CN114488439A

CN114488439A - Optical module

Info

Publication number: CN114488439A
Application number: CN202210217109.5A
Authority: CN
Inventors: 张加傲; 王欣南; 于琳; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-03-07
Filing date: 2022-03-07
Publication date: 2022-05-13
Anticipated expiration: 2042-03-07
Also published as: CN114488439B

Abstract

The application provides an optical module, includes: a circuit board and a first optical transceiver component; the first optical transceiver component includes: a first base disposed on the circuit board; the first silicon optical chip is arranged on the first base and used for receiving light which does not carry signals so as to generate optical signals through modulation and receiving the optical signals from the outside; the first light source is arranged on the first base and used for providing light which does not carry signals for the first silicon optical chip; the first secondary circuit board is arranged on the circuit board and is electrically connected with the circuit board through a solder ball, a first notch is arranged at the end part of the first secondary circuit board, the first notch surrounds the side edge of the first silicon optical chip in a semi-surrounding mode, a bonding pad is arranged on the top surface of the edge of the first notch, and the bonding pad is connected with the first silicon optical chip in a routing mode; and the first digital signal processing chip is arranged on the first secondary circuit board and is electrically connected with the first secondary circuit board through a solder ball. The optical module provided by the embodiment of the application solves the problem of crosstalk when the integration level of the optical module is high and the wiring on the circuit board is more.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

At present, with the continuous improvement of the requirement of the transmission rate of the optical module, the integration level of the optical module is higher and higher; when the integration level of the optical module is higher and higher, the power density of the optical module is also increased, and the number of photoelectric devices, wiring lines and the like arranged on a circuit board in the optical module is increased. When the number of photoelectric devices, wires and the like arranged on the circuit board is increased continuously, the wires on the circuit board are crowded, the problems that signal crosstalk between the wires is increased and the like easily occur, and further the performance of the optical module is degraded.

Disclosure of Invention

The embodiment of the application provides an optical module, which aims to solve the problem that when the integration level of the optical module is higher, more photoelectric devices and wiring lines are arranged on a circuit board of the optical module, and the transmission rate of the optical module is influenced. .

The application provides an optical module, includes:

a circuit board;

the first optical transceiving component is electrically connected with the circuit board and used for generating optical signals and receiving the optical signals from the outside;

wherein the first optical transceiver component comprises:

a first base disposed on the circuit board;

the first silicon optical chip is arranged on the first base and used for receiving light which does not carry signals so as to generate optical signals through modulation and receiving the optical signals from the outside;

the first light source is arranged on the first base and used for providing light which does not carry signals for the first silicon optical chip;

the first secondary circuit board is arranged on the circuit board and is electrically connected with the circuit board through a solder ball, a first notch is arranged at the end part of the first secondary circuit board, the first notch surrounds the side edge of the first silicon optical chip in a semi-surrounding mode, a bonding pad is arranged on the top surface of the edge of the first notch, and the bonding pad is connected with the first silicon optical chip in a routing mode;

and the first digital signal processing chip is arranged on the first secondary circuit board and is electrically connected with the first secondary circuit board through a solder ball.

The optical module comprises a circuit board and a first optical transceiving component, wherein the first optical transceiving component is electrically connected with the circuit board; the first optical transceiver component comprises a first base, a first silicon optical chip, a first light source, a first secondary circuit board and a first digital signal processing chip, the first silicon optical chip, the first light source, the first secondary circuit board and the first digital signal processing chip are arranged on the first base, the first light source provides light which does not carry signals for the first silicon optical chip, and the first digital signal processing chip is electrically connected with the first silicon optical chip through circuit wiring on the first secondary circuit board so as to realize signal transmission between the digital signal processing chip and the silicon optical chip and further realize that the first optical transceiver component generates optical signals and receives the optical signals from the outside of the optical module. In the optical module that this application provided, including the first light transceiver module of first base, first silicon optical chip, first light source, first time circuit board and first digital signal processing chip, can be convenient for realize the relatively independent assembly of light transceiver module, make the production of optical module have manufacturability, stronger repairability more to improve optical module product yield and reliability, further make local detail handle more meticulously, the performance is more superior.

In the optical module provided by the application, the first secondary circuit board is arranged in the first optical transceiver component, the transmission of the high-frequency signal between the first digital signal processing chip and the first silicon optical chip is realized through the first secondary circuit board, and a transmission path is provided for the transmission of the high-frequency signal between the first digital signal processing chip and the first silicon optical chip. Meanwhile, in the optical module provided by the application, the first-time circuit board and the circuit board are combined for use, the utilization rate of the internal space of the optical module is fully expanded, a sufficient space is provided for wiring of the internal circuit of the optical module, the optical performance, the high-frequency performance, the thermal performance and the like of the optical module are more coordinated, and the optical module is convenient to develop towards a higher speed direction.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module provided in accordance with some embodiments;

FIG. 4 is an exploded view of a light module provided in accordance with some embodiments;

fig. 5 is a first schematic diagram illustrating an internal structure of an optical module according to some embodiments;

fig. 6 is a first schematic diagram illustrating an internal structure of another optical module according to some embodiments;

FIG. 7 is an exploded schematic view of an interior of a light module according to some embodiments;

fig. 8 is a second schematic diagram illustrating an internal structure of an optical module according to some embodiments;

FIG. 9 is a partially exploded, partial schematic view of an optical module provided in accordance with some embodiments;

fig. 10 is an exploded schematic view of the interior of another light module provided in accordance with some embodiments;

fig. 11 is a second schematic internal structural diagram of another optical module according to some embodiments;

fig. 12 is a front view of a first optical transceiver component provided in accordance with some embodiments;

fig. 13 is a first perspective view of a first optical transceiver component according to some embodiments;

fig. 14 is an exploded view of a first optical transceiver component according to some embodiments;

fig. 15 is a second perspective view of a first optical transceiver component according to some embodiments;

FIG. 16 is a schematic diagram of a basic structure of a base provided in accordance with some embodiments;

FIG. 17 is an exploded view of a submount and light source, silicon chiplet, etc. according to some embodiments;

FIG. 18 is a diagram illustrating a base use state provided in accordance with some embodiments;

fig. 19 is a first exploded view of a first optical transceiver component according to some embodiments;

fig. 20 is a second exploded view of a partial structure of a first optical transceiver module according to some embodiments;

FIG. 21 is a schematic view of a protective shield according to some embodiments;

FIG. 22 is a first schematic diagram illustrating a structure of a secondary circuit board according to some embodiments;

FIG. 23 illustrates a second example of a structure of a secondary circuit board according to some embodiments;

FIG. 24 is a schematic top view of a secondary circuit board according to some embodiments;

FIG. 25 is a schematic diagram illustrating a third layer structure of a daughter circuit board according to an embodiment of the present disclosure;

FIG. 26 is a schematic diagram illustrating a sixth layer of a daughter circuit board according to an embodiment of the present disclosure;

FIG. 27 is a schematic diagram illustrating a second layer structure of a daughter circuit board according to an embodiment of the present application;

fig. 28 is a schematic structural diagram of a seventh layer of a sub-circuit board according to an embodiment of the present application.

Detailed Description

The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C", both including the following combination of A, B and C: a alone, B alone, C alone, a combination of a and B, a combination of a and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

The use of "adapted to" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

As used herein, "about," "approximately" or "approximately" includes the stated value as well as average values within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measuring the particular quantity (i.e., the limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, ultra-long-distance transmission can be theoretically achieved. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a structural diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical module 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. Further, an optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, and a circuit board 300 disposed in the housing.

The shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two

openings

204 and 205; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates located at two sides of the bottom plate and disposed perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end (right end in fig. 3) of the optical module 200, and the opening 205 is also located at an end (left end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. Wherein, the opening 204 is an electrical port, and the gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to receive the external optical fiber 101 so that the optical fiber 101 is connected to an optical transceiver module inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined to facilitate the installation of devices such as the circuit board 300 and the optical transceiver module into the shell, and the upper shell 201 and the lower shell 202 can form encapsulation protection for the devices. In addition, when the devices such as the circuit board 300 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component 203 located on an outer wall of a housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and an upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking members 203 are located on the outer walls of the two lower side plates of the lower housing 202, and include snap-fit members that mate with a cage of an upper computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with it, and the connection relationship between the engaging member and the upper computer is changed to release the engagement relationship between the optical module 200 and the upper computer, so that the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. The electronic components may include, for example, capacitors, resistors, transistors, Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip may include, for example, a Micro Controller Unit (MCU), a Transimpedance Amplifier (TIA), a Clock and Data Recovery (CDR), a power management chip, and a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The gold fingers may be disposed on only one side surface (e.g., the upper surface shown in fig. 4) of the circuit board 300, or may be disposed on both upper and lower surfaces of the circuit board 300, so as to adapt to the situation with a large demand for the number of pins. The golden finger is configured to establish an electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are commonly used in conjunction with rigid circuit boards to supplement the rigid circuit boards.

In the embodiment of the present application, the optical module 200 further includes an optical fiber connector 400, the optical fiber connector 400 is disposed at the optical port 205, the optical fiber connector 400 is used for implementing optical connection between an external optical fiber and the optical port, further, an optical signal generated by the optical transceiver module is transmitted to the external optical fiber through the optical fiber connector 400, and an optical signal output by the external optical fiber is transmitted to the optical transceiver module through the optical fiber connector 400.

In the embodiment of the present application, an optical transceiver module is further disposed on the circuit board 300, and the optical transceiver module is electrically connected to the circuit board 300 and is configured to generate an optical signal and receive an optical signal output by an external optical fiber. In the embodiment of the present application, the optical transceiver module is connected to the optical fiber connector 400 through the optical fiber ribbon, the optical signal generated by the optical transceiver module is transmitted to the optical fiber connector 400 through the optical fiber ribbon, and the optical signal output by the external optical fiber is transmitted to the optical fiber ribbon through the optical fiber connector 400 and then transmitted to the optical transceiver module through the optical fiber ribbon. In some embodiments of the present invention, one optical transceiver module or two optical transceiver modules are disposed on the circuit board 300, but the embodiments of the present invention are not limited to one or two optical receiver modules, and more than two optical receiver modules may be disposed under the condition that the space allows. Illustratively, the circuit board 300 further has a first optical transceiver module disposed thereon, or the circuit board 300 has a first optical transceiver module and a second optical transceiver module disposed thereon.

Fig. 5 is a schematic diagram illustrating an internal structure of an optical module according to some embodiments, and fig. 5 shows an assembly relationship between an optical transceiver module and a circuit board 300 according to an embodiment of the present application. As shown in fig. 5, the optical module provided in the embodiment of the present application includes a first optical transceiver module 500, and the first optical transceiver module 500 is disposed on the circuit board 300. For example, the first optical transceiver module 500 is disposed in the middle of the circuit board 300, but the position of the first optical transceiver module 500 in the embodiment of the present application is not limited thereto and may be adjusted as needed.

As shown in fig. 5, some embodiments of the present application provide a first optical transceiver component 500 including a first base 510, a first light source 520, a first silicon microchip 530, and a first secondary circuit board 540; the first base 510 is disposed on the circuit board 300, and the top of the first base 510 is used for carrying the first light source 520 and the first silicon microchip 530; the first light source 520 is arranged on one side of the first silicon microchip 530, a first notch is arranged at the end part of the first secondary circuit board 540, and the first secondary circuit board 540 is arranged on the other side of the first silicon microchip 530 in a matching way through the first notch; the first sub circuit board 540 is located above the circuit board 300, the bottom of the first sub circuit board 540 is attached to the circuit board 300, the top is used for bearing devices such as the first digital signal processing chip 550 and the like, and the wire bonding is used for connecting the first silicon optical chip 530 and the like, so that the first digital signal processing chip 550 is only used for driving and connecting the first silicon optical chip 530, but the driving of the first silicon optical chip 530 in the application is not limited to the first digital signal processing chip 550. Illustratively, the first secondary circuit board 540 is parallel to the circuit board 300. In some embodiments of the present application, the first light source 520 is disposed on a side of the first silicon photo chip 530 away from the gold finger on the circuit board 300, i.e., a side of the first silicon photo chip 530 close to the light port. In some embodiments of the present application, the first base 510, the first light source 520, and the first silicon photonic chip 530, etc. may be referred to as a first silicon photonic component for generating optical signals and directly receiving optical signals from the outside.

The first light source 520 is used for generating light carrying no signal and transmitting the light carrying no signal to the first silicon optical chip 530, the first silicon optical chip 530 receives the light carrying no signal and modulates the light carrying no signal to output light carrying a signal, and the light carrying the signal is transmitted to the optical fiber connector 400 through the optical fiber ribbon; the optical signal transmitted by the external optical fiber is transmitted to the optical fiber ribbon inside the optical module through the optical fiber connector 400, and transmitted to the first silicon optical chip 530 through the optical fiber ribbon, and the first silicon optical chip 530 receives the optical signal and converts the optical signal into an electrical signal. In some embodiments of the present application, in order to facilitate coupling of an optical signal generated by the first silicon optical fiber chip 530 to an optical fiber ribbon and coupling of an externally input optical signal transmitted in the optical fiber ribbon to the first silicon optical chip 530, the optical fiber ribbon inside the optical module includes a transmitting optical fiber ribbon and a receiving optical fiber ribbon, an optical fiber outlet of the first silicon optical chip 530 is provided with an optical fiber connector, an optical fiber inlet of the first silicon optical chip 530 is provided with an optical fiber connector, one end of the transmitting optical fiber ribbon is connected to the optical fiber connector 400, and the other end of the transmitting optical fiber ribbon is connected to the optical fiber connector, and one end of the receiving optical fiber ribbon is connected to the optical fiber connector 400, and the other end of the receiving optical fiber ribbon is connected to the optical fiber connector.

In some embodiments of the present application, the first base 510 serves as a heat sink for the first light source 520 and the first silicon photo chip 530. Illustratively, the first base 510 is made of a copper block, which has good thermal conductivity and can perform good heat dissipation for the first light source 520 and the first silicon optical chip 530.

In the embodiment of the present application, the first sub circuit board 540 is disposed in the first optical transceiver module 500, so as to ensure the arrangement space and routing requirement of the devices such as the first digital signal processing chip 550. For example, the first digital signal processing chip 550 is disposed on the first sub circuit board 540, and most of the traces associated with the first digital signal processing chip 550 are disposed in the first sub circuit board 540; on one hand, the first circuit board 540 is used for realizing the signal transmission between the first digital signal processing chip 550 and the first silicon optical chip 530, so that the density of high-speed signal lines for signal transmission between the first digital signal processing chip 550 and the first silicon optical chip 530 can be reduced, and the mutual crosstalk can be reduced; on the other hand, the power lines associated with the first dsp chip 550 are disposed inside the first pcb 540, which can effectively prevent ESD and power rail collapse and reduce ground bounce.

