CN109991705B - High-speed parallel bidirectional transmission optical module - Google Patents
High-speed parallel bidirectional transmission optical module Download PDFInfo
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- CN109991705B CN109991705B CN201910234609.8A CN201910234609A CN109991705B CN 109991705 B CN109991705 B CN 109991705B CN 201910234609 A CN201910234609 A CN 201910234609A CN 109991705 B CN109991705 B CN 109991705B
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- 230000003287 optical effect Effects 0.000 title claims abstract description 144
- 230000005540 biological transmission Effects 0.000 title claims abstract description 37
- 230000002457 bidirectional effect Effects 0.000 title claims abstract description 20
- 239000000835 fiber Substances 0.000 claims abstract description 7
- 230000008054 signal transmission Effects 0.000 claims abstract description 5
- 239000013307 optical fiber Substances 0.000 claims description 35
- 238000012544 monitoring process Methods 0.000 claims description 22
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000012858 packaging process Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005457 optimization Methods 0.000 description 4
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000007175 bidirectional communication Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to the technical field of optical modules, and provides a high-speed parallel bidirectional transmission optical module, which comprises a heat sink carrier, two receiving units for receiving optical signals, and two transmitting units for transmitting the optical signals, wherein the upper surface of the heat sink carrier is inwards recessed to form two first grooves, the two first grooves are arranged side by side, and the two transmitting units are respectively arranged in the two first grooves; and one side of the heat sink carrier is provided with a PCB, and the two receiving units are respectively and electrically connected with the PCB through two first flexible circuit boards. The invention saves transmission fiber resources, realizes two paths of signal transmission back and forth in one single-mode fiber, and is beneficial to quality and cost control of optical packaging by dividing the packaging of the optical module into a plurality of units and assembling and positioning the units according to the positions of the grooves.
Description
Technical Field
The invention relates to the technical field of optical modules, in particular to a high-speed parallel bidirectional transmission optical module.
Background
Along with the process of digitization, data processing, storage and transmission have been rapidly developed. The rapid growth of large data volume search services and video traffic has greatly driven the development of supercomputer and storage based data centers. The design idea of the data center optical module is to provide higher access density through smaller volume and lower cost, and finally improve the access capacity of users.
The high-speed parallel transmission optical module is used as a main product for interconnection application of a short-distance data center, and has a wide market application prospect. The high-speed parallel transmission optical module realizes optical intercommunication through the parallel optical module and the ribbon optical cable. Typically, the optical interface employs standard MPO/MTP cables, 4 transmit and 4 receive channels. The parallel light receiving and transmitting module can provide larger transmission bandwidth under the condition of smaller space and lower energy consumption occupation, and the corresponding research and development are accelerated increasingly.
The high-speed parallel bidirectional transmission multichannel optical module can simultaneously transmit and receive optical signals in two directions in each optical fiber of the optical cable, and the optical signals in the front direction and the back direction are not interfered with each other. In the conventional bidirectional transmission multi-channel optical module, only optical signals in the same direction are transmitted in each optical fiber of the optical cable, so that two optical fibers are required for realizing bidirectional communication. In comparison, the single-fiber bidirectional technology only uses one optical fiber to finish the work which can be finished by two original optical fibers, and the transmission quantity of the existing optical fibers is doubled, so that the optical fiber resources are greatly saved. In a high-speed parallel bidirectional transmission multichannel optical module of a data center, the single-fiber bidirectional technology amplifies transmission capacity by one time under the same number of optical cables (optical fibers), and is very fit with the design idea of the optical module of the data center.
But the high-speed parallel bi-directional transmission multi-channel optical module has a lot of optical packaging elements. The difficulty of optical module packaging is also that the integration of multiple chips and multiple optical components within a package size envelope with limited protocol requirements presents a significant challenge to packaging technology.
