CN112799182A - Method for manufacturing multi-channel integrated assembly - Google Patents
Method for manufacturing multi-channel integrated assembly Download PDFInfo
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- CN112799182A CN112799182A CN202011618962.5A CN202011618962A CN112799182A CN 112799182 A CN112799182 A CN 112799182A CN 202011618962 A CN202011618962 A CN 202011618962A CN 112799182 A CN112799182 A CN 112799182A
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- mounting
- cover plate
- power supply
- mounting part
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention belongs to the technical field of semiconductors, and particularly relates to a manufacturing method of a multi-channel integrated component, which comprises the following steps: a mounting box manufacturing step, namely manufacturing a mounting part, an upper cover plate and a lower cover plate of the mounting box; the mounting part is provided with a plurality of independent mounting cavities, the bottom of each mounting cavity is provided with a power supply connecting hole, the front side wall is provided with an output port, and the rear side wall is provided with an input port; the bottom of the mounting part is provided with a power panel access slot; a power supply mounting step, mounting the power supply board in the power supply board access slot; a substrate mounting step of mounting the hybrid integrated substrate in a mounting cavity; an input/output access step, coupling the optical fiber with the high-speed photoelectric conversion chip by penetrating the input port, and electrically connecting the radio frequency connector with the amplifier by penetrating the output port; and a packaging step, namely fixing the lower cover plate at the bottom of the mounting part and fixing the upper cover plate at the top of the mounting part. The integrated assembly manufactured by the method can improve the integration level and ensure the stability of the working performance.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a manufacturing method of a multi-channel integrated assembly.
Background
In modern optical fiber communication systems, optical signals transmitted through optical fibers need to be converted into electrical signals by using photoelectric converters, so that monitoring and maintenance of optical fiber networks and signal processing are realized.
With the development of microwave photon transmission technology, the size of a transmission system is larger, a single light adjusting component is not enough to meet most use scenes, and a plurality of adjusting components are required to be used together for many times. However, the existing adjusting assemblies are all separated, i.e. the adjusting assemblies are separated. A single adjusting component is difficult to meet the requirement of transmission scale, and a plurality of adjusting components are used, so that the difficulty in management is high due to the separation of the adjusting components, and the problems of carrying and installation are also troublesome.
On the other hand, if a plurality of substrates are directly integrated together, although the integration level is improved, more use requirements can be met, signal interference is generated when the substrates work, the work of each other is influenced, and further the working performance of the integrated assembly is unstable.
Therefore, a method for manufacturing a multi-channel integrated component is needed, which can ensure the stability of the working performance while improving the integration level of the manufactured integrated component.
Disclosure of Invention
The invention aims to provide a method for manufacturing a multi-channel integrated component, which can ensure the stability of working performance while improving the integration level of the manufactured integrated component.
The basic scheme provided by the invention is as follows:
the manufacturing method of the multi-channel integrated assembly comprises the following steps:
a mounting box manufacturing step, namely manufacturing a mounting part, an upper cover plate and a lower cover plate of the mounting box; the upper cover plate and the lower cover plate are both flat plates; the bottom surface and the top surface of the mounting part are both planes, a plurality of independent mounting cavities are formed in the mounting part, the mounting cavities are grooves penetrating through the top surface of the mounting part, the bottom of each mounting cavity is provided with a power supply connection hole, the front side wall is provided with an output port, and the rear side wall is provided with an input port; the bottom of the mounting part is provided with a power panel access slot;
a power supply mounting step, mounting the power supply board in the power supply board access slot;
a substrate integration step, wherein a high-speed photoelectric conversion chip, an amplifier and a passive electronic component are integrated on the same substrate to obtain a hybrid integrated substrate;
a substrate mounting step, mounting the hybrid integrated substrate in the mounting cavity, and electrically connecting the hybrid integrated substrate with the power panel through the power supply connection hole;
an input/output access step, in which an optical fiber is coupled with a high-speed photoelectric conversion chip on the hybrid integrated substrate through an input port; electrically connecting the radio frequency connector with an amplifier on the hybrid integrated substrate through the output port;
and a packaging step, namely fixing the lower cover plate at the bottom of the mounting part and fixing the upper cover plate at the top of the mounting part.
