CN1252499C - Parallel optical fiber array coupling componen element - Google Patents
Parallel optical fiber array coupling componen element Download PDFInfo
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- CN1252499C CN1252499C CN 03128028 CN03128028A CN1252499C CN 1252499 C CN1252499 C CN 1252499C CN 03128028 CN03128028 CN 03128028 CN 03128028 A CN03128028 A CN 03128028A CN 1252499 C CN1252499 C CN 1252499C
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Abstract
The present invention relates to a coupling component with a parallel optical fiber array, which belongs to a photo-electronic device in the field of optical communication and a parallel processing computer. A structure formed by directly coupling a one-dimensional optical fiber array with a bare optical fiber head of 45 DEG and a VCSEL chip of a parallel lasing array or a PIN chip of a parallel array detector is further disclosed on the basis of the patent application of ' a positioning component of an optical fiber array '. The one-dimensional optical fiber array of the present invention is composed of a grooving basal piece, a substrate basal piece and optical-fiber cores, and optical-fiber cores bared on the end of one-dimensional optical fiber array are processed into an optical flat of 45 DEG. Each optical-fiber core is corresponding to each picture element of the VCSEL chip of a parallel lasing array or the PIN (or a GaAs) chip of an array detector in a one-to-one mode, and the space between cylindrical surfaces of the bared optical-fiber cores opposite to the optical flat of 45 DEG and the picture element is from 20 to 400 micrometers. The coupling component with a parallel optical fiber array of the present invention is directly coupled with an array VCSEL chip and a PIN chip and has the advantages of high coupling efficiency, cost reduction, and simple and compact structure, and the optical performance of an optoelectronic device is enhanced.
Description
Technical field
The invention belongs to the optoelectronic device in the fields such as optical communication, parallel processing computer, specially refer in the fields such as optical communication, parallel processing computer, active and passive light electronic chip is imported, the optical-fiber array assembly of output parallel channel coupling interface.
Background technology
In recent years, because the fast development of a group of planes, network operations system in optical communication and the computer realm is used for various new type of passive devices of message area and active device emerge in multitude.Planar waveguide chip, the micro photo-electro-mechanical switch MEMS chip etc. such as multiplexing, demultiplexing, beam splitter that are used for surface-emission laser array VCSEL chip, light-receiving PIN chip, the various uses in broadband high-speed field are succeeded in developing in succession.Said chip will encapsulate when being made into practical devices, the input and output coupling interface of the optical-fiber array assembly of very high degree of precision as chip must be arranged, with each the bar light-path in the said chip, aim at accurately with corresponding each bar optical fiber strictness in the optical-fiber array assembly, light signal could be imported, exported, be made into practical devices steady in a long-term.The encapsulation technology of above-mentioned device is to guarantee the gordian technique of the superior optical characteristics of device, simultaneously, also is the operation of labor intensive, and it is one of the highest part in the device cost.Because above chip all adopts photoelectron technology to be developed into, so the encapsulation technology of device must be complementary with the positional precision of photoetching lines to the accuracy requirement of each bar fiber position in the optical-fiber array assembly.Moreover, also need optical fiber head is processed into the shape of various needs simultaneously, as to optical fiber head strictness be processed into 8 °, 45 °, 57 °, sphere, aspheric surface etc., especially for the optical-fiber array assembly in the parallel transceiver module of surface-emission laser array VCSEL/PIN, its encapsulation technology needs the fiber array of very high degree of precision, could guarantee direct-coupled high-level efficiency.So, provide different shape very high degree of precision optical-fiber array assembly be to guarantee the high-quality optical characteristics of optoelectronic device, improve packaging technology efficient, reduce one of the most key technology of device cost.
Fiber array all is to adopt on the particular crystal orientation silicon chip at present, corrodes some parallel V-shaped grooves, and optical fiber is embedded in the V-shaped groove, with the surface of V-shaped groove inside surface as each bar optical fiber of location, be made into optical-fiber array assembly, see United States Patent (USP) 5,656.120, Chinese patent 00101007.7.What also have is carved into Baltimore groove on substrate, optical fiber is embedded in the Baltimore groove, as each bar optical fiber surface of location, is made into optical-fiber array assembly with the Baltimore groove inside surface, sees United States Patent (USP) 6,706371.In the above fiber orientation method, the bearing accuracy of optical fiber is relevant with the process precision that the degree of depth and the inside surface of V-shaped groove that corrodes shaping or Baltimore groove are shaped.
