CN107688217A - Optical module - Google Patents
Optical module Download PDFInfo
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- CN107688217A CN107688217A CN201710994611.6A CN201710994611A CN107688217A CN 107688217 A CN107688217 A CN 107688217A CN 201710994611 A CN201710994611 A CN 201710994611A CN 107688217 A CN107688217 A CN 107688217A
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- Prior art keywords
- light
- lens
- silicon substrate
- chip
- collimation lens
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The embodiment of the present invention provides a kind of optical module, including：Silicon substrate optical chip, the substrate being arranged on above silicon substrate optical chip, the laser chip and reflecting surface being arranged on above substrate, substrate is provided with collimation lens, silicon substrate optical chip is provided with collector lens, reflecting surface, and the light for laser chip to be sent reflexes to collimation lens；Collimation lens, the light for will be reflected on collimation lens are converted into parallel light emergence to collector lens；Collector lens, injected for the directional light incided on collector lens to be converted into converging light in silicon substrate optical chip.The optical module, parallel optical transport between light transmitting terminal and silicon substrate optical chip, and then the PT positional tolerance and coupling efficiency of light transmitting terminal and silicon substrate optical chip are substantially increased, reduce coupling cost.
Description
Technical field
The present embodiments relate to photoelectric communication technology, more particularly to a kind of optical module.
Background technology
The photoelectric chip integrated based on silicon substrate is current study hotspot, Si-based OEIC technology be by fiber waveguide/
Modulator, photodetector and drive circuit and acceptor circuit carry out single-chip integration, i.e., by optical element and electricity component collection
Into on a single die.But because silicon is indirect semiconductor material, the extreme value of its conduction band and valence band corresponds to different ripples and lost,
Radiation recombination probability is very low, and two strong nonradiative transition process, i.e. auger recombination and free-carrier Absorption be present, because
This, silicon materials can not be fabricated to laser component.Current silicon substrate optical chip, III-V external race's laser of generally use come
Light source is done, the input of light source is realized by way of being coupled and aligned.
Conventional laser by the laser hot spot of diverging with grating coupling structure, grating position is focused on by condenser lens
Put, light source is input in photoelectric chip.But in this configuration, the relative position tolerance of laser and grating coupler
Often it is limited, coupling efficiency is low.
The content of the invention
The embodiment of the present invention provides a kind of optical module, is limited with solving existing optical module PT positional tolerance so that coupling effect
The problem of rate is low.
The embodiment of the present invention provides a kind of optical module, including：Silicon substrate optical chip, it is arranged on above the silicon substrate optical chip
Substrate, the laser chip and reflecting surface being arranged on above the substrate, the substrate are provided with collimation lens, the silicon substrate light core
Piece is provided with collector lens；
The reflecting surface, the light for the laser chip to be sent reflex to the collimation lens；
The collimation lens, parallel light emergence is converted into the optically focused for will be reflected to the light on the collimation lens
Lens；
The collector lens, the silicon is injected for the directional light incided on the collector lens to be converted into converging light
In base optical chip.
In a kind of possible implementation of the present embodiment, the silicon substrate optical chip is provided with grating coupler, described
Grating coupler is arranged on the lower section of the collector lens；
The collector lens, specifically for the converging light is emitted into the grating coupler, so that the grating coupling
Clutch is coupled to the converging light, and the light after coupling is injected in the silicon substrate optical chip.
In the alternatively possible implementation of the present embodiment, be covered with lid in the substrate, the upper lid it is interior
Side wall is ramped side walls, and the ramped side walls form the reflecting surface.
In the alternatively possible implementation of the present embodiment, speculum is provided with above the silicon substrate optical chip,
The speculum forms the reflecting surface.
In the alternatively possible implementation of the present embodiment, the collimation lens is arranged on the upper table of the substrate
Face；Or the collimation lens is arranged on the inside of the substrate；Or the collimation lens is arranged under the substrate
Surface.
In the alternatively possible implementation of the present embodiment, the collector lens is arranged on the silicon substrate optical chip
Upper surface；Or the collector lens is arranged on the inside of the silicon substrate optical chip.