In the optical module with the structure shown in fig. 5, the first circuit board 540 is used in combination with the circuit board 300, so that the utilization rate of the internal space of the optical module can be fully expanded, a sufficient space is provided for routing of the internal circuit of the optical module, the optical performance, the high-frequency performance, the thermal performance and the like of the optical module are more coordinated, and the optical module is developed towards a higher speed direction.

In some embodiments of the present application, BGA (Ball Grid Array Package) solder balls are disposed on the back surface (the surface facing the first sub-board 540) of the first digital signal processing chip 550, and are electrically connected to corresponding pads on the first sub-board 540 through the BGA solder balls.

Fig. 6 is a schematic diagram of an internal structure of another optical module according to some embodiments, and fig. 6 shows an assembly relationship between another optical transceiver module provided in this embodiment and a circuit board 300. As shown in fig. 6, in an optical module provided in some embodiments of the present application, the optical module includes a first optical transceiver module 500 and a second optical transceiver module 600, and the first optical transceiver module 500 and the second optical transceiver module 600 are disposed on a circuit board 300. As shown in fig. 6, the second optical transceiver module 600 is disposed on the left side of the first optical transceiver module 500, but the embodiment of the present invention is not limited thereto, and the second optical transceiver module 600 may be disposed on the right side of the first optical transceiver module 500.

As shown in fig. 6, some embodiments of the present application provide a second optical transceiver component 600 including a second base 610, a second light source 620, a second silicon optical chip 630 and a second secondary circuit board 640; the second base 610 is arranged on the circuit board 300, and the top of the second base 610 is used for bearing the second light source 620 and the second silicon optical chip 630; the second light source 620 is disposed on one side of the second silicon microchip 630, a second notch is disposed at an end of the second secondary circuit board 640, and the second secondary circuit board 640 is disposed on the other side of the second silicon microchip 630 through the second notch in a matching manner; the second sub circuit board 640 is disposed above the circuit board 300, and the bottom of the second sub circuit board 640 is attached to the circuit board 300, and the top of the second sub circuit board 640 is used for carrying devices such as the second digital signal processing chip 650 and the like, and wire bonding the second silicon optical chip 630 and the like, so that the second digital signal processing chip 650 is only used for driving and connecting the second silicon optical chip 630. Illustratively, the second secondary circuit board 640 is parallel to the circuit board 300; the second sub circuit board 640 is located on the same side of the circuit board 300 as the first sub circuit board 540. In some embodiments of the present application, the second base 610, the second light source 620, the second silicon photonic chip 630, and the like may be referred to as a second silicon photonic component for generating optical signals and directly receiving optical signals from the outside.

The second light source 620 is used for generating light carrying no signal and transmitting the light carrying no signal to the second silicon optical chip 630, the second silicon optical chip 630 receives the light carrying no signal and modulates the light carrying no signal to output light carrying a signal, and the light carrying the signal is transmitted to the optical fiber connector 400 through the optical fiber ribbon; the optical signal transmitted by the external optical fiber is transmitted to the optical fiber ribbon inside the optical module through the optical fiber connector 400, and transmitted to the second silicon optical chip 630 through the optical fiber ribbon, and the second silicon optical chip 630 receives the optical signal and converts the optical signal into an electrical signal. In some embodiments of the present application, in order to facilitate coupling of an optical signal generated by the second silicon optical chip 630 to an optical fiber ribbon and coupling of an externally input optical signal transmitted in the optical fiber ribbon to the second silicon optical chip 630, the optical fiber ribbon inside the optical module includes a transmitting optical fiber ribbon and a receiving optical fiber ribbon, an optical fiber outlet of the second silicon optical chip 630 is provided with an optical fiber connector, an optical fiber inlet of the second silicon optical chip 630 is provided with an optical fiber connector, one end of the transmitting optical fiber ribbon is connected to the optical fiber connector 400, and the other end of the transmitting optical fiber ribbon is connected to the optical fiber connector, and one end of the receiving optical fiber ribbon is connected to the optical fiber connector 400, and the other end of the receiving optical fiber ribbon is connected to the optical fiber connector.

In this embodiment, the second secondary circuit board 640 is disposed in the second optical transceiver module 600, which is convenient for ensuring the arrangement space and routing requirements of the second digital signal processing chip 650 and other devices. For example, the second digital signal processing chip 650 is disposed on the second sub circuit board 640, and most of the related traces of the second digital signal processing chip 650 are disposed in the second sub circuit board 640; on one hand, the second circuit board 640 is used for realizing signal transmission between the second digital signal processing chip 650 and the second silicon optical chip 630, so that the density of high-speed signal lines for signal transmission between the second digital signal processing chip 650 and the second silicon optical chip 630 can be reduced, and mutual crosstalk can be reduced; on the other hand, the power line associated with the second dsp chip 650 is disposed inside the second pcb 640, which can effectively prevent ESD and power rail collapse and reduce ground bounce.

Compared with the optical module internal structure shown in fig. 5, the optical module internal structure shown in the structure shown in fig. 6 has the advantages that the second optical transceiver module 600 and the first optical transceiver module 500 are both provided with independent secondary circuit boards, so that the utilization rate of the optical module internal space can be further expanded; the optical module is more convenient to share the internal devices and wiring, the phenomenon that wiring congestion of high frequency and the like caused by the fact that all electric chips, optical assemblies, heat dissipation structures and the like must be borne by the limited PCB area is avoided, and further the optical performance, the high frequency performance, the thermal performance and the like of the optical module are more coordinated. In this embodiment, the secondary circuit boards corresponding to the second optical transceiver module 600 and the first optical transceiver module 500 are correspondingly provided with corresponding digital signal processing chips, so that the digital signal processing chips are dedicated to the corresponding optical transceiver modules, thereby facilitating the development of the optical module in the direction of higher speed. Meanwhile, the second optical transceiver module 600 and the first optical transceiver module 500 are respectively provided with an independent secondary circuit board, and the independent secondary circuit board is provided with a corresponding digital signal processing chip, so that the optical module can be produced more manufacturably and more repairability, the product yield and reliability of the optical module can be improved, the local detail processing is more precise, and the performance is more excellent.

Fig. 7 is an exploded view of the interior of an optical module according to some embodiments. As shown in fig. 7, in order to facilitate the assembly of the first optical transceiver module 500 on the circuit board 300, a first sinking groove 310 is provided on the circuit board 300, and the first sinking groove 310 is used for supporting and providing a first base 510; the first sinking groove 310 can facilitate adjusting the relative height between the plane of the pins on the first silicon optical chip 530 and the top surface of the first sub-circuit board 540, and can also facilitate mounting and positioning of the first optical transceiver module 500.

Fig. 8 is a schematic diagram of an internal structure of an optical module according to some embodiments. Further, as shown in fig. 7 and 8, a first through hole 320 is disposed on the first sinking groove 310, and the first through hole 320 penetrates through the bottom surface of the first sinking groove 310 and the bottom surface of the circuit board 300. The first through hole 320 is used to facilitate the contact between the heat dissipation boss on the housing and the first optical transceiver module 500, so as to dissipate heat of the first optical transceiver module 500. In the embodiment of the present application, the first optical transceiver module 500 is assembled by combining the first sinking groove 310 and the first through hole 320, so that on the basis of ensuring that the first optical transceiver module 500 is fixedly assembled on the circuit board, it is further convenient for the back surface of the circuit board 300 to have more sufficient space for arranging devices and routing.