Each bar optical fiber is accurately located the structure of the substrate surface etching groove two side line positioning optical waveguides that are based on number of patent application 01133513.0 " optical fibre array positioning assembly " proposition in the one-dimension optical-fiber array of the present invention, as shown in Figure 1, among Fig. 1 (A) (B) (C) be the situation of locating each bar optical fiber with substrate surface Baltimore groove two side lines, wherein a slice is that the surface has the substrate that is etched into Baltimore groove one by one, the width of groove face should be less than the diameter of optical fiber core diameter, determining of the width of etching depth and groove, be placed on surface groove two side lines with optical fiber, the optical fiber lower surface can not contact the inside surface of groove and be advisable.
Summary of the invention
A kind of parallel optical fibre array coupling assembly proposed by the invention, propose on " optical fibre array positioning assembly " basis at number of patent application 01133513.0, further propose a kind of high precision optical fiber array and parallel emission laser array VCSEL chip or the direct-coupled structure of detector array PIN chip with 45 ° of bare fibre heads.
A kind of parallel optical fibre array coupling assembly of the present invention, comprise the cutting substrate, substrate base and the fiber core between them, the cutting substrate surface has the Baltimore groove that is arranged in parallel, every fiber core is thrown on two side lines of Baltimore groove surface, the groove width of Baltimore groove is less than the diameter of fiber core, the Baltimore groove degree of depth is positioned at the arc section height of Baltimore groove part greater than fiber core, constitute the one-dimension optical-fiber array, it is characterized in that: (1) described parallel optical fibre array coupling assembly also comprises parallel emission laser array VCSEL chip or detector array PIN or GaAs chip, (2) the exposed fibre core in described one-dimension optical-fiber array end is processed optical flat at 45, and each bar fibre core of one-dimension optical-fiber array is aimed at one to one with parallel laser array VCSEL each picture dot of chip or detector array PIN or each picture dot of GaAs chip launched.
Described parallel optical fibre array coupling assembly, it is further characterized in that with the face of cylinder and corresponding the walking abreast of 45 ° of corresponding exposed fibre cores of optical flat launches laser array VCSEL chip picture dot or parallel array detector PIN or GaAs chip picture dot apart from 20-400 μ m; The 45 ° of optical flats of exposed fibre core and surface or the emitted laser bundle or the detector array PIN chip receiving surface angle at 45 of corresponding parallel emission laser array VCSEL chip.
Novel surface-emission laser array VCSEL chip began a large amount of practicability in nearly 2 years, each picture dot light-emitting area 1-2 μ m only in this laser chip, the chamber is about 3 μ m, it is that a kind of threshold value is low, modulation rate is fast, the angle of divergence is little, garden type hot spot, can directly be coupled, need not strict temperature control with multimode optical fiber, can be developed into a peacekeeping two-dimensional array chip, the communication light source of many advantages such as cost is low.The parallel transceiver module of present 850 wavelength VCSEL/PIN has been widely used in broadband, high-speed data communications and parallel processing computer field.By the parallel emission laser array VCSEL chip that extensive integrated opto-electronic technology develops, the normal pitch between the picture dot is 250 μ m, the about 0.2 μ m of positional precision error.The one-dimension optical-fiber array that needs very high degree of precision adopts special coupled structure, each picture dot emitted laser bundle in the parallel emission of the one dimension laser array VCSEL chip could be coupled to each bar optical fiber output in the one-dimension optical-fiber array one to one equably.The high precision optical fiber array of 45 ° of bare fibre cores of termination band that the present invention proposes, the bearing accuracy of each bar optical fiber can reach 0.2-0.4 μ m, its precision fully and in the VCSEL array chip positional precision of each picture dot mate fully, so, can be used for direct coupling fully with emission laser array VCSEL chip.Equally, normal pitch also is 250 μ m between parallel array detector PIN or the GaAs chip picture dot, can directly be coupled with the one-dimension optical-fiber array of 45 ° of optical flats of termination band or receive, and it is a kind of very simple and compact coupled structure.Thereby, can improve coupling efficiency greatly, reduce cost, improve the optical property of optoelectronic device.
