CN108508553A - A kind of optical mode group - Google Patents
A kind of optical mode group Download PDFInfo
- Publication number
- CN108508553A CN108508553A CN201810321976.7A CN201810321976A CN108508553A CN 108508553 A CN108508553 A CN 108508553A CN 201810321976 A CN201810321976 A CN 201810321976A CN 108508553 A CN108508553 A CN 108508553A
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- Prior art keywords
- lens array
- chip
- groove
- photoelectric chip
- photoelectric
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention provides a kind of optical mode group.The optical mode group includes circuit board, the first driving chip, the first photoelectric chip, the second photoelectric chip, the second driving core and lens subassembly.The upper surface of lens subassembly is equipped with the first groove and the second groove.The bottom surface of first groove forms reflecting surface；The side of second groove is equipped with the first lens array and the second lens array being arranged above and below.The first lens array being arranged above and below being arranged in second recess sidewall and the second lens array can increase the transmission channel of light, reduce the volume of optical mode group, reduce the manufacturing cost of optical mode group.Since the light that the first photoelectric chip sends or receives passes through reflecting surface and the first lens array, the light that second photoelectric chip sends or receives passes through reflecting surface and the second lens array, thus reflecting surface can reflect two groups of light simultaneously, two light paths being arranged above and below are formed, and then realize the multichannel simultaneous transmission of light on the basis of increasing transmission line.
Description
Technical field
The present invention relates to field of communication technology more particularly to a kind of optical mode groups.
Background technology
Active optical cable (Active Optical Cables, AOC) is to realize that photoelectricity turns by extra power in communication process
The communications cable changed.In general, AOC includes optical fiber and the optical module for being located at optical fiber both ends, pass through optical fiber and optical module
Connection can realize opto-electronic conversion.
Optical module is the component that opto-electronic conversion is realized in AOC, i.e., transmitting terminal converts electrical signals to optical signal, and passes through light
Fibre transmission；The optical signal received is converted to electric signal by receiving terminal.In general, optical module include upper shell 01, lower casing 02 with
And circuit board 03, chip 04, lens subassembly 05 and structure of fiber_optic in cavity are formed by positioned at upper shell 01 and lower casing 02
06 etc., as shown in Fig. 1.The surface chip placement 04 of circuit board 03, and lens subassembly 05, chip 04 are placed in the top of chip 04
Transmitting/reception of light is realized by lens subassembly 05.The side of lens subassembly 05 is provided with structure of fiber_optic 06, and optical fiber passes through optical fiber
Holder 06 accesses in lens subassembly 05, realizes the light connects between lens subassembly 05 and optical fiber.
The optical module of above structure is relatively suitable for connection single row of fiber.With the raising of optical fiber transfer rate, the number of optical fiber
Amount is continuously increased.To accommodate greater number of optical fiber and realizing opto-electronic conversion, the volume of lens subassembly 05 and structure of fiber_optic 06 is not
Disconnected to increase, the overall volume of optical module constantly increases.However, cannot to meet encapsulation integrated small for the optical module of multi fiber, large volume
The requirement of type, and the manufacturing cost of optical module can be increased.
Invention content
The present invention provides a kind of optical mode group, and the optical module manufacturing cost to solve existing multi fiber, large volume is higher to ask
Topic.
The present invention provides a kind of optical mode group, including circuit board, the set gradually in the same direction on the circuit board
One driving chip, the first photoelectric chip, the second photoelectric chip and the second driving chip, and be provide with first photoelectric chip and
The lens subassembly of second photoelectric chip；
The upper surface of the lens subassembly is equipped with the first groove and the second groove；The bottom surface of first groove forms reflection
Face；Second groove is equipped with the first lens array and the second lens array being arranged above and below close to the side of first groove
Row；
The light that first photoelectric chip sends or receives passes through the reflecting surface and first lens array；
The light that second photoelectric chip sends or receives passes through the reflecting surface and second lens array.