Disclosure of Invention
The invention aims to provide a high-speed parallel bidirectional transmission optical module, which saves transmission optical fiber resources, realizes back and forth two paths of signal transmission in one single-mode optical fiber, and is beneficial to quality and cost control of optical packaging by dividing the packaging of the optical module into a plurality of units and assembling and positioning the units according to the positions of grooves.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: the high-speed parallel bidirectional transmission optical module comprises a heat sink carrier, two receiving units for receiving optical signals and two transmitting units for transmitting the optical signals, wherein the upper surface of the heat sink carrier is inwards recessed to form two first grooves, the two first grooves are arranged side by side, and the two transmitting units are respectively arranged in the two first grooves; and one side of the heat sink carrier is provided with a PCB, and the two receiving units are respectively and electrically connected with the PCB through two first flexible circuit boards.
Further, each emission unit includes an LD chip set, a first optical lens set, an optical isolator, a beam splitting prism and a second optical lens set, wherein the LD chip set, the first optical lens set, the optical isolator, the beam splitting prism and the second optical lens set are sequentially arranged in the corresponding first groove, the optical isolator, the beam splitting prism and the second optical lens set are used for isolating reflected light, the beam splitting prism is used for splitting and outputting optical signals, and the optical signals emitted by the LD chip set sequentially pass through the first optical lens set, the optical isolator, the beam splitting prism and the second optical lens set.
Further, each of the LD chip groups includes four LD chips arranged side by side.
Further, each of the first optical lens group and each of the second optical lens group includes four lenses arranged side by side, and the four LD chips are configured in one-to-one correspondence with the four lenses.
Further, the optical signals passing through the second optical lens group are coupled into an optical fiber array, the optical fiber array comprises four single-mode optical fibers arranged side by side, the four single-mode optical fibers and the four LD chips are configured in one-to-one correspondence, each LD chip and the corresponding single-mode optical fiber form an optical path, input light of the four optical paths is lambda 1, and output light of the four optical paths is lambda 2.
Further, the distance between two adjacent single-mode optical fibers is not less than 750 μm.
Further, each receiving unit comprises four PD chips for converting four paths of optical signals emitted by the four LD chips into electrical signals, the four PD chips are arranged side by side and are configured in one-to-one correspondence with the four LD chips, and the four PD chips are connected with transimpedance amplifiers.
Further, the lower surface of the heat sink carrier is recessed inwards to form two second grooves, each second groove is internally provided with a backlight monitoring unit, and the two backlight monitoring units are respectively and electrically connected with the PCB through two second flexible circuit boards; the two backlight monitoring units are configured in one-to-one correspondence with the two emission units.
Further, the two first grooves are in one-to-one correspondence with the two second grooves, the heat sink carrier is provided with a first through hole penetrating one of the first grooves and the corresponding second groove, and the heat sink carrier is also provided with a second through hole penetrating the other first groove and the corresponding second groove; the light emitted by one of the emitting units is reflected to the corresponding backlight monitoring unit through the first through hole part, and the light emitted by the other emitting unit is reflected to the corresponding backlight monitoring unit through the second through hole part.
Further, each backlight monitoring unit comprises four MPD chips arranged side by side, and each MPD chip is packaged on the second flexible circuit board through a semiconductor packaging process.
Compared with the prior art, the invention has the beneficial effects that: the transmission optical fiber resources are saved, two paths of signal transmission back and forth are realized in one single-mode optical fiber, and the corresponding high-speed parallel bidirectional transmission optical module is beneficial to the quality and cost control of optical packaging by dividing the packaging of the optical module into a plurality of units and assembling and positioning the units according to the positions of the grooves.
