In the present embodiment, the first lens array 14 can be integrally formed by the first lens subassembly 1, the setting of the first lens array 14 At the back side of the first lens subassembly 1, laser chip array 13 is fitted in electricity towards circuit board 7 by the back side of the first lens subassembly 1 On road plate 7, and make the light-emitting window of laser chip array 13 towards the first lens array 14, so that laser chip array 13 issued Optical signal is propagated to the direction of the first lens array 14.
The direction of propagation for the optical signal that laser chip array 13 issues is from the bottom to top, therefore, to guarantee the first lens array The optical signal that column 14 can issue laser chip array 13 is assembled, in the present embodiment, the first lens array 14 is horizontal It places, the optical signal vertically propagated that laser chip array 13 is issued passes through the first lens array 14.
The index path of optical module shown in Figure 9, such as the lightray propagation path of a length of λ 1 of figure medium wave, the first lens group The propagation path of the transmitting optical signal of part 1 are as follows: after the optical signal that laser chip array 13 issues is assembled via the first lens array 14, The converging light of formation generates reflection after traveling to reflecting surface 12, and optical path turns 90 °, and the reflected light of formation is projected by light-emitting surface 15, In Entered in the second lens subassembly 2 after air borne a distance by incidence surface 25, optical signal enters third after penetrating filter plate 21 Lens array 4 is assembled, and the converging light of formation enters in optical fiber interface 31.
The embodiment of the present invention provides optical module, what the first lens subassembly 1 therein needed to emit laser chip array 13 The optical power of optical signal decays, so that the coupled optical power of optical module is consistent, connects even if being finally coupled into optical fiber The optical power of mouth 31 is consistent with optical power required by optical fiber interface 31.Previous embodiment is used in the first lens subassembly 1 Injected plastics material in add the mode of the material for the optical power that can be used for decaying such as graphite, and in other embodiments, also can be used The mode of plating decaying film on reflecting surface 12.
Specifically, in the present embodiment, decaying film is coated on reflecting surface 12, decaying film is used to send out laser chip array 13 The optical power of optical signal out decays, so that the optical signal that laser chip array 13 emits is traveling to the progress of reflecting surface 12 When reflection, while decaying to the optical power of optical signal.It, can be according to the demand optical power of optical module, In in practical plated film Plating has the decaying film that can be realized with the consistent attenuation degree of the coupled optical power of optical module on reflecting surface 12, so that by anti- Optical signal after penetrating the reflection of face 12 and decay power can satisfy the demand of optical module, the i.e. light of the transmission of optical fiber interface 31 optical signal Power requirement guarantees optical coupling effect.
In order to enable the first lens subassembly 1 to decay the optical power for the optical signal that laser chip array 13 emits, The mode of the plating decaying film on the first lens array 14 also can be used.If 24 phase of the first lens array 14 and the second lens array Away from relatively closely, when carrying out plating decaying film to the first lens array 14, easily it is plated on the second lens array 24.And the second lens array Carry out optical power attenuation is not required here for realizing the convergence of the optical signal from optical fiber interface 31 in column 24.If the second lens It is coated with decaying film on array 24, the optical power for receiving optical signal can be reduced again, lead to the received light of light-receiving chip array 23 Signal power is different from coupled optical power needed for optical module, influences coupling effect.
Therefore, in the present embodiment, by the second lens array 24 far from the first lens array 14.It is provided in an embodiment of the present invention Optical module uses separated structure, and the first lens subassembly 1 is separated by a certain distance with the second lens subassembly 2, so that the first lens array 14 and second lens array 24 also a distance away, it is possible to avoid the plating when plating decaying film to the first lens array 14 Onto the second lens array 24, decline in the first lens subassembly 1 of guarantee to the optical power for the optical signal that laser chip array 13 emits In the case where subtracting, it not will lead to the second lens subassembly 2 and the optical power of optical signal had an impact, and then can guarantee optical module Optical coupling effect.
The optical texture of optical module is separated into two using isolated structure by optical module provided in an embodiment of the present invention Part, respectively the first lens subassembly 1 and the second lens subassembly 2.The laser chip array 13 of the lower section of first lens subassembly 1 and the The mode that the light-receiving chip array 23 of two lens subassemblies, 2 lower section is all made of fitting attaches on circuit boards, and is to guarantee optical mode The optical coupling effect of block, it is very high to the patch required precision of laser chip array 13 and light-receiving chip array 23, so that laser The light-emitting window of chip array 13 can be opposite with the first lens subassembly 1, makes the light inlet and second of light-receiving chip array 23 thoroughly Mirror assembly 2 is opposite.
