CN213122371U

CN213122371U - Optical module

Info

Publication number: CN213122371U
Application number: CN202021992828.7U
Authority: CN
Inventors: 刘维伟; 邵乾; 吴涛
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-09-11
Filing date: 2020-09-11
Publication date: 2021-05-04
Anticipated expiration: 2030-09-11

Abstract

The application discloses an optical module, which comprises a circuit board and a tunable light emitting component, wherein the tunable light emitting component is electrically connected with the circuit board through a flexible board; the tunable light emitting component comprises a shell, and an SOA chip, a silicon optical chip and switching ceramics which are arranged in the shell, wherein the shell is provided with an insertion hole, and the flexible plate is inserted into the shell through the insertion hole; the silicon optical chip is connected with the flexible board through a gold wire bonding wire; the SOA chip and the silicon optical chip form a resonant cavity for carrying out resonant amplification on light with various wavelengths emitted by the SOA chip, and the silicon optical chip carries out wavelength selection and modulation on the amplified light to obtain signal light with corresponding wavelength; the SOA chip is connected with the switching ceramic through a gold wire bonding wire, and the switching ceramic is connected with the flexible board through the gold wire bonding wire. According to the optical module, the silicon optical chip and the SOA chip are integrally packaged, and the wavelength can be tuned based on the silicon optical chip and the SOA chip, so that the optical module has a multi-wavelength tunable function.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

In optical fiber communication, a wavelength tunable optical module has been a subject of extensive study. The wavelength tunable optical module can not only make full use of the broadband resource of the optical fiber of a DWDM (Dense wavelength Division Multiplexing) system, greatly improve the communication capacity of a network system, but also be more flexible and changeable in links such as networking, material preparation and the like compared with the DWM optical module with fixed wavelength, and can also be used as a backup light source of the traditional DWDM system, thereby being a key factor of an intelligent optical network.

At the initial stage of 5G network construction, a wavelength tunable optical module is a core unit, and existing wavelength tuning methods mainly focus on the design of optical devices, for example, a tunable method of a DFB (Distributed Feedback Laser), a DBR (Distributed Bragg reflector), a Distributed Bragg reflector (Distributed Bragg reflector) + an electro-absorption modulator, a Littman-metallurgical external cavity structure method, and the like, all of which are complex processes and designs on the structure, waveguide, and epitaxial growth of the optical device, thereby achieving multi-wavelength tuning.

Although there are many methods for realizing tunable wavelength, it usually needs very complicated optical design and manufacturing process, high precision control, and has the problems of difficult realization, high manufacturing cost, narrow tuning range, high power consumption, and the like, and is not favorable for the application of wavelength tunable optical module.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module to realize the development of low cost, wide tuning range, low power consumption and the like of a wavelength tunable optical module.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, includes:

a circuit board;

the tunable light emitting component is electrically connected with the circuit board through a flexible board and used for emitting signal light;

wherein the tunable optical transmission component comprises:

the shell is provided with an insertion hole, and the flexible board is inserted into the shell through the insertion hole;

the SOA chip is arranged in the shell and used for emitting light with various wavelengths;

the switching ceramic is arranged in the shell, the SOA chip is connected with the switching ceramic through a gold wire bonding wire, and the switching ceramic is connected with the flexible board through a gold wire bonding wire;

the silicon optical chip is arranged in the shell and is connected with the flexible board through a gold wire bonding wire; and the wavelength selection module is used for selecting the wavelengths of the light with the multiple wavelengths and modulating the selected light to obtain signal light with corresponding wavelengths.

