CN107942451A - A kind of coupling process and coupled structure of silicon optical chip - Google Patents
A kind of coupling process and coupled structure of silicon optical chip Download PDFInfo
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- CN107942451A CN107942451A CN201711341732.7A CN201711341732A CN107942451A CN 107942451 A CN107942451 A CN 107942451A CN 201711341732 A CN201711341732 A CN 201711341732A CN 107942451 A CN107942451 A CN 107942451A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
Abstract
The present invention relates to silicon optical chip coupling technique field, there is provided a kind of coupling process and coupled structure of silicon optical chip.Wherein coupled structure includes optical module, silicon optical chip 1 and pcb board 8, and wherein optical module includes chip of laser 2, coupled lens 3, optical fiber 4, glass cover-plate 5, V grooves substrate 6 and external-connected port 7, and coupling process includes：Silicon optical chip 1 and V grooves substrate 6 are adhesively fixed on pcb board 8；Optical fiber 4 is arranged in the chip V grooves 11 that silicon optical chip 1 is coupled on end face, and the other end is placed in the V-groove 61 of V grooves substrate 6.The silicon optical chip that the present invention uses is end coupling structure, and simplifies the coupling package difficulty of silicon waveguide by V slot structures, realizes that passive coupling encapsulates.
Description
【Technical field】
The present invention relates to silicon optical chip coupling technique field, coupling process and coupling more particularly to a kind of silicon optical chip
Structure.
【Background technology】
With the business explosion such as mobile interchange, big data, HD video, to capacity of communication system and transmission rate
Demand is continuously improved.Silicon-based photonics integration technology based on SOI materials becomes the trend of optical device future development.Silicon waveguide has
High index-contrast, can realize compact-sized photonic device under CMOS compatible technologies.It can also be integrated at the same time with microelectronic component,
Realize that multiple photoelectric cells integrate, realize that standardization, mass make, can effectively reduce device cost.
Silicon waveguide dimensions are submicron order, and light field mould spot is less than 1 μm, differs larger with 8-10 μm of the mould spot in optical fiber.
Mould spot mismatch between the two, can cause optical fiber and the direct-coupling of silicon waveguide to have very big loss.Therefore as silicon waveguide and outside
The interface of boundary's optical fiber connection, silicon waveguide coupled structure become the difficult point that silicon optical chip is designed and encapsulated.
Common silicon optical chip Waveguide end face coupled structure has positive wedge-shaped or reverse wedge-shaped two kinds of special design structures, and two
Kind design is all widely studied and applies in actual product.Positive wedge shape is more using thick silicon technology, the silicon optical chip of design
Size is larger.Positive wedge shape coupled structure coupling package technique is consistent with conventional PLC chip coupling package, and difficulty is relatively small.
Reverse wedge structure design can allow chip size more compact, and reverse wedge-shaped design is designed using cantilever design, cantilever waveguiding structure
It is more sensitive to extraneous stress, it is necessary to develop new encapsulating structure and method during coupling package, ensure product productibility and
Reliability.
Chip of light waveguide, which is coupled and aligned, is divided into two kinds of active alignment and packaging passive alignment.Active alignment be by luminous power or
The monitoring of electric current, high precision apparatus adjust the relative position of optical fiber component and waveguide chip, reach Best Coupling effect.It is passive right
Standard be by aid mark or structure, under vision facilities, realize optical fiber component and fiber waveguide being coupled and aligned and it is fixed.
Conventional silicon optical chip uses the coupling process of chip-lens-waveguide, and when coupling package is by optical fiber and silicon waveguide
Mould spot transformational structure is coupled and aligned, which will usually monitor the Output optical power (i.e. active alignment) of the silicon waveguide other end, should
Method both ends need both ends to couple silicon waveguide at the same time, and difficulty is larger.By turning in silicon optical chip input/output terminal, silicon wave guide mode spot
Change structural area design V-structure to be connected, the passive coupling of optical fiber and silicon waveguide is realized by V grooves, coupling package difficulty can be simplified.
When coupling package carries the silicon optical chip of V groove design structures, the coupling of traditional chip of laser-lens-waveguide
Method, can not be applicable in.Chip of laser is packaged into the mode of coaxial component when being coupled with this eka-silicon optical chip, is applicable to list
Passage product, but when being directed to multichannel (2 or 4 passage) product, coaxial component tube body size is limited to, can not be in finite size
The coupling package of multichannel silicon optical chip is realized on pcb board.Therefore, the coupling of a kind of silicon optical chip suitable for V groove passive couplings
Closing structure and method becomes technological difficulties.
