CN219040469U - Semiconductor heat-conducting plate - Google Patents
Semiconductor heat-conducting plate Download PDFInfo
- Publication number
- CN219040469U CN219040469U CN202222540802.4U CN202222540802U CN219040469U CN 219040469 U CN219040469 U CN 219040469U CN 202222540802 U CN202222540802 U CN 202222540802U CN 219040469 U CN219040469 U CN 219040469U
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- Prior art keywords
- heat
- conducting plate
- plate main
- main body
- main part
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 239000011248 coating agent Substances 0.000 claims abstract description 37
- 238000000576 coating method Methods 0.000 claims abstract description 37
- 238000001816 cooling Methods 0.000 claims abstract description 33
- 239000004519 grease Substances 0.000 claims abstract description 13
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Abstract
The utility model provides a semiconductor heat-conducting plate, which comprises a heat-conducting plate main body, a first cooling coating, radiating fins, a second cooling coating and heat-conducting silicone grease, wherein the inside of the heat-conducting plate main body is in a cavity shape, the front end and the rear end of the heat-conducting plate main body are both provided with first air openings communicated with the inside of the heat-conducting plate main body, the heat-conducting plate main body is provided with second air openings communicated with the inside of the heat-conducting plate main body, the inner wall of the heat-conducting plate main body is coated with the first cooling coating, the inner wall of the heat-conducting plate main body is fixedly provided with a plurality of radiating fins connected with the heat-conducting plate main body into a whole, the radiating fins are alternately distributed, the outer sides of the radiating fins are coated with the second cooling coating, the top end of the heat-conducting plate main body is provided with a plurality of grooves which are uniformly distributed at intervals, the top end of the heat-conducting plate main body is provided with vent holes communicated with the grooves, and the other ends of the vent holes are communicated with the inner cavity of the heat-conducting plate main body, and the top end of the heat-conducting plate main body is coated with the heat-conducting silicone grease, and the vent holes extend to the outside of the heat-conducting silicone grease. The utility model can realize the ventilation of the upper, lower, left and right, has large cooling coating area and good cooling effect.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a semiconductor heat-conducting plate.
Background
The heat conducting sheet has heat conducting and insulating effects, and is used between the heating device and the radiating sheet or the metal base, and in an electronic circuit, the electronic equipment which occupies larger space originally is gradually reduced along with the continuous improvement of the integration level and the gradual reduction of the volume, but the heating value of the internal unit volume is continuously increased. The semiconductor is extremely easy to cause the temperature overheat problem because of large heating value, and if the emitted heat can not be removed in time, the running state and the service life of the semiconductor can be greatly influenced.
At present, a plurality of products have higher requirements on heat dissipation of the products along with improvement of the process, the conventional heat conducting plate is not ideal in general heat conducting effect, and a semiconductor heat conducting plate with an authorized bulletin number of CN213816135U realizes front-back left-right ventilation and heat dissipation of wind, but the inside of the semiconductor heat conducting plate is not circulated with the top air of the semiconductor heat conducting plate, so that the heat dissipation effect is to be improved.
Disclosure of Invention
The present utility model provides a semiconductor heat-conducting plate to solve the above-mentioned problems.
In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides a semiconductor heat-conducting plate, includes heat-conducting plate main part, first cooling coating, radiating fin, second cooling coating and heat conduction silicone grease, the inside cavity form that is of heat-conducting plate main part, the front end and the rear end of heat-conducting plate main part all are equipped with rather than the first wind gap of inside intercommunication, the both sides of heat-conducting plate main part all are equipped with rather than the second wind gap of inside intercommunication, the inner wall coating of heat-conducting plate main part has first cooling coating, heat-conducting plate main part inner wall is fixed with rather than even a plurality of radiating fin as an organic whole, radiating fin distributes in turn, the outside coating of radiating fin has the second cooling coating, the top of heat-conducting plate main part is equipped with the recess of a plurality of even interval distribution, the top of heat-conducting plate main part be equipped with the ventilation hole of recess intercommunication, the other end of ventilation hole with the inner chamber intercommunication of heat-conducting plate main part, the top coating of heat-conducting plate main part has the heat conduction silicone grease, the ventilation hole extends to the outside of heat conduction silicone grease.
Preferably, the first cooling coating and the second cooling coating are both made of a nano resin cooling coating.
Preferably, the heat dissipation fin and the heat conduction plate main body are made of the same material.
Preferably, the groove is disposed at the top of the heat conductive plate body and forms a stepped shape with the heat conductive plate body.
Preferably, the heat conductive plate body is a semiconductor heat conductive plate.
The utility model provides a semiconductor heat-conducting plate. The beneficial effects are as follows:
according to the semiconductor heat-conducting plate provided by the utility model, the first air opening and the second air opening are communicated with the ventilation holes to form air flow, so that the heat dissipation is further increased, and the use area of the cooling coating is increased by arranging the built-in heat dissipation fins, so that the heat dissipation effect is increased.
Drawings
Fig. 1 is a schematic diagram of a semiconductor heat conducting plate structure according to the present utility model.
Fig. 2 is a schematic side view of a semiconductor heat-conducting plate according to the present utility model.
In the figure: 1. a heat conductive plate main body; 2. a first tuyere; 3. a first cooling coating; 4. a heat radiation fin; 5. a second cooling coating; 6. a second tuyere; 7. a groove; 8. a vent hole; 9. and (5) heat-conducting silicone grease.