The technical solution that the embodiment of the present invention provides can include the following benefits：
The present invention provides a kind of optical mode group.The optical mode group includes circuit board, is set gradually in the same direction on circuit boards
The first driving chip, the first photoelectric chip, the second photoelectric chip and the second driving chip, and be provide with the first photoelectric chip and
The lens subassembly of second photoelectric chip.The upper surface of lens subassembly is equipped with the first groove and the second groove.The bottom surface of first groove
Form reflecting surface；Second groove is equipped with the first lens array and the second lens array being arranged above and below close to the side of the first groove
Row.Since the first lens array and the second lens array that are arranged above and below is arranged in the second recess sidewall simultaneously, it is thus possible to increase
Add the transmission channel of light, reduce the volume of optical mode group, reduces the manufacturing cost of optical mode group.Again due to the first photoelectric chip and second
Photoelectric chip is disposed adjacent, and the light that the first photoelectric chip sends or receives passes through reflecting surface and the first lens array, the second light
The light that electrical chip sends or receives is by reflecting surface and the second lens array, thus reflecting surface can reflect two groups of light simultaneously, shape
The light path being arranged above and below at two, so on the basis of increasing transmission line realize light multichannel simultaneous transmission.
It should be understood that above general description and following detailed description is only exemplary and explanatory, not
It can the limitation present invention.
Description of the drawings
In order to illustrate more clearly of the technical solution of the application, letter will be made to attached drawing needed in the embodiment below
Singly introduce, it should be apparent that, for those of ordinary skills, without having to pay creative labor,
Other drawings may also be obtained based on these drawings.
Fig. 1 is the structural schematic diagram of existing optical module；
Fig. 2 is the overall structure diagram of optical module provided in an embodiment of the present invention；
Fig. 3 is the cross section stereo structural schematic diagram of optical module provided in an embodiment of the present invention；
Fig. 4 is the first location diagram of driving chip provided in an embodiment of the present invention and photoelectric chip；
Fig. 5 is second of location diagram of driving chip provided in an embodiment of the present invention and photoelectric chip
Fig. 6 is the third location diagram of driving chip provided in an embodiment of the present invention and photoelectric chip；
Fig. 7 is the 4th kind of location diagram of driving chip provided in an embodiment of the present invention and photoelectric chip；
Fig. 8 is the upward view of lens subassembly in Fig. 3 provided in an embodiment of the present invention；
Fig. 9 is the structural schematic diagram of the third lens array and the 4th lens array provided in an embodiment of the present invention；
Figure 10 is the index path of optical module provided in an embodiment of the present invention.
Specific implementation mode
With the raising of optical fiber transfer rate, the quantity of optical fiber is continuously increased.To accommodate greater number of optical fiber and realization
The volume of opto-electronic conversion, lens subassembly and structure of fiber_optic continues to increase, and the overall volume of optical module constantly increases.However, mostly light
Fine, large volume optical module cannot meet the requirement of encapsulation integration of compact, and can increase the manufacturing cost of optical module.
In view of the above-mentioned problems, the application provides a kind of optical module, while realizing multichannel simultaneous transmission, to reduce light
The volume of module reduces the manufacturing cost of optical mode group.The core concept of optical module provided by the present application is：On circuit boards along electricity
The first driving chip, the first photoelectric chip, the second photoelectric chip and the second driving chip that road plate length direction is set gradually, with
And it is provide with the lens subassembly of the first photoelectric chip and the second photoelectric chip.The upper surface of lens subassembly is equipped with the first groove and second
Groove.The bottom surface of first groove forms reflecting surface；Second groove is equipped with first to be arranged above and below close to the side of the first groove thoroughly
Lens array and the second lens array.The light that two groups of photoelectric chips are sent out is injected respectively after the reflection of reflecting surface different location
In first lens array and the second lens array.Since the first lens array being arranged above and below is arranged in the second recess sidewall simultaneously
With the second lens array, it is thus possible to increase the transmission channel of light, reduce the volume of optical mode group, reduce being prepared into for optical mode group
This.Again since the first photoelectric chip and the second photoelectric chip are disposed adjacent, and the light that the first photoelectric chip sends or receives passes through
Reflecting surface and the first lens array, the light that the second photoelectric chip sends or receives is by reflecting surface and the second lens array, thus
Reflecting surface can reflect two groups of light simultaneously, form two light paths being arranged above and below, and then on the basis of increasing transmission line
Realize the multichannel simultaneous transmission of light.