Basic scheme theory of operation and beneficial effect:
by adopting the method, after the mounting box is manufactured, the power panel is arranged in the power panel access slot at the bottom of the mounting box. And then, the integrated hybrid integrated substrates are mounted, and the mounting box is provided with a plurality of independent mounting cavities, so that a plurality of hybrid integrated substrates can be respectively mounted in the mounting cavities.
When the hybrid integrated substrate is installed, the hybrid integrated substrate is electrically connected with the power panel through the power supply connecting hole, and then the optical fiber penetrates through the input port to be coupled with the high-speed photoelectric conversion chip on the hybrid integrated substrate; and electrically connecting the radio frequency connector with the amplifier on the hybrid integrated substrate through the output port. In this way, each substrate can be operated. And then, fixing the lower cover plate at the bottom of the mounting part, and fixing the upper cover plate at the top of the mounting part.
Because a plurality of hybrid integrated substrates are integrated, the application range is wide, and the working efficiency is high. Compared with an assembly using a plurality of independent substrates, the integrated level is higher, and the transportation and the installation are easier. Meanwhile, compared with the conventional integration mode, the integrated assembly manufactured by the method has the advantages that the hybrid integrated substrates are respectively arranged in the installation cavities and are mutually independent, so that mutual influence cannot be caused during working, and the performance stability of the integrated assembly can be further ensured.
In conclusion, the integrated assembly manufactured by the method can improve the integration level and ensure the stability of the working performance.
Further, in the manufacturing step of the mounting box, an inner cover plate is manufactured, and the inner cover plate is matched with an upper opening of the mounting cavity; in the packaging step, the inner cover plate is covered on the mounting cavity, and then the upper cover plate is fixed on the top of the mounting part.
By the manufacturing method, independence among the installation cavities can be further guaranteed, and stability of working performance of the integrated assembly is further guaranteed.
Furthermore, in the input and output access step, the radio frequency connector and the output hole are welded by a gold-tin ring.
Further, in the packaging step, the lower cover plate is fixed at the bottom of the mounting portion through a parallel seam welding sealing process, and the upper cover plate is fixed at the top of the mounting portion through the parallel seam welding sealing process.
The manufacturing process can ensure the air tightness of the integrated assembly.
Further, in the step of manufacturing the mounting box, the number of the mounting cavities is more than three.
Furthermore, the sizes and the shapes of the installation cavities are consistent.
The mounting cavity has good consistency and is convenient to process and produce.
Further, in the integrating step, the amplifier is a low noise amplifier.
Further, the mounting portion material is kovar material.
Further, the material of the substrate is 99 alumina ceramics.
Further, in the power supply installation step, after the power supply circuit board is installed in the power supply board access slot, the power supply circuit board is bonded and baked by adopting an epoxy silver glue process.
Drawings
FIG. 1 is a schematic structural diagram according to a first embodiment of the present invention;
FIG. 2 is an exploded view of a first embodiment of the present invention;
FIG. 3 is a side cross-sectional view of a third embodiment of the present invention;
fig. 4 is a partial schematic view of a portion a in fig. 3.
Detailed Description
The following is further detailed by way of specific embodiments:
reference numerals in the drawings of the specification include: the hybrid integrated circuit comprises an installation part 1, an upper cover plate 2, a lower cover plate 3, a hybrid integrated substrate 4, an inner cover plate 5, an optical fiber 6, a radio frequency connector 7, a power panel 8, a support rod 9, a slide rail 10, a heat dissipation motor 11, heat dissipation blades 12, a blocking piece 13 and an electric telescopic rod 14.
