CN102540349A - Packaging method for high-efficiency vertical coupling interconnection of optical fiber and optical waveguide chip - Google Patents
Packaging method for high-efficiency vertical coupling interconnection of optical fiber and optical waveguide chip Download PDFInfo
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- CN102540349A CN102540349A CN2012100140972A CN201210014097A CN102540349A CN 102540349 A CN102540349 A CN 102540349A CN 2012100140972 A CN2012100140972 A CN 2012100140972A CN 201210014097 A CN201210014097 A CN 201210014097A CN 102540349 A CN102540349 A CN 102540349A
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Abstract
The invention discloses a packaging method for high-efficiency vertical coupling interconnection of optical fiber and optical waveguide chip which comprises the following steps of: preparing a silica-based nano waveguide grating and scanning the silica-based nano waveguide grating by applying a scanning electron microscope; preparing a curing packaging material with a low refractive index; preparing a monomode optical fiber; coating an optical anti-reflection film on the surface of the silica-based nano waveguide grating; regulating the position between the monomode optical fiber and the silica-based nano waveguide grating; dispensing an adhesive at the coupling ends of the monomode optical fiber and the silica-based nano waveguide grating; exposing and curing an inner packaged body subjected to adhesive dispensing; preparing a V-shaped optical fiber positioning groove; placing the monomode optical fiber in the V-shaped optical fiber positioning groove; carrying out curing packaging on the monomode optical fiber; exposing and curing the V-shaped optical fiber positioning groove subjected to adhesive dispensing; and testing the finally packaged structure. The invention overcomes the defects of instability and the like of a nano waveguide and grating vertical coupling system on the existing optical integrated chip. The packaged structure provided by the invention has simple structure and high stability, resists external interference and is easy for array integration.
Description
Technical field
The invention belongs to the integrated optics field, the method for packing of particularly a kind of optical fiber and the efficient vertical coupled interconnection of chip of light waveguide.
Background technology
Along with the development of high speed informationization technology, the development of integrated optical device has become the inexorable trend of the staggered development in each field such as following optical communication, photometry calculation, light sensing.Also there is great potential using value in fields such as simultaneously integrated at micro-optical device, light quantum device, chronometer time frequency measurement, light, high sensor, optical-fiber network and light quantum computing machine.What silica-based integrated unit optical interconnection system was made up of the various silicon-based optical waveguide devices that comprise laser instrument, modulator, detector etc. is the interconnection system of transmission signals with light.And SOI (Silicon-On-Insulator, the silicon on the dielectric substrate) material because high refractive index contrast, with advantage such as traditional cmos process compatibility, become the main Material Used of fiber waveguide device.Along with micro-nano photoelectron development of integration technology, the size of optoelectronic device is more and more littler, and multi-purpose optoelectronic device is integrated on the same chip becomes possibility.Yet existing LASER Light Source volume is big, fails to realize the integrated of LASER Light Source and optoelectronic device, so between external light source and integrated optical wave guide device, need the interconnect devices of efficient, a low-loss coupled apparatus and nano optical wave guide and optical fiber.
Traditional coupling scheme are to let optical fiber directly dock coupling with fiber waveguide device because insert loss, the mode switch loss is bigger, causes coupling efficiency very low, is no more than 10% usually.Though adopt the lens fiber coupling can dwindle the optical fiber mode spot, accurately aim at needs between the waveguide, directly aim at the nanometer waveguide and almost can't realize.The present invention utilizes nanometer waveguide optical grating and the vertical coupled optical interconnection scheme of single-mode fiber; Utilize optical transmission; Change optical propagation direction; Realize vertical coupledly, solve low-loss optically transmission problem, can realize coupling efficiency above 50% from the tens of micron fiber of diameter to the optical waveguide structure of hundred nanometers.But adopt the vertical raster coupling that the incident angle of optical fiber is required harshness, also very high to the stability requirement of coupled system, and can not realize repetitive operation, need to aim at every turn.So, how to make the vertical raster coupled system stable more, reliable, be easy to reuse, be the key that improves light transmissioning efficiency, also be the bottleneck of restriction integrated optical device development.