The application provides an optical module, including circuit board and tunable optical transmission subassembly, tunable optical transmission subassembly passes through the flexible sheet and is connected with the circuit board electricity for signal light is launched. The tunable light emitting assembly comprises a shell, and an SOA chip, a silicon optical chip and switching ceramics which are arranged in the shell, wherein the shell is provided with an insertion hole, a flexible plate is inserted into the shell through the insertion hole, the silicon optical chip is connected with the flexible plate through a gold wire bonding wire, the switching ceramics is connected with the flexible plate through a gold wire bonding wire, and the SOA chip is connected with the switching ceramics through a gold wire bonding wire, so that the connection of the tunable light emitting assembly with the flexible plate and a circuit board is realized, and the circuit board is used for electrifying the tunable light emitting assembly and emitting high-frequency signals to the tunable light emitting; the silicon optical chip and the SOA chip form a resonant cavity, light which is emitted by the SOA chip and does not carry signals is amplified in the resonant cavity, after the light is amplified to meet the standard, the wavelength of the amplified light is selected in the silicon optical chip, and the selected light is modulated to obtain signal light with corresponding wavelength. The silicon optical chip has the advantages of low optical loss, high integration density and compatibility with a CMOS (complementary metal oxide semiconductor), and has huge application potential in the aspect of developing low-cost and high-speed photoelectric devices.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

fig. 2 is a schematic structural diagram of an optical network terminal;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;

fig. 4 is an exploded schematic view of an optical module according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a tunable optical transmission element in an optical module according to an embodiment of the present disclosure;

fig. 6 is an exploded schematic view of a tunable optical transmission element in an optical module according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a main housing in an optical module provided in an embodiment of the present application;

fig. 8 is a schematic structural diagram of a transfer board in an optical module according to an embodiment of the present disclosure;

fig. 9 is a schematic partial structural diagram of a tunable optical transmission assembly in an optical module according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a silicon optical chip in an optical module according to an embodiment of the present disclosure;

fig. 11 is a top view of a silicon optical chip in an optical module according to an embodiment of the present disclosure;

fig. 12 is a top view of a tunable optical transmission assembly in an optical module according to an embodiment of the present disclosure;

fig. 13 is a schematic optical path diagram of a light emitting device in an optical module according to an embodiment of the present disclosure.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.

One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 via the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a first boss portion such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and an optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application, and fig. 4 is an exploded schematic diagram of the optical module according to the embodiment of the present application. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, a tunable optical transmission assembly 400, and an optical fiber adapter 700.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the packaging cavity generally presents a square body. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper shell 201 on the lower shell 202.

The two openings can be two end openings (204, 205) located at the same end of the optical module, or two openings located at different ends of the optical module; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect the tunable optical transmission assembly 400 inside the optical module; optoelectronic devices such as circuit board 300, tunable optical transmission assembly 400, fiber optic adapter 700 are located in the package cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the tunable light emitting assembly 400, the optical fiber adapter 700 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the packaging protection shell at the outermost layer of the module; the upper shell and the lower shell are made of metal materials generally, electromagnetic shielding and heat dissipation are achieved, the shell of the optical module cannot be made into an integral component generally, and therefore when devices such as a circuit board are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking member 203 is pulled to make the unlocking member 203 relatively move on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is fixed in the cage of the upper computer by the clamping component of the unlocking component 203; by pulling the unlocking member 203, the engaging member of the unlocking member 203 moves along with the unlocking member, and further, the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 is used to provide signal circuits for signal electrical connection, which can provide signals. The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver module by using the flexible circuit board.

Fig. 5 is a schematic structural diagram of the tunable optical transmission assembly 400 in the optical module provided in the embodiment of the present application, and fig. 6 is an exploded schematic diagram of the tunable optical transmission assembly 400 in the optical module provided in the embodiment of the present application. As shown in fig. 5 and 6, one end of the tunable optical transmission assembly 400 is connected to the circuit board 300 through the flexible board 500, and the circuit board 300 powers up and provides a high frequency signal to the optical device of the tunable optical transmission assembly 400 through the flexible board 500; the other end of the tunable optical transmission assembly 400 is connected to the optical fiber adapter 700, and the signal light emitted by the tunable optical transmission assembly 400 is transmitted to an external optical fiber through the optical fiber adapter 700, so as to realize emission of the signal light.