Description of drawings
Fig. 1 is number of patent application 01133513.0 " optical fibre array positioning assembly " synoptic diagram;
Fig. 2 is one-dimension optical-fiber array synoptic diagram among the present invention;
Fig. 3 represents in the one-dimension optical-fiber array optical fiber discharge process in the fiber array;
Fig. 4 is the one-dimension optical-fiber array side view with 45 ° of optical flats;
Fig. 5 is the one-dimension optical-fiber array synoptic diagram with 8 ° of angles;
Fig. 6 is for being with 8 ° of angle one-dimension optical-fiber array side views;
Fig. 7 is one embodiment of the present invention;
Fig. 8 is the parallel transmitter module synoptic diagram of the surface-emission laser VCSEL that is made of the present invention;
The parallel PIN receiver module synoptic diagram of Fig. 9 for constituting by the present invention.
Embodiment
In the parallel optical fibre array coupling assembly of the present invention the high precision optical fiber array of 45 ° of bare fibres of a kind of termination band as shown in Figure 2, it is made up of optical fiber (100), cutting substrate (120) and substrate base (130) with 45 ° of bare fibre heads.Its manufacturing process is as follows, if will develop the fiber array of 1 * n with 45 ° of bare fibre heads, at first, according to application for a patent for invention 01133513.0 etching Baltimore groove substrate, be parallel to the semi-conductor chip separate machine that etching is recessed to be divided into needed size, selective etching has the cutting substrate (120) greater than n+2 bar Baltimore groove.Substrate base (130) width is identical with the cutting substrate, length is than the short 3-5mm of cutting substrate, substrate cleaned up standby, is that the part of 2mm is removed covering (110) with the front end length L of the optical fiber of needs discharging, the nuditing fiber diameter is the core diameter of 125 μ m, cleans up standby.During discharging optical fiber, at first, cutting substrate (120) is placed on the planar substrates of a level, place up on band Baltimore groove surface, and maintain static in the process of discharging optical fiber.Discharging optical fiber process is seen shown in Figure 3, on the Baltimore groove of the both sides that are equal to or greater than n bar Baltimore groove on the cutting substrate, respectively discharge a length respectively approximately less than L, the core diameter diameter is the nuditing fiber core (100) that 125 μ m clean up, place a slice substrate base (130) thereon, the left and right width of this substrate and following cutting substrate (120) align, and the front end of following cutting substrate exposes 1-2mm, and about 2-3mm is exposed in the rear end.On substrate base (130) surface, add a suitable pressure, substrate position is stablized motionless about making, at this moment, can be that L one 2mm, core diameter diameter are the cleaned bare fibre cores of 125 μ m with standby front end length, from the rear end between the last subtegulum, insert one by one on each bar Baltimore groove and and locate, discharge n bar optical fiber one by one concurrently with the both sides of Baltimore groove.Then, with flowability ultraviolet glue (140) preferably, seldom drop in optical fiber core diameter surface from tail end, rely on the surface tension in optical fiber slit between last substrate and Baltimore groove substrate, ultraviolet glue (140) is flowed into and fills up the slit of going up between the subtegulum, and nuditing fiber lower surface and Baltimore groove slit, solidify with UV-irradiation again, make optical fiber correctly locate and be firmly fixed between two substrates, and the lower surface of nuditing fiber head is solidified togather with Baltimore groove securely, and paying special attention to the nuditing fiber core can not have any glue-line to pollute with the contacted periphery of going up of Baltimore groove.At last, with respect to the strict processing of cutting substrate surface surface at 45,45 ° of optical flat nuditing fibers of termination band core one-dimension optical-fiber array side view is seen Fig. 4 together for nuditing fiber core and cutting substrate.
