CN219799852U

CN219799852U - Optical module

Info

Publication number: CN219799852U
Application number: CN202321010191.0U
Authority: CN
Inventors: 张加傲; 王欣南; 慕建伟; 于琳
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2023-04-27
Filing date: 2023-04-27
Publication date: 2023-10-03
Anticipated expiration: 2033-04-27

Abstract

In the optical module provided by the disclosure, a circuit board is provided with a first groove and a second groove which are opposite to each other on the side edge, and a first golden finger is arranged on the surface of the end part; a stress concentration area is formed between the first groove and the second groove; the first digital signal processing chip is arranged on the surface of the circuit board; the circuit board is provided with a first high-frequency signal wire group, one end of the first high-frequency signal wire group is electrically connected with the first digital signal processing chip, the other end of the first high-frequency signal wire group is electrically connected with the first golden finger, and the first high-frequency signal wire group penetrates through the stress concentration easy area; and a plurality of capacitors are arranged on the first high-frequency signal line group in the stress concentration region. The optical module provided by the disclosure uses the capacitor to strengthen the bending strength of the stress easy-concentration area so as to reduce bending of the circuit board in the stress easy-concentration area.

Description

Optical module

Technical Field

The disclosure relates to the technical field of optical fiber communication, and in particular relates to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology. In some optical modules, the optical module with a high transmission rate has a high integration density of the optical module with a lower transmission rate, for example, a multichannel optical transceiver technology is adopted, so as to realize the transmission and the reception of the optical signals of multiple wavelengths of the optical module.

Disclosure of Invention

The embodiment of the disclosure provides an optical module for reducing bending deformation of a circuit board.

The present disclosure provides an optical module, comprising:

the circuit board is provided with a first groove and a second groove which are opposite to each other on the side edge, and a first golden finger is arranged on the surface of the end part; a stress concentration area is formed between the first groove and the second groove;

the first digital signal processing chip is arranged on the surface of the circuit board;

the circuit board is also provided with a first high-frequency signal wire group, one end of the first high-frequency signal wire group is electrically connected with the first digital signal processing chip, the other end of the first high-frequency signal wire group is electrically connected with the first golden finger, and the first high-frequency signal wire group penetrates through the stress concentration easily area; and a plurality of capacitors are arranged on the first high-frequency signal line group in the stress concentration region.

In the optical module provided by the disclosure, in a stress easy-concentration area between a first groove and a second groove, a plurality of capacitors are arranged on a first high-frequency signal line group connected with a first golden finger by a first digital signal processing chip, so that bending strength of the stress easy-concentration area is enhanced by the capacitors, and bending of a circuit board in the stress easy-concentration area is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

Fig. 1 is a partial architectural diagram of an optical communication system provided in accordance with some embodiments of the present disclosure;

fig. 2 is a partial block diagram of a host computer according to some embodiments of the present disclosure;

FIG. 3 is a block diagram of an optical module provided in accordance with some embodiments of the present disclosure;

FIG. 4 is an exploded schematic view of an optical module provided according to some embodiments of the present disclosure;

fig. 5 is an internal block diagram of an optical module provided according to some embodiments of the present disclosure;

fig. 6 is a schematic structural diagram of an optical transceiver component according to some embodiments of the present disclosure;

FIG. 7 is an exploded view of the internal structure of an optical module provided in accordance with some embodiments of the present disclosure;

Fig. 8 is a schematic diagram illustrating an assembly of an optical transceiver and a circuit board according to some embodiments of the present disclosure;

fig. 9 is a second schematic diagram illustrating an assembly of an optical transceiver component and a circuit board according to some embodiments of the present disclosure;

fig. 10 is an exploded view of an optical transceiver component provided in accordance with some embodiments of the present disclosure;

fig. 11 is a second exploded view of an optical transceiver component according to some embodiments of the present disclosure;

fig. 12 is a schematic structural diagram of an optical transceiver housing according to some embodiments of the present disclosure;

fig. 13 is a second schematic structural view of an optical transceiver housing according to some embodiments of the present disclosure;

fig. 14 is a schematic structural diagram III of an optical transceiver housing according to some embodiments of the present disclosure;

fig. 15 is a schematic structural view of a first upper cover according to some embodiments of the present disclosure;

fig. 16 is a second schematic structural view of a first upper cover according to some embodiments of the present disclosure;

FIG. 17 is a schematic view of a second upper cover provided in accordance with some embodiments of the present disclosure;

fig. 18 is a schematic structural view of another optical transceiver component provided according to some embodiments of the present disclosure;

FIG. 19 is a schematic partial structure of another circuit board provided in accordance with some embodiments of the present disclosure;

fig. 20 is a partial schematic view of an assembly of an optical transceiver component and a circuit board provided according to some embodiments of the present disclosure;

fig. 21 is a schematic diagram of a partial structure of another circuit board according to some embodiments of the present disclosure;

FIG. 22 is a state diagram of electrical connections for a first DSP chip provided in accordance with some embodiments of the disclosure;

FIG. 23 is a diagram of electrical connections of a second DSP chip provided in accordance with some embodiments of the disclosure;

fig. 24 is a schematic illustration of bending a circuit board according to some embodiments of the present disclosure;

fig. 25 is a schematic illustration of a partial structure of a third circuit board provided in accordance with some embodiments of the present disclosure;

fig. 26 is a schematic diagram of a third circuit board according to some embodiments of the present disclosure;

fig. 27 is a schematic partial structure of a fourth circuit board according to some embodiments of the present disclosure;

FIG. 28 is an exploded view of FIG. 27;

fig. 29 is a schematic structural view of a first elastic heat conductive member according to some embodiments of the present disclosure;

fig. 30 is a schematic structural view ii of a first elastic heat conductive member according to some embodiments of the present disclosure;

Fig. 31 is a state diagram of use of a first elastic heat conductive member provided according to some embodiments of the present disclosure.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and specifically described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present disclosure, but not all embodiments. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

In the optical communication technology, in order to establish information transfer between information processing apparatuses, it is necessary to load information onto light, and transfer of information is realized by propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in the information transmission device, so that high-speed, long-distance and low-cost information transmission can be realized. The signal that the information processing apparatus can recognize and process is an electrical signal. Information processing devices typically include optical network terminals (Optical Network Unit, ONUs), gateways, routers, switches, handsets, computers, servers, tablets, televisions, etc., and information transmission devices typically include optical fibers, optical waveguides, etc.

The optical module can realize the mutual conversion of optical signals and electric signals between the information processing equipment and the information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal; the optical module converts the first optical signal into a first electrical signal and transmits the first electrical signal to an optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Since information transmission can be performed between the plurality of information processing apparatuses by an electric signal, it is necessary that at least one of the plurality of information processing apparatuses is directly connected to the optical module, and it is unnecessary that all of the information processing apparatuses are directly connected to the optical module. Here, the information processing apparatus directly connected to the optical module is referred to as an upper computer of the optical module. In addition, the optical signal input or the optical signal output of the optical module may be referred to as an optical port, and the electrical signal input or the electrical signal output of the optical module may be referred to as an electrical port.

Fig. 1 is a partial block diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in fig. 1, the optical communication system mainly includes a remote information processing apparatus 1000, a local information processing apparatus 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 extends in the direction of the remote information processing apparatus 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through an optical port of the optical module 200. The optical signal may be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection may almost maintain the original optical power, and the optical signal may be totally reflected in the optical fiber 101 a plurality of times to transmit the optical signal from the remote information processing apparatus 1000 into the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing apparatus 1000, thereby realizing remote, low power loss information transfer.

The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected, or fixedly connected, with the optical module 200. The upper computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the operating state of the optical module 200.