Fig. 9 is a partially exploded, partial schematic view of an interior portion of an optical module provided in accordance with some embodiments. As shown in fig. 9, solder balls are disposed on the back surface of the first sub circuit board 540, corresponding pads are disposed on the circuit board 300, and the solder balls of the first sub circuit board 540 are attached to the corresponding pads on the circuit board 300 by solder so as to attach the first sub circuit board 540 to the circuit board 300 and realize the electrical connection between the first sub circuit board 540 and the circuit board 300. Illustratively, the back surface (the surface facing the circuit board 300) of the first sub-circuit board 540 is provided with BGA solder balls, and the BGA solder balls are electrically connected with corresponding pads on the circuit board 300.

Fig. 10 is an exploded schematic view of the interior of another optical module provided in accordance with some embodiments. As shown in fig. 10, in order to facilitate the assembly of the second optical transceiver module 600 on the circuit board 300, a second sinking groove 330 is further disposed on the circuit board 300, and the second sinking groove 330 is used for supporting the mounting base 610; the second sinking groove 330 can conveniently adjust the relative height between the plane of the pins on the second silicon optical chip 630 and the top surface of the secondary circuit board 640, and on the other hand, can also perform the mounting and positioning of the second optical transceiver module 600. In some embodiments of the present invention, the second sinking groove 330 and the first sinking groove 310 are disposed on the circuit board 300 in the direction as shown in fig. 10.

Fig. 11 is a second schematic diagram of an internal structure of another optical module according to some embodiments. Further, as shown in fig. 10 and 11, a second through hole 340 is disposed on the second sinking groove 330, and the second through hole 340 penetrates through the bottom surface of the second sinking groove 330 and the bottom surface of the circuit board 300; the second through hole 340 is used to facilitate the contact between the heat dissipation boss on the housing and the second optical transceiver module 600, so as to dissipate heat of the second optical transceiver module 600.

Fig. 12 is a front view of a first optical transceiver component according to some embodiments, fig. 13 is a first perspective view of a first optical transceiver component according to some embodiments, fig. 14 is an exploded schematic view of a first optical transceiver component according to some embodiments, fig. 15 is a second perspective view of a first optical transceiver component according to some embodiments, and fig. 12-15 illustrate basic structures of a first optical transceiver component according to embodiments of the present disclosure.

In some embodiments of the present disclosure, the first light source 520, the optical outlet 570 and the optical inlet 580 are disposed on the same side of the first silicon optical chip 530, the optical outlet 570 is optically connected to the optical signal outlet of the first silicon optical chip 530, and the optical inlet 580 is optically connected to the optical signal inlet of the first silicon optical chip 530. As shown in fig. 12, the light inlet, the light signal inlet, and the light signal outlet of the first silicon optical chip 530 are located on the left side of the device, i.e. facing the light port of the optical module, and then the first light source 520, the light outlet connector 570, and the light inlet connector 580 are all disposed on the left side of the first silicon optical chip 530, such as to effectively reduce the bending and winding of the optical fiber ribbon connecting between the light outlet connector 570, the light inlet connector 580, and the optical fiber connector 400, so as to reduce the loss of optical signal transmission.

The end of the first sub circuit board 540 is provided with a first notch 541, the first notch 541 surrounds the side of the first silicon optical chip 530 in a semi-surrounding manner, for example, the first sub circuit board 540 surrounds the side of the first silicon optical chip 530 in a two-side manner through the first notch 541; the top surface of the edge of the first opening 541 is provided with a plurality of bonding pads, and the first circuit board 540 is connected with the first silicon optical chip 530 through the bonding pads in a routing way. The first gap 541 surrounds the side of the first silicon optical chip 530 in a semi-surrounding manner, so that the first gap 541 surrounds the side of the first silicon optical chip 530 in an open manner, which is convenient for reducing the size of the first test circuit board 540 to reduce the influence of the arrangement of the first test circuit board 540 on the wiring of the circuit board 300 and the arrangement of devices. Illustratively, 3 sidewalls of the first gap 541 surround the side of the first silicon microchip 530, and a plurality of pads corresponding to the pins of the first silicon microchip 530 are disposed on the top surface of the first sub-circuit board 540 connected to the 3 sidewalls of the first gap 541, and the pads are connected to the corresponding pins of the first silicon microchip 530 by wire bonding; the edge of the first gap 541 covers the edge of the first base 510. In some embodiments of the present application, the pins of the first silicon optical chip 530 are mainly concentrated on three side edges surrounded by the first notch 541, and pads are disposed on top surfaces of the three side edges of the first notch 541, so that the first silicon optical chip 530 is surrounded by the first notch 541, which facilitates wire bonding between the first silicon optical chip 530 and the first circuit board 540. As shown in fig. 12, the light outlet connector 570 is disposed on one side of the first light source 520, and the light inlet connector 580 is disposed on the other side of the first light source 520.

Furthermore, the plane of the pins of the first silicon optical chip 530 and the plane of the pads on the first circuit board 540 are located at or near the same height, so that the interconnection routing height and routing length of the pins of the first silicon optical chip 530 and the pads on the first circuit board 540 are reduced to the greatest extent, the high-frequency performance of high-speed signals is ensured, the bandwidth degradation and the rising edge slowing are relieved, and the port reflection at the interconnection position is improved.

In some embodiments of the present application, a first step 511 is disposed at the bottom of the first base 510, and the first step 511 is configured to be disposed in the first through hole 320; the step 511 provided at the bottom of the first susceptor 510 facilitates the positioning assembly of the first susceptor 510 on the first sinking groove 310. Further, the projection of first silicon microchip 530 on the bottom surface of first base 510 covers first step 511, that is, first step 511 is located on the back surface of first base 510 where first silicon microchip 530 is mounted, which facilitates heat dissipation of first silicon microchip 530 because first silicon microchip 530 is one of the main heat-generating devices in first optical transceiver module 500. For example, the lower housing 202 of the optical module is provided with a heat conducting pillar, which contacts the first step 511 and is used to shorten a heat dissipation path of the first silicon microchip 530, so that heat generated by the first silicon microchip 530 is conducted to the housing of the optical module and the outside of the optical module, thereby facilitating heat dissipation of the first silicon microchip 530.

In some embodiments of the present application, the side of the first silicon optical chip 530 not surrounded by the first gap 541 further includes a pin, and the pin of the side needs to be electrically connected to the circuit board 300, and if the pin of the side of the first silicon optical chip 530 is directly connected to the circuit board 300 by a wire bonding, the first base 510 needs to be crossed, which causes the wire bonding between the pin of the side and the circuit board to be relatively long. In order to facilitate the electrical connection between the side pin of the first silicon optical chip 530 and the circuit board 300 and to control the length of the wire bonding connection, the first optical transceiver module 500 further includes a first bridge 560; the first bridge 560 is laid with a circuit, and the first silicon photo chip 530 is electrically connected to the circuit board 300 through the first bridge 560. Illustratively, the first bridge 560 is disposed on the first base 510, one end of the first bridge 560 is wire bonded to the circuit board 300, and the other end of the first bridge 560 is wire bonded to the side pin of the first silicon microchip 530.

In some embodiments of the present application, the first bridge 560 is a substrate with a number of metal traces disposed on a top surface. Each metal wire correspondingly electrically connects the circuit board 300 and a corresponding pin of the first silicon optical chip 530; the substrate may be ceramic or copper, but is not limited thereto. For example, the first bridge 560 may form a metal trace shape for surface metallization of the ceramic substrate.