In consideration of it, the defects of overcoming present in the prior art is the art urgent problem to be solved.
【The content of the invention】
The technical problem to be solved in the present invention is during the silicon optical chip that coupling package carries V groove design structures, traditional swashs
The coupling process of light device chip-lens-waveguide, can not be applicable in.Chip of laser be packaged into the mode of coaxial component with it is such
When silicon optical chip couples, when being applicable to single channel product, but being directed to multichannel (2 or 4 passage) product, coaxial component is limited to
Tube body size, can not realize the coupling package of multichannel silicon optical chip on the pcb board of finite size.
The present invention adopts the following technical scheme that：
In a first aspect, the present invention provides a kind of coupling process of silicon optical chip, coupled structure includes optical module, silicon light
Chip 1 and pcb board 8, wherein optical module include chip of laser 2, coupled lens 3, optical fiber 4, glass cover-plate 5, V grooves substrate 6
With external-connected port 7, coupling process includes：
By being adhesively fixed on pcb board 8 for silicon optical chip 1 and V grooves substrate 6；One end of optical fiber 4 is placed into silicon optical chip
In chip V grooves 1-1 on 1 coupling end face, the other end of optical fiber 4 is placed in the V-groove 6-1 of V grooves substrate 6；
Wherein, the chip of laser 2, coupled lens 3, optical fiber 4 and glass cover-plate 5 are arranged on V grooves substrate 6.
Preferably, the coupling end face silicon waveguide of the silicon optical chip 1 includes the chip V grooves 1-1 and cantilever silicon waveguide 1-2
Structure, wherein, the cantilever silicon waveguide 1-2 is connected with V-groove 1-1 couplings, and the light with being placed on the V-groove 1-1
Complete light path coupling in the port of fibre 4.
Preferably, after the optical module is separately fixed at chip V grooves 1-1 and V-groove 6-1 by optical fiber 4, laser is realized
Cantilever silicon waveguide 1-2's between device chip 2 and silicon optical chip 1 is of coupled connections, and realizes that light path connects.
Preferably, 6 material therefor of V grooves substrate is silicon, and the V-groove 6-1 on V grooves substrate 6 is processed by wet etching
Form.
Preferably, the chip of laser 2 is launched for end face, including FP lasers or Distributed Feedback Laser.
Preferably, when the coupled structure further includes glass gasket 9, ultraviolet glue 10 and matching fluid 11, the coupling side
Method also includes putting the optical fiber 4 above ultraviolet glue hydropexis on glass block 9, then fixed V grooves substrate 6, realizes whole optics group
Part and the alignment package of chip coupled end.
Preferably, described 4 two end faces of optical fiber, the tail optical fiber end face of LC Receptacle7, is both needed to divest coating layer segment
1-4 millimeters, be preferably 2 millimeters.
Second aspect, present invention also offers a kind of coupled structure of silicon optical chip, coupled structure includes optical module, silicon
Optical chip 1 and pcb board 8, wherein optical module include chip of laser 2, coupled lens 3, optical fiber 4, glass cover-plate 5, V groove substrates
6 and external-connected port 7, coupled structure includes：
Silicon optical chip 1 and V grooves substrate 6 are adhesively fixed on pcb board 8；
Optical fiber 4 is arranged in the chip V grooves 1-1 that silicon optical chip 1 is coupled on end face, and the other end is placed on the V of V grooves substrate 6
In type groove 6-1；
Wherein, the chip of laser 2, coupled lens 3, optical fiber 4 and glass cover-plate 5 are arranged on V grooves substrate 6.
Preferably, the coupling end face silicon waveguide of the silicon optical chip 1 includes the chip V groove 1-1, and cantilever silicon waveguide
1-2 structures, wherein, the cantilever silicon waveguide 1-2 is directly connected with V-groove.
Preferably, the chip of laser 2 goes out luminous point and 4 core centre of optical fiber in V-groove 6-1 is highly consistent；Laser
2 optical axis of chip is overlapped with the core centre line of optical fiber 4 in V-groove 6-1.
