CN109683082A - A kind of test macro and test method for optical chip - Google Patents
A kind of test macro and test method for optical chip Download PDFInfo
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- CN109683082A CN109683082A CN201811597651.8A CN201811597651A CN109683082A CN 109683082 A CN109683082 A CN 109683082A CN 201811597651 A CN201811597651 A CN 201811597651A CN 109683082 A CN109683082 A CN 109683082A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
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- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Abstract
The invention discloses a kind of test macros for optical chip, comprising: microscope, the microscope have object lens；Chip fixture, the chip fixture are located at the lower section of the object lens；Fibre channel coupler block, the fibre channel coupler block are located at the lower section of the chip fixture；Position adjustment structure adjusts position and the angle of the fibre channel coupler block by adjusting the position adjustment structure wherein the fibre channel coupler block is fixed on the position adjustment structure.Embodiment disclosed by the invention, optical chip grating region may be implemented and be completed at the same time Multi-channel optical coupling, receiving end may be implemented and transmitting terminal is individually tested, chip testing is convenient for changing, multichannel optical fiber can recycle, the assembled formation of channel one time, may be implemented Batch assemblage, process repeatability is higher.
Description
Technical field
The present invention relates to the packaging and testing technical fields of optical chip.Specifically, the present invention relates to one kind to be used for optics
The test macro and test method of chip.
Background technique
In recent years, since data center, cloud computing etc. develop rapidly, the data for bringing magnanimity need to realize storage and hand over
It changes.Silicon based photon becomes due to the unique innate advantage such as its CMOS technique compatible, at low cost and solves the problems, such as the preferred of this
Scheme.On the one hand, by the lasting research and development of each enterprise and research institute, detector, modulator, waveguide, grating etc. are more and more
Silicon based photon device, which realizes, fast and efficiently to be developed, either discrete device or monolithic die, and performance is substantially
It can satisfy current application demand, still, chip without any damage test becomes a urgent problem to be solved.
Realize the optical coupled of silicon optical chip, at present most are exactly grating coupler because its can have it is larger
Coupling regime more preferably to match the numerical aperture of single mode optical fiber.Fig. 1 shows optical chip test macro according to prior art
Schematic diagram.As shown in Figure 1, V-groove optical fiber blocks are fixed to the grating region of chip front side by ultraviolet glue.But due to grating region
In chip front side, the usual electrode of coupling platform microscope, silicon optical device is all in the same face, and which results in coupling
Practical operation difficulty is big, and since coupling cured later significantly limits integration density and testing efficiency.
It is fiber array is realized by way of active alignment optical coupled in the industry, so at present for such application
Ultraviolet adhesive curing is used afterwards, does not have channel expansibility.Particularly, for being the optical chip for being used to test early period, light
Fine coupling block and all not reproducible utilization of optical chip, there are chip, technical problems, the assembling difficulty such as to be not easy to replace larger and inadequate
Stablize, is repeated not high, it is more that restriction is electrically interconnected.
Summary of the invention
Present invention seek to address that the high precision measurement of the sub- chip of silicon based opto-electronics, optical signal couple hardly possible to silicon optical chip entry/exit
Spend big problem.The nuclear structure and coupling scheme provided through the invention, may be implemented the test of multichannel silicon photon chip
It is encapsulated with optical coupling.
Aiming at the problems existing in the prior art, according to an aspect of the present invention, it provides a kind of for optical chip
Test macro, comprising:
Microscope, the microscope have object lens；
Chip fixture, the chip fixture are located at the lower section of the object lens；
Fibre channel coupler block, the fibre channel coupler block are located at the lower section of the chip fixture；
Position adjustment structure, wherein the fibre channel coupler block is fixed on the position adjustment structure, by adjusting described
Position adjustment structure adjusts position and the angle of the fibre channel coupler block.
In one embodiment of the invention, chip to be measured is fixed on the chip fixture, wherein the back of chip to be measured
Face faces microscopical object lens；The face down of chip to be measured and include alignment mark and grating region.
It in one embodiment of the invention, further include being located at chip back one to be measured for the test macro of optical chip
The first light source of side and second light source positioned at chip back side to be measured.
In one embodiment of the invention, the chip fixture includes adjusting unit, for adjusting the position of chip to be measured
It sets.
In one embodiment of the invention, the back side of the chip to be measured has rear electrode, and the rear electrode is logical
TSV conductive hole is crossed to be electrically connected with front electrode formation.