Fig. 16 is a schematic diagram of a basic structure of a base according to some embodiments. As shown in fig. 16, in some embodiments of the present application, to facilitate the arrangement and assembly of the first light source 520 and the first silicon photo chip 530, the first base 510 includes a base body 5110, a first mounting stage 512 and a second mounting stage 513 are disposed on top of the base body 5110, the first mounting stage 512 is used for carrying the first light source 520, and the second mounting stage 513 is used for carrying the first silicon photo chip 530. The positions of the first mounting stage 512 and the second mounting stage 513 are selected according to the assembly requirements of the first light source 520 and the first silicon microchip 530; at the same time, the relative height between the top surfaces of the first mounting stage 512 and the second mounting stage 513 is also selected based on the assembly requirements of the first light source 520 and the first silicon microchip 530. As in this embodiment of the present application, the first mounting table 512 and the second mounting table 513 are disposed on the top of the base body 5110 to implement division of local functions on the top of the first base 510, so as to implement adaptation of the assembly heights of the first light source 520, the first bridge 560, the light-emitting connector 570 and the light-entering connector 580, and then facilitate assembly positioning of the first light source 520 and the first silicon optical chip 530 based on the functional division of the area of the first base 510, thereby facilitating precise assembly of the first light source 520 and the first silicon optical chip 530. In one embodiment of the present application, the first light source 520 includes a plurality of devices, and in order to make the optical axes of the devices at the same height, a step face 5121 is disposed on the first mounting stage 512, and the relative height of the surfaces of the first mounting stage 512 is adjusted by the step face 5121. The step face 5121 may be a protrusion forming face or a recess forming face.

In some embodiments of the present application, the first step 511 is disposed opposite to the second mounting platform 513, that is, the first step 511 is disposed on the base body 5110 at the bottom facing away from the second mounting platform 513. Illustratively, the first step 511 is obliquely disposed at the bottom of the base body 5110, i.e., an included angle between a central axis of the first step 511 and an extended central axis of the first mounting stage 512 is a predetermined angle, such as 8 °. In some embodiments, the first through hole 320 is disposed on the circuit board 300 in an inclined manner, i.e., an included angle between a central axis of the first through hole 320 and a central axis of the circuit board 300 is a predetermined angle, such as 8 °.

Further, in some embodiments of the present application, a third installation table 514, a fourth installation table 515, and a fifth installation table 516 are further disposed on the top of the base body 5110, where the third installation table 514, the fourth installation table 515, and the fifth installation table 516 are located on the same side of the second installation table 513 as the first installation table 512, the third installation table 514 and the fourth installation table 515 are located on one side of the first installation table 512, the fourth installation table 515 is located between the third installation table 514 and the first installation table 512, and the fifth installation table 516 is located on the other side of the first installation table 512. The third mounting station 514 is configured to carry an optical splice 570, the fourth mounting station 515 is configured to carry a first bridge 560, and the fifth mounting station 516 is configured to carry an optical splice 580. The relative heights between the top surfaces of the third, fourth and fifth mounting

platforms

514, 515, 516 and the top surface of the second mounting platform 513 are selected according to the assembly requirements of the optical joint 570, the first bridge 560 and the optical joint 580.

Further, in some embodiments of the present disclosure, a first space 517 is disposed between the first mounting stage 512 and the fourth mounting stage 515, a second space 518 is disposed between the first mounting stage 512 and the fifth mounting stage 516, and a third space 519 is disposed between the third mounting stage 514 and the fourth mounting stage 515, and the first space 517, the second space 518, and the third space 519 are used in combination, so as to achieve thermal isolation among the first light source 520, the first base stage 560, the light-emitting joint 570, and the light-entering joint 580 on the first base stage 510, and effectively prevent heat generated on the first light source 520 and the first bridge 560 from affecting the light-emitting joint 570 and the light-entering joint 580, so that the light-coupling efficiency between the light-emitting joint 570, the light-entering joint 580, and the first silicon optical chip 530 is caused by deformation of the light-exiting joint 570 and the light-entering joint 580.

Fig. 17 is an exploded view of a base and light source, silicon optical chip, etc. according to some embodiments, and fig. 18 is a diagram illustrating a state of use of a base according to some embodiments. As shown in fig. 17 and 18, the first light source 520 is disposed on the first mounting stage 512, the first silicon photonic chip 530 is disposed on the second mounting stage 513, the optical joint 570 is disposed on the third mounting stage 514, the first bridge 560 is disposed on the fourth mounting stage 515, and the optical joint 580 is disposed on the fifth mounting stage 516. When the first light source 520, the first silicon optical chip 530, the first bridge 560, the light-emitting connector 570 and the light-entering connector 580 are assembled, the first light source 520, the first silicon optical chip 530, the first bridge 560, the light-exiting connector 570 and the light-entering connector 580 can be correspondingly assembled on a corresponding mounting table, so that the assembly accuracy of the first light source 520, the first silicon optical chip 530, the first bridge 560, the light-exiting connector 570, the light-entering connector 580 and the like on the mounting table can be ensured to a certain extent, and the assembly accuracy among the first light source 520, the first silicon optical chip 530, the first bridge 560, the light-exiting connector 570 and the light-entering connector 580 can be further ensured, and the assembly of the first light source 520, the first silicon optical chip 530, the first bridge 560, the light-exiting connector 570, the light-entering connector 580 and the like is further facilitated.

In some embodiments of the present application, to facilitate providing the first silicon chiplet 530 with light that does not carry signals via the first light source 520, the first light source 520 includes optics such as a lens in addition to a laser. Further, in order to realize the relative sealing of the first light source 520 and the protection of the laser, the first light source 520 further comprises a protective cover, and the protective cover covers the laser and is a relatively closed working environment of the laser.

Fig. 19 is a first exploded view of a partial structure of a first optical transceiver module according to some embodiments, and fig. 20 is a second exploded view of a partial structure of a first optical transceiver module according to some embodiments. As shown in fig. 19 and 20, the first light source 520 includes a laser 521, a collimating lens 522, and an isolator 523, and the laser 521, the collimating lens 522, and the isolator 523 are directly disposed on the first base 510. The laser 521 is directly arranged on the first base 510, so that heat generated by the laser 521 is directly transmitted to the first base 510 with high thermal conductivity, and heat dissipation of the laser 521 is facilitated; meanwhile, the collimating lens 522 and the isolator 523 are directly arranged on the first base 510, so that the collimating lens 522 and the isolator 523 are influenced by heat equally, and the coaxial stability of the optical axes of the collimating lens 522 and the isolator 523 is further ensured. In some embodiments, a laser 521, a collimating lens 522, and an isolator 523 are disposed on the first mounting stage 512. Illustratively, the straight lens 522 and the isolator 523 are arranged on the step surface 5121, and the optical axis heights of the collimating lens 522 and the isolator 523 are adjusted through the step surface 5121, so that the optical axes of the collimating lens 522 and the isolator 523 are at the same height as the light-emitting optical axis of the laser 521.

In some embodiments of the present application, the laser 521 is connected to the circuit board 300 by wire bonding, and is powered by the circuit board 300 to emit light. The light beam emitted by the laser 521 is converted into a collimated light beam by the collimating lens 522, the collimated light beam directly passes through the isolator 523, the collimated light beam passing through the isolator 523 is transmitted to the first silicon photonic chip 530, and the light beam is subjected to electro-optical modulation in the first silicon photonic chip 530.