Compared with prior art, the beneficial effects of the present invention are：
The silicon optical chip that the present invention uses is end coupling structure, and simplifies the coupling package of silicon waveguide by V slot structures
Difficulty, realizes that passive coupling encapsulates.
Optical module in the present invention, design carry the substrate manufacture of V slot structures, there is chip of laser patch electricity on substrate
Pole and gold thread bonding electrode.V-groove is used to fix optical fiber, and patch electrode is used for automatic chip mounting laser tube core, and structure is reliable, batch
It is low to measure cost.
The V groove substrate channel spacing that the present invention uses and silicon optical chip interchannel, can be according to silicon optical chip waveguides away from consistent
Line space design adjustment processing, structure are reliable.
The coupling packaging structure simple and compact that the present invention uses, size is small, easy to product small-sized encapsulated.
【Brief description of the drawings】
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of coupled structure top view of silicon optical chip provided in an embodiment of the present invention；
Fig. 2 is a kind of silicon optical chip structure diagram provided in an embodiment of the present invention；
Fig. 3 is a kind of silicon optical chip structure top view provided in an embodiment of the present invention；
Fig. 4 is a kind of silicon optical chip waveguide coupling end structure illustration provided in an embodiment of the present invention；
Fig. 5 is a kind of coupled structure front view of silicon optical chip provided in an embodiment of the present invention；
Fig. 6 is a kind of preferred coupled encapsulating structure top view of silicon optical chip provided in an embodiment of the present invention；
Fig. 7 be a kind of silicon optical chip provided in an embodiment of the present invention coupled structure in optical module structure diagram；
Wherein：
1：Silicon optical chip；1-1：Chip V grooves；1-2：Cantilever silicon ripple；2：Chip of laser；3：Coupled lens；4：Optical fiber；5：
Glass cover-plate；6：V groove substrates；6-1：V-groove；6-2：Patch electrode；7：LC Receptacle；8：Pcb board；9：Glass gasket；
10：Ultraviolet glue；11：Matching fluid.
【Embodiment】
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
In the description of the present invention, term " interior ", " outer ", " longitudinal direction ", " transverse direction ", " on ", " under ", " top ", " bottom " etc. refer to
The orientation or position relationship shown be based on orientation shown in the drawings or position relationship, be for only for ease of the description present invention rather than
It is required that the present invention must be with specific azimuth configuration and operation, therefore it is not construed as limitation of the present invention.
In various embodiments of the present invention, symbol "/" represents the implication at the same time with two kinds, such as " the second entry/exit light
Mouthful " show that the port both can also light extraction with entering light.And for symbol, " A and/or B " then show before and after being connected by the symbol
Combination between object include " A ", " B ", " three kinds of situations of A and B ", such as " back-scattering light and/or reflected light ", then show it
It can express single " back-scattering light ", single " reflected light ", and in " back-scattering light and reflected light " three kinds of implications
It is one of any.
In addition, as long as technical characteristic involved in each embodiment of invention described below is each other not
Forming conflict can be mutually combined.
Embodiment 1:
The embodiment of the present invention 1 provides a kind of coupling process of silicon optical chip, as shown in Figure 1, coupled structure includes optics
Component, silicon optical chip 1 and pcb board 8, wherein optical module include chip of laser 2, coupled lens 3, optical fiber 4, glass cover-plate 5,
V grooves substrate 6 and external-connected port 7, coupling process includes：
By being adhesively fixed on pcb board 8 for silicon optical chip 1 and V grooves substrate 6；One end of optical fiber 4 is placed into silicon optical chip
In chip V grooves 1-1 on 1 coupling end face, the other end of optical fiber 4 is placed in the V-groove 6-1 of V grooves substrate 6；
Wherein, the chip of laser 2, coupled lens 3, optical fiber 4 and glass cover-plate 5 are arranged on V grooves substrate 6.
Under normal conditions, also include silicon waveguide coupled structure on silicon optical chip 1, coupler, modulator, MPD, PD,
The photoelectric cells such as TIA, laser driving.
The silicon optical chip that the embodiment of the present invention uses is end coupling structure, and simplifies the coupling of silicon waveguide by V slot structures
Encapsulation difficulty is closed, realizes that passive coupling encapsulates.Also, design carries the substrate manufacture of V slot structures, has chip of laser on substrate
Patch electrode and gold thread bonding electrode.V-groove is used to fix optical fiber, and patch electrode is used for automatic chip mounting laser tube core, structure
Reliably, batch cost is low.
