CN108508551A - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
- Publication number
- CN108508551A CN108508551A CN201810298868.2A CN201810298868A CN108508551A CN 108508551 A CN108508551 A CN 108508551A CN 201810298868 A CN201810298868 A CN 201810298868A CN 108508551 A CN108508551 A CN 108508551A
- Authority
- CN
- China
- Prior art keywords
- speculum
- silicon substrate
- lens
- optical module
- isolator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
Abstract
The present invention provides a kind of optical modules.Optical module includes silicon substrate, laser, lens, isolator, speculum and silicon optical chip.Laser, lens, isolator, speculum are set to the upper surface of silicon substrate.Speculum gluing is in the upper surface of silicon substrate, and speculum is located at isolator backwards to the side of lens.According to light module package method, speculum is fixed on by adhesive layer on silicon substrate.Adhesive layer it is in uneven thickness.Silicon optical chip is set to the lower surface of silicon substrate.Laser sends out light beam, through lens focus, by being reflected through speculum after isolator, into silicon optical chip.The error on component supplied materials size, tolerance and passive placement accuracy can be compensated by adhesive layer in uneven thickness, coupling loss is reduced, improves coupling yield.
Description
Technical field
The present invention relates to the component package field of optic communication device, especially a kind of optical module.
Background technology
In high-speed data communication field, silicon photonic integrated circuits obtain very big concern, however link budget problems limit
The application of silicon photonic integrated circuits is made.A usual optical module is comprising in a silicon optical chip, a silicon substrate, a reflection
Lid, a laser, a lens, an isolator, different schemes may also include the component of some other auxiliary.
Its light path basic principle is：Laser light extraction, by lens focus, by being reflected through speculum after isolator, from silicon substrate bottom
It projects in portion.The assembling sequence of a usual optical module is：First by laser, lens, isolator, speculum by the way of passive
It is fixed, then will be fixed between light source assembly and silicon optical chip with active mode.
Since there are accumulated tolerances and mounted accumulated tolerance to feed back to going out for light source assembly for the appearance and size of each component
Shooting angle deviation is larger, and coupled power loss is corresponding to increase by 1~2dB, reduces the yield of light source assembly.
Invention content
The purpose of the present invention is to provide a kind of higher optical modules of yield.
A kind of optical module, including
Silicon substrate；
Laser is set to the upper surface of the silicon substrate；
Lens are set to the upper surface of the silicon substrate, and the lens are oppositely arranged with the laser；
Isolator is set to the upper surface of the silicon substrate, and the isolator is located at the lens backwards to the laser
Side；
Speculum is fixed on the upper surface of the silicon substrate by adhesive layer, and the speculum is located at the isolator
Backwards to the lens side, the adhesive layer it is in uneven thickness；
Silicon optical chip is set to the lower surface of the silicon substrate；
The laser sends out light beam, through the lens focus, by being reflected through the speculum after the isolator, into
Enter the silicon optical chip.
Laser, lens, isolator are mounted on silicon substrate by the optical module of present embodiment by way of passive attachment
On plate, then by way of passive attachment, silicon substrate is mounted on silicon optical chip.Then by the way of active coupling,
Laser light extraction is coupled into the grating coupler of silicon optical chip by speculum.Speculum is fixed on the silicon by adhesive layer
The upper surface of substrate, and adhesive layer is in uneven thickness.Above-mentioned optical module adjusts speculum according to the thickness of adhesive layer
Fixed position and fixed angle, so that speculum is in Best Coupling point.So as to compensatory reflex mirror due to gluing deformation, come
The error that material size etc. is brought, improves the coupling yield of optical module.
Using the light module package method of present embodiment, it is only necessary to carry out primary active coupling, remaining device uses
Passive attachment.Fixed position and the fixed angle of speculum are adjusted by the thickness of adhesive layer, so that speculum is in best
Coupling point.So as to compensate component due to the mistake brought on gluing deformation, supplied materials size, tolerance and passive placement accuracy
Difference reduces coupling loss, improves coupling yield.