In some embodiments, the laser 521, the collimating lens 522 and the isolator 523 are sequentially disposed on the first base 510 along the length direction of the first base 510, and the first silicon photonic chip 530 is disposed on the first base 510 in an inclined manner, even if the light-entering port axis of the first silicon photonic chip 530 forms a predetermined angle with the extending direction of the light-emitting axis of the first light source 520, so that when the light beam output by the first light source 520 is reflected at the light-entering port end face of the first silicon photonic chip 530, the reflected light beam does not return to the laser 521 along the original path, and when the reflected light beam is incident on the isolator 522, the reflected light beam is isolated by the isolator 522, thereby preventing the reflected light beam from affecting the light-emitting performance of the laser 521. Illustratively, the angle between the light inlet axis of the first silicon microchip 530 and the extending direction of the light emitting axis of the first light source 520 is 8 °, but is not limited to 8 °.

In this application embodiment, the light-emitting connector 570 and the light-in connector 580 are used for fixing the tip of optical fiber ribbon, and the fiber end face of optical fiber ribbon is used for coupling input or output optical signal, when adopting first silicon optical chip 530 slope to set up on first base 510, can replace the optical fiber ribbon that directly uses the optical fiber ribbon that has the slope terminal surface to have the parallel and level terminal surface, and then reducible processing procedure of processing optical fiber ribbon slope terminal surface, and then reduce the processing degree of difficulty of optical fiber ribbon.

In some embodiments of the present application, the extending direction of the second mounting stage 513 forms a preset angle with the extending direction of the first mounting stage 512, and then when the first light source 520 and the first silicon optical chip 530 are assembled, the first light source 520 is assembled based on the first mounting stage 512 in a positioning manner, and the first silicon optical chip 530 is installed based on the first mounting stage 512 in a positioning manner, so that a preset angle is formed between the axis of the light inlet of the first silicon optical chip 530 and the light outlet direction of the first light source 520, and the difficulty in optically coupling the first light source 520 to the first silicon optical chip 530 is reduced. Further, the extending directions of the third mounting stage 514 and the fifth mounting stage 516 and the second mounting stage 513 are also at a predetermined angle, so as to ensure that the

optical connectors

570 and 580 are at a predetermined angle with the corresponding optical ports of the first silicon optical chip 530.

In some embodiments of the present application, the base body 5110 includes a first portion 5111 and a second portion 5112, the first portion 5111 is connected to the second portion 5112, and an extending direction of the first portion 5111 forms an included angle of a preset angle with an extending direction of the second portion 5112; the first mount 512 is provided on the first portion 5111, and the second mount 513 is provided on the second portion 5112. Illustratively, when the first base 510 is assembled on the circuit board 300, the extending direction of the first portion 5111 is parallel to the length direction of the circuit board 300, and the extending direction of the second portion 5112 forms a predetermined angle with the length direction of the circuit board 300.

In some embodiments of the present invention, the first notch 541 is inclined by a predetermined angle along the length direction of the first sub circuit board 540, so as to facilitate the assembly of the first sub circuit board 540 with the first silicon optical chip 530, and facilitate the assembly of the first sub circuit board 540 on the circuit board 300. The inclination angle of the first gap 541 along the length direction of the first sub circuit board 540 can be selected according to the included angle between the axis of the light inlet of the first silicon optical chip 530 and the light outlet direction of the first light source 520. For example, when the included angle between the light inlet axis of the first silicon microchip 530 and the light outlet direction of the first light source 520 is 8 °, the first gap 541 is inclined by 8 ° along the length direction of the first sub-circuit board 540, and may be inclined by approximately 8 °.

In some embodiments, the first light source 520 further includes a protective cover 524, a bottom of the protective cover 524 is connected to the first base 510, and forms a receiving cavity with the first base 510 to receive the laser 521, the collimating lens 522 and the isolator 523.

Further, in order to improve the sealing performance of the protection cover 524, the first light source 520 further includes an optical glass block 525, and the optical glass block 525 is located at the light inlet of the first silicon microchip 530 and at the end of the protection cover 524, and is used for transmitting light and sealing the end of the protection cover 524. Illustratively, the optical glass block 525 is a wedge-shaped block, and the light incident surface is perpendicular to the optical axis of the collimating lens 522 and the light emitting surface is perpendicular to the axis of the light inlet of the first silicon photo chip 530, so as to ensure that light can be smoothly transmitted to the light inlet of the obliquely arranged first silicon photo chip 530 through the optical glass block 525 and prevent the reflected light from the light inlet of the first silicon photo chip 530 from returning to the original incident light path, so as to ensure that the horizontal light beam emitted by the laser 521 is smoothly incident to the light inlet of the obliquely arranged first silicon photo chip 530.

Fig. 21 is a schematic structural view of a protective cover according to some embodiments. In some embodiments, as shown in fig. 20 and 21, the protecting cover 524 is a cap structure without a bottom and with an opening 5241 at one end, and the opening 5241 faces the first silicon microchip 530. In some embodiments, the optical glass block 525 is disposed at the opening 5241, and the end surface of the opening 5241 is an inclined surface for facilitating assembly with the first silicon photo chip 530.

In some embodiments, an end of the protection cover 524 away from the first silicon optical chip 530 protrudes from the first mounting stage 512 for covering the bonding wire between the laser 521 and the circuit board 300. In some embodiments of the present disclosure, the protective cover 524 may be made of a metal material such as copper, so that the protective cover 524 also has an electromagnetic shielding function, and will facilitate heat dissipation of the first light source 520.

In some embodiments of the present application, the bottom of the protection cover 524 is embedded in the first space 517 and the second space 518, and the protection cover 524 is fixed by the first space 517 and the second space 518, which facilitates positioning and installation of the protection cover 524. In some embodiments, the upper case 201 is provided with a heat conducting pillar, and the heat conducting pillar contacts the top of the protective cover 524, so as to improve the heat dissipation capability of the protective cover 524, and thus, heat is rapidly conducted to the housing of the optical module and the outside of the optical module.

In this embodiment, the surface of the first sub-circuit board 540 is provided with a bonding pad, and the inner layer is provided with a circuit trace, etc. for electrically connecting the first sub-circuit board 540 and the circuit board 300, the first sub-circuit board 540 and the first digital signal processing chip 550, and the first sub-circuit board 540 and the first silicon microchip 530, etc. The specific structure of the first sub-circuit board 540 is described below with reference to specific examples.

Fig. 22 is a first structural diagram of a secondary circuit board according to some embodiments, and fig. 22 illustrates a use state of the first secondary circuit board 540 without the first digital signal processing chip 550 connected thereto. As shown in fig. 22, a first land matrix 542 is disposed on the top surface of the first sub circuit board 540, and the first land matrix 542 is used for electrically connecting the first digital signal processing chip 550. Illustratively, the first pad matrix 542 is connected to the first digital signal processing chip 550 by solder balls. Further, the top surface of the first sub circuit board 540 is further provided with a plurality of bonding pads 5411 for wire bonding of the first silicon optical chip 530, and the bonding pads 5411 are arranged on the top surface of the edge of the first notch 541 for wire bonding of the first silicon optical chip 530 to the first sub circuit board 540; the top surface of the first sub-board 540 is further provided with other pads for mounting resistors, capacitors, etc., which are not shown in detail in the figure. The pads 5411 include a high frequency connection pad 5412 for transmitting a high frequency signal between the first digital signal processing chip 550 and the first silicon microchip 530, and may further include a pad for supplying power to the first silicon microchip 530, and the like. Illustratively, the high-frequency connection pads 5412 are a plurality of pairs, and the high-frequency connection pads 5412 are disposed on the top surface near the edge of the first gap 541 of the first pad matrix 542, i.e., the high-frequency connection pads 5412 are disposed on the top surface of the edge of the first gap 541 in the length direction of the first sub board 540.