It is following that optical module provided by the present application is described in detail in a manner of specific embodiment.
Attached drawing 2,3 is please referred to, attached drawing 2 shows optical module overall structure diagram provided by the embodiments of the present application, attached drawing 3
Show the cross section stereo structural schematic diagram of optical module provided by the embodiments of the present application.
By attached drawing 2,3 it is found that optical module provided by the embodiments of the present application includes upper shell 01 and lower casing 02.Upper shell 01
The shell structure of inner hollow is formed after being fastened with lower casing 02.Upper shell 01 and lower casing 02 are formed by inside shell structure
It is packaged with circuit board 1, the first driving chip 2, the first photoelectric chip 3, the second photoelectric chip 4, the second driving chip 5, lens group
Part 6 and structure of fiber_optic 7, are consequently formed complete optical module.
Specifically, circuit board 1 is located at the bottom inside lower casing 02.Along the same direction of circuit board 1, such as length direction or
Width direction is equipped with the first driving chip 2, the first photoelectric chip 3, the driving of the second photoelectric chip 4 and second on circuit board 1 successively
Chip 5.It is driven due to setting gradually the first driving chip 2, the first photoelectric chip 3, the second photoelectric chip 4 and second on circuit board 1
Dynamic chip 5, for ease of driving chip driving photoelectric chip work, in the embodiment of the present application, the first driving chip 2 is for driving
First photoelectric chip 3, the second driving chip 5 is for driving the second photoelectric chip 4.
The top of first photoelectric chip 3 and the second photoelectric chip 4 is covered with lens subassembly 6, and lens subassembly 6 is for reflecting the
The light that one photoelectric chip 3 and the second photoelectric chip 4 are projected or injected.Specifically, the upper surface of lens subassembly 6 is equipped with the first groove
8 and second groove 9.To reduce the volume of lens subassembly 6, the first groove 8 and the second groove 9 are disposed adjacent.The bottom of first groove 8
Face forms reflecting surface 10.Second groove 9 is equipped with the first lens array 11 and second being arranged above and below close to the side of the first groove 8
Lens array 12, wherein it refers to short transverse along lens subassembly 6 to be arranged above and below.
Reflecting surface 10 is for reflecting the light that the first photoelectric chip 3 and the second photoelectric chip 4 send or receive, therefore, for just
It is arranged and considers the volume of lens subassembly 6 in the position of the first lens array 11 and the second lens array 12, reflecting surface 10
Angle of inclination is 45 ± 5 °.By adjusting the angle of inclination of reflecting surface 10, the position of the first photoelectric chip 3 and the second photoelectric chip 4
It sets and the position of the first lens array 11 and the second lens array 12, can realize that reflecting surface 10 reflects the first photoelectric chip 3
The light sent or received with the second photoelectric chip 4.
First lens array 11 and the second lens array 12 be by convex lens group at array, thus the first lens array
11 and second lens array 12 play the role of assembling and light and be converted into collimated light beam.More preferably, the first lens array
11 and second lens array 12 respectively include at least eight convex lens, transmitted while to realize a plurality of light.Further, it is just
In the first lens array 11 and the second lens array 12 is arranged simultaneously on 9 side wall of the second groove, and it is anti-convenient for reflecting surface 10
Light after penetrating is injected respectively in the first lens array 11 and the second lens array 12, the first lens array 11 and the second lens array
Row 12 are arranged in parallel, and each parallel to the bottom surface of the second groove 9.