Compared to traditional coupling package method, when reprocessing, dismounting need to be only carried out to speculum and is reprocessed, is returned
It repaiies that speculum is relatively easy, avoids reprocessing the difficulty for removing silicon substrate, and improve and reprocess yield.
Description of the drawings
Fig. 1 is the structure chart of the optical module of present embodiment；
Fig. 2 is the flow chart of the optical module of present embodiment；
Fig. 3 is the particular flow sheet according to step S40 shown in Fig. 2；
Fig. 4 is the connecting curve figure drawn according to step shown in Fig. 3；
Fig. 5 is the vertical view of the speculum of optical module shown in Fig. 2；
Fig. 6 is the side view of the speculum of the optical module of Fig. 2.
The reference numerals are as follows：100, optical module；110, silicon substrate；111, mark point；120, laser；130, thoroughly
Mirror；140, isolator；150, speculum；151, inclined-plane；152,153, seamed edge；160, silicon optical chip.
Specific implementation mode
Embodying the exemplary embodiment of feature of present invention and advantage will describe in detail in the following description.It should be understood that
The present invention can have various variations in different embodiments, neither depart from the scope of the present invention, and theory therein
Bright and diagram inherently is illustrated as being used, rather than to limit the present invention.
Referring to Fig. 1, the present invention provides a kind of optical module 100.
Optical module 100 includes silicon substrate 110, laser 120, lens 130, isolator 140, speculum 150 and silicon light core
Piece 160.
Laser 120, lens 130, isolator 140, speculum 150 are set to the upper surface of silicon substrate 110.Silicon substrate
110 upper surface is equipped with the mark line of laser 120 and the mark line of speculum 150, and laser 120 is used for by mark line
Contraposition attachment and speculum 150 couple initial position determine.The upper surface of silicon substrate 110 offers attachment slot.Attachment
Slot is for mounting lens 130 and isolator 140.
Lens 130 are oppositely arranged with laser 120.Lens 130 are used for the laser beam that confined laser 120 is sent out.
Isolator 140 is located at side of the lens 130 backwards to laser 120.Isolator 140 can prevent in light path due to each
The harmful effect that the reverse transfers light that kind reason generates generates light source and light path system.
Speculum 150 is fixed on the upper surface of silicon substrate 110 by adhesive layer, and positioned at isolator 140 backwards to lens
130 side.Speculum 150 is made of optical glass.
Speculum 150 is prism.The cross section of speculum 150 is trapezoidal.Speculum 150 is set there are one inclined-plane 151, this is tiltedly
Face 151 is reflecting surface, and laser beam is entered through reflective surface in silicon substrate 110.It is coated with height on the reflecting surface of speculum 150
Reflecting layer.
Adhesive layer it is in uneven thickness.It is by dispensing, by pressing in the speculum technique for fixing of traditional optical module
Determine speculum.The bottom surface of speculum approaches with silicon substrate upper surface and is mutually parallel.Therefore, it is formed between speculum and silicon substrate
One glue-line in homogeneous thickness." thickness of glue-line is uniform " herein is within the scope of certain fabrication error.In present embodiment
Optical module in the in uneven thickness of adhesive layer refer to, relative to the glue-line in homogeneous thickness that traditional gluing process is formed
Speech.Speculum 150 can adjust angle and the position that speculum 150 is located at silicon substrate 110 by adhesive layer in uneven thickness,
So that speculum 150 is in Best Coupling point.
Specifically, have between the bottom surface of speculum 150 and the upper surface of silicon substrate 110 there are an angle, make speculum
An adhesive layer in uneven thickness is formed between 150 bottom surface and the upper surface of silicon substrate 110.Specifically in the present embodiment,
The thickness distribution of adhesive layer everywhere is in 10 μm~70 μ ms.
Angle is formed between the bottom surface and the upper surface of silicon substrate 110 of speculum 150.The angular dimension of angle be -3 °~+
3°。
The thickness of adhesive layer is codetermined by the angular dimension and glue property of angle.In general, if using stream
Dynamic preferable UV glue general control gap of property is 10 μm~50 μm.When the angle of angle is 3 °, speculum, which upwarps, makes gap increase
The base length * sin3 ° of big height=speculum.The base length of speculum is about 400 μm, and therefore, speculum upwarps
Make gap sin3 °=20 μm increased height=400 μm *.At this point, one end thickness of adhesive layer is 10 μm~50 μm, the other end
Thickness be 30 μm~70 μm.Therefore, the thickness distribution of adhesive layer everywhere is in 10 μm~70 μ ms.