The tunable optical transmission assembly 400 includes a housing 600 and an optical transmission device 800 disposed in the housing 600, wherein the housing 600 is provided with a jack through which the flexible board 500 can be inserted into the housing 600, so as to connect the flexible board 500 and the tunable optical transmission assembly 400. Specifically, the housing 600 includes a main housing 601 and a cover 602 covering the main housing 601, the main housing 601 and the cover 602 form a housing having an internal cavity, the insertion hole is disposed on a side surface of the main housing 601, and the flexible board 500 is inserted into the cavity of the main housing 601 through the insertion hole.

The light emitting device 800 is connected with the flexible board 500 by gold wire bonding wires to transmit an electrical signal, a high frequency signal, etc., transmitted from the circuit board 300 to the tunable light emitting assembly 400, to the light emitting device 800, so that the light emitting device 800 emits a signal light.

In the embodiment of the present application, the tunable optical transmission assembly 400 may further include an interposer 900, and the interposer 900 is connected to the flexible board 500 to support the flexible board 500. The adapter board 900 may be inserted into the housing 600 through an insertion hole on the main housing 601 to achieve connection of the flexible board 500 and the light emitting device 800.

Fig. 7 is a schematic structural diagram of a main housing 601 in an optical module provided in an embodiment of the present application, and fig. 8 is a schematic structural diagram of a relay board 900 in an optical module provided in an embodiment of the present application. As shown in fig. 7 and 8, the main casing 601 includes a first side plate 6011, a second side plate 6012, a third side plate 6013, a fourth side plate 6014, and a bottom plate 6015, wherein the first side plate 6011, the second side plate 6012, the third side plate 6013, and the fourth side plate 6015 are respectively connected to a side edge of the bottom plate 6015 to form a cavity casing with an open upper end. That is, the main housing 601 is a square body, the upper end of the square body is open, and the inside of the square body is a cavity.

The insertion holes formed in the side surface of the main housing 601 include a first insertion hole 6016 and a second insertion hole 6017, the first insertion hole 6016 is formed in the second side plate 6012 of the main housing 601, the second insertion hole 6017 is formed in the third side plate 6013 of the main housing 601, and the first insertion hole 6016 is communicated with the second insertion hole 6017. Specifically, a first insertion hole 6016 is disposed on the second side plate 6012 along a length direction thereof, and a length dimension of the first insertion hole 6016 is the same as a length dimension of the second side plate 6012; a second insertion hole 6017 is formed in the third side plate 6013 along the length direction of the third side plate 6013, and the length dimension of the second insertion hole 6017 is smaller than that of the third side plate 6013; one end of first insertion hole 6016 communicates with one end of second insertion hole 6017, and thus an "L" shaped insertion hole is provided on the left side surface of main housing 601.

When the adapter plate 900 is inserted into the insertion hole of the main housing 601, the end surface of the adapter plate 900 inserted into the housing 600 abuts against the inner side wall of the second insertion hole 6017, and the end surface can be adhered to the inner side wall of the second insertion hole 6017; the bottom surface of the interposer 900 may also be adhered to the lower sidewalls of the first and

second insertion holes

6016, 6017. In this way, the adapter plate 900 can be fixed to the main housing 601.

A notch is formed in one end of the adapter plate 900 inserted into the housing 600, the notch is formed from the front side surface of the adapter plate 900 to the rear side surface of the adapter plate 900, and the length of the notch is smaller than the distance between the front side surface and the rear side surface of the adapter plate 900, that is, the notch on the adapter plate 900 is an L-shaped notch. When the adapter plate 900 is inserted into the main housing 601, the first side 901 of the gap may be flush with the inner edge of the first insertion hole 6016, and the second side 902 of the gap may be flush with the inner edge of the second insertion hole 6017, so as to limit the adapter plate 900.

