CN109031532A - A kind of coupling process of planar waveguide chip and fiber array - Google Patents
A kind of coupling process of planar waveguide chip and fiber array Download PDFInfo
- Publication number
- CN109031532A CN109031532A CN201810960847.2A CN201810960847A CN109031532A CN 109031532 A CN109031532 A CN 109031532A CN 201810960847 A CN201810960847 A CN 201810960847A CN 109031532 A CN109031532 A CN 109031532A
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- Prior art keywords
- chip
- fiber array
- adjusting bracket
- glue
- waveguide chip
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
- G02B6/305—Optical coupling means for use between fibre and thin-film device and having an integrated mode-size expanding section, e.g. tapered waveguide
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses the coupling process of a kind of planar waveguide chip and fiber array, comprising the following steps: S1, single fiber and PLC chip are placed on sextuple adjusting bracket；S2, the sextuple adjusting bracket of adjusting are aligned the fibre core of planar optical waveguide chip with the main waveguide of the input terminal of PLC chip, export image completion 1CH/2CH fiber array by feux rouges and are directed at light passing with display waveguide chip；S3, it adjusts sextuple adjusting bracket and draws close 8 ° of end face parallel alignments of output end and fiber array of PLC chip, until horizontal CCD and vertical CCD display contact surface are seamless, and the product pad value that light power meter is included in is adjusted to minimum；S4, in 8 ° of the left and right end face dispensing of planar optical waveguide chip and fiber array and PLC chip, so that the glue of a glue surface is uniformly flow to 8 ° of end faces.It is an advantage of the invention that the thickness control of glue-line can will be coupled within 10 microns and uniform 8 degree of faces of coating.
Description
Technical field
The present invention relates to optical commucication field, the coupling process of especially a kind of planar waveguide chip and fiber array.
Background technique
With the rapid development of the broadband communication network construction based on fiber optic network, universal, the light point of unification of three nets
Distribution ODN is the key component of optical access network, is made of optical splitter, optical fiber cable and optical wiring product etc., wherein light point
Road device is the core devices in ODN.Now, the principal element for influencing optical splitter is external mechanical shock and environment to product light
The influence of performance is learned, mechanical shock is relatively stable by raw material and technology controlling and process reliability.As optical splitter demand increases,
Improving optical splitter is the service life, reduces environment and has a very important significance to optical splitter device optical index variable quantity.
Coupling is the important production process of planar optical waveguide device and AWG device, is product optical property and reliability
The key component of energy, the technology controlling and process of coupling also become the key component of device quality, at present FA and chip coupling in coupling
Conjunction end face is parallel, and glue-line is partially thick, and first UV solidification, glue-line shrinkage amplitude is big, and corresponding IL parameter fluctuation range is larger, IL parameter
Fluctuation also has certain relationship (being described here just for bondline thickness), such aging of product process with the energy that UV irradiates
It is not particularly evident to IL variation.Because the thickness of glue-line is partially thick, the water absorbing capacity of glue also floats therewith, the coefficient of expansion of glue
Bigger than normal, in environmental performance test, glue-line water inlet, glue-line displacement probability is higher, and glue-line, which generates variation IL parameter, to become larger therewith.
Summary of the invention
The purpose of the present invention is to overcome the shortcomings of the existing technology, provides the coupling of a kind of planar waveguide chip and fiber array
Conjunction method.