Due in the first lens subassembly 1 the first lens array 14 and reflecting surface 12 with the one of the first lens subassembly 1 at Type, the second lens array 24 and filter plate 21 in the second lens subassembly 2 are integrally formed with the second lens subassembly 2, so that the Optical path between one lens array 14 and reflecting surface 12 is stable, between the second lens array 24 and filter plate 21 optical path It is stable, is not in deviate.And if the relative position of laser chip array 13 and light-receiving chip array 23 occurs Deviation, then will lead to laser chip array 13 and the optical path of the first lens array 14 deviates, and, lead to light-receiving core Chip arrays 23 and the optical path of the second lens array 24 deviate, it will influence optical coupling effect.
As it can be seen that when the relative position tolerance of laser chip array 13 and light-receiving chip array 23 is larger, such as tolerance When greater than 7 μm, will lead to laser chip array 13 and light-receiving chip array 23 can not couple with fiber array simultaneously, can It can will appear that laser couples and light-receiving chip array 23 can not be coupled to best situation, either conversely, the two Best situation can not be coupled to.
To avoid laser chip array 13 and the relative position of light-receiving chip array 23 from deviation occur, guarantee optical module Optical texture is separated into the first lens subassembly 1 and the second lens group by optical coupling effect, optical module provided in an embodiment of the present invention Part 2.Optical texture in optical module uses separated structure, can reduce to laser chip array 13 and light-receiving chip array 23 Patch required precision, between laser chip array 13 and light-receiving chip array 23 relative position and angle requirement compared with Pine can reduce paster technique difficulty.
Specifically, the patch relative position angle of laser chip array 13 as shown in figure 14 and light-receiving chip array 23 The biggish schematic diagram of deviation.When specific coupling, the second lens subassembly 2 is coupled on light-receiving chip array 23 respectively, and, First lens subassembly 1 is coupled on laser chip array 13, i.e., makes light-receiving chip array 23 and the second lens subassembly 2 respectively It is coupled and aligned, and, so that laser chip array 13 is coupled and aligned with the first lens subassembly 1.
Schematic diagram when light-receiving chip array 23 and the second lens subassembly 2 as shown in figure 15 is coupled and aligned, according to light The coupling optical path for receiving chip array 23 and the second lens array 24, by the second lens array 24 and 23 coupling of light-receiving chip array Close alignment, realization the second lens subassembly 2 is coupled on light-receiving chip array 23, at this time the angle of the second lens subassembly 2 and Position couples unanimously with light-receiving chip array 23.
Schematic diagram when laser chip array 13 and the first lens subassembly 1 as shown in figure 16 is coupled and aligned, according to laser First lens array 14 is coupled and aligned by the coupling optical path of chip array 13 and the first lens subassembly 1 with laser chip array 13, First lens subassembly 1 is coupled on laser chip array 13 by realization, at this time the angles and positions and laser of the first lens subassembly 1 Chip array 13 is consistent.
First lens subassembly 1 of separation is coupled and aligned laser chip array 13, and, the second lens subassembly 2 is coupled The first lens subassembly 1 and the second lens subassembly 2 after being directed at light-receiving chip array 23, then after being coupled and aligned are aligned, so that The incidence surface 25 of the light-emitting surface 15 of first lens subassembly 1 and the second lens subassembly 2 is opposite, forms the optical texture of optical module, can To guarantee the coupling effect of optical module.
From the above technical scheme, a kind of optical module provided in an embodiment of the present invention, according to different optical power attenuations It is required that specifically including the first lens subassembly 1 and the second lens subassembly 2 being attached on circuit board 7 using separated structure.Second The top of lens subassembly 2 is equipped with filter plate 21, and the side of the separate incidence surface 25 of filter plate 21 is equipped with optical fiber interface 31, comes from light It is reflected after the lightray propagation to filter plate 21 of fine interface 31, the reflected light travels of formation are to positioned at the second lens subassembly 2 In the light-receiving chip array 23 of bottom.Reflecting surface 12 is formed on the top of the first lens subassembly 1, what laser chip array 13 issued Reflection is generated after lightray propagation to reflecting surface 12, the reflected light of formation is projected by light-emitting surface 15 and enters the second lens subassembly 2 In interior optical fiber interface 31.The optical signal power attenuation degree of first lens subassembly 1 is greater than the optical signal function of the second lens subassembly 2 Rate attenuation degree enables the first lens subassembly 1 to decay the optical power for the optical signal that laser chip array 13 emits, It is consistent the optical power for being finally coupled into optical fiber interface 31 with optical power required by optical fiber interface 31, guarantees optical coupling Effect.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to of the invention its Its embodiment.This application is intended to cover any variations, uses, or adaptations of the invention, these modifications, purposes or Person's adaptive change follows general principle of the invention and including the undocumented common knowledge in the art of the present invention Or conventional techniques.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are by appended Claim is pointed out.