The host computer 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

The upper computer 100 further includes an external electrical interface, which may access an electrical signal network. For example, the pair of external electrical interfaces includes a universal serial bus interface (Universal Serial Bus, USB) or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so as to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing apparatus 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing apparatus 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing apparatus 2000 is transmitted to the upper computer 100 through the network cable 103, the upper computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the upper computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and the second optical signal is transmitted to the optical fiber 101, where the second optical signal is transmitted to the remote information processing apparatus 1000 in the optical fiber 101. For example, a first optical signal from the remote information processing apparatus 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal from the first electrical signal, and the fourth electrical signal is transmitted to the local information processing apparatus 2000. The optical module is a tool for realizing the mutual conversion between the optical signal and the electric signal, and the information is not changed in the conversion process of the optical signal and the electric signal, and the coding and decoding modes of the information can be changed.

The host computer 100 includes an optical line terminal (Optical Line Terminal, OLT), an optical network device (Optical Network Terminal, ONT), a data center server, or the like in addition to the optical network terminal.

Fig. 2 is a partial block diagram of a host computer according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, fig. 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in fig. 2, the upper computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex structure such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the host computer 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 are connected by bi-directional electrical signals. Furthermore, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module according to some embodiments of the present disclosure, and fig. 4 is an exploded schematic diagram of an optical module according to some embodiments of the present disclosure. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, and an optical transceiver 400.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 203 and 204; the outer contour of the housing generally presents a square shape.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction of the connection line of the two openings 203 and 204 may be identical to the length direction of the optical module 200 or may be inconsistent with the length direction of the optical module 200. For example, opening 203 is located at the end of light module 200 (right end of fig. 3), and opening 204 is also located at the end of light module 200 (left end of fig. 3). Alternatively, the opening 203 is located at the end of the light module 200, while the opening 204 is located at the side of the light module 200. The opening 203 is an electrical port, and the golden finger of the circuit board 300 extends out of the electrical port and is inserted into the electrical connector of the upper computer 100; the opening 204 is an optical port configured to access the external optical fiber 101 such that the optical fiber 101 is connected to the optical transceiver 400 in the optical module 200.

The circuit board 300, the optical transceiver 400 and the like are conveniently mounted in the upper and lower housings 201 and 202 by adopting a combined assembly mode, and the upper and lower housings 201 and 202 can encapsulate and protect the devices. In addition, the positioning member, the heat dissipation member, and the electromagnetic shielding member of these devices are easily disposed when the circuit board 300, the optical transceiver member 400, and the like are assembled, which is advantageous for automating the production.

In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the light module 200 further includes an unlocking member 600 located outside its housing. The unlocking part 600 is configured to achieve a fixed connection between the optical module 200 and the upper computer, or to release the fixed connection between the optical module 200 and the upper computer.

For example, the unlocking member 600 is located outside the two lower side plates 2022 of the lower housing 202, and includes an engaging member that mates with the cage 106 of the upper computer 100. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging part of the unlocking part 600; when the unlocking member 600 is pulled, the engaging member of the unlocking member 600 moves along with the unlocking member, so that the connection relationship between the engaging member and the host computer is changed, and the fixation between the optical module 200 and the host computer is released, so that the optical module 200 can be pulled out from the cage 106.

The circuit board 300 includes circuit traces, electronic components, chips, etc., and the electronic components and the chips are connected according to a circuit design through the circuit traces to realize functions of power supply, electric signal transmission, grounding, etc. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (limiting amplifier), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, a digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; the rigid circuit board may also be inserted into an electrical connector in the cage 106 of the host computer 100.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is electrically connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 (such as the upper surface shown in fig. 4) or on the surfaces of the upper side and the lower side of the circuit board 300, so as to provide more pins, thereby being suitable for occasions with high pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to realize power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission and the like. Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

In some embodiments, the optical transceiver component 400 is physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through a corresponding flexible circuit board or electrical connection, respectively.

In some embodiments, the optical transceiver 400 includes an optical transmitting assembly for generating a transmitted optical signal and an optical receiving assembly for receiving an optical receiving signal. In some embodiments, to increase the transmission rate of the optical module, the optical transmitting assembly and the optical receiving assembly respectively include a plurality of transmission channels, so that the optical transmitting assembly generates a plurality of wavelength transmitting optical signals and the optical receiving assembly receives a plurality of wavelength receiving optical signals. Illustratively, the optical transmitting assembly generates 4 wavelengths of transmitted optical signals and the optical receiving assembly receives 4 wavelengths of received optical signals. When the number of transmission channels of the light emitting element and the light receiving element increases, the volume of the light receiving-transmitting member 400 will be relatively large, and the occupied space in the light module 200 will be increased, so that when the number of transmission channels of the light emitting element and the light receiving element reaches a certain number, the number of transmission channels of the light emitting element and the light receiving element is hardly increased.

In some embodiments, the optical transceiver 400 includes two sets of optical transmitting assemblies and two sets of optical receiving assemblies, each set of optical transmitting assemblies generating a plurality of wavelengths of transmitted optical signals, each set of optical receiving assemblies receiving a plurality of wavelengths of received optical signals for further increasing the number of transmission channels of the optical transmitting assemblies and the optical receiving assemblies. Of course, in some embodiments, the optical transceiver 400 is not limited to include two sets of optical transmitting components and two sets of optical receiving components. In some embodiments, each set of light emitting components produces 4 wavelengths of emitted light signals, and each set of light receiving components receives 4 wavelengths of received light signals. Of course, in some embodiments, each set of light emitting components is not limited to generating four wavelengths of emitted light signals, e.g., each set of light emitting components generates 1 or 2 wavelengths of emitted light signals; each group of light receiving elements is not limited to receiving 4 wavelengths of received light signals, e.g., each group of light receiving elements receives 1 or 2 wavelengths of received light signals.

In some embodiments, an optical fiber adapter 800 is disposed at an optical port of the optical module 200, one end of the optical fiber adapter 800 is used for connecting the optical fiber 101, and the other end of the optical fiber adapter 800 is connected to the optical transceiver component 400 through an optical fiber inside the optical module, so as to realize transmission of a transmission optical signal generated by the optical transceiver component 400 to the optical fiber 101 and transmission of a reception optical signal input through the optical fiber 101 to the optical transceiver component 400 through the optical fiber. In some embodiments, a plurality of fiber optic adapters 800, such as 2 or the like, are provided at the optical port of the optical module 200.

Fig. 5 is an internal structural diagram of an optical module according to some embodiments of the present disclosure, and fig. 6 is a schematic structural diagram of an optical transceiver component according to some embodiments of the present disclosure. As shown in fig. 5 and 6, an optical fiber 810 is provided in the optical module 200, and the other end of the optical fiber adapter 800 is connected to the optical fiber 810, so that the optical fiber adapter 800 is connected to the optical transceiver 400 via the optical fiber 810.

In some embodiments, fiber optic adapter 800 includes 4 fiber optic adapters and optical fibers 810 include 4 optical fibers; one end of the 4 optical fibers is connected with the 4 optical fiber adapters in a one-to-one correspondence, and the other ends of the 4 optical fibers are respectively connected with the optical transceiver 400. By way of example, 2 out of 4 fiber optic adapters are used to transmit optical signals, and another 2 fiber optic adapters are used to transmit receive optical signals; 2 optical fibers in the 4 optical fibers are used for transmitting the transmitting optical signals, and the other 2 optical fibers are used for transmitting the receiving optical signals; the optical fiber adapters for transmitting the transmitting optical signals are connected with the optical fibers for transmitting the transmitting optical signals in a one-to-one correspondence manner, and the optical fiber adapters for transmitting the receiving optical signals are connected with the optical fibers for transmitting the receiving optical signals in a one-to-one correspondence manner.

In some embodiments, the other end of the optical fiber 810 is provided with an optical fiber connector 820, one end of the optical fiber connector 820 is connected to the optical fiber 810, and the other end of the optical fiber connector 820 is connected to the optical transceiver 400, so that the optical fiber 810 is conveniently connected to the optical transceiver 400 through the optical fiber connector 820, and optical signals are transmitted between the optical transceiver 400 and the optical fiber 810 with high coupling efficiency.

