CN111474641A - A multi-core optical fiber fan-out connector assembly - Google Patents
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
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Abstract
Description
技术领域technical field
本发明涉及光纤通信技术领域,特别涉及一种多芯光纤的扇出接头组件。The invention relates to the technical field of optical fiber communication, in particular to a fan-out connector assembly of a multi-core optical fiber.
背景技术Background technique
多芯光纤(Multi Core Fiber,MCF)是一种在共同的包层区中存在多个独立纤芯的新型光纤,每个纤芯均在单模状态下工作,能够实现长距离低串扰的空分复用光信号传输,非常适合传输大容量的光信息。Multi-core fiber (MCF) is a new type of fiber with multiple independent cores in a common cladding region, each core works in a single-mode state, and can achieve long-distance and low-crosstalk air. Division multiplexing optical signal transmission, very suitable for transmitting large-capacity optical information.
现有的制备多芯光纤的方法,在芯数较多时操作难度较大,难以进行批量制作。The existing method for preparing a multi-core optical fiber is difficult to operate when the number of cores is large, and it is difficult to manufacture in batches.
发明内容SUMMARY OF THE INVENTION
有鉴于此,本发明的目的在于提供一种多芯光纤的扇出接头组件,其制作简单,能够进行批量制作。In view of this, the purpose of the present invention is to provide a fan-out connector assembly of a multi-core optical fiber, which is simple to manufacture and can be manufactured in batches.
为实现上述目的,本发明有如下技术方案:For achieving the above object, the present invention has the following technical solutions:
一种多芯光纤的扇出接头组件,包括:A fan-out connector assembly of a multi-core optical fiber, comprising:
三维波导芯片、多芯光纤头以及单模光纤阵列;Three-dimensional waveguide chips, multi-core fiber heads and single-mode fiber arrays;
所述三维波导芯片的输入端与所述多芯光纤头连接;The input end of the three-dimensional waveguide chip is connected to the multi-core optical fiber head;
所述三维波导芯片的输出端与所述单模光纤阵列连接。The output end of the three-dimensional waveguide chip is connected to the single-mode fiber array.
可选的,所述三维波导芯片包括三维光波导,所述输入端的所述三维光波导呈二维排列,所述输出端的所述三维光波导呈一维排列。Optionally, the three-dimensional waveguide chip includes three-dimensional optical waveguides, the three-dimensional optical waveguides at the input end are arranged in two dimensions, and the three-dimensional optical waveguides at the output end are arranged in one dimension.
可选的,所述多芯光纤头包括:多芯光纤和方形玻璃毛细管;Optionally, the multi-core optical fiber head includes: a multi-core optical fiber and a square glass capillary;
所述多芯光纤位于所述方形玻璃毛细管内。The multi-core optical fiber is located in the square glass capillary.
可选的,所述多芯光纤的芯数范围为4~32。Optionally, the number of cores of the multi-core optical fiber ranges from 4 to 32.
可选的,所述三维光波导的波导数量与所述多芯光纤头中多芯光纤的芯数相同。Optionally, the number of waveguides of the three-dimensional optical waveguide is the same as the number of cores of the multi-core optical fiber in the multi-core optical fiber head.
可选的,所述多芯光纤的芯数为4,所述多芯光纤包括4个单模波导,所述4个单模波导呈矩阵排列。Optionally, the number of cores of the multi-core optical fiber is 4, the multi-core optical fiber includes 4 single-mode waveguides, and the 4 single-mode waveguides are arranged in a matrix.
可选的,所述输入端的所述三维光波导呈矩阵排列。Optionally, the three-dimensional optical waveguides at the input end are arranged in a matrix.
可选的,所述多芯光纤的芯数为7,所述多芯光纤包括7个单模波导,所述7个单模波导呈圆周及圆心排列。Optionally, the number of cores of the multi-core optical fiber is 7, and the multi-core optical fiber includes 7 single-mode waveguides, and the 7 single-mode waveguides are arranged in a circle and a center of the circle.
可选的,所述输入端的所述三维光波导呈圆周及圆心排列。Optionally, the three-dimensional optical waveguides at the input end are arranged in a circle and a circle center.
