CN113534363A - COB optical module and manufacturing method thereof - Google Patents
COB optical module and manufacturing method thereof Download PDFInfo
- Publication number
- CN113534363A CN113534363A CN202110703945.XA CN202110703945A CN113534363A CN 113534363 A CN113534363 A CN 113534363A CN 202110703945 A CN202110703945 A CN 202110703945A CN 113534363 A CN113534363 A CN 113534363A
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- Prior art keywords
- pcb
- heat dissipation
- shell
- chip
- optical module
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to the technical field of optical communication, and provides a COB optical module which comprises a shell, a PCB arranged on the shell, a TIA chip attached to the PCB and a heat dissipation block penetrating through the PCB, wherein the heat dissipation block penetrates through two ends of the PCB and is respectively attached to the TIA chip and the shell. The manufacturing method of the COB optical module comprises the following steps: s1, fixing the PCB on the shell, and opening a window on the PCB in advance; s2, penetrating the PCB from the window by a heat dissipation block, and enabling the heat dissipation block to penetrate one end of the PCB to be attached to the shell; and S3, attaching the TIA chip on the PCB, and enabling the heat dissipation block to penetrate through the other end of the PCB and be attached to the TIA chip. The TIA chip and the shell are directly connected through the aluminum nitride heat dissipation block, and the aluminum nitride has good heat conduction performance and can be directly connected with the module shell, so that the connection with the shell through the heat dissipation pad is avoided, and the heat dissipation of the TIA chip is greatly improved.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to a COB optical module and a manufacturing method thereof.
Background
With the gradual update of 5G communication technology, the market demands for high-speed modules such as 25G, 100G, 200G, 400G and the like are increased, the market competition is intensified, and the requirements on cost control and reliability of the high-speed modules are increased;
as shown in fig. 1 to 3, a conventional optical module includes a light engine and a module housing which are assembled in advance. The optical engine includes two parts, a TOSA (transmitter optical) and a ROSA (receiver optical). The optical engine needs to be assembled in advance, and then the optical engine is assembled in the optical module shell to form the optical module. The ROSA of the conventional optical module is specifically manufactured as follows:
firstly, adhering PD and TIA on a PCB by using silver glue;
routing PD and TIA;
the AWG (arrayed waveguide) with the pigtail is coupled with the PD and fixed.
In order to reduce the cost, a conventional TIA integrates a CDR (clock time data restorer), the power consumption of the whole TIA is large, and therefore the heat dissipation of the TIA needs to be considered in design, otherwise, when the ambient temperature is high, for example, 85 degrees, the performance of the product is rapidly degraded due to the limited operating temperature of the TIA. For this reason, the heat dissipation design of the TIA is also a significant design difficulty.
Because the optical engine of traditional optical module assembles in advance and then installs in the module shell, consequently TIA's heat dissipation can only be through the heat conduction pad that thickness can be compressed heat-transfer to the module shell on the heat dissipation, traditional radiating mode mainly has following two kinds:
the first method comprises the following steps: as shown in fig. 4, some copper columns are embedded in the PCB board attached to the TIA area for heat dissipation, and heat generated by the TIA is transferred to the copper columns and then transferred to the module housing through the thermal pad. This kind of mode is because the size of copper post is limited, need fill up a heat conduction pad with between copper post and the module shell, and the radiating effect is not very good, and when ambient temperature reached about 85 degrees, the performance of product can deteriorate more seriously.
And the second method comprises the following steps: as shown in fig. 5, a copper block is pre-embedded on the PCB board attached to the TIA area for heat dissipation, and heat generated by the TIA is transferred to the copper block and then to the module housing through the thermal pad. This kind of mode radiating effect will be better than first kind of mode, but the cost of pre-buried copper billet can lead to the cost increase by a wide margin of PCB board, and the copper billet still needs to increase the heat conduction pad with being connected of module shell in addition, therefore the radiating effect still is unsatisfactory.
Disclosure of Invention
The invention aims to provide a COB optical module and a manufacturing method thereof, which can at least solve part of defects in the prior art.
In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions: the utility model provides a COB optical module, includes the casing, locates PCB board on the casing, paste TIA chip on the PCB board and run through the radiating block of PCB board, the radiating block passes the both ends of PCB board are laminated respectively TIA chip with the casing.
Furthermore, a window is formed in the PCB, and the heat dissipation block penetrates through the PCB from the window.
Further, the heat dissipation block is an aluminum nitride heat dissipation block.