Drawings
Fig. 1 is a schematic view of a first view structure of a high-speed parallel bidirectional transmission optical module according to an embodiment of the present invention;
fig. 2 is a schematic view of a second view structure of a high-speed parallel bidirectional transmission optical module according to an embodiment of the present invention;
fig. 3 is a schematic view of a first view angle structure of a heatsink carrier and PCB connection of a high-speed parallel bi-directional optical module according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a second view angle structure of a heatsink carrier of a high-speed parallel bidirectional optical module according to an embodiment of the present invention;
Fig. 5 is a schematic diagram of a partial structure of a high-speed parallel bidirectional transmission optical module according to an embodiment of the present invention;
Fig. 6 is a schematic structural diagram of an optical fiber array of a high-speed parallel bidirectional transmission optical module according to an embodiment of the present invention;
Fig. 7 is a schematic diagram of a traveling direction of an optical path in a first groove of a high-speed parallel bidirectional transmission optical module according to an embodiment of the present invention;
In the reference numerals: 1-a receiving unit; a 2-transmitting unit; a 20-LD chipset; 21-a first optical lens group; 22-an optical isolator; 23-a beam splitting prism; 24-a second optical lens group; 3-a heatsink carrier; 30-a first groove; 31-a second groove; 32-a first through hole; 33-a second through hole; 4-PCB; 5-a first flexible circuit board; 6-an optical fiber array; 7-a backlight monitoring unit; 8-a second flexible circuit board.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-7, an embodiment of the present invention provides a high-speed parallel bidirectional transmission optical module, which includes a heatsink carrier 3, two receiving units 1 for receiving optical signals, and two transmitting units 2 for transmitting optical signals, wherein the upper surface of the heatsink carrier 3 is recessed inwards to form two first grooves 30, the two first grooves 30 are arranged side by side, and the two transmitting units 2 are respectively arranged in the two first grooves 30; a PCB4 is mounted on one side of the heatsink carrier 3, and the two receiving units 1 are electrically connected to the PCB4 through two first flexible circuit boards 5, respectively. In this embodiment, transmission fiber resources are saved, two paths of signal transmission are realized in one single mode fiber, and each part in the optical module in the prior art is divided and formed into a plurality of subunits, namely two receiving units 1 and two transmitting units 2, although with the increase of the rate, if more receiving units 1 and transmitting units 2 exist, the configuration can also be performed according to the form. The first groove 30 and the second groove 31 which are arranged side by side are strip grooves, so that the assembly and the positioning of the transmitting unit 2 can be facilitated, the packaging efficiency is improved, and the mass production is facilitated.
The following are specific examples:
with reference to fig. 5 and 7, each of the emission units 2 includes an LD chip group 20, a first optical lens group 21 for shaping divergent light into parallel light, an optical isolator 22 for isolating reflected light, a beam splitting prism 23 for splitting and outputting an optical signal, and a second optical lens group 24 for coupling an optical signal, which are sequentially disposed in the corresponding first groove 30, and the optical signal emitted from the LD chip group sequentially passes through the first optical lens group 21, the optical isolator 22, the beam splitting prism 23, and the second optical lens group 24. Preferably, each of the LD chip sets 20 includes four LD chips arranged side by side. In this embodiment, the LD chip set 20 emits an optical signal, which is shaped into parallel light after passing through the first optical lens, and then transmits the optical isolator 22, and the optical isolator 22 can prevent light on an optical path from being reflected back to the LD chip, and then the optical signal is transmitted through the wind-solar prism again, so that the optical signal with multiple wavelengths is decomposed into multiple parallel light with single wavelength and output to the first optical lens set 21, and the first optical lens set 21 focuses and couples the optical signal to a single mode optical fiber in the four-core FA. Preferably, the LD chip is specifically an electro-absorption semiconductor laser chip (EML).
Further preferably, each of the first optical lens group 21 and each of the second optical lens group 24 includes four lenses arranged side by side, and the four LD chips are configured in one-to-one correspondence with the four lenses. In this embodiment, four lenses may perform convergent coupling on the four optical signals decomposed by the splitting prism 23, respectively.