The coupling process that the embodiment of the present invention is proposed, (laser and optical fiber are directly directed at coupling with waveguide with common method
Close) compare, monitoring and processing when reducing coupling package to photoelectricity index, equipment investment is reduced, reduces operation difficulty.
With reference to the embodiment of the present invention, there are a kind of preferable implementation, with reference to shown in Fig. 2-Fig. 4, wherein, the silicon light
The coupling end face silicon waveguide of chip 1 includes the chip V grooves 1-1 and cantilever silicon waveguide 1-2 structures, wherein, the cantilever silicon ripple
Lead 1-2 with V-groove 1-1 couplings to be connected, and the port of the optical fiber 4 with being placed on the V-groove 1-1 is completed light path and coupled.
Fig. 2 is silicon optical chip structure diagram in above-mentioned preferred implementation scheme, and Fig. 3 is silicon optical chip structure in above-mentioned preferred implementation scheme
Top view.Fig. 4 is that the waveguide of silicon optical chip couples end structure illustration in above-mentioned preferred implementation scheme.
V grooves 6 critical materials as optical module of substrate, is to realize chip of laser 2, optical fiber 4 and cantilever silicon waveguide 1-2
Coupling carrying platform, play the role of element fix, light path alignment and heat dissipation.Design parameter and processing precision direct influence
The producing efficiency and qualification rate of optical module.
V groove substrate channel spacing and the silicon optical chip interchannel that the embodiment of the present invention uses, can be according to silicon light cores away from consistent
The adjustment processing of piece waveguide line space design, structure are reliable.The coupling packaging structure simple and compact that the embodiment of the present invention uses, size
It is small, easy to product small-sized encapsulated.
After the optical module is separately fixed at chip V grooves 1-1 and V-groove 6-1 by optical fiber 4, chip of laser 2 is realized
Cantilever silicon waveguide 1-2's between silicon optical chip 1 is of coupled connections, and realizes that light path connects.
With reference to the embodiment of the present invention, there are a kind of preferable implementation, wherein, 6 material therefor of V grooves substrate is
Silicon, the V-groove 6-1 on V grooves substrate 6 are process by wet etching.
In embodiments of the present invention, the chip of laser 2 be end face transmitting, including but not limited to FP lasers or
Distributed Feedback Laser.
With reference to the embodiment of the present invention, there are a kind of preferable implementation, as shown in Figure 5 and Figure 6, coupled structure further includes
Glass gasket 9, ultraviolet glue 10 and matching fluid 11, then coupling process on glass block 9 also including putting in ultraviolet glue hydropexis
The optical fiber 4 of side, then fixed V grooves substrate 6, realize the alignment package of whole optical module and chip coupled end.
With reference to the embodiment of the present invention, there are a kind of preferable implementation, described 4 two end faces of optical fiber, LC
The tail optical fiber end face of Receptacle7, is both needed to divest 1-4 millimeters of layer segment of coating, is preferably 2 millimeters.
Embodiment 2：
The embodiment of the present invention additionally provides a kind of coupled structure of silicon optical chip, and coupled structure includes optical module, silicon light
Chip 1 and pcb board 8, wherein optical module include chip of laser 2, coupled lens 3, optical fiber 4, glass cover-plate 5, V grooves substrate 6
With external-connected port 7, coupled structure includes：
Silicon optical chip 1 and V grooves substrate 6 are adhesively fixed on pcb board 8；
Optical fiber 4 is arranged in the chip V grooves 1-1 that silicon optical chip 1 is coupled on end face, and the other end is placed on the V of V grooves substrate 6
In type groove 6-1；
Wherein, the chip of laser 2, coupled lens 3, optical fiber 4 and glass cover-plate 5 are arranged on V grooves substrate 6.
The silicon optical chip that the embodiment of the present invention uses is end coupling structure, and simplifies the coupling of silicon waveguide by V slot structures
Encapsulation difficulty is closed, realizes that passive coupling encapsulates.Also, design carries the substrate manufacture of V slot structures, has chip of laser on substrate
Patch electrode and gold thread bonding electrode.V-groove is used to fix optical fiber, and patch electrode is used for automatic chip mounting laser tube core, structure
Reliably, batch cost is low.