Fig. 7 is an exploded view of an internal structure of an optical module provided according to some embodiments of the present disclosure. As shown in fig. 7, a notch 310 is formed on the circuit board 300, and the notch 310 interrupts one side of the circuit board 300; the optical transceiver 400 is disposed within the notch 310. In some embodiments, the optical transceiver 400 is snapped into the notch 310 such that the top surface of the optical transceiver 400 is not flush with the top surface of the circuit board 300 and the bottom surface of the optical transceiver 400 is not flush with the bottom surface of the circuit board 300.

The light receiving and transmitting part 400 includes a light receiving and transmitting housing 500, and a plurality of support plates are formed on the light receiving and transmitting housing 500, and a light emitting assembly and a light receiving assembly are supported and arranged through the support plates, for facilitating the package assembly of the light receiving and transmitting part 400. Illustratively, the optical transceiver housing 500 is formed with a first support plate, a second support plate, a third support plate, etc., the first support plate being located at one side of the optical transceiver housing 500, the second support plate and the third support plate being located at the other side of the optical transceiver housing 500; the first support plate is used for supporting and connecting the light emitting assembly, and the second support plate and the third support plate are respectively used for supporting the light receiving assembly.

In some embodiments, an opening or a gap is provided on the optical transceiver housing 500, through which the optical transceiver housing 500 is assembled with the connection circuit board 300, so that the optical transceiver housing 500 is conveniently assembled with the connection circuit board 300 through the opening or the gap. In some embodiments, the edges of the notch 310 extend into the optical transceiver housing 500 through an opening or gap to facilitate the electrical connection of the light emitting assembly and the light receiving assembly to the circuit board 300.

Fig. 8 is a first schematic diagram illustrating an assembly of an optical transceiver and a circuit board according to some embodiments of the present disclosure, and fig. 9 is a second schematic diagram illustrating an assembly of an optical transceiver and a circuit board according to some embodiments of the present disclosure. In some embodiments, the first support plate 510, the second support plate 520, and the third support plate 530 are formed on the optical transceiver housing 500. The second support plate 520 and the third support plate 530 are positioned at one side of the first support plate 510, the second support plate 520 and the third support plate 530 are stacked up and down, and a gap is provided between the second support plate 520 and the third support plate 530.

The first support plate 510 includes a first surface 511 and a second surface 512, where the first surface 511 and the second surface 512 are two opposite main bearing surfaces on the first support plate 510. The first surface 511 is provided with a first light emitting element 410a, and the second surface 512 is provided with a second light emitting element 410b. In some embodiments, the first light emitting component 410a is configured to emit a first emitted light signal comprising a plurality of wavelengths of light signal; the second light emitting component 410b is configured to emit a second emitted light signal, where the second emitted light signal includes light signals with a plurality of wavelengths. Illustratively, the first emitted light signal comprises 4 wavelengths of light signal and the second emitted light signal comprises 4 wavelengths of light signal. Of course, in the embodiment of the present disclosure, the first emission optical signal is not limited to an optical signal including 4 wavelengths, and the second emission optical signal is not limited to an optical signal including 4 wavelengths. In some embodiments, the first light emitting component 410a may also emit a plurality of emitted light signals, and the second light emitting component 410b may also emit a plurality of emitted light signals.

The second support plate 520 is supportably connected to the first light receiving assembly 420a, and the third support plate 530 is supportably connected to the second light receiving assembly 420b. In some embodiments, the first light receiving component 420a is configured to receive a first received light signal, the first received light signal comprising a plurality of wavelengths of light signals, and the second light receiving component 420b is configured to receive a second received light signal, the second received light signal comprising a plurality of wavelengths of light signals. Illustratively, the first received optical signal comprises four wavelengths of optical signal and the second received optical signal comprises four wavelengths of optical signal. Of course, in the embodiment of the present disclosure, the first received optical signal is not limited to an optical signal including 4 wavelengths, and the second received optical signal is not limited to an optical signal including 4 wavelengths. In some embodiments, the first light receiving component 420a may also receive multiple beams of received light signals, and the second light receiving component 420b may also receive multiple beams of light signals.

In some embodiments, the first support plate 510 is positioned within the notch 310, the second support plate 520 is suspended above the first surface of the circuit board 300, and the third support plate 530 is suspended above the second surface of the circuit board 300. The second support plate 520 and the third support plate 530 are suspended above the surface of the circuit board 300 such that the arrangement of the second support plate 520 and the third support plate 530 does not affect the routing on the circuit board 300.

In some embodiments, the first light emitting assembly 410a includes a light emitting assembly 411a, a lens assembly 412a, a wavelength division multiplexing assembly 413a, a focusing lens 414a, and a semiconductor refrigerator (Thermo Electric Cooler, TEC) 415a. TEC415a is disposed on first side 511, and light emitting assembly 411a and lens assembly 412a are disposed on top of TEC415 a. The light emitting component 411a includes a plurality of light emitting chips to generate emitted light signals of different wavelengths; the lens assembly 412a includes a plurality of collimating lenses, and the collimating lenses are disposed on the output light paths of the light emitting chips, and the collimating lenses are used for collimating the light signals emitted by the light emitting chips. Wavelength division multiplexing component 413a is disposed on the output optical path of lens component 412a for combining the emitted optical signals at the multiple wavelengths. A focusing lens 414a is disposed on the output optical path of the wavelength division multiplexing module 413a, and the focusing lens 414a is used for converging the optical signals.

In some embodiments, the second light emitting component 410b includes a light emitting component 411b, a lens component 412b, a wavelength division multiplexing component 413b, a focusing lens 414b, and a TEC415b. TEC415b is disposed on second side 512, and light emitting assembly 411b and lens assembly 412b are disposed on top of TEC415b, and specific placement of light emitting assembly 411b, lens assembly 412b, wavelength division multiplexing assembly 413b, and focusing lens 414b can be seen in first light emitting assembly 410a for specific placement of light emitting assembly 411a, lens assembly 412a, wavelength division multiplexing assembly 413a, and focusing lens 414 a. In some embodiments, the lens assembly 412b, the wavelength division multiplexing assembly 413b, the focusing lens 414b, and the TEC415b in the second light emitting assembly 410b are symmetrically disposed with respect to the first support plate 510 with respect to the light emitting assembly 411a, the lens assembly 412a, the wavelength division multiplexing assembly 413a, the focusing lens 414a, and the TEC415a in the first light emitting assembly 410 a.

In some embodiments, fiber optic connector 820 includes a first fiber optic connector 821 and a second fiber optic connector 822, and optical fiber 810 includes a first optical fiber 811 and a second optical fiber 812. One end of the first optical fiber connector 821 is connected to the first optical fiber 811, and the other end of the first optical fiber connector 821 is connected to the optical transceiver housing 500; the first optical fiber connector 821 is used for fixing the other end of the first optical fiber 811, and the first optical fiber connector 821 enables the other end of the first optical fiber 811 to be optically connected with the first light emitting component 410a, so that the optical signal output by the first light emitting component 410a is conveniently coupled into the first optical fiber 811. One end of the second optical fiber connector 822 is connected with the second optical fiber 812, and the other end of the second optical fiber connector 822 is connected with the optical transceiver housing 500; the second optical fiber connector 822 is used for fixing the other end of the second optical fiber 812, and the second optical fiber connector 822 enables the other end of the second optical fiber 812 to be optically connected with the second light emitting component 410b, so that the optical signal output by the second light emitting component 410b is conveniently coupled into the second optical fiber 812.

In some embodiments, the side of the optical transceiver housing 500 is provided with a first through hole and a second through hole, the other end of the first optical fiber connector 821 is embedded in the first through hole, and the other end of the second optical fiber connector 822 is embedded in the second through hole.