Further, the PCB is located between the TIA chip and the shell and is fixed on the shell through glue or screws.
Further, the TIA chip and the shell are bonded through the silver adhesive by the heat dissipation block.
Further, the PCB comprises a PD chip, and the PD chip is attached to the PCB.
Further, the optical fiber array comprises an array optical waveguide with a tail fiber, and the array optical waveguide is coupled with the PD.
The embodiment of the invention provides another technical scheme: a manufacturing method of a COB optical module comprises the following steps:
s1, fixing the PCB on the shell, and opening a window on the PCB in advance;
s2, penetrating the PCB from the window by a heat dissipation block, and enabling the heat dissipation block to penetrate one end of the PCB to be attached to the shell;
and S3, attaching the TIA chip on the PCB, and enabling the heat dissipation block to penetrate through the other end of the PCB and be attached to the TIA chip.
Further, in the step S3, a heat dissipation block is attached to the housing by silver paste and is cured by heating.
Further, a PD chip is attached to the PCB, and then gold wires are bonded to the PD chip and the TIA chip.
Compared with the prior art, the invention has the beneficial effects that:
1. the TIA chip is directly connected with the shell through the aluminum nitride heat dissipation block, and the aluminum nitride has good heat conduction performance and can be directly connected with the module shell, so that the connection with the shell through the heat dissipation pad is avoided, and the heat dissipation of the TIA chip is greatly improved.
2. The cost of the copper block pre-buried in the PCB board is too high in the traditional method, the cost of the scheme adopting the aluminum nitride radiating block can be greatly reduced, and the cost of the product is effectively reduced.
Drawings
FIG. 1 is a front view of a conventional optical module pigtailed adapter;
FIG. 2 is a cross-sectional view of a conventional optical module pigtailed adapter;
FIG. 3 is an exploded view of a conventional optical module pigtailed adapter;
fig. 4 is a schematic diagram of a conventional optical module in which a copper pillar is added on a PCB to dissipate heat of a TIA chip;
fig. 5 is a schematic diagram of a conventional optical module in which a copper block is added on a PCB to dissipate heat of a TIA chip;
fig. 6 is a front view of a COB optical module according to an embodiment of the present invention;
fig. 7 is a cross-sectional view of a COB optical module according to an embodiment of the present invention;
fig. 8 is a schematic diagram illustrating connection and heat dissipation between aluminum nitride and a TIA chip and a housing of a COB optical module according to an embodiment of the present invention;
in the reference symbols: 1-a shell; 2-a PCB board; 3-aluminum nitride; 4-PD chip; 5-TIA chip; 6-array optical waveguide; 7-a heat dissipation pad; 8-copper columns; 9-copper block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 6, 7 and 8, an embodiment of the present invention provides a COB optical module, which includes a housing 1, a PCB 2 disposed on the housing 1, a TIA chip 5 attached to the PCB 2, and a heat dissipation block penetrating through the PCB 2, where the heat dissipation block penetrates through two ends of the PCB 2 and is respectively attached to the TIA chip 5 and the housing 1. In this embodiment, the TIA chip 5 and the housing 1 are directly connected through the aluminum nitride heat sink, and since the aluminum nitride 3 has a good thermal conductivity and can be directly connected to the module housing 1, the case 1 is prevented from being connected through the heat sink pad 7, and thus the heat dissipation of the TIA chip 5 is greatly improved. Specifically, adopt the radiating block to run through PCB board 2, its both ends that run through are connected with TIA chip 5 and casing 1 respectively, the heat that TIA chip 5 produced just so can directly be passed through the radiating block and transmit to casing 1 and derive, compare in traditional heat dissipation form, as shown in fig. 4 and fig. 5, except adopting copper post 8 and copper billet 9, still all need cooperate the radiating pad 7 just can the heat dissipation, the thickness of radiating pad 7 is at 300 ~ 500 mu m at least usually, and the radiating block of this embodiment with heat conduction glue lug connection casing 1 can, heat conduction glue thickness is usually only about 20 mu m, the radiating effect is many.
Referring to fig. 6, 7 and 8 as an optimized solution of the embodiment of the present invention, a window is formed on the PCB 2, and the heat dissipation block penetrates through the PCB 2 from the window. In this embodiment, when the PCB 2 is manufactured, a window may be formed on the PCB 2, and the heat dissipation block may penetrate through the PCB 2 through the window. The opening of the window is determined according to the position of the TIA chip 5. The shape of the window can be square, which corresponds to the shape of the heat dissipation block, although other shapes are also feasible, and only the heat dissipation block needs to pass through.