Detailed Description
The utility model will be further described with reference to the accompanying drawings and detailed description below:
in the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms of "top", "bottom", "one side", "the other side", "front", "rear", "middle portion", "inner", "top", "bottom", etc., are directions or positional relationships based on the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-2, a semiconductor heat conducting plate comprises a heat conducting plate main body 1, a first cooling coating 3, radiating fins 4, a second cooling coating 5 and heat conducting silicone grease 9, wherein the inside of the heat conducting plate main body 1 is in a cavity shape, the front end and the rear end of the heat conducting plate main body 1 are both provided with a first air port 2 communicated with the inside of the heat conducting plate main body, two sides of the heat conducting plate main body 1 are both provided with a second air port 6 communicated with the inside of the heat conducting plate main body, the inner wall of the heat conducting plate main body 1 is coated with the first cooling coating 3, the inner wall of the heat conducting plate main body 1 is fixedly provided with a plurality of radiating fins 4 connected with the heat conducting plate main body into a whole, the radiating fins 4 are alternately distributed, the outer sides of the radiating fins 4 are coated with the second cooling coating 5, the top end of the heat conducting plate main body 1 is provided with a plurality of grooves 7 evenly distributed at intervals, the top end of the heat conducting plate main body 1 is provided with vent holes 8 communicated with the grooves 7, the other ends of the vent holes 8 are communicated with the inner cavity of the heat conducting plate main body 1, the top end of the heat conducting plate main body 1 is coated with the heat conducting silicone grease 9, and the heat conducting grease 8 extends to the outside of the vent holes 9.
Through the technical scheme of the utility model, the first cooling coating 3 and the second cooling coating 5 are both made of the nano resin cooling coating.
According to the technical scheme of the utility model, the heat dissipation fins 4 and the heat conduction plate main body 1 are made of the same material.
Through the above technical solution of the present utility model, the groove 7 is disposed at the top of the heat conducting plate body 1 and forms a step shape with the heat conducting plate body 1.
Through the above technical solution of the present utility model, the heat conducting plate main body 1 is a semiconductor heat conducting plate.
According to the semiconductor heat-conducting plate provided by the utility model, the first air port 2 and the second air port 6 are communicated with the ventilation hole 8 to form air flow, so that the heat dissipation is further increased, and the use area of the cooling coating is increased by arranging the built-in heat dissipation fins 4, so that the heat dissipation effect is increased, namely, the built-in heat dissipation area formed by the first cooling coating 3 and the second cooling coating 5 is increased, and the high-efficiency heat dissipation is realized.
Finally, it should be noted that: the present utility model is not limited to the preferred embodiments, but can be modified or substituted for some of the technical features described in the above embodiments by those skilled in the art, although the present utility model has been described in detail with reference to the above embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (5)
1. The utility model provides a semiconductor heat-conducting plate, its characterized in that, including heat-conducting plate main part (1), first cooling coating (3), radiating fin (4), second cooling coating (5) and heat conduction silicone grease (9), the inside cavity form that is of heat-conducting plate main part (1), the front end and the rear end of heat-conducting plate main part (1) all are equipped with rather than inside first wind gap (2) of intercommunication, the both sides of heat-conducting plate main part (1) all are equipped with rather than inside second wind gap (6) of intercommunication, the inner wall coating of heat-conducting plate main part (1) has first cooling coating (3), heat-conducting plate main part (1) inner wall be fixed with rather than even a plurality of radiating fin (4) as an organic whole, radiating fin (4) alternate distribution, the outside coating of radiating fin (4) has second cooling coating (5), the top of heat-conducting plate main part (1) be equipped with a plurality of evenly spaced recess (7), the top of heat-conducting plate main part (1) be equipped with vent (8) of recess (7) intercommunication, the other end of heat-conducting plate main part (1) with the heat conduction grease (9) of heat-conducting plate main part (1) extend to heat conduction grease (9).
2. A semiconductor heat-conducting plate according to claim 1, wherein: the first cooling coating (3) and the second cooling coating (5) are both made of nano resin cooling coating.
3. A semiconductor heat-conducting plate according to claim 1, wherein: the heat dissipation fins (4) are made of the same material as the heat conduction plate main body (1).
4. A semiconductor heat-conducting plate according to claim 1, wherein: the groove (7) is arranged at the top of the heat conducting plate main body (1) and forms a step shape with the heat conducting plate main body (1).
5. A semiconductor heat-conducting plate according to claim 1, wherein: the heat conducting plate main body (1) is a semiconductor heat conducting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222540802.4U CN219040469U (en) | 2022-09-26 | 2022-09-26 | Semiconductor heat-conducting plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222540802.4U CN219040469U (en) | 2022-09-26 | 2022-09-26 | Semiconductor heat-conducting plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219040469U true CN219040469U (en) | 2023-05-16 |
Family
ID=86275756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222540802.4U Active CN219040469U (en) | 2022-09-26 | 2022-09-26 | Semiconductor heat-conducting plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219040469U (en) |
-
2022
- 2022-09-26 CN CN202222540802.4U patent/CN219040469U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230817 Address after: 115, 1st Floor, Building 1, Shangshui Garden, Baijiatuan, Haidian District, Beijing, 100095 Patentee after: Hydrogen Element (Beijing) Intelligent Information Technology Co.,Ltd. Address before: No. 184, Zhangxinzhuang Village, Shenzhou Town, Shenzhou City, Hengshui City, Hebei Province, 053800 Patentee before: Tian Zhixue |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240411 Address after: No. 184, Zhangxinzhuang Village, Shenzhou Town, Shenzhou City, Hengshui City, Hebei Province, 053800 Patentee after: Tian Zhixue Country or region after: China Address before: 115, 1st Floor, Building 1, Shangshui Garden, Baijiatuan, Haidian District, Beijing, 100095 Patentee before: Hydrogen Element (Beijing) Intelligent Information Technology Co.,Ltd. Country or region before: China |
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| TR01 | Transfer of patent right |