Specifically in the present embodiment, adhesive layer is glue-line.Spot printing glue on a silicon substrate, by adjusting the position of speculum
It sets, makes the thickness variation of adhesive layer, then adhesive layer is in uneven thickness.In other embodiments, adhesive layer can also be double
Face glue-line or sponge glue-line.The coupling of angle automatching silicon light grating coupler between reflecting surface and the upper surface of silicon substrate 110
Angle.High reflection layer is coated on reflecting surface.High reflection layer can improve the reflectivity of laser beam on the reflecting surface.
Silicon optical chip 160 is set to the lower surface of silicon substrate 110.Laser 120 sends out light beam, focuses, passes through through lens 130
It reflects, is projected from 110 bottom of silicon substrate, into silicon optical chip 160 through speculum 150 after isolator 140.
Also, specifically in the present embodiment, optical module further includes upper cover.Upper cover for encapsulate, protect laser 120,
Lens 130, isolator 140 and speculum 150.
The light module package method of present embodiment includes step：
Please refer to Fig. 2, step S10, silicon substrate is arrived into laser 120, lens 130, the passive attachment of isolator 140
The position specified on 110.
Utilize identifying system, according to the mark line on silicon substrate 110, contraposition attachment and reflection for laser 120
The initial position that mirror 150 couples determines.Silicon substrate 110 is equipped with attachment slot, for mounting lens 130 and isolator 140.It will swash
Light device 120, lens 130, isolator 140 are passive to be mounted on silicon substrate 110.Also, lens 130, isolator 140 are mounted and are arrived
In corresponding attachment slot.
Step S20, the position that will be specified in the passive attachment to silicon optical chip 160 of silicon substrate 110.
Silicon optical chip 160 is equipped with mark point 111, and the passive contraposition for silicon substrate 110 mounts.It is right on silicon substrate 110
It should be coated with antireflective coating in light transmissive position.Antireflective coating can improve the transmitance of silicon substrate 110, to make laser beam
It enters on silicon optical chip 160.
Step S30, fixture fix silicon optical chip 160, are powered up to laser 120, pass through the folder installed on sextuple adjusting bracket
Tool pickup stationary mirror 150, the mark point 111 on silicon substrate 110, the lower surface of speculum 150 are identified by Coupling device
There are angle between 110 upper surface of silicon substrate, make to form benefit between 110 upper surface of lower surface and silicon substrate of speculum 150
Repay gap.By in step S30, the setting of angle, it may be determined that the initial position of speculum 150.
Step S40, sextuple adjusting bracket drive speculum 150 to move, and the Best Coupling point of speculum 150 is found in coupling.
Fixture is fixed on sextuple adjusting bracket, and speculum 150 is fixed on fixture, is adjusted instead by adjusting sextuple adjusting bracket
Penetrate the position of mirror 150.
The optical axis direction of laser 120 is first axis, vertical with the first axis axial for second.For convenience of saying
Bright, the plane where now providing the upper surface of silicon substrate 110 is the plane where X-axis, Y-axis.The light direction of laser is first
Axial forward direction, the i.e. forward direction of X-axis, the light direction perpendicular to laser are second axial, i.e. Y direction.With X-axis, Y direction
Vertical direction be Z-direction.
Referring to Fig. 3, step S40 specifically includes following steps：
Step S41 adjusts sextuple adjusting bracket and speculum 150 is driven to carry out X, Y-direction coupling, finds best power point P1,
And record 150 coordinate of corresponding speculum and performance number.