In one embodiment of the invention, the chip fixture includes that electricity probe adjusts folder, and electricity probe adjusts folder
It is electrically connected with the rear electrode.
In one embodiment of the invention, the grating region is in the range of 10 to 60 microns.
In one embodiment of the invention, the position adjustment structure is five dimension position adjustment structures.
In one embodiment of the invention, the fibre channel coupler block is V-groove multichannel optical fiber coupling block.
According to another aspect of the present invention, a kind of method using test system and test optical chip is provided, comprising:
Chip to be measured is installed to chip fixture, the back side of the chip to be measured faces microscopical object lens, chip to be measured
Front face fibre channel coupler block, and it is described front include alignment mark and grating region；
Chip is penetrated from chip back by microscope, it is seen that alignment mark；
Position and the angle that fibre channel coupler block is adjusted by position adjustment structure, realize the alignment of optical fiber and grating region.
This patent is used for the test macro and test method of optical chip, and the grating region that optical chip may be implemented is completed at the same time
Multi-channel optical coupling, may be implemented receiving end and transmitting terminal is individually tested, and chip testing is convenient for changing, and multichannel optical fiber can be with
It recycles, Batch assemblage may be implemented, and process repeatability is higher in the assembled formation of channel one time.It is more suitable for more highdensity
Optical electrical transceiver module can provide the application demand of more high bandwidth and longer distance for large-scale data center, Supercomputer Center etc..
Detailed description of the invention
For the above and other advantages and features for each embodiment that the present invention is furture elucidated, will be presented with reference to attached drawing
The more specific description of various embodiments of the present invention.It is appreciated that these attached drawings only describe exemplary embodiments of the invention, therefore
It is not to be regarded as being restriction on its scope.In the accompanying drawings, in order to cheer and bright, identical or corresponding component will use identical or class
As mark indicate.
Fig. 1 shows the schematic diagram of optical chip test macro according to prior art.
Fig. 2 shows the schematic diagrames of the test macro 200 of optical chip according to an embodiment of the invention.
Fig. 3 shows the schematic diagram of optical chip test zone according to an embodiment of the invention.
Fig. 4 shows the schematic diagram of optical chip test zone according to another embodiment of the invention.
Fig. 5 shows the schematic diagram of the test macro 500 of optical chip according to another embodiment of the invention.
Specific embodiment
In the following description, with reference to each embodiment, present invention is described.However, those skilled in the art will recognize
Know can in the case where none or multiple specific details or with other replacements and/or addition method, material or component
Implement each embodiment together.In other situations, well known structure, material or operation are not shown or are not described in detail in order to avoid making this
The aspects of each embodiment of invention is obscure.Similarly, for purposes of explanation, specific quantity, material and configuration are elaborated, with
Comprehensive understanding to the embodiment of the present invention is just provided.However, the present invention can be implemented in the case where no specific detail.This
Outside, it should be understood that each embodiment shown in the accompanying drawings is illustrative expression and is not drawn necessarily to scale.
In the present specification, the reference of " one embodiment " or " embodiment " is meaned to combine embodiment description
A particular feature, structure, or characteristic is included at least one embodiment of the invention.Occur in everywhere in this specification short
Language " in one embodiment " is not necessarily all referring to the same embodiment.
This patent is used for the test macro and test method of optical chip, and the grating region that optical chip may be implemented is completed at the same time
Multi-channel optical coupling, may be implemented receiving end and transmitting terminal is individually tested, and chip testing is convenient for changing, and multichannel optical fiber can be with
It recycles, Batch assemblage may be implemented, and process repeatability is higher in the assembled formation of channel one time.It is more suitable for more highdensity
Optical electrical transceiver module can provide the application demand of more high bandwidth and longer distance for large-scale data center, Supercomputer Center etc..
Fig. 2 shows the schematic diagrames of the test macro 200 of optical chip according to an embodiment of the invention.Such as Fig. 2 institute
Show, the test macro 200 of optical chip may include microscope 210, chip fixture 220, chip to be measured 230, fibre channel coupler block
240, the position adjustment structure 250 of fibre channel coupler block 240.
Microscope 210 can be IR microscope.For the ease of observation, light source can be set near the object lens of microscope 210
211.Chip fixture 220 is located at the lower section of the object lens of microscope 210.Chip 230 to be measured is fixed on chip fixture, wherein to be measured
The back side of chip 230 faces the object lens of microscope 210；The face down of chip 230 to be measured and include alignment mark and grating.