Summary of the invention
Technical matters to be solved by this invention provides the method for packing of a kind of optical fiber and the efficient vertical coupled interconnection of chip of light waveguide; It overcomes nanometer waveguide and the instability of the vertical coupled system of grating and the shortcoming of reregistration on the present optical integrated chip, and simple in structure, good stability, anti-external interference and to be easy to array integrated.
For solveing the technical problem, the invention provides the method for packing of a kind of optical fiber and the efficient vertical coupled interconnection of chip of light waveguide, it is characterized in that it may further comprise the steps:
On the SOI material, adopt micro fabrication to prepare the silicon-based nano waveguide optical grating, and the application scanning Electronic Speculum scan to the silicon-based nano waveguide optical grating;
Applied low-refraction cure package material when being ready to the experiment encapsulation, and use the refractive index that the refractive index detector is measured low-refraction cure package material;
The single-mode fiber that preparation experiment is used is mainly single-mode fiber and digs layer processing, carries out the cutting of alcohol wipe and end face then;
Surface-coated optical anti-reflective film at the silicon-based nano waveguide optical grating;
On above basis, build vertical coupled test macro, combine long-focus CCD and infrared CCD adjustment single-mode fiber and silicon-based nano waveguide optical grating position between the two through sextuple displacement adjusting bracket;
With the coupled end of ready low-refraction cure package material point glue single-mode fiber and silicon-based nano waveguide optical grating, and write down the incident angle of the pairing silicon-based nano waveguide optical grating of sextuple displacement adjusting bracket coupling single-mode fiber;
To the curing that makes public of the inside packaging body of a glue;
According to the incident angle of above-mentioned record, preparing the top has a V-type fiber orientation groove that becomes incident angle with vertical direction;
Single-mode fiber after the above-mentioned some adhesive curing is placed in the V-type fiber orientation groove;
Carry out the cure package of single-mode fiber in the V-type fiber orientation groove with ready curing tackiness material point glue;
To the curing that makes public of the V-type fiber orientation groove of a glue;
Structure to after the final packaging is tested.
Preferably, the mode field diameter of said single-mode fiber is 10um.
Preferably, said single-mode fiber is fixed in the V-type fiber orientation groove through solidifying the tackiness material.
Positive progressive effect of the present invention is:
One, the present invention overcomes nanometer waveguide and the instability of the vertical coupled system of grating and the shortcoming of reregistration on the present optical integrated chip; And simple in structure, good stability, anti-external interference and to be easy to array integrated realize efficient, the light stable coupling and the easy encapsulation of silicon nano optical wave guide and optical fiber.
Two, adopt the vertical raster coupling to improve the coupling efficiency between optical fiber and fiber waveguide device among the present invention.
Three, use optical anti-reflective film among the present invention, can further reduce the Fresnel reflection loss of nanometer grating end face.
Four, use curing glue to give me a little the end of glue nanometer waveguide optical grating and nearly vertical single-mode fiber among the present invention, improved the stability of coupling encapsulation.
Five, the present invention adopts the V-type fiber orientation groove with inclination angle; Realized the efficiency light coupling of grating and single-mode fiber; Overcome the instability that the vertical raster coupled system causes because of external disturbance and the shortcoming of reregistration, improved the incident angle degree of accuracy of coupling encapsulation.
Six, the firm encapsulation technology technology among the present invention is simple, is suitable for and efficient coupling and the easy encapsulation of array fibre with grating, has very large actual application value, can be used for batch process.
Description of drawings
Fig. 1 is the present invention's encapsulating structure key component structural representation that is coupled.
Fig. 2 is the square section synoptic diagram of V-type fiber orientation groove among the present invention.
Fig. 3 is the side tangent plane synoptic diagram of V-type fiber orientation groove among the present invention.
Embodiment
Lift a preferred embodiment below, and combine accompanying drawing to come the clearer the present invention that intactly explains.
