CN219145989U

CN219145989U - High-frequency high-speed circuit board

Info

Publication number: CN219145989U
Application number: CN202223132800.8U
Authority: CN
Inventors: 张志强; 赵俊; 王东府
Original assignee: Shenzhen Octopus Circuit Technology Co ltd
Current assignee: Shenzhen Octopus Circuit Technology Co ltd
Priority date: 2022-11-23
Filing date: 2022-11-23
Publication date: 2023-06-06
Anticipated expiration: 2032-11-23

Abstract

The utility model discloses a high-frequency high-speed circuit board, which relates to the technical field of circuit boards and comprises a shell and a cover plate, wherein a plurality of radiating fins are arranged at the front end and the rear end of the shell, connecting plates are arranged at the left end and the right end of the shell, through holes which are vertically communicated are formed in the upper end of the connecting plates, cushion blocks are arranged at four corners of the lower wall of an inner cavity of the shell, a circuit board main body is jointly arranged among the four cushion blocks, an active radiating mechanism is embedded in the left end face of the shell and is positioned right left of the circuit board main body, the cover plate is matched with the shell, and wiring grooves which are vertically communicated are formed in the upper end of the cover plate. According to the utility model, the shell and the cover plate form a relatively closed space, so that the contact area between the circuit board main body and outside moist air is reduced, and then the heat generated when the active heat dissipation mechanism is matched with the circuit board main body to work is used for blowing hot air in the closed space, so that the circuit board is effectively prevented from being corroded by moisture, and the low dielectric loss factor is maintained.

Description

High-frequency high-speed circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a high-frequency high-speed circuit board.

Background

The high-frequency high-speed PCB is basically the same as the common PCB in production process, and the key point of realizing high-frequency high-speed is the attribute of raw materials, namely the characteristic parameters of the raw materials. The main material of the high-frequency high-speed PCB board is a high-frequency high-speed copper-clad plate, and the core requirements of the high-frequency high-speed PCB board are low dielectric constant (Dk) and low dielectric loss factor (Df). In addition to ensuring lower Dk and Df, the consistency of Dk parameters is also one of the important factors for measuring the quality of the PCB. In addition, an important parameter is the impedance characteristics of the PCB board as well as other physical characteristics.

The dielectric constant (Dk) of the substrate of the high-frequency high-speed circuit board must be small and stable, and generally, the smaller and the better, the transmission rate of signals is inversely proportional to the square root of the dielectric constant of the material, and the signal transmission delay is easily caused by the high dielectric constant.

The dielectric loss (Df) of the high frequency high speed circuit board substrate material must be small, which mainly affects the quality of signal transmission, and the smaller the dielectric loss, the smaller the signal loss.

Impedance of the high-frequency high-speed circuit board, namely resistance and parameters for reactance, is the most basic principle of high-speed design, and because the PCB circuit needs to consider the problems of electric element installation by plugging, conductive performance, signal transmission performance and the like, the lower the impedance is, the better the impedance is, and generally, each large board factory can ensure impedance errors to a certain extent during PCB processing.

The substrate of the high-frequency high-speed circuit board has low water absorption, and the high water absorption can cause dielectric constant and dielectric loss when being wetted.

The existing high-frequency high-speed PCB mostly adopts three waterproof modes of structural waterproofing, pouring sealant waterproofing and surface coating waterproofing, but the structural waterproofing cannot prevent the invasion of water vapor, the pouring sealant waterproofing and the surface coating waterproofing all cause the reduction of the heat dissipation performance of the PCB, so we propose a high-frequency high-speed PCB.

Disclosure of Invention

The utility model mainly aims to provide a high-frequency high-speed circuit board which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a high-frequency high-speed circuit board, includes shell and apron, a plurality of fin is all installed to shell front end and rear end, the connecting plate is all installed to shell left end and right-hand member, the through-hole that link up from top to bottom is opened to the connecting plate upper end, the cushion is all installed to shell inner chamber lower wall four corners, four install the circuit board main part jointly between the cushion, the embedded initiative cooling mechanism that has of shell left end face, initiative cooling mechanism is located circuit board main part right-left side, apron and shell assorted, the wiring groove that link up from top to bottom is opened to the apron upper end.