Chip fixture 210 may also include position adjustment structure, to adjust the position of chip.In one embodiment of the invention, to
Survey chip 230 can or silicon optical chip, germanium silicon optical chip or other semiconductor materials optical chip.
Fibre channel coupler block 240 is in the lower section of chip 230 to be measured.Fibre channel coupler block 240 is fixed on position adjustment structure 250
On.Fibre channel coupler block 240 can be the multichannel optical fiber coupling block with V-groove.Position adjustment structure 250 can be the adjusting of five dimensions
Structure.By adjusting position adjustment structure 250, it is directed at optical fiber in fibre channel coupler block 240 with the specific grating region of chip to be measured.
For the ease of being aligned and observing, second light source 260 can be set in the positive side of chip to be measured.
During carrying out optical chip test using structure shown in Fig. 2, the alignment of metal is provided on optical chip front
Label, microscope penetrate silicon materials from chip back, it is seen that rapid alignment may be implemented in alignment mark.For outputting and inputting
This two-part fibre channel coupler block, can pair mobile by two independent five times regualting frames and realization optical fiber and grating region
Standard, after an optical chip is completed, subsequent optical chip can be with quick-replaceable.Band V can be increased according to optical chip port number
The multichannel optical fiber coupling block of type groove realizes multi-channel coupling.
In other embodiments of the invention, microscope can be observed and be aligned in the front of chip.
Fig. 3 shows the schematic diagram of optical chip test zone according to an embodiment of the invention.
As shown in figure 3, optical chip test zone may include alignment mark 310.Alignment mark 310 is metal mark easy to identify
Note.Grating region 320 is located in alignment mark 310.Use all 8 optical-fibre channels.All waveguides are all identical length.It is all
Waveguide radius of curvature is all identical.Transmission channel 330 and receiving channel 340 are adjacent.
Grating coupled zone can match the single mode optical fiber of numerical aperture NA=1.7 in the range of 10-60 microns.
Waveguide dimensions are about 0.5um x 0.5um x 1cm, and radius of curvature is about 125um, and optical fiber spacing is about
250um。
Fig. 4 shows the schematic diagram of optical chip test zone according to another embodiment of the invention.
As shown in figure 4, optical chip test zone may include alignment mark 410.Alignment mark 410 is metal mark easy to identify
Note.Grating region 420 is located in alignment mark 410.Use all 8 optical-fibre channels.The length of waveguide is not exactly the same.Waveguide is bent
Rate radius differs three times.Transmission channel 430 and receiving channel 440 can be adjacent or non-conterminous.
Grating coupled zone can match the single mode optical fiber of numerical aperture NA=1.7 in the range of 10-60 microns.
Waveguide dimensions are about 0.5 micron x0.5 microns x1 microns, and radius of curvature is about 125 microns and 375 microns, light
Fine spacing is about 250 microns and 750 microns.
Fig. 5 shows the schematic diagram of the test macro 500 of optical chip according to another embodiment of the invention.Such as Fig. 5
Shown, the test macro 500 of optical chip may include microscope 510, chip fixture 520, chip to be measured 530, fibre channel coupler block
540, the position adjustment structure 550 of fibre channel coupler block 540.
Microscope 510 can be IR microscope.For the ease of observation, light source can be set near the object lens of microscope 510
511.Chip fixture 520 is located at the lower section of the object lens of microscope 510.Chip 530 to be measured is fixed on chip fixture, wherein to be measured
The back side 532 of chip 530 faces the object lens of microscope 510；The front 531 of chip 530 to be measured downward and include alignment mark,
Grating and electrode.It is punched in the position of the electrode of chip 530 to be measured, electric interconnection is realized by TSV, thus in chip to be measured
530 back surface forming electrode 533.There is chip fixture electricity probe to adjust folder, and chip live testing may be implemented.Chip fixture
510 may also include position adjustment structure, to adjust the position of chip.In one embodiment of the invention, chip 530 to be measured
Can or silicon optical chip, germanium silicon optical chip or other semiconductor materials optical chip.
Fibre channel coupler block 540 is in the lower section of chip 530 to be measured.Fibre channel coupler block 540 is fixed on position adjustment structure 550
On.Fibre channel coupler block 540 can be the multichannel optical fiber coupling block with V-groove.Position adjustment structure 550 can be the adjusting of five dimensions
Structure.By adjusting position adjustment structure 550, it is directed at optical fiber in fibre channel coupler block 540 with the specific grating region of chip to be measured.
For the ease of being aligned and observing, second light source 560 can be set in the positive side of chip to be measured.