As shown in Figure 1, the coupling encapsulating structure comprises silicon-based nano waveguide optical grating 1, single-mode fiber 2, inner packaging body (coupling potted ends) 3, outer enclosure body 4, V-type fiber orientation groove 5, and the inclination angle of V-type fiber orientation groove 5 is θ.Inner packaging body carries out the adhesive curing of low-refraction ultra-violet curing tackiness material point by refractive index match cream that is coated in grating surface and the vertical fiber of digging layer and solidifies and form.And the outer enclosure body has been mainly by having contained the outer enclosure that whole grating, inner packaging body constitute, and its top has the V-type fiber orientation groove of perforation.The dutycycle of silicon-based nano waveguide optical grating is 1: 1, and etching depth is that (150nm～190nm), Cycle Length are L (580nm～610nm) to h.
As shown in Figure 2, wherein d is the fiber radius that does not dig layer, and W is the opening half-breadth of V-type groove.α is the opening angle of V-type groove; We are set at 45 ° (also can be other angles) among the present invention, should be
thereby can get W
As shown in Figure 3, wherein the angle of V-type fiber orientation groove and vertical direction equals the incident angle (being inclination angle theta) of the vertical coupled waveguide optical grating of single-mode fiber.
The invention provides the method for packing of a kind of optical fiber and the efficient vertical coupled interconnection of chip of light waveguide, it mainly is divided into two steps and realizes.The first is carried out the technology encapsulation of V-type fiber orientation groove incident angle accuracy and stability to single-mode fiber in the coupled system; It two is to have utilized a kind of low-refraction ultra-violet curing tackiness material, is used for silicon-based nano waveguide optical grating and single-mode fiber are carried out an adhesive curing encapsulation.
Owing to the incident angle of single-mode fiber is required harsh, need frequent the aligning during experiment test in the perpendicular coupling structure, anti-external disturbance ability causes the instability of coupled system, makes the fluctuation range of Output optical power bigger.To greatly improve the application of nanometer waveguide light transmissioning efficiency and promotion integrated optics fiber waveguide device so realize efficient, stable vertical nanometer grating coupled system.
The method for packing of optical fiber of the present invention as stated and the efficient vertical coupled interconnection of chip of light waveguide mainly comprises following two big crucial method for packing:
One, silicon-based nano waveguide optical grating and the adhesive curing of single-mode fiber point encapsulation:
1.1 at SOI (Silicon-On-Insulator; Silicon on the dielectric substrate) adopt micro fabrication (such as microelectromechanical systems MEMS on the material; Micro Electro Mechanical systems) prepares the silicon-based nano waveguide optical grating; And application scanning Electronic Speculum (SEM) scans the silicon-based nano waveguide optical grating, satisfies the requirement of efficient coupling encapsulation with the silicon-based nano waveguide optical grating of guaranteeing to prepare.
1.2 applied low-refraction cure package material (like ultraviolet glue) when being ready to the experiment encapsulation, and use the refractive index that the refractive index detector is measured this material, be lower than the refractive index of silicon-based nano waveguide optical grating and optical anti-reflective film to guarantee its refractive index.
1.3 the single-mode fiber that preparation experiment is used is mainly single-mode fiber and digs layer processing, carries out the cutting of alcohol wipe and end face then, must guarantee during cutting that inner packaging body is smooth smooth.The mode field diameter of single-mode fiber is 10um.
1.4 at the surface-coated optical anti-reflective film (refractive index match cream) of silicon-based nano waveguide optical grating to strengthen coupling efficiency.
1.5 on above basis, build vertical coupled test macro; Combine long-focus CCD (Charge-coupled Device through high-precision sextuple displacement adjusting bracket; Charge coupled cell) and infrared CCD adjustment single-mode fiber and silicon-based nano waveguide optical grating position between the two, make it keep stability and high efficiency to be coupled.According to the reversibility of light path, survey output power at inner packaging body with optical power detector.
1.6 coupled end with ready low-refraction cure package material point glue single-mode fiber and silicon-based nano waveguide optical grating; The process of some glue will be carried out under the detection of high-power microscope; And through of the influence of optical power detector judging point glue process to coupling efficiency; Like fruit dot glue process disturbance before efficient coupling, then regulate platform the coupling between the two finely tuned through high precision displacement, reach maximum up to coupling efficiency.And write down the incident angle θ of the pairing silicon-based nano waveguide optical grating of sextuple displacement adjusting bracket coupling single-mode fiber.