可选的,所述多芯光纤头与所述三维波导芯片的输入端连接,所述三维波导芯片的输出端与所述单模光纤阵列连接包括:Optionally, the multi-core fiber head is connected to the input end of the three-dimensional waveguide chip, and the output end of the three-dimensional waveguide chip is connected to the single-mode fiber array including:
所述多芯光纤头通过粘结紫外胶与所述三维波导芯片的输入端连接,所述三维波导芯片的输出端通过粘结紫外胶与所述单模光纤阵列连接。The multi-core optical fiber head is connected to the input end of the three-dimensional waveguide chip by bonding UV glue, and the output end of the three-dimensional waveguide chip is connected to the single-mode fiber array by bonding UV glue.
本发明实施例提供的一种多芯光纤的扇出接头组件,包括:三维波导芯片、多芯光纤头以及单模光纤阵列,三维波导芯片的输入端与多芯光纤头连接,三维波导芯片的输出端与单模光纤阵列连接。这样,通过三维波导芯片的输入端与多芯光纤头连接,三维波导芯片的输出端与单模光纤阵列连接,利用三维波导芯片将多芯光纤头中呈二维排列的多芯分布转换为呈一维阵列的多芯分布,而后与单模光纤阵列对准耦合,形成结构较为简单的多芯光纤扇出接头组件,降低制造难度,并且能够用于批量生产。An embodiment of the present invention provides a multi-core optical fiber fan-out connector assembly, including: a three-dimensional waveguide chip, a multi-core optical fiber head, and a single-mode optical fiber array, the input end of the three-dimensional waveguide chip is connected to the multi-core optical fiber head, and the three-dimensional waveguide chip The output end is connected with the single-mode fiber array. In this way, the input end of the three-dimensional waveguide chip is connected to the multi-core optical fiber head, and the output end of the three-dimensional waveguide chip is connected to the single-mode fiber array, and the three-dimensional waveguide chip is used to convert the two-dimensionally arranged multi-core distribution in the multi-core fiber head into a single-mode fiber array. The multi-core distribution of the one-dimensional array is then aligned and coupled with the single-mode fiber array to form a multi-core fiber fan-out connector assembly with a relatively simple structure, which reduces the manufacturing difficulty and can be used for mass production.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图。In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are For some embodiments of the present invention, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative effort.
图1示出了根据本发明实施例一种多芯光纤的扇出接头组件的结构示意图;FIG. 1 shows a schematic structural diagram of a fan-out connector assembly of a multi-core optical fiber according to an embodiment of the present invention;
图2示出了根据本发明实施例一种三维波导芯片的立体结构示意图;FIG. 2 shows a schematic three-dimensional structure diagram of a three-dimensional waveguide chip according to an embodiment of the present invention;
图3示出了根据本发明实施例一种多芯光纤的截面结构示意图;3 shows a schematic cross-sectional structure diagram of a multi-core optical fiber according to an embodiment of the present invention;
图4示出了根据本发明实施例一种多芯光纤的截面结构示意图。FIG. 4 shows a schematic cross-sectional structure diagram of a multi-core optical fiber according to an embodiment of the present invention.
具体实施方式Detailed ways
为使本发明的上述目的、特征和优点能够更加明显易懂,下面结合附图对本发明的具体实施方式做详细的说明。In order to make the above objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
在下面的描述中阐述了很多具体细节以便于充分理解本发明,但是本发明还可以采用其它不同于在此描述的其它方式来实施,本领域技术人员可以在不违背本发明内涵的情况下做类似推广,因此本发明不受下面公开的具体实施例的限制。Many specific details are set forth in the following description to facilitate a full understanding of the present invention, but the present invention can also be implemented in other ways different from those described herein, and those skilled in the art can do so without departing from the connotation of the present invention. Similar promotion, therefore, the present invention is not limited by the specific embodiments disclosed below.
正如背景技术的描述,现有的制备多芯光纤的方法,在芯数较多时操作难度较大,难以进行批量制作。As described in the background art, the existing methods for preparing multi-core optical fibers are difficult to operate when the number of cores is large, and it is difficult to manufacture in batches.