When first driving chip 2 drives the work of the first photoelectric chip 3, the light that the first photoelectric chip 3 is sent out is through reflecting surface 10
It is injected after reflection in the first lens array 11；Or, the light across the first lens array 11 injects first after the reflection of reflecting surface 10
In photoelectric chip 3, to realize the direction of the launch and receive the opto-electronic conversion in direction.
Likewise, when the second driving chip 5 drives the work of the second photoelectric chip 4, the light that the second photoelectric chip 4 is sent out is through anti-
It penetrates after face 10 is reflected and injects in the second lens array 12；Or, the light across the second lens array 12 is penetrated after the reflection of reflecting surface 10
Enter in the second photoelectric chip 4, to realize the direction of the launch and receive the opto-electronic conversion in direction.
In the embodiment of the present application, by the way that the first lens array being arranged above and below is arranged simultaneously on 9 side wall of the second groove
11 and second lens array 12, the transmission channel of light can be increased, reduce the volume of optical mode group, reduce being prepared into for optical mode group
This.In addition, since the first photoelectric chip 3 and the second photoelectric chip 4 are disposed adjacent, and the first photoelectric chip 3 sends or receives
For light by reflecting surface 10 and the first lens array 11, the light that the second photoelectric chip 4 sends or receives passes through reflecting surface 10 and second
Lens array 12, thus reflecting surface 10 can reflect two groups of light simultaneously, form two light paths being arranged above and below, and then increasing light
The multichannel simultaneous transmission of light is realized on the basis of transmission channel.
Further, the first driving chip 2 and the second driving chip 5 are transmitting driving chip 13 or reception driving chip
14.First photoelectric chip 3 and the second photoelectric chip 4 are photoemission chip 15 or opto-electronic receiver chip 16.Wherein, transmitting is driven
Dynamic chip 13 receives driving core 14 and drives opto-electronic receiver chip 16 for driving photoemission chip 15.
Specifically, attached drawing 4 is please referred to, attached drawing 4 shows the first location diagram of driving chip and photoelectric chip.By
Attached drawing 4 is it is found that the first driving chip 2 and the second driving chip 5 are to emit driving chip 13, the first photoelectric chip 3 and second
Photoelectric chip 4 is photoemission chip 15.When optical module works, two transmitting driving chips 13 control two photoelectricity hairs respectively
Core shooting piece 15 emits beam, and the light sent out injects the first lens array 11 and the second lens respectively after the reflection of reflecting surface 10
In array 12.Optical module at this time can only realize the transmitting of light.
Attached drawing 5 is please referred to, attached drawing 5 shows second of location diagram of driving chip and photoelectric chip.It can by attached drawing 5
Know, the first driving chip 2 and the second driving chip 5 are to receive driving chip 14, the first photoelectric chip 3 and the second photoelectric chip
4 be opto-electronic receiver chip 16.When optical module works, pass through the light of the first lens array 11 and the second lens array 12 through reflection
Face 10 is injected after reflecting in two opto-electronic receiver chips 16 respectively, and two receive driving chip 14 and control two opto-electronic receivers respectively
Chip 16 receives the light.Optical module at this time can only realize the reception of light.
Attached drawing 6 is please referred to, attached drawing 6 shows the third location diagram of driving chip and photoelectric chip.It can by attached drawing 6
Know, the first driving chip 2 is transmitting driving chip 13, and the first photoelectric chip 3 is photoemission chip 15, the second photoelectric chip 4
For opto-electronic receiver chip 16, the second driving chip 5 is to receive driving chip 14.When optical module works, transmitting driving chip 13 is controlled
Photoemission chip 15 processed emits beam, and the light sent out is injected after the reflection of reflecting surface 10 in the first lens array 11；Together
When, it passes through the light of the second lens array 12 to be injected in opto-electronic receiver chip 16 after the reflection of reflecting surface 10, receives driving chip 14
It controls opto-electronic receiver chip 16 and receives the light.Optical module at this time can be achieved at the same time the transmitting and reception of light.