1.7 to the curing that makes public of the inside packaging body of a glue, the duration depends on the size of encapsulating structure point Jiao Chu, generally about five minutes.
Two, V-type fiber orientation groove (vertical dip angle is θ) stability encapsulation:
2.1 according to the incident angle θ of above-mentioned record, preparing the top has a V-type fiber orientation groove that becomes incident angle θ with vertical direction, V-type fiber orientation groove cant angle theta angle mainly act as the incident angle of firm vertical fiber coupling.
2.2 the single-mode fiber after the above-mentioned some adhesive curing is placed in the V-type fiber orientation groove; Keep optical fiber to be in no case of bending; Tangent plane is big as far as possible in optical fiber side end face and the V-type fiber orientation groove contacts, and the plane layer optical fiber that exposes with V-type fiber orientation groove lower end is difficult for long.To ensure that in addition the set. pt. place deformation does not take place to guarantee the stability of secondary encapsulation.
2.3 carry out the cure package of single-mode fiber in the V-type fiber orientation groove with ready viscosity curing materials (like ultraviolet glue or AB glue) some glue.
2.4 to the curing that makes public of the V-type fiber orientation groove of a glue, the duration is approximately five minutes.Single-mode fiber is fixed in the V-type fiber orientation groove through solidifying the tackiness material.
2.5 the structure to after the final packaging is tested, and is mainly the disturbance rejection property testing, under different external disturbances, observes the value of its Maximum Power Output and confirms its degree of stability.
Though more than described embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, under the prerequisite that does not deviate from principle of the present invention and essence, can make numerous variations or modification to these embodiments.Therefore, protection scope of the present invention is limited appended claims.
Claims (3)
1. the method for packing of optical fiber and the efficient vertical coupled interconnection of chip of light waveguide is characterized in that it may further comprise the steps:
On the SOI material, adopt micro fabrication to prepare the silicon-based nano waveguide optical grating, and the application scanning Electronic Speculum scan to the silicon-based nano waveguide optical grating;
Applied low-refraction cure package material when being ready to the experiment encapsulation, and use the refractive index that the refractive index detector is measured low-refraction cure package material;
The single-mode fiber that preparation experiment is used is mainly single-mode fiber and digs layer processing, carries out the cutting of alcohol wipe and end face then;
Surface-coated optical anti-reflective film at the silicon-based nano waveguide optical grating;
On above basis, build vertical coupled test macro, combine long-focus CCD and infrared CCD adjustment single-mode fiber and silicon-based nano waveguide optical grating position between the two through sextuple displacement adjusting bracket;
With the coupled end of ready low-refraction cure package material point glue single-mode fiber and silicon-based nano waveguide optical grating, and write down the incident angle of the pairing silicon-based nano waveguide optical grating of sextuple displacement adjusting bracket coupling single-mode fiber;
To the curing that makes public of the inside packaging body of a glue;
According to the incident angle of above-mentioned record, preparing the top has a V-type fiber orientation groove that becomes incident angle with vertical direction;
Single-mode fiber after the above-mentioned some adhesive curing is placed in the V-type fiber orientation groove;
Carry out the cure package of single-mode fiber in the V-type fiber orientation groove with ready curing tackiness material point glue;
To the curing that makes public of the V-type fiber orientation groove of a glue;
Structure to after the final packaging is tested.
2. the method for packing of optical fiber as claimed in claim 1 and the efficient vertical coupled interconnection of chip of light waveguide is characterized in that, the mode field diameter of said single-mode fiber is 10um.
3. the method for packing of optical fiber as claimed in claim 1 and the efficient vertical coupled interconnection of chip of light waveguide is characterized in that, said single-mode fiber is fixed in the V-type fiber orientation groove through solidifying the tackiness material.