In the embodiment of the present application, the bonding pads 903 may also be disposed on the interposer 900, and the light emitting device 800 is connected to the bonding pads 903 through gold wire bonding wires, so that information transmitted by the flexible board 500 can be transferred to the light emitting device 800 through the interposer 900, and thus the size of the flexible board 500 can be reduced. Pads 903 may be disposed on the edge of interposer 900 along the notch, i.e., pads 903 are disposed on the edge of the "L" shaped notch. Because the light emitting device 800 is arranged in the cavity of the housing 600, the adapter plate 900 is inserted into the L-shaped jack of the main housing 601, the light emitting device 800 is wrapped by the notch on the adapter plate 900, and the bonding pad 903 is arranged on the edge of the L-shaped notch, so that the light emitting device 800 is also wrapped in the L-shaped notch, and the bonding pad is arranged on the edge of the L-shaped notch to facilitate the connection with the light emitting device 800.

In the embodiment of the present application, the interposer 900 and the housing 600 are packaged in a non-airtight manner, the interposer 900 is inserted into the housing 600, one end of the interposer 900 is connected to the flexible board 500, and the other end of the interposer 900 is connected to the light emitting device 800, so that the light emitting device 800 and the flexible board 500 can be conveniently connected. During assembly, the light emitting device 800 is firstly fixed in the cavity of the main housing 601, then the adapter plate 900 is inserted into the insertion hole of the main housing 601, and the adapter plate 900 and the main housing 601 are fixed; then, the device of the light emitting device 800 is connected with a bonding pad 903 on the adapter plate 900 through a gold wire bonding wire; then, the cover plate 602 of the housing 600 is covered on the upper end of the main housing 601; the interposer 900 is then connected to the flexible board 500.

When the interposer 900 is connected to the flexible board 500, the interposer 900 may be connected to a plurality of flexible boards 500 in consideration of more signals to be transmitted. Specifically, the flexible board 500 includes a radio frequency flexible board and a direct current flexible board, the radio frequency flexible board is connected to the upper side of the adapter board 900, the direct current flexible board is connected to the lower side of the adapter board 900, a high-frequency signal (modulation signal) transmitted by the circuit board 300 is transmitted to the adapter board 900 through the radio frequency flexible board, and an electrical signal transmitted by the circuit board 300 is transmitted to the adapter board 900 through the direct current flexible board, so as to respectively realize connection between the circuit board 300 and the tunable light emitting assembly 400.

A through hole is formed in the fourth side wall 6014 of the main housing 601, and the optical fiber adapter 700 is connected to the housing 600 through the through hole, so that the optical fiber adapter 700 is assembled with the housing 600.

Fig. 9 is a schematic structural diagram of a light emitting device 800 in a light module according to an embodiment of the present application. As shown in fig. 9, the light emitting device 800 includes a semiconductor cooler 801, and a silicon optical chip 802, an SOA chip 805, and a transition ceramic 803 which are disposed on the semiconductor cooler 801, wherein the semiconductor cooler 801 is disposed on a bottom plate 6015 for controlling the temperature inside the housing 600, and both the silicon optical chip 802 and the SOA chip 805 are disposed on the surface of the semiconductor cooler 801 and in direct contact with each other, so as to ensure better heat dissipation of the silicon optical chip 802 and the SOA chip 805.

The silicon optical chip 802 is arranged in the light emitting direction of the SOA chip 805, the SOA chip 805 and the silicon optical chip 802 form a resonant cavity, light with various wavelengths emitted by the SOA chip 805 enters the silicon optical chip 802, the light is reflected in the silicon optical chip 802, part of the light returns to the SOA chip 805 again for resonance amplification, the operation is repeated until the intensity of the light meets the standard requirement, the amplified light is subjected to wavelength selection and modulation in the silicon optical chip 802 to obtain signal light, and the signal light is emitted by the silicon optical chip 802 and then coupled to the optical fiber adapter 700 through a lens, so that the emission of the signal light is realized.

An SOA lens 806 is further disposed between the SOA chip 805 and the silicon optical chip 802, and the SOA lens 806 is a converging lens and is used for converging light emitted by the SOA chip 805 to the silicon optical chip 802 to improve the optical path coupling efficiency.