The purpose of the present invention is achieved through the following technical solutions: a kind of coupling side of planar waveguide chip and fiber array
Method, comprising the following steps:
It is S1, the surface cleaning of planar optical waveguide chip and PLC chip is clean, single fiber and PLC chip are then placed on 6 DOF
On adjusting bracket, keep 8 ° of end faces of PLC chip opposite with the light pass surface forward direction of FA；
S2, the sextuple adjusting bracket of adjusting are aligned the fibre core of planar optical waveguide chip with the main waveguide of the input terminal of PLC chip, pass through
The above light source in 2 tunnels is directly accessed at the optical splitter light source of 2 points of N, each station light source has feux rouges and wavelength light source, need to be to survey
Examination wavelength attenuation light source carries out zero calibration, guarantees the accuracy of debugging product decaying, connects 1CH/2CH fiber array afterwards, defeated
Enter to hold 1CH/2CH fiber array and chip to place sextuple adjusting bracket, output end places trapezoidal refracting telescope, exports image by feux rouges
It completes 1CH/2CH fiber array and is directed at light passing with display waveguide chip；
S3, the trapezoidal refracting telescope of output end is removed, fixture places 2ch or more (multichannel) optical fiber array on the right of arrayed waveguide chip
Column, output optical fibre array first passage connect light power meter with last channel fiber tail portion, and adjusting sextuple adjusting bracket makes PLC chip
8 ° of end face parallel alignments of output end and fiber array draw close, until horizontal CCD and vertical CCD display contact surface are seamless, and
The product pad value that light power meter is included in is adjusted to minimum；
The X-axis of S4, the sextuple adjusting bracket of adjusting or so makes planar optical waveguide chip and fiber array retreat a circle, then in planar light
8 ° of the left and right end face dispensing of waveguide chip and fiber array and PLC chip, makes the glue of a glue surface uniformly flow to 8 ° of end faces；
S5, it then adjusts in the X axis of sextuple adjusting bracket the right and left into a circle, taps the master of sextuple adjusting bracket the right and left
Body, observation glue-line glue whether there is mobility, if attenuation parameter is adjusted to minimum value progress UV and is consolidated without there are mobility
Change, if it exists mobility, then there are the X-axis of mobility side for adjusting, inwardly into 0.5 ~ 1 circle, until after observing no mobility
Carry out UV solidification.
Specifically, the sextuple adjusting bracket has the X-axis of left and right adjusting, the Y that the Z axis of up and down adjustment and front and back are adjusted
Axis.
Specifically, the thickness of the glue-line after the solidification is less than 10 μm.
Specifically, sextuple adjusting bracket is adjusted in the step S3 makes output end and 8 ° of end faces of fiber array of PLC chip
Parallel alignment is drawn close, but is not contacted, and encloses the state that just can be contacted by inwardly adjusting X-axis 3 ~ 5.
Reach the invention has the following advantages that being coupled using method of the invention to PLC chip and can make to couple glue-line
Thickness is thin and uniform characteristic, the stable optical performance for coupling PLC, guarantees environment to the Dissipation change amount of device optical performance
It reduces, to improve the service life of PLC device.
Detailed description of the invention
Fig. 1 is that vertical view of the invention couples schematic diagram；
Fig. 2 is that side view of the invention couples schematic diagram；
In figure: 1- planar optical waveguide chip, 2-PLC chip, 3- coupling surface.
Specific embodiment
The present invention will be further described with reference to the accompanying drawing, but protection scope of the present invention is not limited to following institute
It states.
As shown in Figure 1 and 2, the coupling process of a kind of planar waveguide chip and fiber array, comprising the following steps:
It is S1, the surface cleaning of planar optical waveguide chip and PLC chip is clean, single fiber and PLC chip are then placed on 6 DOF
On adjusting bracket, keep 8 ° of end faces of PLC chip opposite with the light pass surface forward direction of FA；
S2, the sextuple adjusting bracket of adjusting are aligned the fibre core of planar optical waveguide chip with the main waveguide of the input terminal of PLC chip, pass through
The above light source in 2 tunnels is directly accessed at the optical splitter light source of 2 points of N, each station light source has feux rouges and wavelength light source, need to be to survey
Examination wavelength attenuation light source carries out zero calibration, guarantees the accuracy of debugging product decaying, connects 1CH/2CH fiber array afterwards, defeated
Enter to hold 1CH/2CH fiber array and chip to place sextuple adjusting bracket, output end places trapezoidal refracting telescope, exports image by feux rouges
It completes 1CH/2CH fiber array and is directed at light passing with display waveguide chip；
S3, the trapezoidal refracting telescope of output end is removed, fixture places 2CH or more (multichannel) optical fiber array on the right of arrayed waveguide chip
Column, output optical fibre array first passage connect light power meter with last channel fiber tail portion, and adjusting sextuple adjusting bracket makes PLC chip
8 ° of end face parallel alignments of output end and fiber array draw close, until horizontal CCD and vertical CCD display contact surface are seamless, and
The product pad value that light power meter is included in is adjusted to minimum；
The X-axis of S4, the sextuple adjusting bracket of adjusting or so makes planar optical waveguide chip and fiber array retreat a circle, then in planar light
8 ° of the left and right end face dispensing of waveguide chip and fiber array and PLC chip, makes the glue of a glue surface uniformly flow to 8 ° of end faces；
S5, it then adjusts in the X axis of sextuple adjusting bracket the right and left into a circle, taps the master of sextuple adjusting bracket the right and left
Body taps by the way of tapping, and observation glue-line glue whether there is mobility, if without there are mobility, by attenuation parameter
It being adjusted to minimum value and carries out UV solidification, if it exists mobility, then there are the X-axis of mobility side for adjusting, inwardly enclosed into 0.5 ~ 1,
Until carrying out UV solidification after observing no mobility.
