CN105891973B - A kind of two-dimensional array optical coupler module - Google Patents
A kind of two-dimensional array optical coupler module Download PDFInfo
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- CN105891973B CN105891973B CN201610321253.8A CN201610321253A CN105891973B CN 105891973 B CN105891973 B CN 105891973B CN 201610321253 A CN201610321253 A CN 201610321253A CN 105891973 B CN105891973 B CN 105891973B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a kind of two-dimensional array optical coupler module, including ceramic bases, light transceiving chip array, microlens array, driving unit array, fiber array and optical fiber connector.In the present invention, fiber array coupled end uses 45 degree of reflectings surface, realizes efficient coupling by lenticule and light transceiving chip array, coupling efficiency is high, small, easy to encapsulate;The alignment of proposition is easier to realize with localization method, is conducive to industrial manufacture;Using special-shaped ceramics substrate, influence of the optical path difference for message transmission rate can be reduced, also there is certain lifting for coupling efficiency;Moreover, cost of manufacture is relatively low for polymer waveguide.Encapsulation microminiaturization and highdensity requirement present invention accomplishes parallel optical module, solve the problems such as manufacture existing in the prior art of high cost, available channel number deficiency, difficult microminiaturization encapsulation, have broad application prospects.
Description
Technical field
The invention belongs to optical communication field, the light transceiver part being related in communication field, more particularly, to a kind of two dimension
Array optical coupler module.
Background technology
With the arrival of big data and cloud era, the data of a large amount of high speeds need to be transmitted and handle.In order to tackle this
Kind demand, enterprise, country establish data center one after another.Large-scale data center generally possesses numerous parallel computations and storage part
Point, optical interconnection is wherein one of major way of data transfer.
Optical interconnection can realize that wherein optical transceiver module passes through opto-electronic conversion handle in transmitting terminal by optical cable, optical module etc.
Electric signal is converted into optical signal, and after signal is transmitted by optical fiber, electric signal is converted optical signals into again in receiving terminal.
In the case where equipment volume is limited, increase severely and the ever-expanding demand of transmission capacity to tackle I/O mouthfuls, optical mode
The direction of block forward direction high density, high speed and Highgrade integration is developed, generally using multi-channel parallel optical module come realize large capacity,
The transmission of high speed signal.
VCSEL (vertical cavity surface emitting laser) arrays of parallel light transceiving module chief component including 850nm and
Its driving, fiber array, photodetector array and its amplifying circuit.Compared to this side light emitting-type laser of semiconductor laser
Device, VCSEL above have its unique advantage as surface-emitting type laser in array application.The vertical cavity structure of VCSEL is good
Horizontal light field is limited, avoids processes such as " cleavage ", wafer scale on-line testing can be carried out as processing microelectronics silicon chip
Or installation, it is easy to make two-dimensional array.Therefore, VCSEL is used in parallel light transceiving module as lasing light emitter.In the hair of optical module
Part is penetrated, VCSEL array outgoing beam is vertical with circuit board, and optical module output light path is parallel to circuit board;In optical module
Receiving portion, optical module input light path and optical detector test surface are also parallel to circuit board, therefore are related to 90 ° of light beam
The problem of deflecting and being coupled with parallel optical interface.
A kind of optical coupling scheme is using flexible PCB.Circuit board is bent in 90 °, pasted on the circuit board holded up
Fill VCSEL array so that VCSEL emergent lights are changed into the light beam parallel to optical fiber, so that and fiber coupling.The shortcomings that this scheme
It is:In manufacturing process, flexible PCB bending angle is difficult to 90 ° in ideal, and the error of bending angle can influence
The alignment of VCSEL array and fiber array, and then reduce coupling efficiency.And it is vertically-mounted be unfavorable for integrating, PCB costs compared with
Height, so less use in practice.
In actual manufacture frequently be microlens array coupling method.Laser beam is complete by a right angle prism
Deflection in 90 ° is coupled into optical fiber, and two right-angle surfaces of right angle prism are all pasted with microlens array to improve coupling efficiency.
Such a scheme lens are made of resin material or glass material.For plastic lens, it is desirable to which the translucency of material is preferable, has length
Phase reliability, such lens will realize the mass production not a duck soup of higher qualification rate.Simultaneously as plastics are more easy to aging, it is long
Phase uses the hydraulic performance decline that can make parallel optical module.