Example one
As shown in fig. 1 and fig. 2, the method for manufacturing a multi-channel integrated component includes:
a mounting box manufacturing step, namely manufacturing a mounting part 1, an upper cover plate 2 and a lower cover plate 3 of the mounting box; the upper cover plate 2 and the lower cover plate 3 are both flat plates; kovar material is used for the mounting portion 1.
The bottom surface and the top surface of the mounting part 1 are both planes, a plurality of independent mounting cavities are formed in the mounting part 1, the mounting cavities are grooves penetrating through the top surface of the mounting part 1, the bottom of each mounting cavity is provided with a power supply connection hole, the front side wall is provided with an output port, and the rear side wall is provided with an input port; the bottom of the mounting part 1 is provided with a power panel access slot; wherein, the quantity of installation cavity is greater than three, and the size and the appearance of each installation cavity are all unanimous. In this embodiment, the number of the mounting cavities is four.
A power supply mounting step of mounting the power supply board 8 in the power supply board access slot; and after the power circuit board is arranged in the power board access slot, the power circuit board is bonded and baked by adopting an epoxy silver adhesive process.
A substrate integration step, in which a high-speed photoelectric conversion chip, an amplifier and a passive electronic component are integrated on the same substrate to obtain a hybrid integrated substrate 4; wherein the amplifier is a low noise amplifier.
A substrate mounting step of mounting the hybrid integrated substrate 4 in a mounting cavity and electrically connecting the hybrid integrated substrate 4 with the power supply board 8 through a power supply connection hole; wherein the substrate is made of 99 alumina ceramics.
An input/output access step, in which the optical fiber 6 passes through the input port to be coupled with the high-speed photoelectric conversion chip on the hybrid integrated substrate 4; the radio frequency connector 7 is electrically connected with the amplifier on the hybrid integrated substrate 4 through the output port; and welding the radio frequency connector 7 with the output hole by using a gold tin ring.
A packaging step, fixing the lower cover plate 3 at the bottom of the mounting part 1, and fixing the upper cover plate 2 at the top of the mounting part 1; the lower cover plate 3 is fixed at the bottom of the mounting part 1 by a parallel seam welding sealing process, and the upper cover plate 2 is fixed at the top of the mounting part 1 by the parallel seam welding sealing process.
The specific implementation process is as follows:
by adopting the method, after the mounting box is manufactured, the power panel 8 is arranged in the power panel access slot at the bottom of the mounting box. After that, the hybrid integrated circuit boards 4 obtained by integration are mounted, and since the mounting box has a plurality of mounting cavities independent of each other, a plurality of hybrid integrated circuit boards 4 can be mounted in each mounting cavity, respectively.
When the hybrid integrated substrate 4 is installed, the hybrid integrated substrate is electrically connected with the power panel 8 through the power supply connection hole, and then the optical fiber 6 passes through the input port to be coupled with the high-speed photoelectric conversion chip on the hybrid integrated substrate 4; the radio frequency connector 7 is electrically connected to the amplifier on the hybrid integrated substrate 4 through the output port. In this way, each substrate can be operated. Thereafter, the lower cover 3 is fixed to the bottom of the mounting portion 1, and the upper cover 2 is fixed to the top of the mounting portion 1.
Because a plurality of hybrid integrated substrates 4 are integrated, the application range is wide, and the working efficiency is high. Compared with an assembly using a plurality of independent substrates, the integrated level is higher, and the transportation and the installation are easier. Meanwhile, compared with the conventional integration mode, the integrated assembly manufactured by the method has the advantages that the hybrid integrated substrates 4 are respectively arranged in the installation cavities and are independent from each other, so that the hybrid integrated substrates cannot influence each other during working, and the performance stability of the integrated assembly can be further ensured.
The integrated assembly manufactured by the method can improve the integration level and ensure the stability of the working performance.