In some embodiments, the first optical fiber connector 821 and the second optical fiber connector 822 are positioned within the notch 310 to avoid interference between the first optical fiber connector 821, the second optical fiber connector 822, and the circuit board 300, facilitating assembly of the optical module 200. In some embodiments, the first optical fiber connector 821 is disposed above the second optical fiber connector 822 and the first optical fiber connector 821 is disposed between the second optical fiber connectors 822 such that the optical fibers connected by the first optical fiber connector 821 are above the circuit board 300 and the optical fibers connected by the second optical fiber connector 822 are below the circuit board 300, effectively avoiding bending of the optical fibers in order to avoid the circuit board 300. Illustratively, the first and second optical fiber connectors 821 and 822 are disposed symmetrically up and down within the notch 310.

In some embodiments, the first light receiving component 420a includes a first array waveguide grating 421a, a first photodetector component 422a, and a first transimpedance amplifier 423a. The second support plate 520 supports the first array waveguide grating 421a, the first photo-detecting assembly 422a and the first transimpedance amplifier 423a are disposed on the circuit board 300, and the first photo-detecting assembly 422a is disposed below the light outlet of the first array waveguide grating 421a, the first transimpedance amplifier 423a is disposed on a side of the first photo-detecting assembly 422a away from the first array waveguide grating 421a, and the first photo-detecting assembly 422a is wire-bonded to the first transimpedance amplifier 423a.

In some embodiments, the first photodetector assembly 422a includes a plurality of light receiving chips, such as a plurality of photodetectors; the first array waveguide grating 421a divides the first received optical signal into a plurality of optical signals according to the wavelength of the optical signal in the first received optical signal, each of the optical signals having a wavelength, and each of the optical receiving chips is configured to receive the received optical signal having a wavelength.

In some embodiments, the second light receiving component 420b includes a second arrayed waveguide grating 421b, a second photodetector component 422b, and a second transimpedance amplifier 423b. The third support plate 530 supports the second arrayed waveguide grating 421b, the second photo-detection assembly 422b and the second transimpedance amplifier 423b are disposed on the circuit board 300, and the second photo-detection assembly 422b is disposed below the light outlet of the second arrayed waveguide grating 421b, the second transimpedance amplifier 423b is disposed on a side of the second photo-detection assembly 422b away from the second arrayed waveguide grating 421b, and the second photo-detection assembly 422b is wire-bonded to the second transimpedance amplifier 423b.

In some embodiments, the second photodetector assembly 422b includes a plurality of light receiving chips, such as a plurality of photodetectors; the second arrayed waveguide grating 421b divides the second received optical signal into a plurality of optical signals according to the wavelength of the optical signal in the second received optical signal, each optical signal having a wavelength, and each optical receiving chip is configured to receive the received optical signal having a wavelength.

Fig. 10 is a first exploded view of an optical transceiver according to some embodiments of the present disclosure, and fig. 11 is a second exploded view of an optical transceiver according to some embodiments of the present disclosure. In some embodiments, as shown in fig. 10 and 11, the optical transceiver component 400 further includes a first upper cover 430 and a second upper cover 440, where the first upper cover 430 covers and connects the first surface of the optical transceiver housing 500, and the second upper cover 440 covers and connects the second surface of the optical transceiver housing 500, so that the first upper cover 430, the optical transceiver housing 500, and the second upper cover 440 form accommodating cavities on the upper and lower sides. In some embodiments, bottoms of the first and second upper covers 430 and 440 connect the optical transceiver housing 500 and the circuit board 300.

Fig. 12 is a schematic structural view of a first optical transceiver housing according to some embodiments of the present disclosure, and fig. 13 is a schematic structural view of a second optical transceiver housing according to some embodiments of the present disclosure. As shown in fig. 12 and 13, the optical transceiver housing 500 further includes a first side plate 540, a second side plate 550, and a third side plate 560, the first side plate 540, the second side plate 550, and the third side plate 560 are sequentially connected, and the first side plate 540, the second side plate 550, and the third side plate 560 surround three sides to which the first support plate 510 is connected. The second side plate 550 is close to the light port end of the light module 200, one end of the second side plate 550 is connected to one end of the first side plate 540, and the other end of the second side plate is connected to one end of the third side plate 560, so that the first side plate 540, the second side plate 550 and the third side plate 560 surround to form a light emitting cavity, the first support plate 510 is located in the light emitting cavity, the first support plate 510 divides the light emitting cavity into an upper cavity and a lower cavity, the first side plate 540 and the third side plate 560 extend along the length direction of the light module 200 respectively, and the first side plate 540 and the third side plate 560 are oppositely arranged along the length direction of the light module 200.

As shown in fig. 12, in some embodiments, the first side plate 540 is located on the right side of the light-transceiving housing 500, and the third side plate 560 is located on the left side of the light-transceiving housing 500, such that the first side plate 540 is located within the notch 310 and near the outer edge of the notch 310 to be closer to the lower side plate 2022.

In some embodiments, the second support plate 520 and the third support plate 530 are positioned outside the light emitting cavity, and one side of the second support plate 520 and one side of the third support plate 530 are respectively connected to one side of the third side plate 560 facing away from the first side plate 540, i.e., one side of the second support plate 520 and one side of the third support plate 530 are connected to the left side of the third side plate 560. The second support plate 520 is positioned above the third support plate 530, a gap 570 is provided between the second support plate 520 and the third support plate 530, and the gap 570 extends to the third side plate 560. When the optical transceiver 400 is assembled with the circuit board 300, the circuit board 300 at the edge of the notch 310 extends into the gap 570, and the gap 570 is used for being matched with and connected with the circuit board 300, so that the optical transceiver 400 and the circuit board 300 can be assembled and connected conveniently through the gap 570. Illustratively, the gap 570 is interference fit with the circuit board 300 to relatively fix the optical transceiver housing 500 and the circuit board 300.

In some embodiments, the first face 511 and the second face 512 of the first support plate 510 are stepped faces, respectively, the stepped first face 511 and the second face 512 facilitate coordinating the relative heights of the light emitting assembly 411, the lens assembly 412, the wavelength division multiplexing assembly 413, and the like.

In some embodiments, a first opening 551 is disposed on the outer side of the second side plate 550, and the first opening 551 is clamped to connect the circuit board 300, so as to connect the second side plate 550 and the circuit board 300 through the first opening 551 in a fitting manner, so that the optical transceiver housing 500 is convenient to assemble and connect the circuit board 300. Illustratively, the first opening 551 is at the same height as the gap 570.

In some embodiments, a second opening 541 is disposed on a side of the first side plate 540 away from the second side plate 550, and the second opening 541 is clamped to the connection circuit board 300, so that the first side plate 540 is assembled and connected through the second opening 541, so that the optical transceiver housing 500 is convenient for assembling and connecting the circuit board 300. Illustratively, the second opening 541 is at the same height as the gap 570, and the second opening 541 is in an interference fit with the circuit board 300. Of course, in some embodiments, the connection between the second opening 541 and the circuit board 300 is filled with glue, and the second opening 541 and the circuit board 300 are connected by sealing with glue.

In some embodiments, a third opening 561 is disposed on a side of the third side plate 560 away from the second side plate 550, and the third opening 561 is engaged with the connection circuit board 300, so as to connect the third side plate 560 through the third opening 561 in a fitting manner, so that the optical transceiver housing 500 is convenient for assembling the connection circuit board 300. Illustratively, the third opening 561 is at the same height as the gap 570, and the third opening 561 is interference fit with the circuit board 300. Of course, in some embodiments, the connection between the third opening 561 and the circuit board 300 is filled with glue, and the third opening 561 and the circuit board 300 are connected by glue sealing.