It is continuously increased in view of network equipment data channel, the port number demand of parallel optical module is also constantly increased, but
It is limited to the IEC61754-7 standards of optical fiber connector, general most 12 cores of one-dimensional array optical fiber connector, for most
According to transmission channel (such as 24 passages, 48 passages), parallel optical module is generally by the way of two-dimensional array coupling.Use lenticule battle array
The mode of row coupling undoubtedly adds the volume of module, is unfavorable for encapsulating the realization of microminiaturization.
In view of the above-mentioned problems, a solution, which is the polymer waveguide array of two dimension, carries out the coupling of light.Built in waveguide
45 ° of total internal reflection mirrors of laser ablation, VCSEL array emergent light enter polymer waveguide by microlens array and realize coupling.
Polymeric waveguiding layer is placed on light printed circuit board (PCB), and VCSEL array and PD arrays are encapsulated as opto chip and are placed in together
On organic carrier, carrier is attached with light printed circuit board (PCB) by BGA.Referring to Doany F E, Schow C L, Lee B G
Et al. the article delivered《Terabit/sec-class board-level optical interconnects through
polymer waveguides using 24-channel bidirectional transceiver modules》.This scheme
Shortcoming is:The material technology of polymer waveguide is more demanding, complex manufacturing process;Ablation total internal reflection mirror is not in waveguide
Easily, it is higher to technological requirement, add cost.
The content of the invention
For the disadvantages described above or Improvement requirement of the prior art, the present invention provides a kind of two-dimensional array optical coupler module,
Its object is to meet the encapsulation microminiaturization to parallel optical module and highdensity requirement, system existing in the prior art is thus solved
The problems such as making of high cost, available channel number deficiency, difficult microminiaturization encapsulation.
Two-dimensional array optical coupler module proposed by the present invention, including it is ceramic bases (6), light transceiving chip array (5), micro-
Lens array (2), driving/amplifying unit array (7), fiber array (1) and optical fiber connector (4), wherein:
The smooth transceiving chip array (5) is mounted in ceramic bases (6), is 2 × N chip arrays, during for launching, institute
It is VCSEL chip arrays to state 2 × N chip arrays;When for receiving, 2 × N chip arrays are photo detector chip battle array
Row;
The fiber array (1) is and the corresponding 2 × N fiber arrays of light transceiving chip array (5);The fiber array
(1) one end incoming fiber optic connector (4), other end underface are pasted with microlens array (2), its fiber end face is ground into 45 degree
Inclined-plane so that when optical coupler module be used for launch when, the optical signal that light transceiving chip array (5) is launched is with total reflection mode
It is coupled into fiber array (1);When optical coupler module is used to receive, the optical signal of transmission is oblique through 45 degree in fiber array (1)
Face is totally reflected, and switchs to vertical downward transportation, is received by light transceiving chip array (5);
Microlens array (2) is that the single ball etched in base plate is produced on by micro-optics and micrometer-nanometer processing technology
Face lens array, the plane side of each lens are close to each optical fiber of fiber array, the wherein planar central and optical fiber array of lens
The center of circle on 45 degree of inclined-planes of optical fiber is located on same vertical line in row (1), to ensure that optical signal with total reflection mode couple;
Then held with the outgoing (or reception) of each chip in light transceiving chip array (5) on the curved surface vertex of microlens array (2) each lens
Face center is located on same vertical line;
The driving/amplifying unit array (7) and ceramic bases (6) are bonded on a printed circuit board by silver paste, and driving/
Amplifying unit array (7) is made of driving/amplifying unit of two 1 × N of row, passes through spun gold binding and the smooth transceiving chip array
(5) chip in, which corresponds, to be connected;When optical coupler module is used to launch, driving/amplifying unit array (7) is used to drive
VCSEL chip arrays, are changed into optical signal by electric signal;When optical coupler module is used to receive, driving/amplifying unit array
(7) it is used for the signal for amplifying photo detector chip array received;
The optical fiber connector (4) is connected with external fiber, is used for transmission optical signal.
The ceramic bases of the attachment light transceiving chip array (5) are non-flat surfaces, by etching special-shaped ceramics base
Bottom changes the height of each smooth transceiving chip array (5) so that light beam is from fiber array (1) to the light of light transceiving chip array (5)
Journey is equal.
Further, 2 × N fiber arrays are made of two 1 × N fiber arrays, 2 × N chip arrays by two 1 ×
N chip arrays form, when being used for realization the function of optical coupler module transceiver, one of them 1 × N fiber array with its just
Corresponding 1 × N the chip arrays in lower section form a receiving channel, another 1 × N fiber array and its underface are corresponding another
A 1 × N chip arrays form transmission channel.