With reference to the embodiment of the present invention, there are a kind of preferable implementation, wherein, the coupling end face of the silicon optical chip 1
Silicon waveguide includes the chip V groove 1-1, and cantilever silicon waveguide 1-2 structures, wherein, the cantilever silicon waveguide 1-2 is directly and V
Type groove is connected.
With reference to the embodiment of the present invention, there are a kind of preferable implementation, wherein, the chip of laser 2 goes out luminous point and V
4 core centre of optical fiber is highly consistent in type groove 6-1；The core centre line weight of 2 optical axis of chip of laser and optical fiber 4 in V-groove 6-1
Close.
Embodiment 3:
The present invention is provided also from industrial realization mode, and a kind of coupling knot of silicon optical chip is illustrated with more complete content
Structure.Whole coupling element as shown in figure 5, by optical module, silicon optical chip 1, pcb board 8, glass gasket 9, ultraviolet glue 10 and
With liquid 11, wherein optical module is by chip of laser 2, coupled lens 3, optical fiber 4, glass cover-plate 5, V grooves substrate 6 and LC
Receptacle7 coupling packages form.
Silicon optical chip 1 includes silicon waveguide coupled structure, coupler, modulator, MPD, PD, TIA, laser driving etc. above
Photoelectric cell, chip coupling end face are made of chip V grooves 1-1 and cantilever silicon waveguide 1-2.Conventional silicon optical chip silicon waveguide is also to adopt
With cantilever design structure, silicon Waveguide end face is directly coupled with optical fiber or laser, needs the silicon ripple that is coupled and aligned at the same time in coupling
The both ends led, alignment debugging difficulty is larger, and coupling package efficiency is low.
The chip V grooves 1-1 and cantilever silicon waveguide 1-2 of silicon optical chip, are as an entirety, are used for realization chip silicon waveguide
With being coupled and aligned for extraneous optical fiber 4.Cantilever silicon waveguide 1-2 be one by SiO 2 waveguide parcel silicon waveguide structure, silicon ripple
Lead and become narrow gradually.Light, which is transferred through reversely wedge-shaped silicon waveguide in silicon waveguide and is transferred in SiO 2 waveguide, to be propagated, most laggard
Enter optical fiber.Therefore the silicon materials below the SiO 2 waveguide of coupling end face need to etch away.Whole silicon optical chip 1 passes through
After semiconductor technology completes the processing of optical electrical element, last machined cantilever waveguide and V grooves.Pass through photoetching, the side of dry etching first
Method, in cantilever waveguide 1-2 Bilateral fenestrations, removes the void region shown in Fig. 4, that is, removes part of silica layer.Part retains
Silicon dioxide layer as cantilevered support structure, ensure the structural strength of waveguide.It is overall after photoetching again by chip entirety gluing
Immerse in chemical solution, for removing the silicon layer below cantilever silicon waveguide 1-2, while etching forms V grooves, and V groove depths are to pass through
Groove width control is designed, to reach desired design, perfect condition is that the center for the optical fiber 4 for inserting V grooves is just directed at cantilever silicon
The center of waveguide.
The embodiment of the present invention realizes the coupling package of silicon optical chip 1 and optical module on pcb board 8.Fig. 5 is of the invention real
A coupling packaging structure schematic diagram is applied, Fig. 6 is coupling packaging structure top view of the embodiment of the present invention, is specifically included：
Optical module is by chip of laser 2, coupled lens 3, optical fiber 4, glass cover-plate 5, V grooves substrate 6 and LC
Receptacle7 couplings assemble.The V grooves substrate 6 is made by silicon materials, is machined with V-groove 6-1 structures and patch above
Plate electrode 6-2, intermediate region etching are sunk, and overall is in concave structure.V-groove 6-1 structures are used to fix optical fiber 4 and LC
The tail optical fiber of Receptacle7, patch electrode 6-2 are used to paste chip of laser 2, and middle sunken regions are used to place coupled lens
3.The position of the core centre of optical fiber 4 in V grooves substrate 6 is consistent with the position height at the emitting facet center of chip of laser 2.