Attached drawing 7 is please referred to, attached drawing 7 shows the 4th kind of location diagram of driving chip and photoelectric chip.It can by attached drawing 7
Know, the first driving chip 2 is to receive driving chip 14, and the first photoelectric chip 3 is opto-electronic receiver chip 16, the second photoelectric chip 4
For photoemission chip 15, the second driving chip 5 is transmitting driving chip 13.When optical module works, the second lens array is passed through
12 light is injected after the reflection of reflecting surface 10 in opto-electronic receiver chip 16, is received the control opto-electronic receiver of driving chip 14 chip 16 and is connect
Receive the light；Meanwhile emitting the control photoemission of driving chip 13 chip 15 and emitting beam, the light sent out passes through reflecting surface 10
It is injected after reflection in the first lens array 11.Optical module at this time can be achieved at the same time the transmitting and reception of light.
In the embodiment of the present application, also it is equipped with third driving chip successively along the length direction of circuit board 1, circuit board 1
17, third photoelectric chip 18, the 4th photoelectric chip 19 and the 4th driving chip 20, and lens subassembly 6 is also located at third photoelectricity
On chip 18 and the 4th photoelectric chip 19, attached drawing 8 is please referred to.In the embodiment of the present application, third driving chip 17 is for driving
Third photoelectric chip 18, the 4th driving chip 20 is for driving the 4th photoelectric chip 19.
With the course of work of the first driving chip 2, the first photoelectric chip 3, the second photoelectric chip 4 and the second driving chip 5
Identical, when third driving chip 17 drives third photoelectric chip 18 to work, the light that third photoelectric chip 18 is sent out is through reflecting surface
It is injected in the first lens array 11 after 10 reflections；Or, the light across the first lens array 11 injects the after the reflection of reflecting surface 10
In three photoelectric chips 18.When 4th driving chip 20 drives the work of the 4th photoelectric chip 19, light that the 4th photoelectric chip 19 is sent out
It is injected in the second lens array 12 after the reflection of reflecting surface 10；Or, the light across the second lens array 12 is reflected through reflecting surface 10
It injects in the 4th photoelectric chip 19 afterwards.
The setting energy of third driving chip 17, third photoelectric chip 18, the 4th photoelectric chip 19 and the 4th driving chip 20
The transmission channel of light is enough further increased, and then realizes the multichannel simultaneous transmission of light.
Further, third driving chip 17 and the 4th driving chip 20 are also transmitting driving chip 13 or reception driving core
Piece 14.Third photoelectric chip 18 and the 4th photoelectric chip 19 are also photoemission chip 15 or opto-electronic receiver chip 16.When
One driving chip 2 and the second driving chip 5 are transmitting driving chip 13 or reception driving chip 14,3 He of the first photoelectric chip
When second photoelectric chip 4 is photoemission chip 15 or opto-electronic receiver chip 16, optical mode driving chip in the block and photoelectricity core
There are four types of position relationships for piece, and realize the various combination of light emitting and reception.When optical module further comprises third driving chip
17, when third photoelectric chip 18, the 4th photoelectric chip 19 and four driving chips 20, optical mode driving chip in the block and photoelectricity core
The position relationship of piece then has more combinations, and then can realize the combination of different light emittings and reception.Such as the first driving core
Piece 2, the second driving chip 5 and third driving chip 17 are transmitting driving chip 13, the first photoelectric chip 3, the second photoelectricity core
Piece 4 and third photoelectric chip 18 are photoemission chip 15, and the 4th driving chip 20 is to receive driving chip 14, the 4th photoelectricity
When chip 19 is opto-electronic receiver chip 16, optical module can realize the transmitting and the reception of light all the way of three road light.It is driven about first
Dynamic chip 2, the first photoelectric chip 3, the second photoelectric chip 4, the second driving chip 5, third driving chip 17, third photoelectric chip
18, other of the 4th photoelectric chip 19 and the 4th driving chip 20 combine, and the embodiment of the present application repeats no more.