Example two
Different from the first embodiment, in the step of manufacturing the mounting box, an inner cover plate 5 is further manufactured, and the inner cover plate 5 is matched with an upper opening of the mounting cavity; in the packaging step, the inner cover plate 5 is covered on the mounting cavity, and then the upper cover plate 2 is fixed on the top of the mounting part 1. By the manufacturing method, independence among the installation cavities can be further guaranteed, and stability of working performance of the integrated assembly is further guaranteed.
EXAMPLE III
As shown in fig. 3 and 4, unlike the first embodiment, in the present embodiment, heat dissipation openings are formed on the side walls of the mounting portion 1 where the output opening and the input opening are located; a heat dissipation motor 11 and heat dissipation blades 12 are arranged in the heat dissipation port, and the heat dissipation blades 12 are fixed on a rotating shaft of the fan-type heating motor; the fan-type electric motor is electrically connected with the microcontroller; a temperature sensor is fixedly arranged on the inner wall of the mounting cavity and is electrically connected with the microcontroller;
an electric telescopic rod 14 is fixedly arranged on the inner wall of the mounting cavity in the horizontal direction, and the electric telescopic rod 14 is electrically connected with the microcontroller; a connecting strip is fixed at the free end of the electric telescopic rod 14, one end of the connecting strip is fixed with the electric telescopic rod 14, a blocking piece 13 is fixed at the other end of the connecting strip, and the blocking piece 13 is in contact with the inner wall; in the initial state, the blocking piece 13 completely blocks the heat dissipation opening;
the wind measuring part is fixed on the top of the mounting box and comprises a wind measuring base and a wind measuring sheet, wherein the middle of the wind measuring base is concave; the wind measuring sheet is a thin sheet and is fixed on the wind measuring strip, one end of the wind measuring strip is fixed with the wind measuring sheet, and the other end of the wind measuring strip is hinged with the wind measuring base; the wind measuring device also comprises an elastic piece, wherein one end of the elastic piece is fixed with the side sealing strip, and the other end of the elastic piece is fixed with the wind measuring base; a first electrode plate is fixed on one side of the wind measuring strip, which is far away from the elastic piece, a second electrode plate is fixed at a position corresponding to the wind measuring base, the first electrode plate and the first electrode plate are positioned in the same wind direction circuit, and the wind direction circuit is electrically connected with an input interface of the microcontroller;
when the detected temperature of the temperature sensor is higher than a first threshold value, the microcontroller controls the electric telescopic rod 14 to contract by a first length and controls the heat dissipation motor 11 to rotate according to a first gear; the micro-controller stores the relationship between the temperature and the expansion amount of the electric expansion rod 14; the microcontroller also stores the relationship between the temperature and the rotating speed of the heat dissipation motor 11; when the microcontroller receives the electric signal sent by the wind direction circuit, the heat dissipation motor 11 is controlled to rotate in a reverse square shape;
the drying box is provided with a plurality of drying holes, and a drying agent is arranged in the drying box; two support rods 9 vertical to the side wall are fixed on the side wall where the input port is located, vertical slide rails 10 are respectively fixed on the support rods 9, and the drying box is located between the two slide rails 10 and is in sliding connection with the two slide rails 10; the bottoms of the slide rails 10 are equal to the bottom of the heat dissipation opening in height, and a fixing block is fixedly arranged between the bottoms of the two slide rails 10.
The specific implementation process is as follows:
in the working process, because the box body is in a closed state, the temperature in the installation cavity can be higher. If the substrate is not processed in time, the working performance and the service life of the substrate are affected.
In this application, when temperature sensor's detection temperature was higher than first threshold value, microcontroller control electric telescopic handle 14 contracts first length to control heat dissipation motor 11 and rotate according to first gear. Because the opening degree of thermovent can be decided to the shrink distance of electric telescopic pole 14, because the thermovent opens more, the leakproofness is just relatively worse, consequently, in this application, the relation between the flexible volume of temperature and electric telescopic pole 14 is stored in little the control, and the temperature is higher (the heat dissipation demand is stronger), and the degree that the thermovent opened is bigger, has satisfied the heat dissipation. In this way, the heat dissipation is satisfied, and meanwhile, the sealing performance is guaranteed as far as possible. Meanwhile, the relation between the temperature and the rotating speed of the heat dissipation motor 11 is stored in the microcontroller; when the temperature is higher, the rotating speed of the heat dissipation motor 11 is faster, and the heat dissipation effect is improved.