Pitch angle is the corner dimension between the bottom surface and the upper surface of silicon substrate 110 of speculum 150.Under initial position
Pitch angle Θ1, by adjusting sextuple adjusting bracket, so that speculum 150 is moved along X, Y-direction, coupling finds the pitch angle most
Good power points P1.Then P1150 coordinate of corresponding speculum is (X1, Y1, Θ1)。
Step S42 finely tunes pitch angle, then adjusts sextuple adjusting bracket again and speculum 150 is driven to carry out X, Y direction coupling
Best power point P is found in conjunction2, and record 150 coordinate of corresponding speculum and performance number.
Finely tune pitch angle Θ2, sextuple adjusting bracket is adjusted again, speculum 150 is made to be moved along X, Y-direction, and coupling finds this
The best power point P of pitch angle2, then P2The coordinate of corresponding speculum 150 is (X2, Y2, Θ2)。
Step S43, repeatedly above-mentioned steps S42, repeatedly finely tunes pitch angle, then repeatedly adjusts sextuple adjusting bracket band again
Dynamic speculum 150 carries out X, Y-direction coupling, finds best power point Pn, and record 150 coordinate of corresponding speculum and power
Value.Then PnThe coordinate of corresponding speculum 150 is (Xn, Yn, Θn)。
Step S44, according to the connecting curve between the performance number and pitch angle for drawing best power point P, the highest of curve
The Best Coupling point that the corresponding best power point of point is, and the corresponding coordinate of Best Coupling point is recorded, which is
Best Coupling coordinate.
As shown in figure 4, specifically, using the watt level of best power point P as ordinate, using pitch angle Θ as abscissa,
Draw connecting curve.
For connecting curve there are a peak value, which is Best Coupling point.The corresponding best work(of Best Coupling point
Rate point PnCoordinate position be Best Coupling coordinate.Best Coupling coordinate includes X, Y and pitch angle Θ.Wherein, pitch angle Θ
Angular dimension for angle, angle is -3 °~+3 °.
The lower surface of speculum 150 is a specific compensation gap with 110 upper table interplanar distance of silicon substrate.It is big to compensate gap
Small pitch angle Θ sizes and glue property by Best Coupling coordinate codetermines.In general, if using mobility compared with
The good UV glue general control gap is 10 μm~50 μm.When pitch angle Θ is 3 °, speculum, which upwarps, makes the increased height in gap
The base length * sin3 ° of=speculum.The base length of speculum is about 400 μm, and therefore, speculum, which upwarps, makes gap increase
Big height=400 μm sin3 °=20 μm *.At this point, the clearance height of compensation gap one end is 10 μm~50 μm, between the other end
Gap height is 30 μm~70 μm.
Specifically in the present embodiment, compensate gap everywhere in thickness in 10 μm~70 μ ms.
Referring to Fig. 6, speculum 150 is risen by fixture 2, in 110 corresponding position coating glue of silicon substrate, according to best
Coupling point falls speculum 150 by fixture 2, and the position coordinates fallen are the coordinate of Best Coupling point, and glue fills speculum
The compensation gap of 150 lower surfaces and 110 upper surface of the silicon substrate.Adhesive layer is formed by glue.That is the thickness of adhesive layer is
Compensate the thickness in gap.
When connecting curve takes best power point PnWhen, corresponding coordinate (angle of rotation angle, the angle of deflection angle, pitching
The angle of angle Θ, first axle Xn, the second axis Yn) it is Best Coupling coordinate.At this point, passing through the fixed speculum 150 of dispensing and silicon
Substrate 110 just completes the sextuple coupling package of optical module.
Referring to Fig. 5, the angular dimension of the deflection angle of speculum 150 is the angle that speculum 150 is rotated along Z axis.It please join
Fig. 6 is read, the visual angle of Fig. 6 is towards laser light direction.The angular dimension of the rotation angle of speculum 150 is speculum 150 along X
The angle of axis rotation.The angular dimension of the pitch angle Θ of speculum 150 is the angle that speculum 150 is rotated along Y-axis.