Further, Anti-reflective coating can be plated on the coupled end reflective surface of 2 × N fiber arrays, further to increase
Add the coupling efficiency of light.
Further, the present invention also proposes fiber array aligning method in a kind of optical coupler module, including following step
Suddenly:
(1) masterplate is made, plurality of parallel lines is etched on the reference axis y directions of silicon base, line spacing is one-dimension optical-fiber battle array
Each optical fiber spacing on row;Reference axis x directions etch two parallel lines A, B, its line spacing is two row one-dimension optical-fiber arrays
The distance at microlens array center;
(2) first row one-dimension optical-fiber array is placed on a silicon substrate, overlooks its 45 ° directly over fiber array at this time tiltedly
Face, because it is in one-dimensional stain array that in 45 ° of reflectings surface of one-dimension optical-fiber array total reflection light fibre array face machined flat, which occurs, for light beam,
Fiber array is translated in y directions so that stain array is fallen within each bar parallel lines on silicon base y directions, completes y directions pair
It is accurate;
(3) one-dimension optical-fiber array is translated up in the reference axis x side of silicon base so that it is parallel that stain array is located at y directions
The point of intersection of line and line A, fixes the position of first row one-dimension optical-fiber array;Secondary series one-dimension optical-fiber array is taken, by y side
To translation so that its stain array is fallen within the parallel lines of y directions so that secondary series one-dimension optical-fiber array and first row one-dimension optical-fiber
Array is aligned on reference axis y directions;Position of the secondary series one-dimension optical-fiber array on reference axis x directions is translated again so that black
Lattice array is located at the point of intersection of y directions parallel lines and line B, completes arrangement.
In general, by the contemplated above technical scheme of the present invention compared with prior art, advantages of the present invention exists
In:Cost of manufacture is relatively low for polymer waveguide, and alignment and the localization method of proposition are easier to realize, are conducive to industrial system
Make;In addition, the present invention uses special-shaped ceramics substrate, influence of the optical path difference for message transmission rate can be reduced, for optocoupler
Closing efficiency also has certain lifting.
Brief description of the drawings
Fig. 1 is photosignal transmission schematic diagram of the present invention.
Fig. 2 is the structure diagram of two-dimensional array optical coupler module of the present invention.
Fig. 3 is 2-D optical fibre array device architecture schematic diagram of the present invention.
Fig. 4 is the masterplate schematic diagram of two row one-dimension optical-fiber array positioning of the present invention.
Fig. 5 is ceramic bases structure diagram of the present invention.
Fig. 6 is the structure diagram of optical coupling portion of the present invention.
In all of the figs, identical reference numeral is used for representing identical element or structure.In all of the figs, it is identical
Reference numeral be used for representing identical element or structure, wherein:
1- fiber arrays, 2- microlens arrays, 3- optical fiber pigtails, 4- optical fiber connectors, 5- light transceiving chip arrays, 6- potteries
Porcelain substrate, 7- drivings/amplifying unit array, 8- printed circuit board (PCB)s.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in each embodiment of invention described below
Not forming conflict each other can be mutually combined.
Two-dimensional array optical coupler module of the present invention has two kinds of application scenarios:
1. 2 × N channel:Receiving module and transmitting module separation, do not share same circuit board.Receive and emitting structural one
Cause, the chip only mounted in ceramic bases is different.What is mounted in transmitting module ceramic bases is the VCSEL array of 2 × N, is connect
Receive module attachment is the photodetector array of 2 × N.
2. the optical coupler module of 1 × N channel:Transmitting and receiving module one, structure are as shown in Figure 2.But ceramic bases
What the upper row of two row passage one mounted is the VCSEL chips of 1 × N, and what another row mounted is the photo detector chip of 1 × N.
The structure of two-dimensional array optical coupler module proposed by the invention is as shown in Figure 2.Two-dimensional array optical coupler module bag
Include fiber array 1, microlens array 2, optical fiber pigtail 3, optical fiber connector 4, light transceiving chip array 5, ceramic bases 6, driving/
Amplifying unit array 7, printed circuit board (PCB) 8.
Optical coupling transmitting module is identical with optical coupling receiving module structure, below with the 2-D optical fibre array of light emission module
Illustrate its structure exemplified by device, as shown in figure 3, the first 2-D optical fibre array device portions include fiber array 1, microlens array
2, optical fiber pigtail 3 and optical fiber connector 4.