When heat is dissipated, if the direction of internal circulation is opposite to the wind direction of the outside and the external wind force is large, a large wind resistance is encountered during heat dissipation, so that the heat dissipation effect is not ideal. In order to prevent the situation, the wind measuring device further comprises a wind measuring part fixed on the top of the mounting box, and the wind measuring part comprises a wind measuring base and a wind measuring sheet, wherein the middle of the wind measuring base is concave; the wind measuring sheet is a thin sheet and is fixed on the wind measuring strip, one end of the wind measuring strip is fixed with the wind measuring sheet, and the other end of the wind measuring strip is hinged with the wind measuring base; the wind measuring device also comprises an elastic piece, wherein one end of the elastic piece is fixed with the side sealing strip, and the other end of the elastic piece is fixed with the wind measuring base; a first electrode plate is fixed on one side, away from the elastic part, of the wind measuring strip, a second electrode plate is fixed at a position corresponding to the wind measuring base, the first electrode plate and the first electrode plate are located in the same wind direction circuit, and the wind direction circuit is electrically connected with an input interface of the microcontroller.
So that the wind which makes the wind measuring sheet rotate towards the direction of the second electrode sheet is the reverse wind. If the wind direction circuit does not send a level signal to the microcontroller, the first electrode plate is not in contact with the second electrode plate, which indicates that the wind direction is not the counter wind direction or the wind force in the counter wind direction is very small, and normal heat dissipation is not influenced. Therefore, the microcontroller controls the heat dissipation motor 11 to rotate in a normal steering direction. When the microcontroller receives the electric signal sent by the wind direction circuit, the direction at this moment is reverse wind and the wind power is larger, and normal heat dissipation can be influenced, so that the microcontroller controls the heat dissipation motor 11 to reversely rotate, the heat dissipation wind direction is consistent with the reverse wind direction, and the heat dissipation effect is enhanced.
Besides, the drying box is also included, a plurality of drying holes are formed in the drying box, and a drying agent is arranged in the drying box; two support rods 9 vertical to the side wall are fixed on the side wall where the input port is located, vertical slide rails 10 are respectively fixed on the support rods 9, and the drying box is located between the two slide rails 10 and is in sliding connection with the two slide rails 10; the bottoms of the slide rails 10 are equal to the bottom of the heat dissipation opening in height, and a fixing block is fixedly arranged between the bottoms of the two slide rails 10.
After the drying agent in the drying box absorbs water, the weight of the drying agent becomes heavier, and the drying agent moves downwards along the slide rail 10 and finally reaches the bottom of the slide rail 10 (namely the heat dissipation opening). When the drying box works, hot air can be discharged outwards at the heat radiating opening due to the heat radiating relation, the hot air discharged outwards blows on the drying box, and the drying agent can be dried, so that the moisture absorbed by the drying agent is discharged outwards along with the hot air. And then make the drier resume the dryness factor, weight reduction, upward movement, do not influence the scattered hot-blast while, can carry on the drying again and absorb water.
The foregoing is merely an example of the present invention, and common general knowledge in the field of known specific structures and characteristics is not described herein in any greater extent than that known in the art at the filing date or prior to the priority date of the application, so that those skilled in the art can now appreciate that all of the above-described techniques in this field and have the ability to apply routine experimentation before this date can be combined with one or more of the present teachings to complete and implement the present invention, and that certain typical known structures or known methods do not pose any impediments to the implementation of the present invention by those skilled in the art. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.