As an optimization scheme of the embodiment of the present invention, referring to fig. 7, the optical signals passing through the second optical lens group 24 are coupled into the optical fiber array 6, the optical fiber array 6 includes four single-mode optical fibers arranged side by side, the four single-mode optical fibers are configured in a one-to-one correspondence with the four LD chips, each LD chip and the corresponding single-mode optical fiber form an optical path, the input light of the four optical paths is λ 1, and the output light of the four optical paths is λ 2. In this embodiment, the optical fiber array 6 is a four-core optical fiber array, as shown in fig. 7, the arrow indicates the direction of the optical signal, the output optical signal is shaped by the second optical lens group 24, and then is converted into parallel light by the divergent light with a certain divergence angle, and the four parallel light beams are totally reflected by the beam splitting prism 23 and reach the receiving unit 1 respectively. Preferably, the distance between two adjacent single-mode optical fibers is not less than 750 μm. Preferably, the input light of the four light paths is 1270nm, and the output light is 1330nm.
As an optimization scheme of the embodiment of the present invention, each receiving unit 1 includes four PD chips for converting four optical signals emitted by four LD chips into electrical signals, the four PD (receiving) chips are arranged side by side and configured in one-to-one correspondence with the four LD chips, and the four PD chips are connected with transimpedance amplifiers. In this embodiment, four PD chips may convert four optical signals into electrical signals for output and amplification by a transimpedance amplifier.
As an optimization scheme of the embodiment of the present invention, referring to fig. 2,3 and 4, the lower surface of the heatsink carrier 3 is recessed inwards to form two second grooves 31, each second groove 31 is internally provided with a backlight monitoring unit 7, and the two backlight monitoring units 7 are electrically connected with the PCB4 through two second flexible circuit boards 8 respectively; the two backlight monitoring units 7 are configured in one-to-one correspondence with the two emission units 2. In this embodiment, the backlight monitor unit 7 is provided to monitor the emitted light power of the LD chip, and the two second grooves 31 are also bar-shaped grooves which can be positioned easily on the one hand and can be provided with an FPC (flexible circuit board) on the other hand.
Further optimizing the above solution, referring to fig. 2,3 and 4, two first grooves 30 are in one-to-one correspondence with two second grooves 31, the heatsink carrier 3 has a first through hole 32 penetrating one of the first grooves 30 and the second groove 31 corresponding thereto, and the heatsink carrier 3 further has a second through hole 33 penetrating the other first groove 30 and the second groove 31 corresponding thereto; the light emitted by one of the emitting units 2 is partially reflected into the corresponding backlight monitoring unit 7 through the first through hole 32, and the light emitted by the other emitting unit 2 is partially reflected into the corresponding backlight monitoring unit 7 through the second through hole 33. In this embodiment, the first groove 30 and the second groove 31 on the upper and lower surfaces of the heatsink carrier 3 are penetrated by through holes, the first through hole 32 and the second through hole 33 are square through holes, the prism reflects the incident light signal in the light path to the receiving unit 1, and simultaneously reflects the light emitted from the LD chip to the backlight monitoring unit 7 in proportion to the light emitted from the LD chip, and the light emitted from the LD chip passes through the through holes to the backlight monitoring unit 7.
As an optimization scheme of the embodiment of the present invention, referring to fig. 2, each of the backlight monitoring units 7 includes four MPD chips arranged side by side, and each of the MPD chips is packaged on the second flexible circuit board 8 through a semiconductor packaging process. In this embodiment, the backlight monitoring unit monitors with an MPD (backlight detector) chip, and preferably, the MPD chip and the TIA chip are both fixed to the FPC by a Die Bonding process of the semiconductor package, and the electrical connection between the PD chip and the FPC is implemented by a Wire Bonding process of the semiconductor package. Preferably, the reinforcing plate is arranged on the back of the FPC, and the reinforcing plate is a metal sheet or a ceramic substrate.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a high-speed parallel bidirectional transmission optical module, includes heat sink carrier, its characterized in that: the heat sink carrier comprises two receiving units for receiving optical signals and two transmitting units for transmitting the optical signals, wherein the upper surface of the heat sink carrier is inwards recessed to form two first grooves, the two first grooves are arranged side by side, and the two transmitting units are respectively arranged in the two first grooves; and one side of the heat sink carrier is provided with a PCB, the two receiving units are respectively and electrically connected with the PCB through two first flexible circuit boards, the receiving units and the transmitting units are vertically opposite to each other and are stacked, and a single mode fiber is adopted to realize back and forth two paths of signal transmission.