Although described above is various embodiments of the present invention, however, it is to be understood that they are intended only as example to present
, and without limitation.For those skilled in the relevant art it is readily apparent that various combinations, modification can be made to it
Without departing from the spirit and scope of the invention with change.Therefore, the width of the invention disclosed herein and range should not be upper
It states disclosed exemplary embodiment to be limited, and should be defined according only to the appended claims and its equivalent replacement.
Claims (10)
1. a kind of test macro for optical chip, comprising:
Microscope, the microscope have object lens；
Chip fixture, the chip fixture are located at the lower section of the object lens；
Fibre channel coupler block, the fibre channel coupler block are located at the lower section of the chip fixture；
Position adjustment structure, wherein the fibre channel coupler block is fixed on the position adjustment structure, by adjusting the position
Adjustment structure adjusts position and the angle of the fibre channel coupler block.
2. being used for the test macro of optical chip as described in claim 1, which is characterized in that chip to be measured is fixed on the core
On plate clamp, wherein the back side of chip to be measured faces microscopical object lens；The face down of chip to be measured and include to fiducial mark
Note and grating region.
3. being used for the test macro of optical chip as claimed in claim 2, which is characterized in that further include being located at chip to be measured to carry on the back
The first light source of face side and second light source positioned at chip back side to be measured.
4. being used for the test macro of optical chip as claimed in claim 2, which is characterized in that the chip fixture includes adjusting
Unit, for adjusting the position of chip to be measured.
5. being used for the test macro of optical chip as claimed in claim 2, which is characterized in that the back side of the chip to be measured has
There is rear electrode, the rear electrode is electrically connected by TSV conductive hole with front electrode formation.
6. being used for the test macro of optical chip as claimed in claim 5, which is characterized in that the chip fixture includes electricity
Probe adjusts folder, and electricity probe adjusts folder and is electrically connected with the rear electrode.
7. being used for the test macro of optical chip as claimed in claim 2, which is characterized in that the grating region is micro- 10 to 60
In the range of rice.
8. being used for the test macro of optical chip as described in claim 1, which is characterized in that the position adjustment structure is five
Tie up position adjustment structure.
9. being used for the test macro of optical chip as described in claim 1, which is characterized in that the fibre channel coupler block is V-type
Slot multichannel optical fiber coupling block.
10. a kind of method using test system and test optical chip described in any one of any one of claims 1 to 99, comprising:
Chip to be measured is installed to chip fixture, the back side of the chip to be measured faces microscopical object lens, and chip to be measured is just
Face faces fibre channel coupler block, and the front includes alignment mark and grating region；
Chip is penetrated from chip back by microscope, it is seen that alignment mark；
Position and the angle that fibre channel coupler block is adjusted by position adjustment structure, realize the alignment of optical fiber and grating region.
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| CN110579699A (en) * | 2019-09-20 | 2019-12-17 | 武汉电信器件有限公司 | Chip testing device |
| CN110988646A (en) * | 2019-12-24 | 2020-04-10 | 武汉邮电科学研究院有限公司 | Silicon-based photoelectronic chip wafer-level online testing device based on grating coupling |
| CN111649840A (en) * | 2020-05-08 | 2020-09-11 | 上海交通大学 | Optical resonator low-temperature sensor and preparation and packaging methods thereof |
| CN111679179A (en) * | 2020-06-15 | 2020-09-18 | 中国科学院半导体研究所 | Semi-packaged detector chip testing device and using method |
| CN112098768A (en) * | 2019-05-30 | 2020-12-18 | 上海新微技术研发中心有限公司 | Method and equipment for testing silicon optical chip |
| CN112924143A (en) * | 2021-01-29 | 2021-06-08 | 中国科学院微电子研究所 | Photonic chip wafer level testing device and method |
| CN113447792A (en) * | 2021-06-21 | 2021-09-28 | 武汉光迅科技股份有限公司 | Chip performance test system and test method |
| CN113702004A (en) * | 2021-08-30 | 2021-11-26 | 中南大学 | Automatic coupling test equipment and method for silicon optical chip |
| CN113985246A (en) * | 2021-10-21 | 2022-01-28 | 武汉光谷信息光电子创新中心有限公司 | Testing and packaging tool and system for chip |
| CN116858498A (en) * | 2023-06-09 | 2023-10-10 | 武汉光启源科技有限公司 | Coupling test method and device |
| CN117191358A (en) * | 2023-09-21 | 2023-12-08 | 苏州猎奇智能设备有限公司 | Silicon optical chip testing device and testing method thereof |
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