It should be understood that the present invention is not limited to the precise structure already described above and shown in the accompanying drawings, and And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is limited only by the attached claims.

Claims (10)

1. a kind of optical module characterized by comprising circuit board, and, the first lens subassembly being attached on the circuit board With the second lens subassembly, the light-emitting surface of first lens subassembly is opposite with the incidence surface of second lens subassembly;
The top of second lens subassembly is equipped with inclined filter plate, and the bottom of second lens subassembly is equipped with light-receiving core Chip arrays;The light-receiving chip array is placed on the circuit board, and is located at the circuit board and second lens group Between part;The side far from the incidence surface of the filter plate is equipped with optical fiber interface, the optical signal from the optical fiber interface It is reflected after traveling to the filter plate, the reflected light travels of formation to the light-receiving chip array;
Inclined reflecting surface is formed on the top of first lens subassembly, and the bottom of first lens subassembly is equipped with laser chip Array;The laser chip array is placed on the circuit board, and be located at the circuit board and first lens subassembly it Between;Reflection is generated after the lightray propagation to the reflecting surface that the laser chip array issues, the reflected light of formation is by described Light-emitting surface projects, then enters in the optical fiber interface in second lens subassembly via the incidence surface;
The material of first lens subassembly is different with the material of second lens subassembly, the light letter of first lens subassembly Number power attenuation degree is greater than the optical signal power attenuation degree of second lens subassembly.
2. optical module according to claim 1, which is characterized in that include for declining in the material of first lens subassembly The substance of dim light power.
3. optical module according to claim 1, which is characterized in that the surface of the reflecting surface is coated with decaying film, described to decline The optical power for subtracting optical signal of the film for issuing to the laser chip array decays.
4. optical module according to claim 1, which is characterized in that be equipped with the between the optical fiber interface and the filter plate Three lens arrays, the optical signal from the optical fiber interface occur after traveling to the filter plate via the third lens array Reflection.
5. optical module according to claim 1, which is characterized in that between the light-receiving chip array and the filter plate It equipped with the second lens array, is reflected in the filter plate, the reflected light of formation is traveled to via second lens array In the light-receiving chip array.
6. optical module according to claim 1, which is characterized in that set between the laser chip array and the reflecting surface There is the first lens array, the optical signal that the laser chip array issues travels to the reflection via first lens array Reflection is generated behind face, the reflected light of formation is projected by the light-emitting surface.
7. optical module according to claim 1, which is characterized in that fixed frame is equipped in second lens subassembly, it is described Second lens subassembly is separated into paths cavity and optical fiber fixed cavity by fixed frame, and the paths cavity is used for Realize the propagation of the optical signal from first lens subassembly and the propagation of the optical signal from the optical fiber interface, the light Fine fixed cavity is for fixing the optical fiber interface.
8. optical module according to claim 7, which is characterized in that the fixed frame is equipped with paths mouth, the light Road propagates mouth and installs the third lens array, and the third lens array is gone out by the paths mouth and the optical fiber interface Optical port is corresponding.
9. optical module according to claim 7, which is characterized in that be equipped with optical fiber fixed knot in the optical fiber fixed cavity Structure is equipped with the optical fiber interface in the fiber retention structures.
10. optical module according to claim 9, which is characterized in that be symmetrically arranged with two optical fiber on the fixed frame and fix Part, two optical fiber fixing pieces are located in the optical fiber fixed cavity, and the optical fiber fixing piece is embedded in the optical fiber fixed knot Structure, with the fixation fiber retention structures.
CN201910812590.0A 2019-08-30 2019-08-30 A kind of optical module Pending CN110501789A (en)

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Family Cites Families (5)

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US8926199B1 (en) * 2013-09-16 2015-01-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Fiber to lens attach device, system, and method
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Application publication date: 20191126