2 optical axis center line of chip of laser is overlapped with the optical axis center line of optical fiber 4 in V-groove 6-1.These designs are provided in component
During processing, the adjusting difficulty of coupled lens 3 is reduced, component production efficiency is improved and reduces difficulty of processing
Embodiment 4：
The embodiment of the present invention additionally provides a kind of processing side for coupling combination as described in Example 3 available for processing and fabricating
Method, comprises the following steps：
In step 301, fixed silicon optical chip 1 is pasted in the specified region designed on pcb board 8, between chip couples end face
Glass block 9 is pasted every 1mm positions, and realizes that 8 silicon optical chip of pcb board, 1 gold wire bonding connects；
In step 302, qualified optical module will be made to be placed on pcb board 8, the optical fiber of optical module is placed on
In the V grooves of silicon optical chip, under high-definition image system, it is ensured that fiber end face does not touch cantilever silicon waveguide 1-2 end faces；
In step 303, ultraviolet glue 10 is put on glass block 9, fixed optical module is by the top of glass block 9
Optical fiber, then fixed V grooves substrate 6, realize being coupled and aligned for optical fiber and chip end face silicon waveguiding structure；
In step 304, the matching fluid 11 on the coupled end millet cake of silicon optical chip 1, realizes that refraction of light path rate matches.
The embodiment of the present invention reduces the waveguide of cantilever silicon and outer member in silicon optical chip by designing V groove supplementary structures
Difficulty is coupled, technological feasibility is good, and reliability is high.It is convenient follow-up by the optical fiber component that is fabricated to of chip of laser and connector
Passive coupling is aligned, the packaging technology of facilitating chip, improves encapsulation producing efficiency.
Embodiment 5：
Fig. 7 is optical assembly structure schematic diagram of the present invention, its optical assembly structure can be used as the other each implementations of the present invention
The buying object of coupling packaging structure proposed in example, you can used as semi-finished product module.With reference to marginal data optics group
Part coupling packaging structure, comprises the following steps that：
In step 401, under picture system, according to design requirement, determine chip of laser 2 and patch electrode 6-2's
Relative position, which is pasted, fixes, and whole patch operation needs to carry out under high definition microscope, is completed using high-precision patch device.Patch
Plate electrode 6-2 also realizes the pad gold wire bonding function of the positive electrode of chip of laser 2, external pcb board 8, and realization electrically connects
It is logical, facilitate subsequent coupling lens 3 to debug.The patch of chip of laser 2 can realize automation batch making.
In step 402,4 both ends of optical fiber divest coat post-processing and obtain neat fiber end face, and one end is placed on V-type
In groove 1-1, the other end is as output terminal.The tail optical fiber end face of LC Receptacle7 divests coat, and V-groove 6-1 is passed through in centre
Optical fiber need by being placed on after laser ablation coat in V-groove 6-1.The fiber lengths for divesting coat are 2 millimeters of left sides
It is right.After four optical fiber are all placed in V-groove 6-1, glass cover-plate 5 is placed above optical fiber, it is suitably ultraviolet using hardness
Glue 10, the V grooves region of glass cover-plate 5 and V grooves substrate 6 is fixed.It is required that the end face of optical fiber 4 and V trough rim bound pairs in V grooves 6-1
Together.The tail optical fiber of optical fiber 4 and LC Receptacle7 are general single mode fiber.Needed that multimode fibre also may be selected according to product.
In step 403, coupled lens 3 are located in the centre of chip of laser 2 and optical fiber 4, are placed in concave regions
Coupled lens 3, are powered up to chip of laser 2 by external instrument, work normally laser, external PD as receiving terminal, with
The other end alignment of optical fiber 4, coupling efficiency is determined by detecting the photoelectric current of PD.Lens position is adjusted, makes chip of laser 2
Coupling efficiency maximum after fixed coupling lens 3, complete the making of whole optical module.
The optical module size that the embodiment of the present invention is proposed is smaller, about 5x5mm, is conducive to the miniaturization envelope of photoelectric device
Dress.Output terminal is 4 optical fiber, and convenient to carry out coupling package with silicon optical chip 2, which belongs to passive coupling alignment, has
Effect improves the coupling assembling of photoelectric device.
The making of V-groove 6-1 is accurately controlled using photoetching corrosion or high accuracy section machining, the depth of V-groove, V
Separation deviation can be controlled in 0.5 microns.
Patch electrode 6-2 processing is using the semiconductor technology processing and fabricatings such as photoetching, sputtering, technical maturity, high precision machining.
For the positioning and stickup of chip of laser 2, patch operation can be automated, improves production efficiency.