Formed as shown in figure 3,2-D optical fibre array 1 staggers to fit closely by the identical one-dimension optical-fiber array of two row.
V-groove is carved in silicon-based substrates first, is placed the fiber in groove, then the end face of optical fiber and V-groove is ground to
45 ° of inclined-planes, so that the one-dimension optical-fiber array of 45 ° of reflectings surface of band be made.In order to be lifted in manufacturing process for the mistake of array alignment
Poor tolerance limit, need to mount a microlens array 2, light can also be made by adding microlens array in each one-dimension optical-fiber array lower surface
Shu Huiju, increases the efficiency of optical coupling.To improve the coupling efficiency of light, can be plated on the reflecting surface of fiber array high anti-
Penetrate film (the general reflectance coating for using 850nm wavelength at present).Then positioning fitting is carried out to two row one-dimension optical-fiber arrays.
Positioning fitting for two row one-dimension optical-fiber arrays, the present invention are as follows using the scheme for making masterplate alignment, principle:
If its 45 ° of inclined-planes are overlooked directly over from fiber array, because light beam is all-trans in 45 ° of reflectings surface of one-dimension optical-fiber array
Penetrate, i.e., be emitted without light beam from 45 ° of inclined-planes, so fiber array face machined flat is in a row stain, visual stain array is one-dimensional light
Fibre array positioning datum.Before positioning is bonded, alignment masterplate is made first.Positioning for two row one-dimension optical-fiber arrays,
From the aspect of left and right alignment and offset distance two, therefore stencil structure is as shown in Figure 4.Masterplate is silicon-based substrate, its y side
It is etched with plurality of parallel lines upwards, line spacing is each V-groove spacing of one-dimension optical-fiber array, and each optical fiber spacing;X directions etch
There are two parallel lines A, B, its line spacing is the distance at 2 center of microlens array of two row one-dimension optical-fiber arrays, can from Fig. 2
Go out, this distance is the spacing of two row VCSEL arrays (or photodetector array).Positioning action is as follows:First light is tieed up by first
Fibre array is placed on masterplate, is fallen within by translating stain array in y directions on each bar parallel lines in y directions.Then in x
Translated on direction so that stain array is located at the point of intersection of y directions parallel lines and line A, and it is one-dimensional so to fix first row
The position of fiber array;Secondary series one-dimension optical-fiber array is taken, by being translated in y directions so that its stain array falls within y directions
On each bar parallel lines, and it is opposite one by one with the stain array of first row one-dimension optical-fiber array to fall parallel lines.Then in the x direction
Translated so that stain array is located at the point of intersection of y directions parallel lines and line B.By aforesaid operations, the two one-dimensional light of row are completed
The positioning of fibre array, then carries out fitting and forms 2-D optical fibre array.Again by after the 3 termination fiber stripping of tail optical fiber of 2-D optical fibre array,
Penetrate in the MT optical fiber connectors 4 of 2-D, carry out the end surface grinding of MT again after ultra-violet curing.It is made after above-mentioned flow
2-D optical fibre array device of the present invention.
The special-shaped ceramics of the present invention for being pasted with light transceiving chip array (VCSEL array or photodetector array) 5
6 structure of substrate is as shown in Figure 5.In above-mentioned fiber array device, two row one-dimension optical-fiber arrays have point up and down in height, if
Using flat ceramic bases, then certain optical path difference is had between two row laser beams.The appearance of optical path difference can influence data
Transmission rate, so need change two row chip attachment substrates height.In addition, change shapes of substrates so that array chip
Height is different, can also reduce the distance of fiber array and VCSEL lasers (or optical detector), make light be more easy to assemble, so that
Improve coupling efficiency.
Ceramic bases 6 are integrally formed, and the passage of an indentation are formed by etching, wherein a row light transceiving chip array 5
It is mounted on, another smooth transceiving chip array 5 is then in the substrate raised.The depth capacity of indentation passage is used with photoetching
Laser pulse energy metric density and sweep speed it is related, wherein the general maximum etching depth of Ultra-Violet Laser etching is up to 0.16mm.
Optical coupling portion separation structure of the present invention is as shown in Figure 6.To ensure fiber array 1 and light transceiving chip array 5
Coupling effect detects the coupling efficiency of each passage by power meter, it is necessary to adjust displacement and the angle of 2-D optical fibre array.Adjustment
When reaching optimistic coupling efficiency, 2-D optical fibre array and ceramic bases 6 are bonded on printed circuit board (PCB) 8.