为此,本申请实施例提供一种多芯光纤的扇出接头组件,包括:三维波导芯片、多芯光纤头以及单模光纤阵列,三维波导芯片的输入端与多芯光纤头连接,三维波导芯片的输出端与单模光纤阵列连接。这样,通过三维波导芯片的输入端与多芯光纤头连接,三维波导芯片的输出端与单模光纤阵列连接,利用三维波导芯片将多芯光纤头中呈二维排列的多芯分布转换为呈一维阵列的多芯分布,而后与单模光纤阵列对准耦合,形成结构较为简单的多芯光纤扇出接头组件,降低制造难度,并且能够用于批量生产。To this end, an embodiment of the present application provides a fan-out connector assembly of a multi-core optical fiber, including: a three-dimensional waveguide chip, a multi-core optical fiber head, and a single-mode optical fiber array, the input end of the three-dimensional waveguide chip is connected to the multi-core optical fiber head, and the three-dimensional waveguide chip The output end of the chip is connected with the single-mode fiber array. In this way, the input end of the three-dimensional waveguide chip is connected to the multi-core optical fiber head, and the output end of the three-dimensional waveguide chip is connected to the single-mode fiber array, and the three-dimensional waveguide chip is used to convert the two-dimensionally arranged multi-core distribution in the multi-core fiber head into a single-mode fiber array. The multi-core distribution of the one-dimensional array is then aligned and coupled with the single-mode fiber array to form a multi-core fiber fan-out connector assembly with a relatively simple structure, which reduces the manufacturing difficulty and can be used for mass production.
为了便于理解本申请的技术方案和技术效果,以下将结合附图对具体的实施例进行详细的描述。In order to facilitate the understanding of the technical solutions and technical effects of the present application, specific embodiments will be described in detail below with reference to the accompanying drawings.
参见图1和图2所示,本申请实施例提供一种多芯光纤的扇出接头组件,包括:Referring to FIG. 1 and FIG. 2 , an embodiment of the present application provides a fan-out connector assembly of a multi-core optical fiber, including:
三维波导芯片1、多芯光纤头2以及单模光纤阵列3;A three-dimensional waveguide chip 1, a
三维波导芯片1的输入端12与多芯光纤头2连接;The
三维波导芯片1的输出端13与单模光纤阵列3连接。The
本申请实施例中,三维波导芯片1包括三维光波导11,三维波导芯片1输入端12的三维光波导11呈二维排列,三维波导芯片1的输出端13的三维光波导11呈一维排列,参见图2所示,图2为三维波导芯片1的立体结构图。三维波导芯片1将二维排列的多芯分布转换为一维排布的多芯分布。本实施例中,可以通过激光直写波导技术制备三维光波导11,具体的,可以为,飞秒激光通过物镜聚焦到材料内部,例如玻璃、晶体、高分子以及透明陶瓷等,诱导材料结构改变使其折射率提高,从而在材料内部形成三维立体光波导。本实施例中,采用玻璃作为光波导形成的基体,例如可以采用氧化物玻璃、氟化物玻璃等。飞秒激光在各种玻璃中写入的光波导通过改变激光照射条件来改变折射率和芯径,实现单模和多模的光波导,并且光通信波段的损耗小于0.5db/cm。In the embodiment of the present application, the three-dimensional waveguide chip 1 includes a three-dimensional