In the embodiment of the present application, the lower surface of lens subassembly 6 is equipped with third groove 21, and the bottom surface of third groove 21 is set
There are the third lens array 22 and the 4th lens array 23, as shown in Fig. 9.Since the lower surface of lens subassembly 6 is recessed equipped with third
Slot 21, and lens subassembly 6 is located at the top of the first photoelectric chip 3 and the second photoelectric chip 4, therefore, the third lens array 22
It is located at the top of the first photoelectric chip 3 and the second photoelectric chip 4 with the 4th lens array 23.In the embodiment of the present application, third
Lens array 22 is preferably placed at the top of the first photoelectric chip 3, and the 4th lens array 23 is located at the top of the second photoelectric chip 4.
The light that first photoelectric chip 3 is sent out forms directional light after passing through the third lens array 22, and directional light is through reflecting surface
It is injected in the first lens array 11 after 10 reflections；Or, the light across the first lens array 11 injects the after the reflection of reflecting surface 10
It in three lens arrays 22, and then injects in the first photoelectric chip 3, to realize the direction of the launch and receive the opto-electronic conversion in direction.
The light that second photoelectric chip 4 is sent out forms directional light after passing through the 4th lens array 23, and directional light is through reflecting surface
It is injected in the second lens array 12 after 10 reflections；Or, the light across the second lens array 12 injects the after the reflection of reflecting surface 10
It in four lens arrays 23, and then injects in the second photoelectric chip 4, to realize the direction of the launch and receive the opto-electronic conversion in direction.
Further, the lower surface of lens subassembly 6 is additionally provided with the 4th groove 24, and the depth value of the 4th groove 24 is different from the
The depth value of three grooves 21, at this point, third groove 21 and the 4th groove 24 formed it is ladder-like.Third groove 21 and the 4th groove 24
Stair-stepping setting can reduce the material for preparing of lens subassembly 6, and then reduce the manufacturing cost of lens subassembly 6.For ease of recessed
Setting photoelectric chip is preferably provided with third photoelectric chip 18 and the 4th light in embodiments of the present invention in slot in third groove 21
Electrical chip 19 is preferably provided with the first photoelectric chip 3 and the second photoelectric chip 4 in the 4th groove 24.More preferably, third groove
21 third photoelectric chip 18 and the 4th photoelectric chip 19 are photoemission chip 15, the first photoelectricity core in the 4th groove 24
Piece 3 and the second photoelectric chip 4 are opto-electronic receiver chip 16.
Since the first lens array 11 and the second lens array 12 include respectively at least eight convex lens, to make to wear
The light for crossing the third lens array 22 and the 4th lens array 23 injects the first lens array 11 and the second lens array 12 respectively
In different convex lenses, the third lens array 22 and the 4th lens array 23 also respectively include at least eight convex lens.Meanwhile it wearing
The light for crossing convex lens in the third lens array 22 and the 4th lens array 23 injects first thoroughly respectively after the reflection of reflecting surface 10
In lens array 11 and the different convex lens of the second lens array 12.
In optical module provided by the embodiments of the present application, the structure of fiber_optic for fiber plant is additionally provided in the second groove 9
7.Structure of fiber_optic 7 is internally provided with two rows of fiber arrays 25, and two rows of fiber arrays 25 include respectively a plurality of optical fiber, and often arrange optical fiber
Quantity be at least the quantity of convex lens in the first lens array 11 or the second lens array 12.First lens array 11 and second
Lens array 12 corresponds to row's fiber array 25 respectively, and as shown in Fig. 10, the first lens array 11 corresponds to the optical fiber array arranged
Row 25, the second lens array 12 correspond to the lower fiber array 25 arranged.For ease of injecting the first lens array 11 and the second lens array
The light of row 12 respectively enters in corresponding fiber array 25, and the first lens array 11 and row's fiber array 25 are located at same water
In plane, the second lens array 12 and another row's fiber array 25 are located in same level.