In the alternatively possible implementation of the present embodiment, the collimation lens is convex lens, for will be reflected to
Diverging light on the collimation lens is converted into directional light, and is emitted to the collector lens；
Or the collimation lens is concavees lens, is converted into putting down for will be reflected to the converging light on the collimation lens
Row light, and it is emitted to the collector lens.
In the alternatively possible implementation of the present embodiment, it is provided between the laser chip and the reflecting surface
Lens, the light that the lens are used to send the laser chip enters line convergence, and the light after convergence is emitted into the reflection
Face.
In the alternatively possible implementation of the present embodiment, it is provided with and isolates between the reflecting surface and the lens
Device.
In the alternatively possible implementation of the present embodiment, the collimation lens and the PT positional tolerance of the substrate are small
In or equal to 1um, the PT positional tolerance of the collector lens and the grating coupler is less than or equal to 1um.
Optical module provided in an embodiment of the present invention, by set silicon substrate optical chip, above silicon substrate optical chip set substrate,
Laser chip and reflecting surface, substrate is set to be provided with collimation lens above substrate, silicon substrate optical chip is provided with collector lens.Its
In, reflecting surface, the light for laser chip to be sent reflexes to collimation lens, and collimation lens is saturating for will be reflected to collimation
Light on mirror is converted into parallel light emergence and turned to collector lens, collector lens, the directional light for that will incide on collector lens
Converging light is changed into inject in silicon substrate optical chip.So cause the light transmitting terminal hair that laser chip, reflecting surface and collimation lens are formed
Directional light is penetrated, silicon substrate optical chip receives directional light, and because directional light can transmit over long distances, and transmission loss is low, and then improves
The PT positional tolerance of light transmitting terminal and silicon substrate optical chip.Meanwhile collector lens is carried out to the directional light for inciding silicon substrate optical chip
Assemble, form converging light, and silicon substrate optical chip is injected into the converging light, and then improve coupling efficiency.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are this hairs
Some bright embodiments, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of existing optical module；
Fig. 2 is the structural representation of optical module embodiment one provided by the invention；
Fig. 3 is the structural representation of optical module embodiment two provided by the invention；
Fig. 4 is another structural representation of optical module embodiment two provided by the invention.
Description of reference numerals：
100：Laser box；
110：Substrate；
111：Etching groove；
120：Laser chip；
130：Reflecting surface；
140：Collimation lens；
150：Isolator；
160：Lens；
170：Upper lid；
171：Ramped side walls.
200：Silicon substrate optical chip；
210：Grating coupler；
220：Material platform；
230：Collector lens.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
Fig. 1 is the structural representation of existing optical module.As shown in figure 1, existing optical module (that is, is swashed by Laser Box
Light box 100) and silicon substrate optical chip 200 form, wherein laser box 100 is lasing light emitter, by laser box 100 and silicon substrate optical chip
200 relative position alignment so that laser box 100 send optically coupling in silicon substrate optical chip 200.Laser box 100 is by upper lid
170th, substrate 110, laser chip 120, lens 160 and isolator 150 collectively constitute.Light is produced by laser chip 120 first,
The diverging light that laser chip 120 is sent is entered line convergence by lens 160, and the light of convergence passes through isolator 150 and laser box 100 successively
Ramped side walls 171, reflex in substrate 110, and be emitted to from the bottom surface of substrate 110 on silicon substrate optical chip 200.Silicon substrate light
Chip 200 is collectively constituted by material platform 220 and grating coupler 210.The major function of grating coupler 210 is to from silicon substrate
The incident light in the upper surface of optical chip 200 is collected, and is coupled into material platform 220.