本申请实施例中,多芯光纤头2用于承载多芯光纤。例如,多芯光纤头2包括:多芯光纤和方形玻璃毛细管,多芯光纤位于方形玻璃毛细管内。多芯光纤是一种在共同的包层区中存在多个独立纤芯的新型光纤。可以通过采用掺氟包层折射率剖面结构,实现长距离低串扰的空分复用光信号传输。基于空分复用理念的多芯光纤,在一根光纤中同时传输多路光信号,可极大地提高通信容量,以突破当前普通单模光纤传输容量极限。本实施例中,多芯光纤的芯数范围可以为4~32,例如可以为4、7、16等。In the embodiment of the present application, the multi-core
在具体的实施例中,形成多芯光纤头2的方法可以为,将多芯光纤穿入方形玻璃毛细管并突出于方形玻璃毛细管3~5mm,而后用胶水将多芯光纤固定于方形玻璃毛细管内,待多芯光纤固定后,研磨去除突出于方形玻璃毛细管的多芯光纤,使得多芯光纤的端面与方形玻璃毛细管的端面齐平,以便后续与波导芯片对准耦合。In a specific embodiment, the method for forming the multi-core
本实施例中,三维光波导11的波导数与多芯光纤的芯数相同,从而使得三维光波导与多芯光纤完全耦合,便于光信号的传输。例如,多芯光纤的芯数可以为4,多芯光纤包括4个单模波导,4个单模波导呈矩阵排列,参见图3所示,图3为4芯多芯光纤的截面图。多芯光纤中的4个单模波导呈矩阵排列时,三维波导芯片1的输入端12的三维光波导11也呈矩阵排列。多芯光纤的芯数还可以为7,多芯光纤包括7个单模波导,7个单模波导呈圆周及圆心排列,参见图4所示,图4为7芯光纤的截面图。多芯光纤中的7个单模波导呈圆周及圆心排列时,三维波导芯片1的输入端12的三维光波导11也呈圆周及圆心排列。In this embodiment, the number of waveguides of the three-dimensional
本申请实施例中,单模光纤阵列3中的单模光纤(Single Mode Fiber)为中心玻璃芯很细只能传一种模式的光纤。单模光纤的模间色散很小,对光源的谱宽和稳定性有较高的要求。In the embodiment of the present application, the single-mode fiber (Single Mode Fiber) in the single-
本实施例中,形成单模光纤阵列3的方法,可以为,将玻璃V型槽、玻璃进行超声波清洗并烘干,而后将玻璃V型槽放入装配工装内。将单模光纤带前端7mm左右的光纤剥除涂覆层,露出内部的光纤带,并对暴露出的光纤带进行清洁。将单模光纤带放入V型槽中,调整光纤带前后的位置,使得暴露的光纤带处于V型槽的台阶位置上,台阶位置是指V型槽的位置,光纤带的尾部被临时固定在夹具上,以避免光纤带脱离出V型槽。随后,将玻璃盖板放在玻璃V型槽上并夹紧,并在玻璃盖板与玻璃V型槽端面的连接处注入紫外固化胶水,待紫外固化胶水充满玻璃V型槽和玻璃盖板之间的间隙时,采用紫外光照射,使得紫外固化胶水被固化,从而将玻璃V型槽、光纤带以及玻璃盖板粘结为一个整体,形成单模光纤阵列,从装配工装上取下单模光纤阵列。而后可以将单模光纤阵列放入85℃左右的烘箱内进行烘烤,以彻底固化紫外固化胶水,还可以对形成的单模光纤阵列的端面进行研磨,以利于后续与波导芯片进行耦合。In this embodiment, the method for forming the single-mode
本申请实施例中,三维波导芯片1的输入端12与多芯光纤头2连接,三维波导芯片1的输出端13与单模光纤阵列3连接。In the embodiment of the present application, the
本实施例中,三维波导芯片1的输入端12与多芯光纤头2连接,利用三维波导芯片1将多芯光纤头2中呈二维排列的多芯分布转换为呈一维排列的多芯分布,而后将三维波导芯片1的输出端13与单模光纤阵列3连接,形成结构较为简单的多芯光纤扇出接头组件,降低制造难度,并且能够用于批量生产。In this embodiment, the
本实施例中,形成多芯光纤扇出接头组件的方法,可以为,设置六维光学调节系统,六维光学调节系统包括处于中间的芯片固定座,两侧各有一个六维精密光学调节架,同时配置有相应的激光光源、双通道光功率计、光功率计、紫外光固化系统、CCD摄像监视系统、照明光源以及防震光学平台。而后,将三维波导芯片1输入端12和输出端13进行清洁,装入六维光学调节系统的芯片固定座上,三维波导芯片1的输出端13可以在左侧,输入端12可以在右侧。而后,将多芯光纤头2装入六维光学调节系统右侧光学调节架上的光纤阵列夹具上,并对准光功率计的探测头。随后,将单模光纤阵列3装入六维光学调节系统左侧光学调节架的光纤阵列夹具上,将分别处于最边缘的两个通道光纤连接激光源。在CCD摄像监视系统的观察下,通过监测光功率计的插入损耗值,不断调整两侧的六维精密光学调节架,使得插入损耗值达到预设值,在插入损耗值达到预设值时,表明多芯光纤头2与三维波导芯片1的输入端12波导已经对准,单模光纤阵列3最边缘处的通道光纤与三维波导芯片1的输出端13波导已经对准。而后,将单模光纤阵列的其他通道光纤分别接入激光源,检测其插入损耗值,必要时可以微调光学调节架,使得各个通道的损耗值都达到均衡。本实施例中,在调整好三维波导芯片1、多芯光纤头2以及单模光纤阵列3的位置后,可以在多芯光纤头2与三维波导芯片1的输入端12连接处涂覆紫外胶水,在三维波导芯片1的输出端13与单模光纤阵列3的连接处涂覆紫外胶水,而后用紫外光照射涂覆的紫外胶水,使得紫外胶水固化,将多芯光纤头2与三维波导芯片1的输入端12连接在一起,将三维波导芯片1的输出端13与单模光纤阵列3连接在一起,形成多芯光纤的扇出接头组件。还可以将多芯光纤的扇出接头组件放入85℃的烘箱中进行高温烘烤,使紫外胶水完全固化。