In some embodiments, the other ends of the first and third side plates 540 and 560 extend beyond the other end of the first support plate 510, and the second and third openings 541 and 561 extend to the edge of the other end of the first support plate 510. When the first side plate 540 and the third side plate 560 are assembled to connect the circuit board 300, the circuit board 300 at the edge of the notch 310 extends into the edge of the other end of the first support plate 510, so as to facilitate the electrical connection between the device on the first support plate 510 and the circuit board 300.

In some embodiments, the first stopper 521 and the second stopper 522 are disposed on the second support plate 520, the first stopper 521 and the second stopper 522 are disposed on the top surface of the end of the second support plate 520, a first positioning interval 523 is formed between the first stopper 521 and the second stopper 522, and the light-incident end of the first array waveguide grating 421a is disposed in the first positioning interval 523.

In some embodiments, a third limiting block 531 and a fourth limiting block 532 are disposed on the third supporting plate 530, the third limiting block 531 and the fourth limiting block 532 are disposed on the top surface of the end portion of the third supporting plate 530, a second positioning space 533 is formed between the third limiting block 531 and the fourth limiting block 532, and the light incident end of the second arrayed waveguide grating 421b is disposed in the second positioning space 533.

In some embodiments, the length of the second support plate 520 and the length of the third support plate 530 are shorter than the length of the third side plate 560, so that the light receiving and transmitting housing 500 forms a unfilled corner on the outer side where the third side plate 560 is disposed, which helps to control the volume of the light receiving and transmitting housing 500. Illustratively, one end of the second support plate 520 and one end of the third support plate 530 extend to the middle of the third side plate 560, respectively, and the other end of the second support plate 520 and the other end of the third support plate 530 extend to the middle of the third side plate 560, respectively. In this way, the occupation of the first light receiving assembly 420a and the second light receiving assembly 420b on the inner volume of the optical module 200 can be conveniently controlled, the occupation of the first light receiving assembly 420a and the second light receiving assembly 420b on the circuit board 300 can be saved, and the lengths of the high-frequency signal wires connected with the first light receiving assembly 420a and the second light receiving assembly 420b can be conveniently coordinated.

Fig. 14 is a schematic structural diagram III of an optical transceiver housing according to some embodiments of the present disclosure. As shown in fig. 14, the outer side of the second side plate 550 is connected to the first optical fiber connector 821 and the second optical fiber connector 822. In some embodiments, the connection of the first optical fiber connector 821 and the second side plate 550 is located above the first opening 551, and the connection of the second optical fiber connector 822 and the second side plate 550 is located below the first opening 551. Illustratively, the first optical fiber connector 821 and the second optical fiber connector 822 are symmetrically disposed on both upper and lower sides of the first opening 551.

Fig. 15 is a schematic structural view of a first upper cover according to some embodiments of the present disclosure, and fig. 16 is a schematic structural view of a second upper cover according to some embodiments of the present disclosure. As shown in fig. 15 and 16, the first upper cover 430 includes a first upper cover body 431, a first barrier 432, and a second barrier 433, the top of the first barrier 432 and the top of the second barrier 433 are respectively connected to edges of the bottom surface of the first upper cover body 431, and the first barrier 432 and the second barrier 433 are connected, and the bottom of the first barrier 432 and the bottom of the second barrier 433 are used to connect the circuit board 300. The bottom edge of the first upper cover body 431, to which the first barrier 432 and the second barrier 433 are not connected, is used to connect the optical transceiver housing 500. Illustratively, the side surface of the first side plate 540, the side surface of the second side plate 550, and the side surface of the third side plate 560 on the same side as the first surface 511 are respectively connected to the bottom surface of the first upper cover body 431, and the top surfaces of the first stopper 521 and the second stopper 522 are connected to the bottom surface of the first upper cover body 431; the inner side surface of the first baffle 432 is connected to the end surface of the first side plate 540 and the end surface of the third side plate 560, and the inner side surface of the second baffle 433 is connected to the side surface of the second stopper 522. In some embodiments, first barrier 432 and second barrier 433 are connected at right angles.

In some embodiments, the bottom surface of the first upper cover body 431 is welded to the optical transceiver housing 500, and the bottom of the first barrier 432 and the bottom of the second barrier 433 are connected to the circuit board 300 by glue.

Fig. 17 is a schematic structural view of a second upper cover according to some embodiments of the present disclosure. In some embodiments, as shown in fig. 17, the second upper cover 440 includes a second upper cover body 441, a third barrier 442, and a fourth barrier 443, the top of the third barrier 442 and the top of the fourth barrier 443 are respectively connected to edges of the bottom surface of the second upper cover body 441, and the third barrier 442 and the fourth barrier 443 are connected. The shape of the second upper cover body 441 and the shape of the first upper cover body 431 are symmetrical with respect to the first support plate 510, the third barrier 442 and the first barrier 432 are symmetrical with respect to the first support plate 510, and the fourth barrier 443 and the second barrier 433 are symmetrical with respect to the first support plate 510. In some embodiments, the assembly of the second upper cover 440 with the optical transceiver housing 500 refers to the assembly of the first upper cover 430 with the optical transceiver housing 500.

Fig. 18 is a schematic structural diagram of another optical transceiver component provided according to some embodiments of the present disclosure. As shown in fig. 18, when the first and second upper covers 430 and 440 are assembled to the optical transceiver housing 500, a first space 571 is formed between the bottom of the first barrier 432 and the bottom of the third barrier 442, the first space 571 communicates with the gap 570, the bottom of the second barrier 433 and the bottom of the fourth barrier 443 form a second space 572, and the second space 572 communicates with the first space 571. The gap 570, the first space 571 and the second space 572 are respectively used for embedding the connection circuit board 300.

Fig. 19 is a schematic partial structure of another circuit board according to some embodiments of the present disclosure, and fig. 20 is a schematic partial structure of an assembly of an optical transceiver component and a circuit board according to some embodiments of the present disclosure. As shown in fig. 19 and 20, the notch 310 includes a first side 311, a second side 312, a third side 313, a fourth side 314, and a fifth side 315 that are sequentially connected, where the first side 311, the third side 313, and the fifth side 315 are parallel to an end side of the circuit board 300, and the second side 312 and the fourth side 314 are parallel to a side of the circuit board 300 in a longitudinal direction. The first side 311 and the second side 312 surround the side of the optical fiber connector 820, and the third side 313, the fourth side 314 and the fifth side 315 surround the side of the optical transceiver housing 500.

In some embodiments, the first opening 551 is embedded with the connection circuit board 300, the gap 570 is embedded with the connection circuit board 300, the second opening 541 is embedded with the connection circuit board 300, the third opening 561 is embedded with the connection circuit board 300, such that the third side 313 is located in the first opening 551, the fourth side 314 is embedded in the gap 570 and the first space 571, and the fifth side 315 is embedded in the second space 572, and such that the circuit boards at the edges of the fourth side 314 and the fifth side 315 are located in the space formed by the optical transceiver housing 500, the first upper cover 430, and the second upper cover 440.

In some embodiments, the top surface of the first upper cover 430 contacts the upper housing 201, and the heat generated by the optical transceiver component 400 is transferred to the first upper cover 430, and the first upper cover 430 transfers the heat to the cover 2011 of the upper housing 201, so as to dissipate the heat of the optical transceiver component 400 through the cover 2011.

In some embodiments, the top surface of the second upper cover 440 contacts the lower housing 202, and the heat generated by the optical transceiver 400 is transferred to the second upper cover 440, and the second upper cover 440 transfers the heat to the bottom plate 2021 of the lower housing 202, so as to dissipate the heat of the optical transceiver 400 through the bottom plate 2021.

In some embodiments, the outer sidewall of the first side plate 540 contacts the lower housing 202, and the heat generated by the light transceiver 400 is transferred to the first side plate 540, and the first side plate 540 transfers the heat to the lower side plate 2022 of the lower housing 202, so that the heat dissipation of the light transceiver 400 is achieved by the lower side plate 2022. Illustratively, the outer sidewall of the first side plate 540 is flush with the side edge of the circuit board 300 or beyond the side edge of the circuit board 300, and the outer sidewall of the first side plate 540 contacts the lower side plate 2022 through a thermal pad.