Preferably, the right end of the shell is provided with a heat dissipation opening which is penetrated left and right, and the inner wall of the heat dissipation opening is provided with a first dustproof net.

Preferably, a metal heat conducting plate is installed at the lower end of the circuit board main body, a plurality of heat conducting filaments are installed at the lower end of the metal heat conducting plate, and the heat conducting filaments are distributed in a rectangular array.

Preferably, the outer surface of the circuit board main body is not contacted with the inner wall of the shell.

Preferably, the initiative cooling mechanism comprises a mounting block, mounting block lower extreme and shell inner chamber lower wall upper end fixed connection, the mounting block right-hand member is opened and is had a plurality of left and right sides to link up the mounting groove, a plurality of the mounting groove is linear array and distributes, mounting groove internally mounted has miniature fan and second dust screen, the second dust screen is located miniature fan outside.

Preferably, the upper end face of the mounting block is flush with the upper end face of the housing, and the lower end of the heat conducting filament is not in contact with the lower wall of the inner cavity of the housing.

Compared with the prior art, the utility model has the following beneficial effects:

1. the circuit board main body is placed in the closed space, so that the contact area between the circuit board main body and outside moist air is reduced, and the heat generated when the active heat dissipation mechanism is matched with the circuit board main body to work is used for blowing hot air out of the closed space, so that the heat dissipation capacity of the circuit board main body is improved, the content of moist gas in the closed space is further reduced, and the circuit board is effectively prevented from being corroded by moisture;

2. through setting up the cushion with circuit board main part overhead in the shell inner chamber, do benefit to the flow of air, improve heat exchange efficiency, the rethread sets up metal heat-conducting plate and heat-conducting filament with the heat conduction that circuit board main part during operation produced to in the air, improve radiating efficiency.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic perspective view of the housing;

fig. 3 is a schematic perspective view of a circuit board body;

fig. 4 is a schematic perspective view of an active heat dissipation mechanism.

In the figure: 1. a housing; 2. a heat radiation fin; 3. a connecting plate; 4. a through hole; 5. a cushion block; 6. a circuit board main body; 7. a heat dissipation mechanism; 8. a cover plate; 9. wiring grooves; 11. a heat radiation port; 12. a first dust screen; 61. a metal heat-conducting plate; 62. a thermally conductive filament; 71. a mounting block; 72. a mounting groove; 73. a micro fan; 74. and a second dust screen.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1-4, a high-frequency high-speed circuit board comprises a housing 1 and a cover plate 8, in this embodiment, the housing 1 and the cover plate 8 are all rectangular structures, a plurality of heat dissipation fins 2 are all installed at the front end and the rear end of the housing 1, in this embodiment, the heat dissipation fins 2 are of a structure with a narrow upper part and a wide lower part, the contact area between the housing 1 and a mounting surface is increased, the heat dissipation capacity of the housing 1 is improved, a connecting plate 3 is installed at the left end and the right end of the housing 1, through holes 4 penetrating up and down are formed in the upper end of the connecting plate 3, cushion blocks 5 are installed at four corners of the lower wall of an inner cavity of the housing 1, a circuit board main body 6 is jointly installed among the cushion blocks 5, a high-frequency high-speed circuit board is installed on the circuit board main body 6, an active heat dissipation mechanism 7 is embedded in the left end face of the housing 1, the cover plate 8 is matched with the housing 1, wiring grooves 9 penetrating up and down are formed in the upper end of the cover plate 8, and wiring harnesses are firstly connected with the wiring harnesses 6 through the wiring grooves 9 and then pass through the housing 1.

Further, the right end of the housing 1 is provided with a heat dissipation opening 11 that penetrates left and right, as a specific embodiment, the height of the heat dissipation opening 11 in this embodiment is greater than the thickness of the circuit board main body 6, the inner wall of the heat dissipation opening 11 is provided with a first dust-proof net 12, and the probability of adhering dust to the circuit board main body 6 is reduced by the first dust-proof net 12.

Further, a metal heat conducting plate 61 is installed at the lower end of the circuit board main body 6, and as a specific implementation manner, in this embodiment, the metal heat conducting plate 61 and the circuit board main body 6 are connected by using heat conducting silica gel, and a plurality of heat conducting filaments 62 are installed at the lower end of the metal heat conducting plate 61, and a plurality of heat conducting filaments 62 are distributed in a rectangular array.