Claims (10)
1. The method for manufacturing the multi-channel integrated assembly is characterized by comprising the following steps:
a mounting box manufacturing step, namely manufacturing a mounting part, an upper cover plate and a lower cover plate of the mounting box; the upper cover plate and the lower cover plate are both flat plates; the bottom surface and the top surface of the mounting part are both planes, a plurality of independent mounting cavities are formed in the mounting part, the mounting cavities are grooves penetrating through the top surface of the mounting part, the bottom of each mounting cavity is provided with a power supply connection hole, the front side wall is provided with an output port, and the rear side wall is provided with an input port; the bottom of the mounting part is provided with a power panel access slot;
a power supply mounting step, mounting the power supply board in the power supply board access slot;
a substrate integration step, wherein a high-speed photoelectric conversion chip, an amplifier and a passive electronic component are integrated on the same substrate to obtain a hybrid integrated substrate;
a substrate mounting step, mounting the hybrid integrated substrate in the mounting cavity, and electrically connecting the hybrid integrated substrate with the power panel through the power supply connection hole;
an input/output access step, in which an optical fiber is coupled with a high-speed photoelectric conversion chip on the hybrid integrated substrate through an input port; electrically connecting the radio frequency connector with an amplifier on the hybrid integrated substrate through the output port;
and a packaging step, namely fixing the lower cover plate at the bottom of the mounting part and fixing the upper cover plate at the top of the mounting part.
2. The method of fabricating a multi-channel integrated package of claim 1, wherein: in the manufacturing step of the mounting box, an inner cover plate is further manufactured and matched with an upper opening of the mounting cavity; in the packaging step, the inner cover plate is covered on the mounting cavity, and then the upper cover plate is fixed on the top of the mounting part.
3. The method of fabricating a multi-channel integrated package of claim 1, wherein: and in the input and output access step, the radio frequency connector is welded with the output hole by a gold-tin ring.
4. The method of fabricating a multi-channel integrated package of claim 1, wherein: in the packaging step, the lower cover plate is fixed at the bottom of the mounting part by a parallel seam welding and sealing process, and the upper cover plate is fixed at the top of the mounting part by the parallel seam welding and sealing process.
5. The method of fabricating a multi-channel integrated package of claim 1, wherein: in the step of manufacturing the mounting box, the number of the mounting cavities is more than three.
6. The method of fabricating a multi-channel integrated package of claim 5, wherein: the size and the shape of each installation cavity are consistent.
7. The method of fabricating a multi-channel integrated package of claim 1, wherein: in the integration step, the amplifier is a low noise amplifier.
8. The method of fabricating a multi-channel integrated package of claim 1, wherein: the mounting portion material is kovar material.
9. The method of fabricating a multi-channel integrated package of claim 1, wherein: the material of the substrate is 99 alumina ceramic.
10. The method of fabricating a multi-channel integrated package of claim 1, wherein: in the power supply installation step, after the power supply circuit board is installed in the power supply board access slot, the power supply circuit board is bonded and baked by adopting an epoxy silver glue process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011618962.5A CN112799182A (en) | 2020-12-31 | 2020-12-31 | Method for manufacturing multi-channel integrated assembly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011618962.5A CN112799182A (en) | 2020-12-31 | 2020-12-31 | Method for manufacturing multi-channel integrated assembly |
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| CN112799182A true CN112799182A (en) | 2021-05-14 |
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| CN202011618962.5A Pending CN112799182A (en) | 2020-12-31 | 2020-12-31 | Method for manufacturing multi-channel integrated assembly |
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| CN110854479A (en) * | 2019-11-26 | 2020-02-28 | 北京无线电测量研究所 | Microwave assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203745470U (en) * | 2014-03-31 | 2014-07-30 | 西门子（中国）有限公司 | Blood gas analyzer |
| CN107643570A (en) * | 2017-10-31 | 2018-01-30 | 深圳市易飞扬通信技术有限公司 | Optics of parallel encapsulation and preparation method thereof |
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Application publication date: 20210514 |