In the coupled structure of existing laser box 100 and silicon substrate optical chip 200, because light is emitted from laser chip 120,
Received to grating coupler 210, its space length is longer, thus must be introduced into the convergence that lens 160 carry out light beam, by reasonable
Parameter designing, the size of the final spot size and grating coupler 210 for incide grating coupler 210 matches,
So as to form higher coupling efficiency.But in this configuration, the relative position of laser box 100 and silicon substrate optical chip 200 is held
Difference is often limited.This is mainly, on the one hand, the transmitting and reception of converging light, can bring limit to the PT positional tolerance in short transverse
System；On the other hand, because the light spot received area of grating coupler 210 is often limited by designing, its size is smaller, therefore swashs
Light box 100 is with the PT positional tolerance of silicon substrate optical chip 200 in the horizontal also only in 1~2um.When laser and grating coupler
210 relative position tolerance is by limited time, it is desirable to which the making precision of laser box 100 and silicon substrate optical chip 200 is high, so undoubtedly increases
Coupling cost, reduces coupling overall efficiency.
Optical module provided in an embodiment of the present invention, by setting collimation lens in light transmitting terminal, make the outgoing of light transmitting terminal flat
Row light, and silicon substrate optical chip receives directional light.Because directional light can transmit over long distances, and transmission loss is low, and then increases
The PT positional tolerance of coupling.Meanwhile collector lens enters line convergence to the directional light for inciding silicon substrate optical chip, converging light is formed, and
Silicon substrate optical chip is injected into the converging light, and then improves coupling efficiency.
Meanwhile the optical module of the present embodiment is by controlling the parameter of lens to design the size of parallel hot spot, when parallel
When hot spot is very big, its horizontal level tolerance coupled also accordingly increases.
Technical scheme is described in detail with specifically embodiment below.These specific implementations below
Example can be combined with each other, and may be repeated no more for same or analogous concept or process in some embodiments.
Fig. 2 is the structural representation of optical module embodiment one provided by the invention.As shown in Fig. 2 the optical mode of the present embodiment
Block includes：Silicon substrate optical chip 200, the substrate 110 for being arranged on the top of silicon substrate optical chip 200, the laser for being arranged on the top of substrate 110
Chip 120 and reflecting surface 130, substrate 110 are provided with collimation lens 130, and silicon substrate optical chip 200 is provided with collector lens 230.
Wherein, reflecting surface 130, the light for laser chip 120 to be sent reflex to collimation lens 140.
Collimation lens 140, parallel light emergence is converted into collector lens for will be reflected to the light on collimation lens 140
230。
Collector lens 230, silicon substrate light core is injected for the directional light incided on collector lens 230 to be converted into converging light
In piece 200.
As shown in Fig. 2 the substrate 110 of the present embodiment, laser chip 120 and reflecting surface 130 form light transmitting terminal, it is designated as swashing
Light box 100.
In order to improve the PT positional tolerance of laser box 100 and silicon substrate optical chip 200, transmitting of the present embodiment in laser box 100
End and the reception top of silicon substrate optical chip 200 are reasonably designed.Specifically, collimation lens 140 is set in substrate 110,
In silicon substrate optical chip 200, collector lens 230 is set.Wherein, reflecting surface 130 is reflected the light that laser chip 120 is sent, instead
It is mapped on collimation lens 140, the light that collimation lens 140 will be reflected to thereon is converted into directional light, and is emitted to collector lens 230
On.The directional light that collimation lens 140 is injected is converged to converging light by collector lens 230 again, and is emitted to silicon substrate optical chip 200
In.
That is the present embodiment, by setting collimation lens 140 in substrate 110 so that the light that laser box 100 is emitted is parallel
Light, the directional light is incided to the top of silicon substrate optical chip 200, so that passed between laser box 100 and silicon substrate optical chip 200
Defeated light is directional light, and the directional light can transmit over long distances, and transmission loss is low, and then improves laser box 100 and silicon substrate
The PT positional tolerance of optical chip 200.Meanwhile collector lens 230 is set on silicon substrate optical chip 200, the collector lens 230 is to inciding
The directional light of silicon substrate optical chip 200 enters line convergence, forms converging light, and the converging light is injected into silicon substrate optical chip 200, Jin Erti
High coupling efficiency.
Further, the optical module of the present embodiment, the collimated light beam coupled between laser box 100 and silicon substrate optical chip 200
Hot spot can freely design, when the hot spot of collimated light beam becomes big, laser box 100 and silicon substrate optical chip 200 are planar
PT positional tolerance will also greatly improve, and further improve coupling efficiency.