In some embodiments, the outer side wall of the first baffle 432 and the outer side wall of the third baffle 442 contact the lower housing 202, and the heat generated by the light transceiver 400 is transferred to the first baffle 432 and the third baffle 442, and the first baffle 432 and the third baffle 442 transfer the heat to the lower side plate 2022 of the lower housing 202, so that the heat dissipation of the light transceiver 400 is performed by the lower side plate 2022. Illustratively, the outer sidewalls of the first and third baffles 432, 442 are flush with the side edge of the circuit board 300 or beyond the side edge of the circuit board 300, and the outer sidewalls of the first and third baffles 432, 442 contact the lower side plate 2022 through thermal pads.

Fig. 21 is a schematic diagram illustrating a partial structure of another circuit board according to some embodiments of the present disclosure. As shown in fig. 21, a first DSP chip 320 is disposed on the first surface 301 of the circuit board 300, and a second DSP chip 330 is disposed on the second surface 302 of the circuit board 300. The first DSP chip 320 and the second DSP chip 330 are respectively and electrically connected to the circuit board 300, the circuit board 300 is provided with a high-frequency wiring, the first DSP chip 320 and the second DSP chip 330 are electrically connected to the high-frequency wiring, and the light emitting component, the light receiving component and the golden finger are electrically connected through the high-frequency wiring. In some embodiments, the first DSP chip 320 and the second DSP chip 330 are symmetrically disposed on both surfaces of the circuit board 300.

Fig. 22 is a state diagram of electrical connections for a first DSP chip provided in accordance with some embodiments of the present disclosure. In some embodiments, as shown in fig. 20, a first gold finger 340 is disposed at an end of the first surface 301, and a first high-frequency signal line group 303, a second high-frequency signal line group 304, and a third high-frequency signal line group 305 are disposed on the circuit board 300. The first high-frequency signal line group 303 includes a plurality of pairs of high-frequency signal lines, one end of the high-frequency signal lines in the first high-frequency signal line group 303 is electrically connected to the first DSP chip 320, and the other end of the high-frequency signal lines in the first high-frequency signal line group 303 is electrically connected to the first gold finger 340. One end of the second high-frequency signal line set 304 is electrically connected to the first light emitting component 410a, and the other end of the second high-frequency signal line set 304 is electrically connected to the first DSP chip 320; one end of the third high-frequency signal line group 305 is electrically connected to the first light receiving component 420a, and the other end of the third high-frequency signal line group 305 is electrically connected to the first DSP chip 320.

In some embodiments, the pairs of high frequency signal lines in the first high frequency signal line group 303 are located on the same layer of the circuit board 300, such as on the top layer of the circuit board 300. Of course, in some embodiments, the pairs of high-frequency signal lines in the first high-frequency signal line group 303 are located on different layers of the circuit board 300. Illustratively, when the first gold finger 340 is a plurality of rows of gold fingers, the pairs of high-frequency signal lines in the first high-frequency signal line group 303 are located at different layers of the circuit board 300.

In some embodiments, the second high frequency signal line set 304 includes a plurality or pairs of high frequency signal lines, and the plurality or pairs of high frequency signal lines in the second high frequency signal line set 304 are located on the same layer of the circuit board 300. Illustratively, the second high frequency signal line group 304 includes four high frequency signal lines, which are disposed on the top layer of the circuit board 300.

In some embodiments, the third high frequency signal line group 305 includes a plurality of pairs of high frequency signal lines, and the pairs of high frequency signal lines in the third high frequency signal line group 305 are located on the same layer of the circuit board 300. Illustratively, the third high frequency signal line group 305 includes four pairs of high frequency signal lines, the four pairs of high frequency signal lines being disposed on the top layer of the circuit board 300.

Fig. 23 is a diagram of electrical connection states of a second DSP chip provided in accordance with some embodiments of the present disclosure. In some embodiments, as shown in fig. 23, a second gold finger 350 is disposed at an end of the second surface 302, and a fourth high-frequency signal line group 306, a fifth high-frequency signal line group 307, and a sixth high-frequency signal line group 308 are disposed on the circuit board 300. The fourth high-frequency signal line set 306 includes a plurality of pairs of high-frequency signal lines, one end of the high-frequency signal line in the fourth high-frequency signal line set 306 is electrically connected to the second DSP chip 330, and the other end of the high-frequency signal line in the fourth high-frequency signal line set 306 is electrically connected to the second gold finger 350. One end of the fifth high-frequency signal line group 307 is electrically connected to the second light emitting element 410b, and the other end of the fifth high-frequency signal line group 307 is electrically connected to the second DSP chip 330; one end of the sixth high-frequency signal line group 308 is electrically connected to the second light receiving element 420b, and the other end of the sixth high-frequency signal line group 308 is electrically connected to the second DSP chip 330.

In some embodiments, the pairs of high frequency signal lines in the fourth high frequency signal line set 306 are located on the same layer of the circuit board 300, such as on the bottom layer of the circuit board 300. Of course, in some embodiments, the pairs of high frequency signal lines in the fourth high frequency signal line set 306 are located at different layers of the circuit board 300. Illustratively, when the second gold finger 350 is a plurality of rows of gold fingers, the pairs of high-frequency signal lines in the fourth high-frequency signal line group 306 are located at different layers of the circuit board 300.

In some embodiments, the fifth high frequency signal line group 307 includes a plurality or pairs of high frequency signal lines, and the plurality or pairs of high frequency signal lines in the fifth high frequency signal line group 307 are located on the same layer of the circuit board 300. Illustratively, the fifth high-frequency signal line group 307 includes four high-frequency signal lines disposed at the bottom layer of the circuit board 300.

In some embodiments, the sixth high frequency signal line group 308 includes a plurality of pairs of high frequency signal lines, and the pairs of high frequency signal lines in the sixth high frequency signal line group 308 are located on the same layer of the circuit board 300. Illustratively, the sixth high-frequency signal line group 308 includes four pairs of high-frequency signal lines, which are disposed at the bottom layer of the circuit board 300.

In some embodiments, the high-frequency signal lines in the first high-frequency signal line group 303 cross the high-frequency signal lines in the fourth high-frequency signal line group 306 without crossing the high-frequency signal lines in the first high-frequency signal line group 303 without crossing the high-frequency signal lines in the fourth high-frequency signal line group 306 without crossing the high-frequency signal lines in the fourth high-frequency signal line group, so as to help reduce signal crosstalk between the high-frequency signal lines.

In some embodiments, the high-frequency signal lines in the second high-frequency signal line group 304 are not crossed in a layer, and the high-frequency signal lines in the fifth high-frequency signal line group 307 are not crossed in a layer, so as to help reduce signal crosstalk between the high-frequency signal lines.

In some embodiments, the high-frequency signal lines of the third high-frequency signal line group 305 are not crossed in a layer, and the high-frequency signal lines of the sixth high-frequency signal line group 308 are not crossed in a layer, and the high-frequency signal lines of the third high-frequency signal line group 305 are not crossed in a layer, so as to help reduce signal crosstalk between the high-frequency signal lines.

In some embodiments, screws are required for assembling and fixing the upper housing 201 and the lower housing 202, and grooves 360 are provided on the sides of the circuit board 300, and the grooves 360 are used for assembling and connecting the lower housing 202 and avoiding the screws. Illustratively, a first groove 361 is disposed on one side of the circuit board 300, a second groove 362 is disposed on the other side of the circuit board 300, and the first groove 361 and the second groove 362 are symmetrically disposed. The first groove 361 and the second groove 362 are symmetrically arranged, so that the circuit board 300 and the lower housing 202 can be assembled conveniently, and the internal space of the optical module 200 occupied by fixing the circuit board 300 is saved.