It should be noted that since component size tolerance and attachment error are mainly to cause the huge deviation of pitch angle
Reason, also, the yield of optical module described in the deviation effects of pitch angle.Therefore, in present embodiment, with bowing for speculum 150
Elevation angle Θ carries out active coupling.That is, the rotation angle and deflection angle of speculum 150 are adjusted to 0 degree.That is, the deflection of speculum 150
Angle and rotation angle are adjusted to parallel with silicon substrate 110.Deflection angle is 0 degree, and the inclined-plane of speculum 150 is parallel to silicon substrate 110
Seamed edge 152 be parallel to line between mark point 111.Rotation angle is adjusted to 0 degree, that is, speculum 150 is perpendicular to optical axis direction
Seamed edge 153 is parallel to the upper surface of silicon substrate 110.Therefore, the size of deflection angle and rotation angle be 0, it is only necessary to pitch angle Θ into
The active coupling of row.
It is appreciated that light module package method provided by the present invention, is equally also adapted to deflection angle and/or rotation angle
Active coupling is carried out, the packaging method of Best Coupling point is found, to improve the yield of the optical module.
Step S50 rises the speculum 150 by fixture, in 110 corresponding position coating glue of the silicon substrate, root
According to Best Coupling point, the speculum 150 is fallen by the fixture, the position coordinates fallen are the coordinate of Best Coupling point,
Glue fills the compensation gap of 150 lower surface of the speculum and 110 upper surface of silicon substrate.Speculum 150 is solid by adhesive layer
It is scheduled on the upper surface of silicon substrate 110.
Due between fixed 150 bottom surface of speculum of active coupling and 110 upper surface of silicon substrate -3 ° due to there are one~+
3 ° of angle, so the bondline thickness of filling adhesive layer is accordingly also uneven.
Also, the adhesive layer of the optical module 100 of present embodiment selects UV glue can be with attachment lens 130, isolator 140
UV glue it is different.The adhesive layer of the optical module of present embodiment can require selection different model according to cured shrinking percentage is coupled
UV glue.For example, glue can select the lower UV glue of shrinking percentage.
The optical module 100 of present embodiment, by way of passive attachment, by laser 120, lens 130, isolator
140 are mounted on silicon substrate 110, and then by way of passive attachment, silicon substrate 110 is mounted on silicon optical chip 160.So
Afterwards by the way of active coupling, the grating that 120 light extraction of laser is coupled into silicon optical chip 160 by speculum 150 couples
Device, dispensing stationary mirror 150.
Using the light module package method of present embodiment, it is only necessary to carry out primary active coupling, remaining device uses
Passive attachment.Speculum 150 is fixed on the upper surface of the silicon substrate 110, and the uneven thickness of adhesive layer by adhesive layer
It is even.Above-mentioned optical module adjusts fixed position and the fixed angle of speculum 150 according to the thickness of adhesive layer, so that speculum
150 are in Best Coupling point.So as to the error that compensatory reflex mirror 150 is brought due to gluing deformation, supplied materials size etc., improve
The coupling yield of optical module.Compared to traditional coupling package method, when reprocessing, speculum 150 need to only be dismounted
Reprocess, reprocess that speculum 150 is relatively easy, avoid reprocessing the difficulty for removing silicon substrate 110, and improve reprocess it is good
Rate.
Although describing the present invention with reference to several exemplary embodiments, it is to be understood that, term used be explanation and
Term exemplary, and not restrictive.Due to the present invention can be embodied in a variety of forms without departing from invention spirit or
Essence, it should therefore be appreciated that the above embodiment is not limited to any details above-mentioned, and should be defined by appended claims
Widely explained in spirit and scope, thus the whole variations fallen into claim or its equivalent scope and remodeling all should be with
Attached claim is covered.
Claims (9)
1. a kind of optical module, including：
Silicon substrate；
Laser is set to the upper surface of the silicon substrate；
Lens are set to the upper surface of the silicon substrate, and the lens are oppositely arranged with the laser；
Isolator is set to the upper surface of the silicon substrate, and the isolator is located at the lens backwards to the one of the laser
Side；
Speculum is fixed on the upper surface of the silicon substrate by adhesive layer, and the speculum is located at the isolator backwards
The side of the lens, the adhesive layer it is in uneven thickness；
Silicon optical chip is set to the lower surface of the silicon substrate；
The laser sends out light beam, through the lens focus, by being reflected through the speculum after the isolator, into institute
State silicon optical chip.