That is the optical module of the present embodiment, the position of laser box 100 and silicon substrate optical chip 200 in short transverse and horizontal direction
Put tolerance to increase so that the process allowance of laser box 100 and silicon substrate optical chip 200 also increases therewith, is easy to adding for optical module
Work manufactures, and then reduces the coupling cost of optical module.
It should be noted that the relative position between collimation lens 140 and collector lens 230, with specific reference to actual conditions
Set, the present embodiment is without limitation.Wherein, the directional light that collimation lens 140 is emitted is as more as possible after transmission
Incide on collector lens 230 on ground.
The present embodiment collimation 140 particular location in substrate 110 of lens is not limited, for example, collimation lens 140 can
To be arranged on the upper surface of substrate 110.Or collimation lens 140 can be arranged on the inside of substrate 110.Or collimation lens
140 can be arranged on the lower surface of substrate 110.
The present embodiment is not also limited to particular location of the collector lens 230 on silicon substrate optical chip 200, for example, optically focused
Lens 230 can be arranged on the upper surface of silicon substrate optical chip 200.Or collector lens 230 can be arranged on silicon substrate optical chip
200 inside.
The reflecting surface 130 of the present embodiment can be arranged on the top of substrate 110, can also be arranged on laser box 100 other
Position, the present embodiment is without limitation, as long as ensureing that light caused by laser chip 120 can be reflexed to standard by reflecting surface 130
On straight lens 140.
The collimation lens 140 of the present embodiment can be arranged in substrate 110 by the mode such as etching, being bonded, and optionally, gathered
Optical lens 230 can also be arranged on silicon substrate optical chip 200 by the mode such as etching, being bonded, wherein glue used in bonding can
To pass light through.
Optical module provided in an embodiment of the present invention, by set silicon substrate optical chip, above silicon substrate optical chip set substrate,
Laser chip and reflecting surface, substrate is set to be provided with collimation lens above substrate, silicon substrate optical chip is provided with collector lens.Its
In, reflecting surface, the light for laser chip to be sent reflexes to collimation lens, and collimation lens is saturating for will be reflected to collimation
Light on mirror is converted into parallel light emergence and turned to collector lens, collector lens, the directional light for that will incide on collector lens
Converging light is changed into inject in silicon substrate optical chip.So cause the light transmitting terminal hair that laser chip, reflecting surface and collimation lens are formed
Directional light is penetrated, silicon substrate optical chip receives directional light, and because directional light can transmit over long distances, and transmission loss is low, and then improves
The PT positional tolerance of light transmitting terminal and silicon substrate optical chip, reduce the manufacturing cost of optical module.Meanwhile collector lens is to inciding silicon
The directional light of base optical chip enters line convergence, forms converging light, and the converging light is injected into silicon substrate optical chip, and then improves coupling
Efficiency.
With continued reference to shown in Fig. 2, the silicon substrate optical chip 200 of the present embodiment is additionally provided with grating coupler 210, grating coupling
Device 210 is arranged on the lower section of collector lens 230.Collector lens 230, grating is emitted to specifically for the converging light for changing itself
Coupler 210, so that grating coupler 210 couples to converging light, and the light after coupling is injected into silicon substrate optical chip 200
In.
In the present embodiment, in order to further improve coupling efficiency, then grating coupler is set on silicon substrate optical chip 200
210, the grating coupler 210 is located at the lower section of collector lens 230.So, collector lens 230 is by collimation lens 140 incident
Directional light enters line convergence, and after forming converging light, the converging light is incided on grating coupler 210.Grating coupler 210 is to entering
The converging light penetrated is coupled, and the light after coupling is injected in silicon substrate optical chip 200, and then improves the coupling effect of optical module
Rate.
Optionally, the present embodiment can also use other devices that there is optical coupling to act on to replace grating coupler 210.