A heat sink 804 is further arranged between the SOA chip 805 and the semiconductor refrigerator 801, the heat sink 804 is pasted on the upper surface of the semiconductor refrigerator 801, the SOA chip 805 is pasted on the upper surface of the heat sink 804, and therefore heat generated by the SOA chip 805 is conducted to the semiconductor refrigerator 801 through the heat sink 804, and heat dissipation efficiency of the SOA chip 805 can be improved.

The light emitted from the SOA chip 805 is amplified in a resonant cavity formed between the SOA chip 805 and the silicon optical chip 802, the amplified light is subjected to wavelength selection, signal modulation and the like in the silicon optical chip 802, the silicon optical chip 802 can be subjected to wavelength selection through temperature control, and thus the temperature of the silicon optical chip 802 can be controlled through the semiconductor refrigerator 801, so that the function of wavelength selection is achieved. A thermistor may also be disposed on the heat sink 804, which together with the semiconductor cooler 801 may control the temperature within the housing 600, better controlling the temperature of the silicon photonics chip 802, and thus improving wavelength selectivity.

Fig. 10 is a schematic structural diagram of a silicon optical chip 802 in an optical module according to an embodiment of the present application, and fig. 11 is a schematic structural diagram of another angle of the silicon optical chip 802 in the optical module according to the embodiment of the present application. As shown in fig. 10 and 11, the silicon optical chip 802 includes an input optical port 8021 and an output optical port 8022, the input optical port 8021 is disposed in the light exit direction of the SOA chip 805, so that light emitted from the SOA chip 805 is converged into the input optical port 8021 of the silicon optical chip 802 through the SOA lens 806, which facilitates light amplification in a resonant cavity formed by the silicon optical chip 802 and the SOA chip 805.

In order to avoid crosstalk and return loss, the input port 8021 of the silicon optical chip 802 and the end surface of the silicon optical chip 802 are arranged at a certain angle, that is, the input port 8021 and the horizontal plane are arranged at a certain angle, so the exit end surface of the SOA chip 805 and the horizontal plane are also arranged at a certain angle, and similarly, the converging light path of the SOA lens 806 is also arranged at a certain angle with the horizontal plane. By the arrangement, the light emitted by the SOA chip 805 can be prevented from being reflected at the end face of the input port 8021 and returning to the SOA chip 805, and the light emitted by the SOA chip 805 can be prevented from being reflected at the end face of the input port 8021 and the reflected light enters the silicon optical chip 802 to influence the signal modulation of the light in the silicon optical chip 802.

In the embodiment of the present application, an angle between the exit end surface of the SOA chip 805 and the horizontal plane, an angle between the input port 8021 of the silicon optical chip 802 and the horizontal plane, and an angle between the converged light path of the SOA lens 806 and the horizontal plane are all 19.5 °, so that the maximum light path coupling efficiency can be ensured.

The output light port 8022 of the silicon optical chip 802 is configured to output the modulated signal light with the corresponding wavelength, and the signal light is converged and coupled into the optical fiber adapter 700, so that the output light port 8022 of the silicon optical chip 802 is located in the light incidence direction of the optical fiber adapter 700. In order to couple the signal light output by the output light port 8022 to the optical fiber adapter 700, a collimating lens 807 and a converging lens 809 are sequentially arranged between the output light port 8022 and the optical fiber adapter 700, the collimating lens 807 and the converging lens 809 are both adhered to the upper surface of the semiconductor refrigerator 801, and the output light port 8022, the collimating lens 807, the converging lens 809 and the optical fiber adapter 700 are located on the same light path. After the signal light output by the output light port 8022 enters the collimating lens 807, the collimating lens 807 converts the signal light into a collimated light beam, the collimated light beam enters the converging lens 809, the converging lens 809 converts the collimated light beam into a converging light beam, and the converging light beam is coupled to the optical fiber adapter 700.