Fig. 23 is a second schematic structural diagram of a secondary circuit board according to some embodiments, and fig. 23 illustrates a back structure of a first secondary circuit board 540. As shown in fig. 23, a second land matrix 543 is disposed on the bottom surface of the first sub circuit board 540, and the first sub circuit board 540 is electrically connected to the circuit board 300 through the second land matrix 543. Illustratively, the second pad matrix 543 is connected to the circuit board 300 by solder balls.

As shown in fig. 23, in the embodiment of the present application, the second pad matrix 543 includes several pads, such as a high frequency pad, a power supply pad, a ground pad, and the like; the high-frequency pad is used for transmitting high-frequency signals, the power supply pad supplies power, and the grounding pad is used for grounding. The second pad matrix 543 includes a high-frequency signal input pad 5431 for inputting a high-frequency signal to the first digital signal processing chip 550, a high-frequency signal output pad 5432 for outputting a high-frequency signal from the first digital signal processing chip 550, and a power supply pad 5433 for supplying power to the first digital signal processing chip 550 and the like. In the embodiment of the present application, there is not more than one pair of the high-frequency signal input pad 5431 and the high-frequency signal output pad 5432; illustratively, as shown in fig. 23, there are 4 pairs of the high-frequency signal input pads 5431 and 4 pairs of the high-frequency signal output pads 5432; the 4 pairs of high-frequency signal input pads 5431 are relatively intensively disposed, and the 4 pairs of high-frequency signal output pads 5432 are relatively intensively disposed.

As shown in fig. 23, in some embodiments of the present application, 4 pairs of high-frequency signal input pads 5431 are provided on one side of the power supply pad 5433, and 4 pairs of high-frequency signal output pads 5432 are provided on the other side of the power supply pad 5433. Illustratively, the power supply pad 5433 is disposed at an off-center position of the second pad matrix 543. A ground pad is disposed between the high-frequency signal input pad 5431 and the power pad 5433, and a ground pad is disposed between the high-frequency signal output pad 5432 and the power pad 5433, wherein the ground pad is used for grounding, and the ground pad is used for realizing the separation between the high-frequency signal pad and the power pad, thereby reducing the crosstalk between the power supply and the high-frequency signal. In some embodiments, a ground pad is disposed between the pair of high-frequency signal input pads 5431 and the pair, and a ground pad is disposed between the pair of high-frequency signal output pads 5432 and the pair, wherein the ground pad is used for grounding, and the ground pad is used for spacing the pair of high-frequency signal pads from the pair, thereby reducing crosstalk between the high-frequency signal pads.

Fig. 24 is a schematic diagram illustrating a top surface structure of a secondary circuit board according to some embodiments. As shown in fig. 24, in some embodiments of the present application, the first pad matrix 542 includes first high-frequency signal input pads 5421, first high-frequency signal output pads 5422, second high-frequency signal input pads 5423, and second high-frequency signal output pads 5424; wherein: the first high frequency signal input pad 5421 is used for the circuit board 300 to input a high frequency signal to the first digital signal processing chip 550 through the first sub circuit board 540, the first high frequency signal output pad 5422 is used for the first digital signal processing chip 550 to input a high frequency signal to the circuit board 300 through the first sub circuit board 540, the second high frequency signal input pad 5423 is used for the first silicon optical chip 530 to input a high frequency signal to the first digital signal processing chip 550 through the first sub circuit board 540, and the second high frequency signal output pad 5424 is used for the first digital signal processing chip 550 to input a high frequency signal to the first silicon optical chip 530 through the first sub circuit board 540.

In the embodiment of the present application, the first sub-circuit board 540 is provided with circuit board traces, such as an optical transmission signal trace and an optical reception signal trace, on the inner layer, and the optical transmission signal trace and the optical reception signal trace are used for electrically connecting the first silicon optical chip 530; illustratively, the light emitting signal traces and the light receiving signal traces are connected for electrically connecting the first digital signal processing chip 550 and the high frequency connection pads 5412 of the first silicon chiplet 530. In some embodiments of this application, optical transmission signal walks to be located the inlayer of difference on the first time circuit board 540 with optical reception signal line to guarantee that optical transmission signal walks to avoid external radiation with optical reception signal line, optical transmission signal walks to be restricted at the inlayer of circuit board with the spontaneous radiation that optical reception signal walked simultaneously, in order to reduce the interference to the external world. In some embodiments, the optical transmit signal traces and the optical receive signal traces are located in non-adjacent inner layers of the first sub-circuit board 540, which helps to further reduce interference. Illustratively, the light emitting signal trace is located at a first middle layer of the first sub circuit board 540, the light receiving signal trace is located at a second middle layer of the first sub circuit board 540, and the first middle layer and the second middle layer are non-adjacent inner layers of the first sub circuit board 540.

Further, a high-frequency input signal trace and a high-frequency output signal trace are further disposed inside the first secondary circuit board 540, the high-frequency input signal trace is used for enabling the high-frequency signal input pad 5431 to be connected with the first digital signal processing chip 550, and the high-frequency output signal trace is used for enabling the high-frequency signal output pad 5432 to be connected with the first digital signal processing chip 550. In some embodiments of the present application, the high frequency input signal trace and the high frequency output signal trace are arranged so as to ensure that the high frequency input signal trace and the high frequency output signal trace are free from external radiation, and meanwhile, the spontaneous radiation of the high frequency input signal trace and the high frequency output signal trace is limited to the inner layer of the circuit board so as to reduce the interference to the outside. In some embodiments, the high frequency input signal traces and the high frequency output signal traces are located in non-adjacent inner layers of the first sub-circuit board 540, which helps to further reduce interference.

In some embodiments of the present application, the optical transmission signal trace and the high frequency input signal trace are located on the same inner layer of the first sub circuit board 540, and the optical reception signal trace and the high frequency output signal trace are located on the same inner layer of the first sub circuit board 540, so that the first sub circuit board 540 is fully utilized on the basis of ensuring low interference. Illustratively, the high-frequency input signal trace is located in a first middle layer of the first sub-circuit board 540, and the high-frequency output signal trace is located in a second middle layer of the first sub-circuit board 540.

In some embodiments of the present application, the inner layer of the first sub-circuit board 540 further includes a third intermediate layer, and a first hollow is disposed on the third intermediate layer, and a projection of the first hollow in the direction of the first intermediate layer covers the light emitting signal trace. Illustratively, the third intermediate layer is adjacent to the first intermediate layer.

In some embodiments of the present application, the inner layer of the first sub-circuit board 540 further includes a fourth middle layer, a second hollow is disposed on the fourth middle layer, and a projection of the second external control in the direction of the second middle layer covers the light receiving signal trace. Illustratively, the fourth intermediate layer is adjacent to the second intermediate layer.

In some embodiments of the present application, a third hollow is further disposed on the third interlayer, and a projection of the third hollow in the direction of the first interlayer covers the high-frequency input signal trace; and a fourth hollow is further arranged on the fourth middle layer, and the projection of the fourth hollow in the direction of the second middle layer covers the high-frequency output signal wiring. In some embodiments of the present application, the first intermediate layer and the second intermediate layer are located between the third intermediate layer and the fourth intermediate layer.