Fig. 3 is the structural representation of optical module embodiment two provided by the invention, and Fig. 4 is that optical module provided by the invention is real
Apply another structural representation of example two.As shown in Figure 3 and Figure 4, it is described in a kind of possible implementation of reflecting surface 130
Lid 170 is covered with substrate 110, the madial wall of the upper lid 170 is ramped side walls 171, and the ramped side walls 171 form institute
State reflecting surface 130.
I.e. the present embodiment reduces the number of components of optical module, simplifies light using the side wall of upper lid 170 as reflecting surface 130
The structure of module.
Optionally, in the alternatively possible implementation of reflecting surface, the present embodiment can also be set above substrate 110
Speculum is put, using the speculum as reflecting surface 130.
In the implementation of collimation lens 140 and collector lens 230, as shown in figure 3, the collimation lens 140 is convex
Lens, directional light is converted into for will be reflected to the diverging light on the collimation lens 140, and is emitted to the collector lens
230.Or as shown in figure 4, the collimation lens 140 is concavees lens, for will be reflected to the meeting on the collimation lens 140
Optically focused is converted into directional light, and is emitted to the collector lens 230.
In actual use, the light incided on collimation lens 140 is generally divided into diverging light and converging light.In the present embodiment
In, as shown in figure 3, when the light after the reflection of reflecting surface 130 is diverging light, collimation lens 140 needs to enter guild to the diverging light
It is poly-, directional light is formed, now, the collimation lens 140 of the present embodiment can be convex lens.As shown in figure 4, when reflecting surface 130 is anti-
When light after penetrating is converging light, collimation lens 140 needs to disperse the converging light, forms directional light, now, the present embodiment
Collimation lens 140 can be concavees lens.Its is simple in construction for the collimation lens 140 of the present embodiment, and then reduces optical module
Processing technology and cost of manufacture.
It should be noted that the convex lens of the present embodiment can be common thick middle, the thin structure in both sides or
With the level crossing or non-planar mirror that diverging light is converted into directional light.Meanwhile the concavees lens of the present embodiment can be common
Intermediate thin, the thick structure in both sides or with the level crossing or non-planar mirror that converging light is converted into directional light, this
Embodiment is not specifically limited to this.
The design parameter of collimation lens 140 can be flat according to the design size of optical module and default outgoing in the present embodiment
Row light spot size determines.For example, the parameter of the collimation lens 140 can be the situation in the design size permission of optical module
It is lower to obtain maximum sized outgoing directional light hot spot.Wherein, it is bigger to be emitted the bigger corresponding PT positional tolerance of directional light hot spot, so
Coupling efficiency also greatly improves.
As shown in Figure 3 and Figure 4, directional light is converted into assembling optically coupling to silicon substrate light by the collector lens 230 of the present embodiment
In chip 200, therefore the second saturating structure of collimation includes but is not limited to traditional toroidal lens structure (such as concavees lens), also wraps
The plane or nonplanar structure of light beam convergence can be realized by including other.
The design parameter of collector lens 230 can be according to 210 receivable optimal spot of grating coupler in the present embodiment
Size and default incident parallel light spot size determine.
In a kind of set-up mode of collimation lens 140, shown in reference picture 3 and Fig. 4, the present embodiment is at the bottom of substrate 110
Portion is provided with etching groove 111, and collimation lens 140 is arranged in etching groove 111.
Specifically, it can use the technologies such as photoetching that one etching groove 111 is set in the bottom of substrate 110, by collimation lens 140
It is arranged in the etching groove 111.The collimation lens 140 can be disposed entirely within the etching groove 111, i.e. the etching groove 111
Depth is more than the height of collimation lens 140.Optionally, collimation lens 140 can be partly arranged in the etching groove 111, this reality
It is without limitation to apply example, is set with specific reference to being actually needed.
Optionally, as shown in Figure 3 and Figure 4, the lower surface of the collimation lens 140 of the present embodiment and the lower surface of substrate 110
Concordantly, the connective stability of collimation lens 140 and substrate 110 can so be improved.