It is set in the second groove 9 to make structure of fiber_optic 7 stablize, the both sides of the first lens array 11 or the second lens array 12
It is equipped with positioning column 26, structure of fiber_optic 7 is equipped with location hole (figure close to the side of the first lens array 11 or the second lens array 12
In be not shown).Structure of fiber_optic 7 is fixed in such a way that positioning column 26 is inserted into 7 upper Positioning holes of structure of fiber_optic.
Attached drawing 9 is please referred to, attached drawing 9 shows the index path of optical module provided by the embodiments of the present application.As shown in Fig. 9,
First driving chip 2 and the second driving chip 5 respectively drive the first photoelectric chip 3 and the second photoelectric chip 4 projects light.First
The light that photoelectric chip 3 projects forms directional light after passing through the third lens array 22, and the light that the second photoelectric chip 4 projects passes through
Directional light is formed after 4th lens array 23.Two beam directional lights penetrate the different location in reflecting surface 10 respectively, and pass through reflecting surface
10 directional light reflected to form different from aforementioned parallel light direction.The two beam directional lights to turn inject the first lens respectively
In array 11 and the second lens array 12, and injected respectively after the convergence of the first lens array 11 and the second lens array 12
In the optical fiber of two rows of fiber arrays 25.Light is through fiber array 25, the first lens array 11, the second lens array 12, reflecting surface
10, it is above-mentioned that the third lens array 22 and the 4th lens array 23, which enter the first photoelectric chip 3 and the process of the second photoelectric chip 4,
The inverse process of process, details are not described herein again.
Since the light that the first photoelectric chip 3 and the second photoelectric chip 4 project is each passed through the third lens array 22 and the
Four lens arrays 23 inject the first lens array 11 and the second lens array 12 respectively after the reflection of reflecting surface 10, and third is saturating
Lens array 22, the 4th lens array 23, the first lens array 11 and the second lens array 12 respectively include at least eight convex lens,
Therefore, during the Once dissemination of light, the multichannel simultaneous transmission of light can be realized.Again due to 9 side wall of the second groove
Upper while the first lens array 11 of setting and the second lens array 12, and the third lens array 22 and the 4th lens array 23 are simultaneously
It is arranged in the bottom of third groove 21, thus optical module provided by the embodiments of the present application can realize multichannel simultaneous transmission
Meanwhile reducing the volume of optical mode group, and then reduce the manufacturing cost of optical mode group.
It is required that those skilled in the art can be understood that the technology in the embodiment of the present invention can add by software
The mode of general hardware platform realize.Based on this understanding, the technical solution in the embodiment of the present invention substantially or
Say that the part that contributes to existing technology can be expressed in the form of software products, which can deposit
Storage is in storage medium, such as ROM/RAM, magnetic disc, CD, including some instructions are used so that computer equipment (can be with
Be personal computer, server either network equipment etc.) execute certain part institutes of each embodiment of the present invention or embodiment
The method stated.
Invention described above embodiment is not intended to limit the scope of the present invention..
Those skilled in the art will readily occur to its of the present invention after considering specification and putting into practice the disclosure invented here
Its embodiment.This application is intended to cover the present invention any variations, uses, or adaptations, these modifications, purposes or
Person's adaptive change follows the general principle of the present invention and includes undocumented common knowledge in the art of the invention
Or conventional techniques.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are by following
Claim is pointed out.
It should be understood that the invention is not limited in the precision architectures for being described above and being shown in the accompanying drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is limited only by the attached claims.
Claims (8)
1. a kind of optical module, which is characterized in that including circuit board, first set gradually in the same direction on the circuit board
Driving chip, the first photoelectric chip, the second photoelectric chip and the second driving chip, and it is provide with first photoelectric chip and institute
State the lens subassembly of the second photoelectric chip；
The upper surface of the lens subassembly is equipped with the first groove and the second groove；The bottom surface of first groove forms reflecting surface；
Second groove is equipped with the first lens array and the second lens array being arranged above and below close to the side of first groove；
The light that first photoelectric chip sends or receives passes through the reflecting surface and first lens array；
The light that second photoelectric chip sends or receives passes through the reflecting surface and second lens array.