The tail optical fiber of optical fiber 4 and LC Receptacle7 described in the embodiment of the present invention are pushed down and fixed, glass by glass cover-plate 5
The width of cover board 5 is 0.2-0.3 millimeters shorter than the length of V-groove 6-1.The design is mainly convenient to add ultraviolet glue.
Optical module overall structure of the embodiment of the present invention is simple, and design structure is compact, and V groove board structures are simple, processes work
Skill maturation is, it can be achieved that standardized production, batch making have cost advantage.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of coupling process of silicon optical chip, it is characterised in that coupled structure includes optical module, silicon optical chip (1) and PCB
Plate (8), wherein optical module include chip of laser (2), coupled lens (3), optical fiber (4), glass cover-plate (5), V groove substrates
(6) and external-connected port (7), coupling process includes：
By being adhesively fixed on pcb board (8) for silicon optical chip (1) and V grooves substrate (6)；One end of optical fiber (4) is placed into silicon light
In chip V grooves (1-1) on chip (1) coupling end face, the other end of optical fiber (4) is placed on to the V-groove (6- of V grooves substrate (6)
1) in；
Wherein, the chip of laser (2), coupled lens (3), optical fiber (4) and glass cover-plate (5) are arranged on V grooves substrate (6)
On.
2. the coupling process of silicon optical chip according to claim 1, it is characterised in that the coupling of the silicon optical chip (1)
End face silicon waveguide by the chip V grooves (1-1) and the waveguide of cantilever silicon (1-2) structure, wherein, the cantilever silicon waveguide (1-2) and V
Type groove (1-1) coupling is connected, and the port of the optical fiber (4) with being placed on the V-groove (1-1) is completed light path and coupled.
3. the coupling process of silicon optical chip according to claim 2, it is characterised in that：The optical module passes through optical fiber
(4) after being separately fixed at chip V grooves (1-1) and V-groove (6-1), realize between chip of laser (2) and silicon optical chip (1)
Cantilever silicon waveguide (1-2's) is of coupled connections, and realizes that light path connects.
4. according to the coupling process of any silicon optical chips of claim 1-3, it is characterised in that：V grooves substrate (6) institute
It is silicon with material, the V-groove (6-1) on V grooves substrate (6) is process by wet etching.
5. according to the coupling process of any silicon optical chips of claim 1-3, it is characterised in that：The chip of laser
(2) launch for end face, including FP lasers or Distributed Feedback Laser.
6. the coupling process of silicon optical chip according to claim 1, it is characterised in that：Glass isolator is further included in coupled structure
When piece (9), ultraviolet glue (10) and matching fluid (11), the coupling process is additionally included on glass block (9) and puts ultraviolet glue
The optical fiber (4) of fixed top, then fixed V grooves substrate (6), realize the alignment package of whole optical module and chip coupled end.
7. the coupling process of silicon optical chip according to claim 1, it is characterised in that：Described (4) two end faces of optical fiber, LC
The tail optical fiber end face of Receptacle (7), is both needed to divest 1-4 millimeters of layer segment of coating.
8. a kind of coupled structure of silicon optical chip, it is characterised in that coupled structure includes optical module, silicon optical chip (1) and PCB
Plate (8), wherein optical module include chip of laser (2), coupled lens (3), optical fiber (4), glass cover-plate (5), V groove substrates
(6) and external-connected port (7), coupled structure includes：
Silicon optical chip (1) and V grooves substrate (6) are adhesively fixed on pcb board (8)；
One end of optical fiber (4) is arranged in the chip V grooves (1-1) on silicon optical chip (1) coupling end face, and the other end is placed on V grooves
In the V-groove (6-1) of substrate (6)
Wherein, the chip of laser (2), coupled lens (3), optical fiber (4) and glass cover-plate (5) are arranged on V grooves substrate (6)
On.
9. the coupled structure of silicon optical chip according to claim 8, it is characterised in that：The coupling of the silicon optical chip (1)
End face silicon waveguide includes the chip V grooves (1-1), and the waveguide of cantilever silicon (1-2) structure, wherein, the cantilever silicon waveguide (1-
2) directly it is connected with V-groove.
10. the coupled structure of silicon optical chip according to claim 8 or claim 9, it is characterised in that：The chip of laser (2)
Go out luminous point and optical fiber (4) core centre in V-groove (6-1) is highly consistent；Chip of laser (2) optical axis and light in V-groove (6-1)
The core centre line of fine (4) overlaps.
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