In some experiments and experiments of the optical module, it was found that the arrangement of the first groove 361 to the second groove 362 causes the formation of a stress concentration prone region a between the first groove 361 and the second groove 362 on the circuit board 300, the stress concentration prone region a penetrates the circuit board 300 in the width direction of the circuit board 300, and the stress concentration prone region a is prone to bending and even breaking. Fig. 24 is a schematic bending diagram of a circuit board according to some embodiments of the present disclosure. As shown in fig. 24, the circuit board 300 is bent at the stress concentration regions a of the first groove 361 to the second groove 362.

In some embodiments, to reduce bending of the circuit board 300 at the stress concentration prone region a, the stress concentration prone region a is provided with electrical devices, such as capacitors, resistors, etc., by which the bending resistance in the stress concentration prone region a is improved.

Fig. 25 is a schematic illustration of a partial structure of a third circuit board provided in accordance with some embodiments of the present disclosure. In some embodiments, as shown in fig. 25, a plurality of capacitors 3031 are disposed on the first surface 301 of the circuit board 300 in the stress concentration prone region a on the first high frequency signal line group 303. The capacitor 3031 is of a ceramic structure and has strong bending resistance, so that the capacitor 3031 is arranged in the stress concentration easy area A, the bending resistance in the stress concentration easy area A can be effectively improved by using the capacitor 3031, and further bending deformation of the circuit board 300 is reduced.

Illustratively, in the stress concentration prone region a, a capacitor 3031 is provided on each of the first high-frequency signal lines 303. Of course, in some embodiments, in the stress concentration prone region a, the capacitor 3031 is disposed on some of the high-frequency signal lines in the first high-frequency signal line group 303, and the capacitor 3031 is not disposed on some of the high-frequency signal lines.

Fig. 26 is a schematic diagram of a third circuit board according to some embodiments of the present disclosure. In some embodiments, as shown in fig. 26, on the first surface 301, in the stress concentration prone area a, a plurality of capacitors 3031 are disposed side by side, and the plurality of capacitors 3031 are respectively connected to the high frequency signal lines in the first high frequency signal line group 303 correspondingly.

In some embodiments, a plurality of capacitors are disposed on the third high frequency signal line group 305 on the second surface 302 of the circuit board 300 in the stress concentration prone region a. In the stress concentration prone region a, the arrangement of the plurality of capacitors on the third high-frequency signal line group 305 may be referred to the arrangement of the plurality of capacitors 3031 on the first high-frequency signal line group 303. In some embodiments, the capacitor disposed on the third high-frequency signal line set 305 and the capacitor 3031 disposed on the first high-frequency signal line set 303 are symmetrically disposed with respect to the circuit board 300, so as to balance the stress of the stress concentration prone region a on the first surface 301 and the second surface 302 of the circuit board 300, and effectively reduce the bending deformation of the circuit board 300.

In the present embodiment, the first DSP chip 320 and the second DSP chip 330 are main heat generating components in the optical module 200, and of course, the main heat generating components in the optical module 200 provided in the embodiment of the present disclosure are not limited to the first DSP chip 320 and the second DSP chip 330, and also include the optical transceiver component 400 and the like. When the first DSP chip 320 and the second DSP chip 330 are disposed on the first surface 301 and the second surface 302 of the circuit board 300, it is particularly important to dissipate heat from the first DSP chip 320 and the second DSP chip 330.

In some embodiments, to facilitate heat dissipation of the main heat generating components such as the first DSP chip 320 and the second DSP chip 330, a heat conducting boss is disposed on the cover 2011 of the upper housing 201 and/or the bottom 2021 of the lower housing 202, and the heat conducting boss contacts and connects the main heat generating components such as the first DSP chip 320 and the second DSP chip 330, so as to transfer the heat generated by the main heat generating components such as the first DSP chip 320 and the second DSP chip 330 to the upper housing 201 or the lower housing 202, and finally the heat is dissipated through the upper housing 201 or the lower housing 202. Due to improper assembly, the heat conduction bosses on the cover 2011 of the upper housing 201 and/or the bottom 2021 of the lower housing 202 are prone to damage to the main heat generating components such as the first DSP chip 320 and the second DSP chip 330.

Fig. 27 is a schematic partial structure of a fourth circuit board according to some embodiments of the present disclosure, and fig. 28 is an exploded schematic view of fig. 27. In some embodiments, as shown in fig. 27 and 28, a first elastic heat conductive member 205 is disposed on top of the first DSP chip 320. The bottom of the first elastic heat conducting component 205 is in contact with and connected to the first DSP chip 320, the bottom of the first elastic heat conducting component 205 is used for being in contact with and connected to the cover 2011 of the upper shell 201, and then the first DSP chip 320 is in contact with and connected to the upper shell 201 through the first elastic heat conducting component 205, so that heat generated by the first DSP chip 320 is transmitted to the upper shell 201. The first elastic heat conducting component 205 is an elastic heat conducting component, and when being extruded by the first DSP chip 320 and the cover 2011, the first elastic heat conducting component will deform, so as to counteract the acting force generated on the first DSP chip 320, so as to reduce the extrusion damage to the first DSP chip 320. In some embodiments, the first elastic heat conductive member 205 is a metal piece of a spring-like structure, having good elasticity and good heat conductive properties.

In some embodiments, as shown in fig. 25 and 26, a second elastic heat conductive member 206 is disposed on top of the second DSP chip 330. The bottom of the second elastic heat conducting component 206 is in contact with and connected to the second DSP chip 330, and the top of the second elastic heat conducting component 206 is used for being in contact with and connected to the bottom plate 2021 of the lower housing 202, so that the second DSP chip 330 is in contact with and connected to the lower housing 202 through the second elastic heat conducting component 206, and heat generated by the second DSP chip 330 is transmitted to the lower housing 202. The second elastic heat conductive member 206 is an elastic heat conductive member, and deforms when being pressed by the second DSP chip 330 and the bottom plate 2021, so that the acting force on the second DSP chip 330 can be reduced, and the pressing damage on the second DSP chip 330 can be reduced. In some embodiments, the second elastic heat conductive member 206 is a metal piece of spring-like structure with good elasticity and good heat conductive properties.

In some embodiments, the first DSP chip 320 and the second DSP chip 330 are symmetrically disposed on the first surface 301 and the second surface 302 of the circuit board 300, and the first elastic heat conductive member 205 and the second elastic heat conductive member 206 are symmetrically disposed on top of the first DSP chip 320 and on top of the second DSP chip 330. Of course, in some embodiments, the first and second elastic heat conductive members 205 and 206 may be adaptively adjusted according to the settings of the first and second DSP chips 320 and 330.

Fig. 29 is a schematic structural view of a first elastic heat conductive member according to some embodiments of the present disclosure, and fig. 30 is a schematic structural view of a second elastic heat conductive member according to some embodiments of the present disclosure. As shown in fig. 29 and 30, the first elastic heat conductive member 205 includes a first contact portion 2051, a first elastic portion 2052, a second elastic portion 2053, and a second contact portion 2054. One end of the first elastic portion 2052 is connected to one end of the first contact portion 2051, and the other end of the first elastic portion 2052 is connected to one end of the second contact portion 2054; one end of the second elastic portion 2053 is connected to the other end of the first contact portion 2051, and the other end of the second elastic portion 2053 is connected to the other end of the second contact portion 2054. The first contact portion 2051 is for contacting the upper case 201, the second contact portion 2054 is for contacting the first DSP chip 320, the upper case 201 presses the first contact portion 2051 or the first DSP chip 320 presses the second contact portion 2054, and the first elastic portion 2052 and the second elastic portion 2053 shrink and deform.