In said structure, when for launching light beam, the light beam that VCSEL laser arrays 5 are launched is through microlens array 2
Convergence enters optical fiber.Light beam is totally reflected on 45 ° of reflectings surface, so that the light beam for becoming parallel to circuit board is passed into optical fiber
It is defeated.Fiber array 1 is opposite one by one with VCSEL array 5.
In the present invention, the ceramic bases 6 and driving/amplifying unit array 7 that are pasted with light transceiving chip array 5 are all placed in printing
On printed circuit board 8.Driving/amplifying unit array 7 is located at 6 both sides of substrate respectively, passes through gold thread binding and light transceiving chip array
Corresponding connection.
The horizontal light beam in printed circuit board (PCB) transmitted in optical fiber enters the 2-D optical fibre array of receiving portion, by being all-trans
Penetrate and be changed into normal beam and enter photodetector array.Photodetector array receives optical signal and converts optical signals to telecommunications
Number.Electric signal is amplified to optical module outputting standard across resistance amplifying unit.The driving unit of emitting portion converts the electrical signal to
Drive the current signal of VCSEL array.VCSEL array receives current signal, and is converted into optical signal launch.VCSEL lasers
The light beam that array emitter goes out is assembled through microlens array enters optical fiber.Light beam is totally reflected on 45 ° of reflectings surface, so as to become
Transmitted parallel to the light beam of circuit board into optical fiber.
The present invention is met for optical module multichannel, high speed using the coupled modes of 45 ° of inclined-plane 2-D optical fibre arrays
Rate, highdensity requirement, avoid polymer waveguide make, the complicated technology such as laser ablation in waveguide, reduce manufacture cost;
The inclined-plane plated film of fiber array and lower section attachment microlens array then considerably increase the error margin in manufacture and improve coupling
Close efficiency.The present invention realizes alignment to two row one-dimension optical-fiber arrays by making standard form, and method is simply of low cost.
In addition, the special-shaped ceramics underlying structure that the present invention uses avoids the optical path difference between two row laser beam arrays, it is right to reduce its
The efficiency of laser and fiber coupling is increased while the influence of data transfer.In short, two-dimensional array coupling of the present invention
Module is a kind of efficient, structure of lower cost.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, all any modification, equivalent and improvement made within the spirit and principles of the invention etc., should all include
Within protection scope of the present invention.
Claims (4)
1. a kind of two-dimensional array optical coupler module, it is characterised in that including ceramic bases (6), light transceiving chip array (5), micro-
Lens array (2), driving/amplifying unit array (7), fiber array (1) and optical fiber connector (4), wherein:
The smooth transceiving chip array (5) is mounted in ceramic bases (6), is 2 × N chip arrays, during for launching, described 2
× N chip arrays are VCSEL chip arrays;When for receiving, 2 × N chip arrays are photo detector chip array;
The fiber array (1) is and the corresponding 2 × N fiber arrays of light transceiving chip array (5);The fiber array (1)
One end incoming fiber optic connector (4), other end underface are pasted with microlens array (2), its fiber end face is ground into 45 degree
Inclined-plane so that when optical coupler module is used to launch, the optical signal that light transceiving chip array (5) is launched is with total reflection mode coupling
Conjunction enters fiber array (1);When optical coupler module is used to receive, the optical signal of transmission is through 45 degree of inclined-planes in fiber array (1)
It is totally reflected, switchs to vertical downward transportation, is received by light transceiving chip array (5);
Microlens array (2) is that the single sphere etched in base plate is produced on by micro-optics and micrometer-nanometer processing technology is saturating
Lens array, the plane side of each lens are close to each optical fiber of fiber array, the wherein planar central of lens and fiber array (1)
The center of circle on middle 45 degree of inclined-planes of optical fiber is located on same vertical line, to ensure that optical signal with total reflection mode couple;It is micro-
The curved surface vertex of lens array (2) each lens is then with the outgoing of each chip in light transceiving chip array (5) or receiving end face center
On same vertical line;
The driving/amplifying unit array (7) and ceramic bases (6) are bonded on a printed circuit board by silver paste, driving/amplification
Cell array (7) is made of driving/amplifying unit of two 1 × N of row, passes through spun gold binding and the smooth transceiving chip array (5)
In chip correspond be connected;When optical coupler module is used to launch, driving/amplifying unit array (7) is used to drive VCSEL
Chip array, is changed into optical signal by electric signal;When optical coupler module is used to receive, driving/amplifying unit array (7) is used for
Amplify the signal of photo detector chip array received;
The ceramic bases of the attachment light transceiving chip array (5) are non-flat surfaces, are changed by etching special-shaped ceramics substrate
The height of each chip in darkening transceiving chip array (5) so that light beam is from fiber array (1) to light transceiving chip array (5)
Equivalent optical path;
The optical fiber connector (4) is connected with exterior fiber optic connector, is used for transmission optical signal.