In order to improve the coupling efficiency of optical module, then in the present embodiment collimation lens 140 and substrate 110 relative position with
And the relative position of collector lens 230 and grating coupler 210 is required for control very accurately within position deviation.It is preferred that
, the PT positional tolerance of the collimation lens 140 and the substrate 110 is less than or equal to 1um, the collector lens 230 with it is described
The PT positional tolerance of grating coupler 210 is less than or equal to 1um.Accurately position can use the process meanses of photoetching strictly to protect for this
Card, now, the position alignment tolerance can of laser box 100 and silicon substrate optical chip 200 is more loose, and then improves laser box
100 with the PT positional tolerance of silicon substrate optical chip 200.
In a kind of possible implementation of the present embodiment, between the laser chip 120 and the reflecting surface 130
It is provided with lens 160, the light that the lens 160 are used to send the laser chip 120 enters line convergence, and by the light after convergence
It is emitted on the reflecting surface 130.
, can be in the light path in the present embodiment when the light path between laser chip 120 and grating coupler 210 is longer
Upper setting lens 160, line convergence is entered to light beam, and then ensures that the light that laser chip 120 is sent can be for transmission to grating coupler
On 210.The lens 160 of the present embodiment can be fixedly installed in substrate 110, can also be fixed on other positions of laser box 100
Place is put, such as is fixed on lid 170, the present embodiment is without limitation, as long as ensureing that lens 160 are arranged on laser chip
Between 120 and reflecting surface 130, and the light that laser chip 120 is sent can be converged on reflecting surface 130.
With continued reference to shown in Fig. 3 and Fig. 4, isolator 150 is provided between the reflecting surface 130 and the lens 160.
Because semiconductor laser chip 120 is very sensitive to reflected light, its penalty can be caused, it is therefore desirable to isolator
150 prevent reflected light.Isolator 150 be only allow light along a direction by and stop in the opposite direction light that light passes through without
Source device.I.e. the present embodiment sets isolator 150 to enter with blocking reflected light between laser chip 120 and reflecting surface 130
Laser chip 120, and then improve the job stability of the service life sum of laser chip 120.The isolator 150 of the present embodiment
Can be fixedly installed in substrate 110 can also be fixed at the other positions of laser box 100, and the present embodiment is not limited this
System, as long as ensureing that isolator 150 is arranged between laser chip 120 and reflecting surface 130, and laser can be entered with blocking reflected light
Chip 120.
Optionally, the isolator 150 can also be arranged between laser chip 120 and the lens 160, blocking reflected
Light enters laser chip 120.
Optical module provided in an embodiment of the present invention, covered by being set in the top of substrate cover, using upper lid inwall as reflection
Face, and then reduce the number of components of optical module, simplify the structure of optical module.Meanwhile when speculum reflects diverging light, will
Collimation lens is arranged to convex lens, and the diverging light for speculum to be reflected is converted into directional light, and is emitted to collector lens.When
When speculum reflects converging light, collimation lens is arranged to concavees lens, the converging light for speculum to be reflected is converted into putting down
Row light, and it is emitted to collector lens.Its is simple in construction for the collimation lens of the structure, is fixed conveniently, and then reduce optical module
Processing technology and cost of manufacture.Further, the present embodiment sets isolator and lens also above substrate, improves optical module
Coupling efficiency and functional reliability.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, either which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
- A kind of 1. optical module, it is characterised in that including：Silicon substrate optical chip, the substrate being arranged on above the silicon substrate optical chip, set Square on the substrate laser chip and reflecting surface are put, the substrate is provided with collimation lens, and the silicon substrate optical chip is set There is collector lens；The reflecting surface, the light for the laser chip to be sent reflex to the collimation lens；The collimation lens, for will be reflected to the light on the collimation lens, to be converted into parallel light emergence saturating to the optically focused Mirror；The collector lens, the silicon substrate light is injected for the directional light incided on the collector lens to be converted into converging light In chip.
- 2. optical module according to claim 1, it is characterised in that the silicon substrate optical chip is provided with grating coupler, institute State the lower section that grating coupler is arranged on the collector lens；The collector lens, specifically for the converging light is emitted into the grating coupler, so that the grating coupler The converging light is coupled, and the light after coupling is injected in the silicon substrate optical chip.