In some embodiments of the present application, a via hole is disposed between pairs of optical transmission signal wires, and the isolation between the pairs of optical transmission signal wires is achieved through the via hole, so as to reduce crosstalk between the pairs; through holes are arranged between pairs of high-frequency input signal wires, and the isolation between the pairs of the high-frequency input signal wires is realized through the through holes so as to reduce crosstalk between the pairs; through holes are arranged between pairs of the optical receiving signal wires, and the isolation between the pairs of the optical receiving signal wires is realized through the through holes so as to reduce crosstalk between the pairs; through holes are arranged between pairs of high-frequency output signal wires, and the isolation between the pairs of the high-frequency output signal wires is realized through the through holes so as to reduce crosstalk between the pairs.

The first sub circuit board 540 provided by the embodiment of the present application is described in detail below with a 10-layer first sub circuit board 540 as a specific embodiment.

Fig. 25 is a schematic structural diagram of a third layer of a sub-circuit board according to an embodiment of the present application. As shown in fig. 25, 4 pairs of optical transmit signal traces 544 and 4 pairs of high frequency input signal traces 545 are disposed on the third layer of the first sub-circuit board 540; one end of the light emission signal routing 544 is connected to the second high-frequency signal output pad 5424 through a via hole, and the other end is connected to the high-frequency connection pad 5412 for wire bonding connection to the first silicon optical chip 530 through a via hole; one end of the high-frequency input signal trace 545 is connected with the first high-frequency signal input pad 5421 through a via hole, and the other end is connected with the high-frequency signal input pad 5431 through a via hole; vias are provided between pairs of the light emission signal traces 544 and vias are provided between pairs of the high frequency input signal traces 545.

Fig. 26 is a schematic structural diagram of a sixth layer of a secondary circuit board according to an embodiment of the present application. As shown in fig. 26, 4 pairs of light receiving signal traces 546 and 4 pairs of high frequency output signal traces 547 are disposed on the sixth layer of the first sub circuit board 540; one end of the light receiving signal routing 546 is connected to the second high-frequency signal input pad 5423 through a via hole, and the other end is connected to the high-frequency connection pad 5412 for wire bonding connection to the first silicon microchip 530 through a via hole; one end of the high-frequency output signal wire 547 is connected to the first high-frequency signal output pad 5422 through a via hole, and the other end is connected to the high-frequency signal output pad 5432 through a via hole; vias are provided between pairs of the light-receiving signal lines 546, and vias are provided between pairs of the high-frequency output signal lines 547.

In the present embodiment, the light emitting signal trace 544 and the light receiving signal trace 546 are distributed in a cross manner on different inner layers of the first sub-circuit board 540, and the high frequency input signal trace 545 and the high frequency output signal trace 547 are distributed in a cross manner on different inner layers of the first sub-circuit board 540, so that the electromagnetic field of the light emitting signal trace 544 and the electromagnetic field of the light receiving signal trace 546 are perpendicular, and the electromagnetic field of the high frequency input signal trace 545 and the electromagnetic field of the high frequency output signal trace 547 are perpendicular, thereby helping to reduce crosstalk coupling.

Fig. 27 is a schematic structural diagram of a second layer of a secondary circuit board according to an embodiment of the present application. As shown in fig. 27, a first cutout 5481 and a third cutout 5482 are provided on the second layer of the first sub circuit board 540; the projection of the first cutout 5481 in the third layer direction of the first sub circuit board 540 covers the light emission signal trace 544, and the projection of the third cutout 5482 in the third layer direction of the first sub circuit board 540 covers the high frequency input signal trace 545.

Fig. 28 is a schematic structural diagram of a seventh layer of a sub-circuit board according to an embodiment of the present application. As shown in fig. 28, a second cutout 5491 and a fourth cutout 5492 are provided on the seventh layer of the first sub circuit board 540; the projection of the second cutout 5491 in the sixth layer direction of the first sub circuit board 540 covers the light-receiving signal traces 546, and the projection of the fourth cutout 5492 in the sixth layer direction of the first sub circuit board 540 covers the high-frequency output signal traces 547.

In an embodiment of the present application, a reference ground is disposed on the first layer, the fourth layer, the fifth layer and the eighth layer of the first sub-circuit board 540 with the 10-layer structure. Illustratively, the first layer and the fourth layer serve as reference grounds for the third layer, and the fifth layer and the eighth layer serve as reference grounds for the sixth layer.

In some embodiments of the present application, the detailed structure of the second optical transceiver module 600 may refer to the structure of the first optical transceiver module 500, and the structure of the second optical transceiver module 600 may be the same as, but not limited to, the structure of the first optical transceiver module 500, and may be slightly adjusted or modified based on the structure of the first optical transceiver module 500. When the structure of the second optical transceiver module 600 is the same as that of the first optical transceiver module 500, the universality of the devices in the first optical transceiver module 500 is improved, the replaceability between two types of products is greatly improved, the rate iteration of the products is accelerated, and the manufacturability is stronger.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

a circuit board;

wherein the first optical transceiver component comprises:

a first base disposed on the circuit board;

the first silicon optical chip is arranged on the first base and used for receiving light without carrying signals so as to generate optical signals through modulation and receiving the optical signals from the outside;

2. The optical module of claim 1, wherein the first notch surrounds three sides of the first silicon optical chip, pads are respectively disposed on top surfaces of the edges of the three sides of the first notch, and the first silicon optical chip is wire-bonded to the pads;

the bonding pad comprises a high-frequency connecting bonding pad, the high-frequency connecting bonding pad is arranged on the top surface of the edge of the first notch in the length direction of the first-time circuit board, and the high-frequency connecting bonding pad is used for transmitting high-frequency signals of the first silicon optical chip and the first digital signal processing chip.

3. The optical module of claim 1, wherein a first sinker is disposed on the circuit board, and a first through hole is disposed in the first sinker; the bottom of the first base is provided with a first step, the first base is arranged in the first sinking groove, the first step is embedded in the first through hole, and the first step penetrates through the first through hole to be in contact with the shell of the optical module.

4. The optical module of claim 1, wherein the first optical transceiver module further comprises a first bridge disposed on the first base and located on a side of the first silicon optical chip away from the first sub-circuit board, and one end of the first bridge is wire bonded to the first silicon optical chip and the other end of the first bridge is wire bonded to the circuit board.

5. The optical module according to claim 1, wherein the first light source includes a protective cover, a laser, a collimating lens, and an isolator, the laser, the collimating lens, and the isolator are sequentially disposed on the first base along a direction extending toward the first silicon optical chip, a bottom of the protective cover is connected to the first base, and the protective cover is disposed over the laser, the collimating lens, and the isolator;

the laser is connected with the circuit board in a routing mode.

6. The optical module of claim 1, wherein the first base comprises a base body, the base body comprises a first portion and a second portion, the first portion is connected to the second portion, the second portion carries the first silicon optical chip, the first portion carries the first light source, and a central axis extending direction of the first portion and a central axis extending direction of the second portion form a predetermined angle.

7. Light module according to claim 6, characterized in that said preset angle is 8 °.

8. The optical module of claim 3, wherein a circuit board trace is disposed on the first sub circuit board located on the back side of the first sinker.

9. The optical module according to claim 3, wherein the first through hole is obliquely disposed on the circuit board, and an angle between a central axis of extension of the first through hole and a central axis of the circuit board is 8 °.

10. The optical module of claim 1, wherein the first secondary circuit board is located on a side of the first silicon optical chip near the optical module electrical port; the first secondary circuit board is parallel to the circuit board.