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014206476A1 (en) * | 2013-06-27 | 2014-12-31 | Das-Nano, S.L. | Optical devices and authentication methods |
| CN104380158A (en) * | 2012-07-30 | 2015-02-25 | 惠普发展公司，有限责任合伙企业 | Optical coupling system and method for fabricating the same |
| WO2015135454A1 (en) * | 2014-03-13 | 2015-09-17 | Huawei Technologies Co., Ltd. | System and apparatus for free space optical coupling |
| CN105226107A (en) * | 2015-08-26 | 2016-01-06 | 中国科学院微电子研究所 | A kind of photon chip of back-scattering light gate coupling encapsulating structure and manufacture method thereof |
| CN105739015A (en) * | 2016-04-29 | 2016-07-06 | 武汉光迅科技股份有限公司 | Coupling method of optical fiber and silicon optical chip, and silicon optical chip |
| JP2016167005A (en) * | 2015-03-10 | 2016-09-15 | 富士通株式会社 | Optical device and manufacturing method for optical device |
| JP2017516150A (en) * | 2014-05-15 | 2017-06-15 | ナノプレシジョン プロダクツ インコーポレイテッドＮａｎｏｐｒｅｃｉｓｉｏｎ Ｐｒｏｄｕｃｔｓ， Ｉｎｃ． | Optical fiber connection to grading coupler |
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| US10018789B2 (en) | 2013-12-20 | 2018-07-10 | Huawei Technologies Co., Ltd. | Method and apparatus for coupling optical waveguide to single-mode fiber |
| CN108549124A (en) * | 2018-04-12 | 2018-09-18 | 中北大学 | A kind of device and method using pulse laser machining holography golden light grid |
| CN109633603A (en) * | 2018-12-04 | 2019-04-16 | 中科天芯科技（北京）有限公司 | A kind of coupling device and method of phased chip of light waveguide and input optical fibre |
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| WO2019212414A1 (en) * | 2018-05-02 | 2019-11-07 | National University Of Singapore | Subwavelength grating coupler for mid-infrared silicon photonics integration |
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| CN112379131A (en) * | 2020-11-02 | 2021-02-19 | 中国科学技术大学 | Hybrid waveguide, preparation method of optical microscope probe and optical microscope probe |
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| WO2023095522A1 (en) * | 2021-11-26 | 2023-06-01 | パナソニックＩｐマネジメント株式会社 | Method for connecting optical waveguide, and optical waveguide connection structure |
| WO2023135649A1 (en) * | 2022-01-11 | 2023-07-20 | 三菱電機株式会社 | Grating coupler |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101793998A (en) * | 2010-03-10 | 2010-08-04 | 中国科学院半导体研究所 | Waveguide grating coupler with distributed Bragg reflector and manufacturing method thereof |
| CN101793520A (en) * | 2010-01-30 | 2010-08-04 | 中北大学 | Integrated optical waveguide gyroscope based on optical microcavity |
| CN101915965A (en) * | 2010-08-23 | 2010-12-15 | 清华大学 | Grating coupler and package structure thereof |
-
2012
- 2012-01-18 CN CN2012100140972A patent/CN102540349A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101793520A (en) * | 2010-01-30 | 2010-08-04 | 中北大学 | Integrated optical waveguide gyroscope based on optical microcavity |
| CN101793998A (en) * | 2010-03-10 | 2010-08-04 | 中国科学院半导体研究所 | Waveguide grating coupler with distributed Bragg reflector and manufacturing method thereof |
| CN101915965A (en) * | 2010-08-23 | 2010-12-15 | 清华大学 | Grating coupler and package structure thereof |
Non-Patent Citations (1)
| Title |
|---|
| 崔丹凤等: "垂直纳米光栅耦合器耦合效率分析与测试", 《传感技术学报》 * |
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| US10018789B2 (en) | 2013-12-20 | 2018-07-10 | Huawei Technologies Co., Ltd. | Method and apparatus for coupling optical waveguide to single-mode fiber |
| US9632281B2 (en) | 2014-03-13 | 2017-04-25 | Futurewei Technologies, Inc. | Free space grating coupler |
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| WO2023135649A1 (en) * | 2022-01-11 | 2023-07-20 | 三菱電機株式会社 | Grating coupler |
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Application publication date: 20120704 |