2. A high speed parallel bi-directional transmission optical module as defined in claim 1, wherein: each emission unit comprises an LD chip group, a first optical lens group, an optical isolator, a beam splitting prism and a second optical lens group, wherein the LD chip group, the first optical lens group, the optical isolator, the beam splitting prism and the second optical lens group are sequentially arranged in the corresponding first groove, the optical signal splitting prism and the second optical lens group are used for splitting and outputting optical signals, the first optical lens group, the optical isolator, the beam splitting prism and the second optical lens group are sequentially arranged in the corresponding first groove, and the optical signals emitted by the LD chip group sequentially pass through the first optical lens group, the optical isolator, the beam splitting prism and the second optical lens group.
3. A high speed parallel bi-directional transmission optical module as defined in claim 2, wherein: each LD chip group comprises four LD chips arranged side by side.
4. A high speed parallel bi-directional transmission optical module as set forth in claim 3 wherein: each first optical lens group and each second optical lens group comprise four lenses which are arranged side by side, and the four LD chips are configured in one-to-one correspondence with the four lenses.
5. A high speed parallel bi-directional transmission optical module as set forth in claim 3 wherein: the optical signals passing through the second optical lens group are coupled into an optical fiber array, the optical fiber array comprises four single-mode optical fibers which are arranged side by side, the four single-mode optical fibers and the four LD chips are configured in one-to-one correspondence, each LD chip and the corresponding single-mode optical fiber form an optical path, input light of the four optical paths is lambda 1, and output light of the four optical paths is lambda 2.
6. A high speed parallel bi-directional transmission optical module as defined in claim 5, wherein: the distance between two adjacent single-mode optical fibers is not less than 750 μm.
7. A high speed parallel bi-directional transmission optical module as set forth in claim 3 wherein: each receiving unit comprises four PD chips for converting four paths of optical signals emitted by the four LD chips into electric signals, the four PD chips are arranged side by side and are configured in one-to-one correspondence with the four LD chips, and the four PD chips are connected with transimpedance amplifiers.
8. A high speed parallel bi-directional transmission optical module as defined in claim 1, wherein: the lower surface of the heat sink carrier is inwards recessed to form two second grooves, a backlight monitoring unit is arranged in each second groove, and the two backlight monitoring units are respectively and electrically connected with the PCB through two second flexible circuit boards; the two backlight monitoring units are configured in one-to-one correspondence with the two emission units.
9. A high speed parallel bi-directional transmission optical module as defined in claim 8, wherein: the two first grooves are in one-to-one correspondence with the two second grooves, the heat sink carrier is provided with a first through hole penetrating one of the first grooves and the second groove corresponding to the first groove, and the heat sink carrier is also provided with a second through hole penetrating the other of the first grooves and the second groove corresponding to the second groove; the light emitted by one of the emitting units is reflected to the corresponding backlight monitoring unit through the first through hole part, and the light emitted by the other emitting unit is reflected to the corresponding backlight monitoring unit through the second through hole part.