2. optical module according to claim 1, which is characterized in that the thickness distribution of the adhesive layer everywhere is 10 μm~70
In μ m.
3. optical module according to claim 1, which is characterized in that the upper table of the bottom surface of the speculum and the silicon substrate
Angle is formed between face, the angular dimension of the angle is -3 °~+3 °.
4. optical module according to claim 1, which is characterized in that the upper surface of the silicon substrate is equipped with multiple mark lines,
Initial position of the mark line for contraposition attachment and the speculum coupling of laser determines.
5. optical module according to claim 1, which is characterized in that the upper surface of the silicon substrate offers attachment slot, institute
Attachment slot is stated for mounting the lens and the isolator.
6. optical module according to claim 1, which is characterized in that be coated with high reflection layer on the reflecting surface of the speculum.
7. optical module according to claim 1, which is characterized in that the adhesive layer is glue layer, the material of the glue layer
Material be the first glue, the lens and or the isolator pass through the second glue fitting fix.
8. optical module according to claim 1, which is characterized in that the optical module further includes upper cover, and the upper cover is used for
It encapsulates, protect the laser, lens, isolator and speculum.
9. optical module according to claim 1, which is characterized in that be coated with corresponding to light transmissive position on the silicon substrate
Antireflective coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810298868.2A CN108508551A (en) | 2018-03-30 | 2018-03-30 | A kind of optical module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810298868.2A CN108508551A (en) | 2018-03-30 | 2018-03-30 | A kind of optical module |
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| Publication Number | Publication Date |
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| CN108508551A true CN108508551A (en) | 2018-09-07 |
Family
ID=63380716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810298868.2A Pending CN108508551A (en) | 2018-03-30 | 2018-03-30 | A kind of optical module |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109343180A (en) * | 2018-09-11 | 2019-02-15 | 深圳市易飞扬通信技术有限公司 | Laser and silicon optical chip coupled structure and its encapsulating structure and packaging method |
| CN109541760A (en) * | 2018-11-16 | 2019-03-29 | 宁波环球广电科技有限公司 | Optical transceiver module |
| CN111338039A (en) * | 2020-04-21 | 2020-06-26 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN111694111A (en) * | 2019-03-15 | 2020-09-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113204082A (en) * | 2021-04-30 | 2021-08-03 | 上海曦智科技有限公司 | Method for manufacturing photonic semiconductor device |
| WO2022021917A1 (en) * | 2020-07-28 | 2022-02-03 | 武汉电信器件有限公司 | Optical path coupling method and device, and storage medium |
| US11828991B2 (en) | 2019-03-15 | 2023-11-28 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
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| US20160252679A1 (en) * | 2013-11-15 | 2016-09-01 | Fujikura Ltd. | Light guide device, manufacturing method, and laser diode module |
| CN106019496A (en) * | 2016-05-31 | 2016-10-12 | 武汉光迅科技股份有限公司 | Light source packaging structure, and positioning and coupling method thereof |
| CN107688217A (en) * | 2017-10-23 | 2018-02-13 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109343180A (en) * | 2018-09-11 | 2019-02-15 | 深圳市易飞扬通信技术有限公司 | Laser and silicon optical chip coupled structure and its encapsulating structure and packaging method |
| CN109541760A (en) * | 2018-11-16 | 2019-03-29 | 宁波环球广电科技有限公司 | Optical transceiver module |
| CN111694111A (en) * | 2019-03-15 | 2020-09-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN111694111B (en) * | 2019-03-15 | 2022-11-11 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US11828991B2 (en) | 2019-03-15 | 2023-11-28 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
| CN111338039A (en) * | 2020-04-21 | 2020-06-26 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2022021917A1 (en) * | 2020-07-28 | 2022-02-03 | 武汉电信器件有限公司 | Optical path coupling method and device, and storage medium |
| CN113204082A (en) * | 2021-04-30 | 2021-08-03 | 上海曦智科技有限公司 | Method for manufacturing photonic semiconductor device |
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