Referring to fig. 6, 7 and 8 as an optimized solution of the embodiment of the present invention, the heat dissipation block is an aluminum nitride 3 heat dissipation block. In the present embodiment, the heat dissipation block is made of aluminum nitride 3, which has good heat dissipation performance. Of course, other heat dissipation materials are also feasible, and the embodiment does not limit this.
Referring to fig. 6, 7 and 8 as an optimized solution of the embodiment of the present invention, the PCB 2 is located between the TIA chip 5 and the housing 1, and the PCB 2 is fixed on the housing 1 by glue or screws. In this embodiment, the PCB board 2 may be attached to the housing 1 by glue or by screw threads.
Referring to fig. 6, 7 and 8 as an optimized solution of the embodiment of the present invention, the heat dissipation block bonds the TIA chip 5 and the housing 1 by using silver paste. In this embodiment, the heat dissipation block may be bonded to the housing 1 and the TIA chip 5 by silver paste, and then heated and cured after the bonding.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 6, fig. 7, and fig. 8, the optical module further includes a PD chip 4, and the PD chip 4 is attached to the PCB 2. Preferably, the optical module further comprises an array optical waveguide 6 with a pigtail, and the array optical waveguide 6 is coupled with the PD. In this embodiment, after the PD chip 4 is attached, gold wires are applied to the PD chip 4 and the TIA chip 5.
The embodiment of the invention provides a manufacturing method of a COB optical module, which comprises the following steps: s1, fixing the PCB 2 on the shell 1, and opening a window on the PCB 2 in advance; s2, a heat dissipation block penetrates through the PCB 2 from the window, and the heat dissipation block penetrates through one end of the PCB 2 and is attached to the shell 1; and S3, attaching the TIA chip 5 to the PCB 2, and enabling the heat dissipation block to penetrate through the other end of the PCB 2 and be attached to the TIA chip 5. In this embodiment, the TIA chip 5 and the housing 1 are directly connected through the aluminum nitride 3 heat dissipation block, and since the aluminum nitride 3 has good thermal conductivity and can be directly connected with the module housing 1, the connection with the housing 1 through the heat dissipation pad 7 is avoided, and thus the heat dissipation of the TIA chip 5 is greatly improved. Specifically, the heat dissipation block penetrates through the PCB 2, and two penetrating ends of the heat dissipation block are respectively connected with the TIA chip 5 and the housing 1, so that heat generated by the TIA chip 5 can be directly transferred to the housing 1 through the heat dissipation block and then led out. In addition, this embodiment is different from the traditional rear-mounted PCB in that the PCB is mounted first, and the traditional optical module must be assembled to a product to mount the PCB to the module case, and at this time, the height from the heat dissipation block to the module case is not fixed, and a large gap must be reserved, which may lead to the need of using the heat dissipation pad 7 to eliminate the gap. The problem does not exist when the PCB is firstly installed in the embodiment, and the heat dissipation block can be directly connected with the TIA chip 5 and the shell 1, so that the heat dissipation efficiency is greatly improved, and the cost is reduced.
As an optimized scheme of the embodiment of the invention, the heat dissipation block is adhered to the shell 1 through silver adhesive and is heated and cured. And (3) pasting a PD chip 4 on the PCB 2, and then bonding gold wires on the PD chip 4 and the TIA chip 5. And then coupling the array optical waveguide 6 with the tail fiber with the PD chip 4, fixing the array optical waveguide 6 to complete the assembly of the emitting part of the optical module, and then covering the upper cover on the shell 1 to complete the manufacture of the module.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a COB optical module which characterized in that: the PCB comprises a shell, a PCB arranged on the shell, a TIA chip attached to the PCB and a heat dissipation block penetrating through the PCB, wherein the heat dissipation block penetrates through two ends of the PCB and is attached to the TIA chip and the shell respectively.
2. The COB optical module of claim 1, characterized in that: the PCB board is provided with a window, and the heat dissipation block penetrates through the PCB board from the window.
3. The COB optical module of claim 1, characterized in that: the radiating block is an aluminum nitride radiating block.
4. The COB optical module of claim 1, characterized in that: the PCB is located between the TIA chip and the shell and is fixed on the shell through glue or screws.
5. The COB optical module of claim 1, characterized in that: and the heat dissipation block is used for bonding the TIA chip and the shell through silver adhesive.