The converged light beam is coupled into the optical fiber adapter 700, and is easily reflected on the end surface of the optical fiber ferrule of the optical fiber adapter 700, and the reflected light beam is easily emitted into the output light port 8022 of the silicon optical chip 802 through the converging lens 809 and the collimating lens 807, so as to affect the signal modulation of the silicon optical chip 802. Thus, an isolator 808 can be arranged between the collimating lens 807 and the converging lens 809, after the signal light is output by the output light port 8022 of the silicon optical chip 802 and enters the collimating lens 807, the collimating lens 807 converts the signal light into a collimated light beam, the collimated light beam enters the converging lens 809 after passing through the isolator 808, the converging lens 809 converts the collimated light beam into a converging light beam, and the converging light beam is coupled to the optical fiber adapter 700; the light beam reflected by the converged light beam on the end surface of the optical fiber ferrule of the optical fiber adapter 700 penetrates through the converging lens 809 and then enters the isolator 808, and the isolator 808 filters the reflected light beam, so that the reflected light beam cannot enter the silicon optical chip 802, and the return loss of light is avoided.

In this embodiment, the switching ceramic 803 and the silicon optical chip 802 may be arranged in parallel on the upper surface of the semiconductor refrigerator 801, the silicon optical chip 802 is directly connected to the flexible board 500 through a gold wire bonding wire, the semiconductor refrigerator 801 is disposed on the bottom plate of the housing 600, the housing 600 is connected to the flexible board 500, the SOA chip 805, the thermistor and other devices are respectively connected to the switching ceramic 803 through gold wire bonding wires, and the switching ceramic 803 is connected to the flexible board 500 through a gold wire bonding wire. Thus, signals transmitted from the circuit board 300 to the flexible board 500 are transmitted to the semiconductor cooler 801 through the housing 600, and signals are transmitted to the silicon optical chip 802 and the switching ceramic 803 through gold wire bonding wires, the switching ceramic 803 transmits signals to devices such as the SOA chip 805 and the thermistor through gold wire bonding wires, and the SOA chip 805 emits light with various wavelengths under the action of the signals; the semiconductor cooler 801 adjusts the temperature in the housing 600 under the signal action, so that the silicon optical chip 802 performs wavelength selection under temperature control; the silicon optical chip 802 modulates the light with the selected wavelength under the action of the signal to obtain signal light with a corresponding wavelength, and the signal light is coupled into the optical fiber adapter 700.

A glass light window may be further disposed between the converging lens 809 and the fourth side plate 6014 of the main housing 601, the glass light window may be adhered to an inner side surface of the fourth side plate 6014, and a central axis of the glass light window coincides with a central axis of the through hole on the fourth side plate 6014, so as to ensure transmission of the converging light beam from the inside to the outside of the housing 600.

Fig. 12 is a partial top view of the tunable optical transceiver module 400 in the optical module according to the embodiment of the present disclosure, and fig. 13 is a schematic optical path diagram of the optical transceiver device 800 in the optical module according to the embodiment of the present disclosure. As shown in fig. 12 and 13, the tunable optical transmission assembly 400 encapsulates the silicon optical chip 802 of the multi-wavelength tunable device and the SOA chip 805 together in the housing 600, and includes two paths of transmission end optical paths, one path of optical path is that light emitted by the SOA chip 805 is converged to the input port 8021 of the silicon optical chip 802 through the SOA lens 806, and the light is resonance-amplified through the resonant cavity formed by the silicon optical chip 802 and the SOA chip 802; the other path of light is that the light after resonance amplification is subjected to wavelength selection in the silicon optical chip 802, the light after wavelength selection is subjected to signal modulation in the silicon optical chip 802, the modulated signal light is emitted from an output light port 8022 of the silicon optical chip 802 after phase interference, the emitted signal light is converted into a collimated light beam through a collimating lens 807, the collimated light beam penetrates into a converging lens 809 through an isolator 808, the signal light is coupled to the optical fiber adapter 700 through the converging lens 809 and is transmitted to an external optical fiber through the optical fiber adapter 700, and light emission is realized.