According to process recited above, can develop the port angle of wedge and be the one-dimension optical-fiber array of 8 ° or any angle, be used for inputs such as beam splitting waveguide chip, array waveguide grating AWG chip, output coupling interface.The port angle of wedge is 8 ° an one-dimension optical-fiber array component, as shown in Figure 5.The length of upper and lower substrate is all identical with width in the assembly, and is last after having discharged optical fiber, injecting glue, UV-irradiation and solidify according to above-mentioned technology, is polished to 8 ° of angles in fiber end face processing, and the side view of its assembly is seen Fig. 6.
The High Precision One Dimensional fiber array direct couple junction structure of parallel emission laser array VCSEL chip and 45 ° of bare fibre cores of termination band as shown in Figure 7.Because the angle of divergence of the laser beam that parallel each picture dot of emission laser array VCSEL chip sends is little, about 15 ° of garden type hot spot, its full angle of divergence, is the multimode optical fiber coupling output of 62.5 μ m if adopt core diameter, can adopt as shown in Figure 8.Direct-coupled mode simple in structure obtains higher coupling efficiency.At first, with VCSEL array chip (150) paster on heat sink substrate (160), the substrate base (130) of the one dimension multimode fiber array of heat sink (160) substrate and 45 ° of bare fibre cores of termination band, and place jointly on heat radiator (190) plane, convey 45 ° of corresponding optical fiber peripheries of bare fibre core diameter, directly relative with VCSEL chip light emitting face, each picture dot emitted laser bundle of VCSEL chip directly passes and 45 ° of fiber cores peripheries that the inclined-plane is relative, be incident on 45 ° of inclined-planes of termination bare fibre core, be directly coupled in the optical fiber core diameter through the reflection on 45 ° of inclined-planes and go.In order to obtain higher coupling efficiency, higher homogeneity and stability, an important parameters is the termination and is with 45 ° of corresponding fiber cores peripheries of bare fibre core and VCSEL chip light emitting surface distance, be made as Δ, the thickness of heat sink (160) is s, the thickness of VCSEL chip (150) is h, and then the thickness of one-dimension optical-fiber array substrate substrate (130) is d, and the pass between them is:
d＝Δ+s+h
The direct-coupled structure of one dimension multimode fiber array assembly of parallel emission laser VCSEL array and 45 ° of bare fibre cores of termination band must guarantee following some: 1) the one dimension multimode fiber array of 45 ° of bare fibre core diameters of termination band and the parallel position arrangement of launching laser array VCSEL chip, must convey the light-emitting area distance, delta of 45 ° of inclined-plane corresponding bare fibre core peripheries and VCSEL chip, about about 20-400 μ m, so that make laser beam about 85% or higher power directly pass bare fibre core periphery, be incident on 45 ° of polished surfaces of bare fibre head multimode optical fiber core, the reflection by 45 ° of polished surfaces is directly coupled in the multimode optical fiber core diameter goes.2) adjust one dimension multimode fiber array assembly, make 45 ° of polished surfaces of bare fibre head strict at 45 with the VCSEL chip surface or the laser beam strictness of launching with it.3) adjust one dimension multimode fiber array assembly, make each the picture dot strictness of each bar fibre core and VCSEL array aim at one to one, the about 0.2-0.4 μ of error m.By above simple structure and correct the adjustment, can obtain higher coupling efficiency, higher homogeneity and stability.
By the parallel transmitter module of the surface-emission laser VCSEL that the present invention constituted as shown in Figure 8, main components and parts have: the one-dimension optical-fiber array of 45 ° of bare fibre cores of termination band, VCSEL array chip (150), heat sink (160), driving circuit array chip (170), circuit board (180), heat radiator (190).At first surface-emission laser VCSEL chip (150) is attached on heat sink (160), allow the substrate base (130) of one dimension multimode fiber array assembly of heat sink (160), 45 ° of bare fibre cores of termination band of drive circuit chip (170), band VCSEL chip of circuit board (180), VCSEL, parallel together being placed on the same heating radiator plane, adopt a cover commissioning device to debug in strict accordance with above coupled structure, in carrying out debug process, the various parameters of strict monitoring, when reaching the optimum position, fix with glue.