6. The COB optical module of claim 1, characterized in that: the PCB further comprises a PD chip, and the PD chip is attached to the PCB.
7. The COB optical module of claim 6, wherein: the array optical waveguide with the tail fiber is further included and coupled with the PD chip.
8. A manufacturing method of a COB optical module is characterized by comprising the following steps:
s1, fixing the PCB on the shell, and opening a window on the PCB in advance;
s2, penetrating the PCB from the window by a heat dissipation block, and enabling the heat dissipation block to penetrate one end of the PCB to be attached to the shell;
and S3, attaching the TIA chip on the PCB, and enabling the heat dissipation block to penetrate through the other end of the PCB and be attached to the TIA chip.
9. The method for manufacturing a COB optical module of claim 8, wherein: in the step S3, the heat dissipation block is attached to the housing by silver paste and cured by heating.
10. The method for manufacturing a COB optical module of claim 8, wherein: and pasting a PD chip on the PCB, and then bonding gold wires on the PD chip and the TIA chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110703945.XA CN113534363A (en) | 2021-06-24 | 2021-06-24 | COB optical module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110703945.XA CN113534363A (en) | 2021-06-24 | 2021-06-24 | COB optical module and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN113534363A true CN113534363A (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110703945.XA Pending CN113534363A (en) | 2021-06-24 | 2021-06-24 | COB optical module and manufacturing method thereof |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205213227U (en) * | 2015-10-30 | 2016-05-04 | 武汉电信器件有限公司 | COB's heat radiation structure |
| CN205263363U (en) * | 2015-12-23 | 2016-05-25 | 福州高意通讯有限公司 | High -speed photoelectric transceiver module's heat radiation structure |
| CN110297297A (en) * | 2019-06-27 | 2019-10-01 | 昂纳信息技术（深圳）有限公司 | A kind of optical module and its light engine installation method |
| CN110459512A (en) * | 2019-09-12 | 2019-11-15 | 东莞铭普光磁股份有限公司 | Radiate mainboard and optical module |
| CN110764202A (en) * | 2019-12-09 | 2020-02-07 | 亨通洛克利科技有限公司 | Structure of 400G optical module |
| CN210093816U (en) * | 2019-04-09 | 2020-02-18 | 成都鸿芯光电通信有限公司 | 100GCOB technology optical module PCB heat radiation structure |
| CN110865441A (en) * | 2018-08-27 | 2020-03-06 | 苏州旭创科技有限公司 | Optical module |
| CN111474643A (en) * | 2020-04-25 | 2020-07-31 | 武汉华工正源光子技术有限公司 | Chip heat dissipation structure of optical module, multi-channel fiber winding optical module and assembling method thereof |
| CN111708131A (en) * | 2020-06-22 | 2020-09-25 | 武汉光迅科技股份有限公司 | Light emitting module and optical module |
| CN213122371U (en) * | 2020-09-11 | 2021-05-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2021
- 2021-06-24 CN CN202110703945.XA patent/CN113534363A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205213227U (en) * | 2015-10-30 | 2016-05-04 | 武汉电信器件有限公司 | COB's heat radiation structure |
| CN205263363U (en) * | 2015-12-23 | 2016-05-25 | 福州高意通讯有限公司 | High -speed photoelectric transceiver module's heat radiation structure |
| CN110865441A (en) * | 2018-08-27 | 2020-03-06 | 苏州旭创科技有限公司 | Optical module |
| CN210093816U (en) * | 2019-04-09 | 2020-02-18 | 成都鸿芯光电通信有限公司 | 100GCOB technology optical module PCB heat radiation structure |
| CN110297297A (en) * | 2019-06-27 | 2019-10-01 | 昂纳信息技术（深圳）有限公司 | A kind of optical module and its light engine installation method |
| CN110459512A (en) * | 2019-09-12 | 2019-11-15 | 东莞铭普光磁股份有限公司 | Radiate mainboard and optical module |
| CN110764202A (en) * | 2019-12-09 | 2020-02-07 | 亨通洛克利科技有限公司 | Structure of 400G optical module |
| CN111474643A (en) * | 2020-04-25 | 2020-07-31 | 武汉华工正源光子技术有限公司 | Chip heat dissipation structure of optical module, multi-channel fiber winding optical module and assembling method thereof |
| CN111708131A (en) * | 2020-06-22 | 2020-09-25 | 武汉光迅科技股份有限公司 | Light emitting module and optical module |
| CN213122371U (en) * | 2020-09-11 | 2021-05-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Application publication date: 20211022 |
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