In some embodiments, the first elastic portion 2052 is a ">" shaped structure with two ends tilted, and the tip portion faces the second elastic portion 2053; the second elastic portion 2053 has a "<" shape with both ends tilted, and the tip portion faces the first elastic portion 2052. When the upper case 201 presses the first contact portion 2051 or the first DSP chip 320 presses the second contact portion 2054, the distance between the two ends of the first elastic portion 2052 is reduced, and the distance between the two ends of the second elastic portion 2053 is reduced, that is, the first elastic portion 2052 and the second elastic portion 2053 elastically deform, so as to reduce the damage of the first DSP chip 320 caused by the pressing force.

In some embodiments, a first thickened portion 2055 is provided on an inner side of the first contact portion 2051, the first thickened portion 2055 being used to locally thicken the first contact portion 2051; a second thickened portion 2056 is provided on the inner side surface of the second contact portion 2054, and the second thickened portion 2056 is used to locally thicken the second contact portion 2054. The first elastic heat conducting component 205 is made of metal plates with relatively thin thickness, and the first thickened portion 2055 and the second thickened portion 2056 are arranged on the first contact portion 2051 and the second contact portion 2054, so that bending of the first contact portion 2051 or the second contact portion 2054 in the deformation process of the first elastic heat conducting component 205 is effectively avoided, contact between the first contact portion 2051 and the upper shell 201 and contact between the second contact portion 2054 and the first DSP chip 320 are affected, and heat dissipation performance of the first elastic heat conducting component 205 is reduced.

In some embodiments, the first elastic heat conductive member 205 further includes a first support portion 2057 and a second support portion 2058, the first support portion 2057 is a "<" shaped structure with two ends tilted, and the second support portion 2058 is a ">" shaped structure with two ends tilted. The middle part of the first support part 2057 is connected with the first elastic part 2052, one end of the first support part 2057 is connected with the first thickened part 2055, and the other end of the first support part 2057 is connected with the second thickened part 2056; the middle part of the second support portion 2058 is connected to the second elastic portion 2053, one end of the second support portion 2058 is connected to the first thickened portion 2055, and the other end of the second support portion 2058 is connected to the second thickened portion 2056. The first and second support portions 2057 and 2058 do not affect the elastic performance of the first elastic heat conductive member 205, and can reduce the bending of the first or second contact portions 2051 and 2054, so that the first contact portion 2051 is sufficiently contacted with the upper case 201 and the second contact portion 2054 is sufficiently contacted with the first DSP chip 320.

In some embodiments, the middle tip of the first support portion 2057 is connected to the middle tip of the first elastic portion 2052, and the middle tip of the second support portion 2058 is connected to the middle tip of the second elastic portion 2053, so that the first elastic heat conductive member 205 is uniformly stressed, and thus, good heat dissipation capability is ensured.

Fig. 31 is a state diagram of use of a first elastic heat conductive member provided according to some embodiments of the present disclosure. As shown in fig. 31, when the upper housing 201 is assembled and connected with the circuit board 300 in the optical module 200, the upper housing 201 presses the first elastic heat conductive member 205, and the first elastic heat conductive member 205 deforms, so that the surface of the first contact portion 2051 contacts the cover 2011, and the surface of the second contact portion 2054 contacts the first DSP chip 320 sufficiently. The damage to the first DSP chip 320 caused by the first elastic heat conductive member 205 pressing the first DSP chip 320 is reduced due to the elastic deformation of the first elastic heat conductive member 205. In this embodiment of the disclosure, the first elastic heat conducting component 205 can not only effectively dissipate heat for the first DSP chip 320, but also reduce damage to the first DSP chip 320.

In some embodiments, the detailed structure of the second elastic heat conduction member 206 may refer to the structure of the first elastic heat conduction member 205, and may be the same as the structure of the first elastic heat conduction member 205, or may be adapted to be deformed based on the structure of the first elastic heat conduction member 205.

In some embodiments, a similar structure of the first elastic heat conducting component 205 may also be used to dissipate heat from other main heat generating components in the optical module 200.

Finally, it should be noted that: the above embodiments are merely for illustrating the technical solution of the present disclosure, and are not limiting thereof; although the present disclosure has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, comprising:

2. The optical module of claim 1, wherein the circuit board comprises a first surface and a second surface, the first digital signal processing chip is on the first surface, and the first gold finger is disposed on the first surface;

the second surface is provided with a second golden finger and a second digital signal processing chip, the circuit board is also provided with a fourth high-frequency signal wire group, one end of the fourth high-frequency signal wire group is electrically connected with the second digital signal processing chip, the other end of the fourth high-frequency signal wire group is electrically connected with the second golden finger, and the fourth high-frequency signal wire group penetrates through the stress concentration area; and a plurality of capacitors are arranged on the fourth high-frequency signal line group in the stress concentration easy area.

3. The optical module of claim 1, wherein the first high frequency signal line group comprises a plurality of pairs of high frequency signal lines, and capacitors are arranged in series on the plurality of pairs of high frequency signal lines in the stress concentration prone region, and the plurality of capacitors are arranged in a row.

4. A light module as recited in claim 3, wherein the first recess is symmetrically disposed with respect to the second recess, and the capacitors disposed on the plurality of pairs of high frequency signal lines are disposed on a line connecting the first recess and the second recess.

5. The optical module according to claim 2, wherein the fourth high-frequency signal line group includes a plurality of pairs of high-frequency signal lines, and capacitors are arranged in series on the plurality of pairs of high-frequency signal lines in the stress concentration prone region; and in the stress concentration easy area, the capacitor arranged on the fourth high-frequency signal line group is symmetrical with the capacitor arranged on the first high-frequency signal line group.

6. The optical module of claim 2, wherein the first digital signal processing chip is not electrically connected to the second gold finger, the second digital signal processing chip is not electrically connected to the first gold finger, and the high-frequency signal lines in the first high-frequency signal line group and the high-frequency signal lines in the fourth high-frequency signal line group are not crossed in series.

7. The optical module of claim 2, wherein the first high frequency signal line set is located at a top layer of the circuit board and the fourth high frequency signal line set is located at a bottom layer of the circuit board.

8. The light module of claim 2 further comprising a first resilient thermally conductive member and a second resilient thermally conductive member; the top of the first elastic heat conduction component is in contact connection with the upper shell, and the bottom of the first elastic heat conduction component is in contact connection with the first digital signal processing chip; the top of the second elastic heat conduction component is in contact connection with the lower shell, and the bottom of the second elastic heat conduction component is in contact connection with the second digital signal processing chip.

9. The optical module of claim 2, wherein a second high-frequency signal line group and a fifth high-frequency signal line group are further provided on the circuit board;

the second high-frequency signal line group is positioned at one side of the first digital signal processing chip far away from the first golden finger, and the fifth high-frequency signal line group is positioned at one side of the second digital signal processing chip far away from the second golden finger;

one end of the second high-frequency signal wire group is electrically connected with the first light emitting component, and the other end of the second high-frequency signal wire group is electrically connected with the first digital signal processing chip;

one end of the fifth high-frequency signal wire group is electrically connected with the second light emitting component, and the other end of the fifth high-frequency signal wire group is electrically connected with the second digital signal processing chip; the high-frequency signal lines in the second high-frequency signal line group and the high-frequency signal lines in the fifth high-frequency signal line group do not cross in a layer.

10. The optical module of claim 2, wherein a third high-frequency signal line group and a sixth high-frequency signal line group are further provided on the circuit board;

the third high-frequency signal line group is positioned at one side of the first digital signal processing chip far away from the first golden finger, and the sixth high-frequency signal line group is positioned at one side of the second digital signal processing chip far away from the second golden finger;

One end of the third high-frequency signal wire group is electrically connected with the first light receiving component, and the other end of the third high-frequency signal wire group is electrically connected with the first digital signal processing chip;

one end of the sixth high-frequency signal wire group is electrically connected with the second light receiving component, and the other end of the sixth high-frequency signal wire group is electrically connected with the second digital signal processing chip; the high-frequency signal lines in the third high-frequency signal line group are not crossed with the high-frequency signal lines in the sixth high-frequency signal line group in a layer-crossing manner.