The function of the parallel PIN receiver module that is made of the present invention is with the light from each bar optical fiber in the one dimension multimode fiber array assembly, be incident on each picture dot of PIN array chip, PIN or GaAs picture dot convert light signal to electric signal, electric signal through receiving the amplification of amplifying circuit, is amplified to the needed level of system with level again.The structure of PIN or GaAs parallel receive module and the structure of VCSEL transmitter module are identical, only need VCSEL chip (150) is replaced as PIN or GaAs chip (200), and chip for driving (170) is replaced as reception amplifying circuit array chip (210), as shown in Figure 9.
Claims (1)
1. parallel optical fibre array coupling assembly, comprise cutting substrate, substrate base and the fiber core between them, the cutting substrate surface has the Baltimore groove that is arranged in parallel, every fiber core is thrown on two side lines of Baltimore groove surface, the groove width of Baltimore groove is less than the diameter of fiber core, the Baltimore groove degree of depth is positioned at Baltimore groove arc section height partly greater than fiber core, constitutes the one-dimension optical-fiber array, it is characterized in that:
(1) described parallel optical fibre array coupling assembly also comprises parallel vertical cavity surface-emitting laser array chip VCSEL or light-receiving detector array PIN or GaAs chip;
(2) the exposed fibre core in described one-dimension optical-fiber array end is processed into respect to 45 ° of optical flats of shaft axis of optic fibre, and each bar fibre core of one-dimension optical-fiber array and parallel each picture dot of vertical cavity surface-emitting laser array chip VCSEL or light-receiving detector array PIN or each picture dot of GaAs chip are aimed at one to one;
(3) with the face of cylinder of 45 ° of corresponding exposed fibre cores of optical flat and corresponding parallel vertical cavity surface-emitting laser array chip VCSEL picture dot or parallel light-receiving detector array PIN or GaAs chip picture dot apart from 20-400 μ m;
(4) 45 ° of optical flats of exposed fibre core and surface or emitted laser bundle or the light-receiving detector array chip PIN receiving surface angle at 45 of corresponding parallel vertical cavity surface-emitting laser array chip VCSEL.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 03128028 CN1252499C (en) | 2003-05-23 | 2003-05-23 | Parallel optical fiber array coupling componen element |
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| CN 03128028 CN1252499C (en) | 2003-05-23 | 2003-05-23 | Parallel optical fiber array coupling componen element |
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| CN1252499C true CN1252499C (en) | 2006-04-19 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103278894A (en) * | 2013-06-14 | 2013-09-04 | 洛合镭信光电科技（上海）有限公司 | Coupling assembly, optical fiber array module using coupling assembly and optical transceiver engine module using coupling assembly |
| CN103383482B (en) * | 2013-07-19 | 2016-03-16 | 武汉博昇光电股份有限公司 | For the manufacture method of the fiber array with VSCEL or PIN array couples |
| CN103383481B (en) * | 2013-07-19 | 2015-05-20 | 武汉博昇光电技术有限公司 | Parallel optical transceiving device based on standard MT connector and manufacturing method thereof |
| CN104597567A (en) * | 2015-01-22 | 2015-05-06 | 中国科学院半导体研究所 | Optical switch array module and chamfered optical fiber array packaging method |
| US20160274321A1 (en) * | 2015-03-21 | 2016-09-22 | Ii-Vi Incorporated | Flexible Structured Optical Modules |
| CN205899082U (en) * | 2016-06-24 | 2017-01-18 | 上海坤腾光电科技有限公司 | Parallel optic fibre corner coupling subassembly |
| CN107526132A (en) * | 2017-09-08 | 2017-12-29 | 南方电网科学研究院有限责任公司 | A kind of coupling package method of integrated optics forceful electric power field sensor |
| CN107688216B (en) * | 2017-10-10 | 2023-03-31 | 成都优博创通信技术股份有限公司 | Optical receiving module and optical communication system |
| CN107843959A (en) * | 2017-11-20 | 2018-03-27 | 武汉驿路通科技股份有限公司 | A kind of Multi-channel optical fiber array and preparation method thereof |
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