Further, the outer surface of the circuit board main body 6 is not contacted with the inner wall of the shell 1, and the circuit board main body 6 is overhead in the inner cavity of the shell 1.

Further, the active heat dissipation mechanism 7 includes a mounting block 71, the lower end of the mounting block 71 is fixedly connected with the upper end of the lower wall of the inner cavity of the housing 1, and a plurality of mounting grooves 72 penetrating left and right are formed in the right end of the mounting block 71, so that as a specific implementation manner, three mounting grooves 72 are formed in the embodiment, the three mounting grooves 72 are distributed in a linear array, a micro fan 73 and a second dust screen 74 are mounted in the mounting grooves 72, the second dust screen 74 is located outside the micro fan 73, and the micro fan 73 is electrically connected with the circuit board main body 6, namely, when the circuit board main body 6 works, the micro fan 73 is electrified to work along with the circuit board main body 6.

Further, the upper end surface of the mounting block 71 is flush with the upper end surface of the housing 1, and the lower end of the heat conducting filament 62 is not in contact with the lower wall of the inner cavity of the housing 1.

It should be noted that, the utility model is a high-frequency high-speed circuit board, a relatively closed space is formed by arranging the shell 1 and the cover plate 8, then the circuit board main body 6 is placed in the closed space, the contact area between the circuit board main body 6 and outside moist air is reduced, then the heat generated when the active heat dissipation mechanism 7 is matched with the circuit board main body 6 to work is arranged to blow hot air in the closed space, the heat dissipation capacity of the circuit board main body 6 is improved, the content of moist gas in the closed space is further reduced, and the circuit board is effectively prevented from being corroded by moisture; the circuit board main body 6 is overhead in the inner cavity of the shell 1 through the cushion block 5, so that the flow of air is facilitated, the heat exchange efficiency is improved, and the heat generated during the operation of the circuit board main body 6 is conducted into the air through the metal heat conducting plate 61 and the heat conducting filaments 62, so that the heat dissipation efficiency is improved.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a high frequency high speed circuit board, includes shell (1) and apron (8), its characterized in that: a plurality of radiating fins (2) are arranged at the front end and the rear end of the shell (1), connecting plates (3) are arranged at the left end and the right end of the shell (1), through holes (4) which are communicated up and down are formed in the upper end of each connecting plate (3), cushion blocks (5) are arranged at four corners of the lower wall of an inner cavity of the shell (1), a circuit board main body (6) is jointly arranged between the cushion blocks (5), an active radiating mechanism (7) is embedded in the left end face of the shell (1), the active radiating mechanism (7) is located right left of the circuit board main body (6), a cover plate (8) is matched with the shell (1), and a wiring groove (9) which is communicated up and down is formed in the upper end of the cover plate (8).

2. The high frequency, high speed circuit board of claim 1, wherein: the right end of the shell (1) is provided with a heat dissipation opening (11) which is penetrated left and right, and a first dust screen (12) is arranged on the inner wall of the heat dissipation opening (11).

3. A high frequency, high speed circuit board according to claim 2, wherein: the circuit board is characterized in that a metal heat conducting plate (61) is arranged at the lower end of the circuit board main body (6), a plurality of heat conducting filaments (62) are arranged at the lower end of the metal heat conducting plate (61), and the heat conducting filaments (62) are distributed in a rectangular array.

4. A high frequency, high speed circuit board according to claim 3, wherein: the outer surface of the circuit board main body (6) is not contacted with the inner wall of the shell (1).

5. The high frequency, high speed circuit board of claim 4, wherein: the active heat dissipation mechanism (7) comprises a mounting block (71), the lower end of the mounting block (71) is fixedly connected with the upper end of the lower wall of the inner cavity of the shell (1), a plurality of mounting grooves (72) which are communicated left and right are formed in the right end of the mounting block (71), the mounting grooves (72) are distributed in a linear array, a micro fan (73) and a second dust screen (74) are mounted in the mounting grooves (72), and the second dust screen (74) is located outside the micro fan (73).

6. The high frequency, high speed circuit board of claim 5, wherein: the upper end face of the mounting block (71) is flush with the upper end face of the shell (1), and the lower end of the heat conducting filament (62) is not contacted with the lower wall of the inner cavity of the shell (1).