- 3. optical module according to claim 1, it is characterised in that be covered with lid in the substrate, the upper lid it is interior Side wall is ramped side walls, and the ramped side walls form the reflecting surface.
- 4. optical module according to claim 1, it is characterised in that speculum is provided with above the silicon substrate optical chip, The speculum forms the reflecting surface.
- 5. according to the optical module described in claim any one of 1-4, it is characterised in that the collimation lens is arranged on the substrate Upper surface；Or the collimation lens is arranged on the inside of the substrate；Or the collimation lens is arranged on the base The lower surface at bottom.
- 6. according to the optical module described in claim any one of 1-4, it is characterised in that the collector lens is arranged on the silicon substrate The upper surface of optical chip；Or the collector lens is arranged on the inside of the silicon substrate optical chip.
- 7. according to the optical module described in claim any one of 1-4, it is characterised in that the collimation lens is convex lens, is used for The diverging light that will be reflected on the collimation lens is converted into directional light, and is emitted to the collector lens；Or the collimation lens is concavees lens, directional light is converted into for will be reflected to the converging light on the collimation lens, And it is emitted to the collector lens.
- 8. according to the optical module described in claim any one of 1-4, it is characterised in that the laser chip and the reflecting surface it Between be provided with lens, the light that the lens are used to send the laser chip enters line convergence, and the light after convergence is emitted to The reflecting surface.
- 9. optical module according to claim 8, it is characterised in that be provided with and isolate between the reflecting surface and the lens Device.
- 10. optical module according to claim 2, it is characterised in that the collimation lens and the PT positional tolerance of the substrate Less than or equal to 1um, the PT positional tolerance of the collector lens and the grating coupler is less than or equal to 1um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710994611.6A CN107688217A (en) | 2017-10-23 | 2017-10-23 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710994611.6A CN107688217A (en) | 2017-10-23 | 2017-10-23 | Optical module |
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| Publication Number | Publication Date |
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| CN107688217A true CN107688217A (en) | 2018-02-13 |
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| CN201710994611.6A Pending CN107688217A (en) | 2017-10-23 | 2017-10-23 | Optical module |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108508551A (en) * | 2018-03-30 | 2018-09-07 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN110388576A (en) * | 2018-04-23 | 2019-10-29 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN111694113A (en) * | 2019-03-15 | 2020-09-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2020186862A1 (en) * | 2019-03-15 | 2020-09-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN111948761A (en) * | 2019-05-14 | 2020-11-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113948958A (en) * | 2021-10-18 | 2022-01-18 | 中国工程物理研究院电子工程研究所 | Preparation method of integrated light source |
| US11828991B2 (en) | 2019-03-15 | 2023-11-28 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
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| US20060164738A1 (en) * | 2003-07-10 | 2006-07-27 | Ryo Yamamoto | Optical path change type optical coupling element |
| CN101147088A (en) * | 2005-02-16 | 2008-03-19 | 应用材料股份有限公司 | Optical coupling to IC chip |
| CN203084244U (en) * | 2012-12-28 | 2013-07-24 | 武汉电信器件有限公司 | Optical assembly for parallel transmission |
| CN105629404A (en) * | 2016-04-08 | 2016-06-01 | 四川华拓光通信股份有限公司 | Coupling lens device applied to vertical cavity surface emitting laser |
| CN106019496A (en) * | 2016-05-31 | 2016-10-12 | 武汉光迅科技股份有限公司 | Light source packaging structure, and positioning and coupling method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108508551A (en) * | 2018-03-30 | 2018-09-07 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN110388576A (en) * | 2018-04-23 | 2019-10-29 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN111694113A (en) * | 2019-03-15 | 2020-09-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2020186862A1 (en) * | 2019-03-15 | 2020-09-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US11828991B2 (en) | 2019-03-15 | 2023-11-28 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
| CN111948761A (en) * | 2019-05-14 | 2020-11-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113948958A (en) * | 2021-10-18 | 2022-01-18 | 中国工程物理研究院电子工程研究所 | Preparation method of integrated light source |
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