Further, the sextuple adjusting bracket has the X-axis of left and right adjusting, the Y that the Z axis of up and down adjustment and front and back are adjusted
Axis.
Further, the thickness of the glue-line after the solidification is less than 10 μm.
Further, sextuple adjusting bracket is adjusted in the step S3 makes the output end of PLC chip and 8 ° of fiber array ends
Face parallel alignment is drawn close, but is not contacted, and encloses the state that just can be contacted by inwardly adjusting X-axis 3 ~ 5.
PLC chip is coupled using method of the present invention can reach coupling glue-line glue-line after cure shrinkage it is thin
And uniformly, test proves that coupling glue-line thickness and uniformity coupling optical performance can be had an impact, i.e., thickness it is thin and
Uniform coupling glue-line is stablized in coupling optical performance, and the fluctuating range of IL is small in the ageing process of product, will not generate
The phenomenon that race value, the Parameters variation amount in environmental performance test are also small.
The above, only presently preferred embodiments of the present invention not do limitation in any form to the present invention.It is any ripe
Those skilled in the art is known, without departing from the scope of the technical proposal of the invention, all using technology contents described above
Many possible changes and modifications or equivalent example modified to equivalent change are made to technical solution of the present invention.Therefore, all
It is the content without departing from technical solution of the present invention, any change modification made to the above embodiment of technology according to the present invention,
Equivalent variations and modification belong to the protection scope of the technical program.
Claims (3)
1. the coupling process of a kind of planar waveguide chip and fiber array, it is characterised in that: the following steps are included:
It is S1, the surface cleaning of planar optical waveguide chip and PLC chip is clean, single fiber and PLC chip are then placed on 6 DOF
On adjusting bracket, keep 8 ° of end faces of PLC chip parallel with the light pass surface of FA opposite；
S2, the sextuple adjusting bracket of adjusting are aligned the fibre core of planar optical waveguide chip with the main waveguide of the input terminal of PLC chip, pass through
The above light source in 2 tunnels is directly accessed at the optical splitter light source of 2 points of N, each station light source has feux rouges and wavelength light source, need to be to survey
Examination wavelength attenuation light source carries out zero calibration, guarantees the accuracy of debugging product decaying, connects 1CH/2CH fiber array afterwards, defeated
Enter to hold 1CH/2CH fiber array and chip to place sextuple adjusting bracket, output end places trapezoidal refracting telescope, exports image by feux rouges
It completes 1CH/2CH fiber array and is directed at light passing with display waveguide chip；
S3, the trapezoidal refracting telescope of output end is removed, fixture places 2CH or more fiber array, output light on the right of arrayed waveguide chip
Fibre array first passage connect light power meter with last channel fiber tail portion, and adjusting sextuple adjusting bracket makes the output end of PLC chip
It is drawn close with 8 ° of end face parallel alignments of fiber array, until horizontal CCD and vertical CCD display contact surface are seamless, and by optical power
The product pad value being included in is adjusted to minimum；
The X-axis of S4, the sextuple adjusting bracket of adjusting or so makes planar optical waveguide chip and fiber array retreat a circle, then in planar light
8 ° of the left and right end face dispensing of waveguide chip and fiber array and PLC chip, makes the glue of a glue surface uniformly flow to 8 ° of end faces；
S5, it then adjusts in the X axis of sextuple adjusting bracket the right and left into a circle, taps the master of sextuple adjusting bracket the right and left
Body, observation glue-line glue whether there is mobility, if attenuation parameter is adjusted to minimum value progress UV and is consolidated without there are mobility
Change, if it exists mobility, then there are the X-axis of mobility side for adjusting, inwardly into 0.5 ~ 1 circle, until after observing no mobility
Carry out UV solidification.