10. A high speed parallel bi-directional transmission optical module as defined in claim 8, wherein: each backlight monitoring unit comprises four MPD chips which are arranged side by side, and each MPD chip is packaged on the second flexible circuit board through a semiconductor packaging process.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910234609.8A CN109991705B (en) | 2019-03-26 | 2019-03-26 | High-speed parallel bidirectional transmission optical module |
| PCT/CN2019/083930 WO2020191844A1 (en) | 2019-03-26 | 2019-04-23 | High-speed parallel two-way transmission optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910234609.8A CN109991705B (en) | 2019-03-26 | 2019-03-26 | High-speed parallel bidirectional transmission optical module |
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| Publication Number | Publication Date |
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| CN109991705A CN109991705A (en) | 2019-07-09 |
| CN109991705B true CN109991705B (en) | 2024-05-03 |
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| CN201910234609.8A Active CN109991705B (en) | 2019-03-26 | 2019-03-26 | High-speed parallel bidirectional transmission optical module |
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| WO (1) | WO2020191844A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110376688A (en) * | 2019-07-16 | 2019-10-25 | 武汉光迅科技股份有限公司 | A kind of optical module |
| WO2021212868A1 (en) * | 2020-04-22 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112799182A (en) * | 2020-12-31 | 2021-05-14 | 重庆霓扬科技有限责任公司 | Method for manufacturing multi-channel integrated assembly |
| CN112764173A (en) * | 2020-12-31 | 2021-05-07 | 武汉联特科技股份有限公司 | Single-mode optical module based on MLG2.0 protocol |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1191023A (en) * | 1995-08-03 | 1998-08-19 | 松下电器产业株式会社 | Optical device and method of manufacturing it |
| CN1523390A (en) * | 2003-01-29 | 2004-08-25 | ������������ʽ���� | Optical communication module and connector thereof |
| CN103984066A (en) * | 2014-05-20 | 2014-08-13 | 昆山柯斯美光电有限公司 | Multi-path parallel optical component for high-speed transmission and assembling method thereof |
| CN109061811A (en) * | 2018-08-10 | 2018-12-21 | 武汉联特科技有限公司 | Double hairs are double to receive optical module |
| CN109491027A (en) * | 2019-01-08 | 2019-03-19 | 中航海信光电技术有限公司 | A kind of parallel optical module |
| CN209525489U (en) * | 2019-03-26 | 2019-10-22 | 武汉联特科技有限公司 | A kind of high-speed parallel two-way transmission optical module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004085756A (en) * | 2002-08-26 | 2004-03-18 | Matsushita Electric Ind Co Ltd | Optical transmission/reception module |
| CN101242075B (en) * | 2008-01-30 | 2010-12-08 | 福州高意通讯有限公司 | Optical structure and its application |
| CN104395796A (en) * | 2012-07-30 | 2015-03-04 | 惠普发展公司，有限责任合伙企业 | Optical waveguide |
| CN204349203U (en) * | 2014-12-31 | 2015-05-20 | 武汉华工正源光子技术有限公司 | Possesses the tunable laser assembly of link polarised light monitoring function |
| JP2019083299A (en) * | 2017-11-01 | 2019-05-30 | 富士通コンポーネント株式会社 | Optical engine and optical module |
-
2019
- 2019-03-26 CN CN201910234609.8A patent/CN109991705B/en active Active
- 2019-04-23 WO PCT/CN2019/083930 patent/WO2020191844A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1191023A (en) * | 1995-08-03 | 1998-08-19 | 松下电器产业株式会社 | Optical device and method of manufacturing it |
| CN1523390A (en) * | 2003-01-29 | 2004-08-25 | ������������ʽ���� | Optical communication module and connector thereof |
| CN103984066A (en) * | 2014-05-20 | 2014-08-13 | 昆山柯斯美光电有限公司 | Multi-path parallel optical component for high-speed transmission and assembling method thereof |
| CN109061811A (en) * | 2018-08-10 | 2018-12-21 | 武汉联特科技有限公司 | Double hairs are double to receive optical module |
| CN109491027A (en) * | 2019-01-08 | 2019-03-19 | 中航海信光电技术有限公司 | A kind of parallel optical module |
| CN209525489U (en) * | 2019-03-26 | 2019-10-22 | 武汉联特科技有限公司 | A kind of high-speed parallel two-way transmission optical module |
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| WO2020191844A1 (en) | 2020-10-01 |
| CN109991705A (en) | 2019-07-09 |
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