2. a kind of two-dimensional array optical coupler module according to claim 1, it is characterised in that 2 × N fiber arrays are by two
A 1 × N fiber arrays composition, 2 × N chip arrays are made of two 1 × N chip arrays, are received when being used for realization optical coupler module
When sending out the function of one, it is logical that one of them 1 × N fiber array 1 × N chip arrays corresponding with immediately below it form a reception
Road, another 1 × N fiber array and corresponding another 1 × N chip array composition transmission channel immediately below it.
3. a kind of two-dimensional array optical coupler module according to claim 1, it is characterised in that 2 × N fiber arrays
Anti-reflective coating is plated on coupled end reflective surface, further to increase the coupling efficiency of light.
A kind of 4. two-dimensional array optical coupler module according to claim 1, it is characterised in that fiber array (1) arrangement
Include the following steps:
(1) masterplate is made, plurality of parallel lines is etched on the reference axis y directions of silicon base, line spacing is on one-dimension optical-fiber array
Each optical fiber spacing;Reference axis x directions etch two parallel lines A, B, its line spacing is micro- for two row one-dimension optical-fiber arrays
The distance at lens array center;
(2) first row one-dimension optical-fiber array is placed on a silicon substrate, overlooks its 45 ° of inclined-planes directly over fiber array at this time,
Because light beam is totally reflected in 45 ° of reflectings surface of one-dimension optical-fiber array, fiber array face machined flat is in one-dimensional stain array,
Y directions translate fiber array so that stain array is fallen within each bar parallel lines on silicon base y directions, completes the alignment of y directions;
(3) translate up one-dimension optical-fiber array in the reference axis x side of silicon base so that stain array be located at y directions parallel lines with
The point of intersection of line A, fixes the position of first row one-dimension optical-fiber array;Secondary series one-dimension optical-fiber array is taken, by being put down in y directions
Move so that its stain array is fallen within the parallel lines of y directions so that secondary series one-dimension optical-fiber array and first row one-dimension optical-fiber array
It is aligned on reference axis y directions;Position of the secondary series one-dimension optical-fiber array on reference axis x directions is translated again so that stain battle array
Row complete arrangement positioned at the point of intersection of y directions parallel lines and line B.
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CN108681059B (en) * | 2018-05-07 | 2023-12-08 | 中国人民解放军陆军工程大学 | Sub microsecond level two-dimensional optical observation device |
CN109613661B (en) * | 2018-08-15 | 2024-05-07 | 苏州旭创科技有限公司 | Optical module |
CN112782812B (en) * | 2019-11-07 | 2023-08-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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TW201533487A (en) * | 2014-02-21 | 2015-09-01 | Enplas Corp | Optical receptacle and optical module |
CN105372770A (en) * | 2015-12-14 | 2016-03-02 | 华中科技大学 | Optical fiber coupling module |
CN205229523U (en) * | 2015-12-23 | 2016-05-11 | 福州高意通讯有限公司 | A light transceiver module for multichannel parallel transmission |
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JP2003207694A (en) * | 2002-01-15 | 2003-07-25 | Nec Corp | Optical module |
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EP0689071A1 (en) * | 1993-05-03 | 1995-12-27 | Litton Systems, Inc. | Optical fiber coupling |
CN103926660A (en) * | 2013-01-15 | 2014-07-16 | 鸿富锦精密工业(深圳)有限公司 | Optical coupling lens |
TW201533487A (en) * | 2014-02-21 | 2015-09-01 | Enplas Corp | Optical receptacle and optical module |
CN105372770A (en) * | 2015-12-14 | 2016-03-02 | 华中科技大学 | Optical fiber coupling module |
CN205229523U (en) * | 2015-12-23 | 2016-05-11 | 福州高意通讯有限公司 | A light transceiver module for multichannel parallel transmission |
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