The tunable optical transmission assembly 400 provided by the embodiment of the present application includes the following specific steps: first, the SOA chip 805 is soldered to the heat sink 804; then the thermal resistor is pasted at the position corresponding to the heat sink 804 by adopting silver colloid; then, the semiconductor cooler 801 is adhered to the bottom plate 6015 of the shell 600 by silver glue for curing; then, the silicon optical chip 802, the heat sink 804 and the switching ceramic 803 are bonded at corresponding positions of the semiconductor refrigerator 801 by silver adhesive; then, the silicon optical chip 802 and the flexible board 500, the SOA chip 805 and the switching ceramic 803, the thermistor and the switching ceramic 803 and the flexible board 500 are connected through a gold wire bonding wire, so that electrical connection is realized; then pasting the SOA lens 806 on the corresponding position of the semiconductor refrigerator 801 according to the light emergent direction of the SOA chip 805; then, the collimating lens 807 is aligned according to the light emitting direction of the silicon optical chip 802 for coupling, the light spot is inspected by a beam scanner, and then the collimating lens 807 is adhered on the semiconductor cooler 801 according to the inspection condition; then the chip mounter passively mounts the isolator 808 and the converging lens 809, and the isolator 808 and the converging lens 809 are pasted on the semiconductor refrigerator 801; then the cover plate 602 is adhered to the upper end face of the main shell 601 for sealing; and finally, coupling the optical fiber adapter 700 to the maximum optical power, and fixing the optical fiber adapter 700 to the shell 600 by using a laser welding machine.

Because the silicon optical chip has the advantages of low optical loss, high integration density and compatibility with CMOS, the silicon optical chip has huge application potential in the aspect of developing low-cost and high-speed photoelectric devices, and the silicon optical chip is packaged into a 25G wireless adjustable wavelength optical device, so that the application development of a silicon optical technology in an optical module is promoted. According to the method, the silicon optical chip and the SOA chip are packaged together, and the wavelength can be tuned based on the silicon optical chip and the SOA chip, so that the optical module has a multi-wavelength tunable function, has good advantages in the aspects of low cost, wide tuning range, low power consumption and the like, and is an optimal solution for solving 25G colorless optical modules.

It should be noted that, in the present specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims

1. A light module, comprising:

a circuit board;

wherein the tunable optical transmission component comprises:

2. The optical module of claim 1, wherein the tunable optical transmit assembly further comprises an interposer that is inserted into the housing through the jack;

the adapter plate is connected with the flexible plate and used for supporting the flexible plate.

3. The optical module according to claim 2, wherein the housing comprises a main housing and a cover plate covering the main housing, and the main housing and the cover plate form a housing with an internal cavity;

the insertion hole is arranged on the side face of the main shell.

4. The optical module according to claim 3, wherein the main housing comprises a bottom plate, a first side plate, a second side plate, a third side plate and a fourth side plate, and the first side plate, the second side plate, the third side plate and the fourth side plate are respectively connected with the side edges of the bottom plate to form a cavity housing with an open upper end;

the jacks comprise a first jack and a second jack, the first jack is arranged on the second side plate, the second jack is arranged on the third side plate, and the first jack is communicated with the second jack.

5. The optical module of claim 4, wherein an end surface of the interposer inserted into the housing abuts against an inner sidewall of the second receptacle;

the adapter plate inserts the one end of casing is equipped with the breach, the first side of breach with the inward flange looks parallel and level of first jack, the second side of breach with the inward flange looks parallel and level of second jack.

6. The optical module according to claim 1, wherein the silicon optical chip comprises an input optical port and an output optical port, the input optical port is disposed in a light exiting direction of the SOA chip, and the output optical port and the input optical port have a predetermined angle.

7. The optical module of claim 6, wherein the input optical port of the silicon optical chip is disposed at an angle to an end surface of the silicon optical chip.

8. The optical module of claim 5, wherein the tunable optical transmission assembly further comprises a semiconductor cooler disposed within the housing, and wherein the SOA chip, the silicon optical chip, and the transition ceramic are disposed on the semiconductor cooler.

9. The optical module of claim 8, wherein the first side surface and the second side surface of the notch respectively abut against two adjacent side surfaces of the semiconductor cooler.