2. the coupling process of a kind of planar waveguide chip and fiber array according to claim 1, it is characterised in that: described
Sextuple adjusting bracket there is the X-axis of left and right adjusting, the Y-axis that the Z axis of up and down adjustment and front and back are adjusted.
3. the coupling process of a kind of planar waveguide chip and fiber array according to claim 1, it is characterised in that: described
Solidification after glue-line thickness less than 10 μm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810960847.2A CN109031532A (en) | 2018-08-22 | 2018-08-22 | A kind of coupling process of planar waveguide chip and fiber array |
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| CN201810960847.2A CN109031532A (en) | 2018-08-22 | 2018-08-22 | A kind of coupling process of planar waveguide chip and fiber array |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109597165A (en) * | 2018-12-13 | 2019-04-09 | 江苏亨通光网科技有限公司 | A kind of adjustment system that optical splitter end face is parallel and method |
| CN110727056A (en) * | 2019-09-05 | 2020-01-24 | 国科光芯(海宁)科技股份有限公司 | Full-automatic PLC chip coupling device, system and method |
| CN112230352A (en) * | 2020-10-28 | 2021-01-15 | 常州光芯集成光学有限公司 | Coupling equipment for area array type light source beam splitting and coupling mode thereof |
| CN112394453A (en) * | 2020-11-25 | 2021-02-23 | 天津津航技术物理研究所 | Method for manufacturing Y waveguide based on refractive index guide type photonic crystal fiber |
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| CN2927081Y (en) * | 2006-07-24 | 2007-07-25 | 深圳飞通光电子技术有限公司 | Planar optical waveguide power beam splitter |
| US20090067797A1 (en) * | 2007-09-06 | 2009-03-12 | Kla-Tencor Technologies Corporation | Optical waveguide radiation control |
| CN101806936A (en) * | 2009-12-08 | 2010-08-18 | 苏州新大诚科技发展股份有限公司 | Novel spot gluing method |
| CN102944916A (en) * | 2012-11-23 | 2013-02-27 | 镇江华坚电子有限公司 | Low-insertion-loss coupling technique |
| CN105137541A (en) * | 2015-09-09 | 2015-12-09 | 镇江华坚电子有限公司 | Planar waveguide optical divider structure |
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2018
- 2018-08-22 CN CN201810960847.2A patent/CN109031532A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2927081Y (en) * | 2006-07-24 | 2007-07-25 | 深圳飞通光电子技术有限公司 | Planar optical waveguide power beam splitter |
| US20090067797A1 (en) * | 2007-09-06 | 2009-03-12 | Kla-Tencor Technologies Corporation | Optical waveguide radiation control |
| CN101806936A (en) * | 2009-12-08 | 2010-08-18 | 苏州新大诚科技发展股份有限公司 | Novel spot gluing method |
| CN102944916A (en) * | 2012-11-23 | 2013-02-27 | 镇江华坚电子有限公司 | Low-insertion-loss coupling technique |
| CN105137541A (en) * | 2015-09-09 | 2015-12-09 | 镇江华坚电子有限公司 | Planar waveguide optical divider structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109597165A (en) * | 2018-12-13 | 2019-04-09 | 江苏亨通光网科技有限公司 | A kind of adjustment system that optical splitter end face is parallel and method |
| CN110727056A (en) * | 2019-09-05 | 2020-01-24 | 国科光芯(海宁)科技股份有限公司 | Full-automatic PLC chip coupling device, system and method |
| CN112230352A (en) * | 2020-10-28 | 2021-01-15 | 常州光芯集成光学有限公司 | Coupling equipment for area array type light source beam splitting and coupling mode thereof |
| CN112394453A (en) * | 2020-11-25 | 2021-02-23 | 天津津航技术物理研究所 | Method for manufacturing Y waveguide based on refractive index guide type photonic crystal fiber |
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Application publication date: 20181218 |