In this embodiment, the method for forming a multi-core optical fiber fan-out connector assembly may include setting a six-dimensional optical adjustment system, the six-dimensional optical adjustment system includes a chip holder in the middle, and a six-dimensional precision optical adjustment frame on each side At the same time, it is equipped with corresponding laser light source, dual-channel optical power meter, optical power meter, ultraviolet curing system, CCD camera monitoring system, lighting source and shock-proof optical platform. Then, clean the
以上对本申请实施例提供的多芯光纤的扇出接头组件进行了详细的描述,该组件通过三维波导芯片的输入端与多芯光纤头连接,三维波导芯片的输出端与单模光纤阵列连接,利用三维波导芯片将多芯光纤头中呈二维排列的多芯分布转换为呈一维阵列的多芯分布,而后与单模光纤阵列对准耦合,形成结构较为简单的多芯光纤扇出接头组件,降低制造难度,并且能够用于批量生产。The fan-out connector assembly of the multi-core optical fiber provided by the embodiment of the present application has been described in detail above. The assembly is connected to the multi-core optical fiber head through the input end of the three-dimensional waveguide chip, and the output end of the three-dimensional waveguide chip is connected to the single-mode fiber array. The three-dimensional waveguide chip is used to convert the two-dimensional multi-core distribution in the multi-core fiber head into a one-dimensional array of multi-core distribution, and then align and couple with the single-mode fiber array to form a multi-core fiber fan-out connector with a relatively simple structure components, reduce the difficulty of manufacturing, and can be used for mass production.
本说明书中的各个实施例均采用递进的方式描述,各个实施例之间相同相似的部分互相参见即可,每个实施例重点说明的都是与其它实施例的不同之处。Each embodiment in this specification is described in a progressive manner, and the same and similar parts between the various embodiments may be referred to each other, and each embodiment focuses on the differences from other embodiments.
以上所述仅是本发明的优选实施方式,虽然本发明已以较佳实施例披露如上,然而并非用以限定本发明。任何熟悉本领域的技术人员,在不脱离本发明技术方案范围情况下,都可利用上述揭示的方法和技术内容对本发明技术方案做出许多可能的变动和修饰,或修改为等同变化的等效实施例。因此,凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所做的任何的简单修改、等同变化及修饰,均仍属于本发明技术方案保护的范围内。The above descriptions are only preferred embodiments of the present invention. Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art, without departing from the scope of the technical solution of the present invention, can make many possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above, or modify them into equivalents of equivalent changes. Example. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solutions of the present invention still fall within the protection scope of the technical solutions of the present invention.
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