2. optical module according to claim 1, which is characterized in that the optical module further includes being located in second groove
Structure of fiber_optic, the structure of fiber_optic is internally provided with the fiber array being arranged above and below；First lens array and described second
Lens array corresponds to fiber array described in a row respectively.
3. optical module according to claim 1, which is characterized in that the lower surface of the lens subassembly is equipped with third groove,
The bottom surface of the third groove is equipped with the third lens array and the 4th lens array；
The light that first photoelectric chip sends or receives by the third lens array, the reflecting surface and it is described first thoroughly
Lens array；
The light that second photoelectric chip sends or receives by the 4th lens array, the reflecting surface and it is described second thoroughly
Lens array.
4. optical module according to claim 3, which is characterized in that it is recessed that the lower surface of the lens subassembly is additionally provided with the 4th
Slot, the depth value of the 4th groove are different from the depth value of the third groove；
The circuit board length direction described in the circuit board upper edge is also equipped with third driving chip, third photoelectric chip, the successively
Four photoelectric chips and the 4th driving chip；The lens subassembly is also located at the third photoelectric chip and the 4th photoelectricity core
On piece；
The third photoelectric chip and the 4th photoelectric chip are set in the third groove；
First photoelectric chip and second photoelectric chip are set in the 4th groove.
5. optical module according to claim 1, which is characterized in that the angle of inclination of the reflecting surface is 45 ± 5 °.
6. optical module according to claim 2, which is characterized in that first lens array or second lens array
Both sides be equipped with positioning column, the positioning column is for being inserted into the location hole on the structure of fiber_optic.
7. according to the optical module described in any one of claim 1-6, which is characterized in that first lens array and described
Second lens array respectively includes at least eight convex lens.
8. optical module according to claim 7, which is characterized in that the optical module further includes upper shell and lower casing, institute
State circuit board, first driving chip, first photoelectric chip, second photoelectric chip, second driving chip
It is encapsulated in the lens subassembly in the cavity that the upper shell and the lower casing surround.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810321976.7A CN108508553B (en) | 2018-04-11 | 2018-04-11 | Optical module |
| CN201911325381.XA CN111142201A (en) | 2018-04-11 | 2018-04-11 | Optical module |
| US16/354,666 US11209608B2 (en) | 2018-04-11 | 2019-03-15 | Optical module |
| PCT/CN2019/078335 WO2019196594A1 (en) | 2018-04-11 | 2019-03-15 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810321976.7A CN108508553B (en) | 2018-04-11 | 2018-04-11 | Optical module |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911325381.XA Division CN111142201A (en) | 2018-04-11 | 2018-04-11 | Optical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108508553A true CN108508553A (en) | 2018-09-07 |
| CN108508553B CN108508553B (en) | 2020-06-16 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810321976.7A Active CN108508553B (en) | 2018-04-11 | 2018-04-11 | Optical module |
| CN201911325381.XA Pending CN111142201A (en) | 2018-04-11 | 2018-04-11 | Optical module |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911325381.XA Pending CN111142201A (en) | 2018-04-11 | 2018-04-11 | Optical module |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN108508553B (en) |
| WO (1) | WO2019196594A1 (en) |
Cited By (6)
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| WO2019196594A1 (en) * | 2018-04-11 | 2019-10-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113009645A (en) * | 2019-12-20 | 2021-06-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113238330A (en) * | 2021-05-10 | 2021-08-10 | 杭州耀芯科技有限公司 | Ultra-thin plate is to board photoelectric conversion device |
| US11209608B2 (en) | 2018-04-11 | 2021-12-28 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
| WO2022193733A1 (en) * | 2021-03-17 | 2022-09-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN116755199A (en) * | 2023-06-19 | 2023-09-15 | 长芯盛（武汉）科技有限公司 | Optical assembly, photoelectric module, installation method, plug and active cable |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN111142201A (en) | 2020-05-12 |
| CN108508553B (en) | 2020-06-16 |
| WO2019196594A1 (en) | 2019-10-17 |
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