CN108663113A - A kind of optic fibre cantilev vibrating sensor and preparation method thereof - Google Patents
A kind of optic fibre cantilev vibrating sensor and preparation method thereof Download PDFInfo
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- CN108663113A CN108663113A CN201810651088.1A CN201810651088A CN108663113A CN 108663113 A CN108663113 A CN 108663113A CN 201810651088 A CN201810651088 A CN 201810651088A CN 108663113 A CN108663113 A CN 108663113A
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- fibre cantilev
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- 239000000835 fiber Substances 0.000 title claims abstract description 62
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000013307 optical fiber Substances 0.000 claims abstract description 35
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 30
- 239000010703 silicon Substances 0.000 claims abstract description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 238000005260 corrosion Methods 0.000 claims description 7
- 230000007797 corrosion Effects 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000009131 signaling function Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
- G01H9/004—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means using fibre optic sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0029—Transducers for transforming light into mechanical energy or viceversa
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/0015—Cantilevers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00523—Etching material
- B81C1/00539—Wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0285—Vibration sensors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
The invention discloses optic fibre cantilev vibrating sensors and preparation method thereof, including silicon pedestal, optic fibre cantilev, encapsulating housing and single optical fiber calibrator, wherein, encapsulating housing is fixed on silicon pedestal, and the bottom of encapsulating housing is provided with the first groove, the upper surface of silicon pedestal, which is provided with, offers the second groove and third groove, wherein, second groove is connected with third groove, first groove is located at the surface of the second groove, the end of single optical fiber calibrator is inserted in the first groove, the end of optic fibre cantilev is extend into along third groove in the second groove, and the light that the end of optic fibre cantilev is projected is incident on after the reflection of the inner wall of the second groove in single optical fiber calibrator, the sensor can realize the measurement of vibration, it is small simultaneously, anti-electromagnetic interference capability is strong, preparation method is simple simultaneously, it is easily achieved.
Description
Technical field
The invention belongs to MEMS technology and vibration measurement field, it is related to a kind of optic fibre cantilev vibrating sensor and its system
Preparation Method.
Background technology
Optical fiber sensing technology is nineteen seventies as optical fiber and Fibre Optical Communication Technology grow up.By outer
Boundary's parameter acts on optical fiber, causes the change of light wave parameter such as light intensity, frequency, wavelength, phase and polarization state in optical fiber etc.
Change, the extraneous parameter of detection is achieved the purpose that by the variation of light wave parameter in detection fiber.Fibre optical sensor is in electricity at present
Force system, the detection of large scale structure and infrastructure, geological disaster the fields such as monitoring be widely used and study.
Vibration problem always is the important subject of science and technology field.With the development of production technology, more next
Some problems caused by shaking will be paid close attention in terms of more research, therefore the monitoring vibrated just is particularly important.Currently, passing
The vibration measurement of system is mainly electromagnetism class sensor, and that there is volumes is larger, easily by electromagnetic interference etc. for the sensor of electromagnetism class
Disadvantage greatly limits its application scenario.
Invention content
It is an object of the invention to overcome the above-mentioned prior art, a kind of optic fibre cantilev vibrating sensor is provided
And preparation method thereof, which can realize the measurement of vibration, while small, and anti-electromagnetic interference capability is strong, prepare simultaneously
Method is simple, it is easy to accomplish.
In order to achieve the above objectives, optic fibre cantilev vibrating sensor of the present invention include silicon pedestal, optic fibre cantilev,
Encapsulating housing and single optical fiber calibrator, wherein encapsulating housing is fixed on silicon pedestal, and the bottom of encapsulating housing is provided with first
Groove, the upper surface of silicon pedestal, which is provided with, offers the second groove and third groove, wherein the second groove is connected with third groove
Logical, the first groove is located at the surface of the second groove, and the end of single optical fiber calibrator is inserted in the first groove, optic fibre cantilev
End extend into the second groove along third groove, and optic fibre cantilev end project inner wall of the light through the second groove
It is incident in single optical fiber calibrator after reflection.
The third groove is V-groove, and the cross section of the second groove is trapezoidal.
Using MEMS wet corrosion techniques using the silica for being carved with required figure do mask the surface of silicon pedestal into
Row anisotropic etching, to form the second groove and third groove.
Angle between the side wall of the side wall and third groove of the upper surface of silicon pedestal and the second groove is 54.7 °.
It is provided on the side wall of second groove and increases anti-metal film, the light of the end injection of optic fibre cantilev is through increasing anti-metal
It is incident in single optical fiber calibrator after film reflection.
Optic fibre cantilev is fixed on by adhesive glue in third groove.
The axis of optic fibre cantilev and the angle increased between anti-metal film are 54.7 °, the axis of optic fibre cantilev and second
The bottom of groove is parallel.
The preparation method of optic fibre cantilev vibrating sensor of the present invention includes the following steps:
1) silicon pedestal is chosen, then mask is done using the silica for being carved with required figure using MEMS wet corrosion techniques and is existed
The surface of silicon pedestal carries out anisotropic etching, to make the second groove and third groove;
2) cutting interception optic fibre cantilev;
3) optic fibre cantilev of interception is fixed in third groove;
4) silicon pedestal for being fixed with optic fibre cantilev is fixed on to the bottom of encapsulating housing;
5) single optical fiber calibrator is installed on encapsulating housing, then light source is connected on optic fibre cantilev, then in single fiber
Light power meter is connect in collimator, by changing the position of single optical fiber calibrator, to determine the maximum position of received optical power, and will
Single optical fiber calibrator is fixed on when received optical power maximum at corresponding position, obtains optic fibre cantilev vibrating sensor.
The invention has the advantages that:
Optic fibre cantilev vibrating sensor of the present invention and preparation method thereof is when specific operation, when extraneous vibration is believed
When number being applied on entire sensor, then causes optical fiber cantilever beam vibration, change so as to cause reflected light path, and then cause
The range that single optical fiber calibrator receives the reflected beams changes, and external equipment can be received instead by analyzing single optical fiber calibrator
The range of irradiating light beam, to obtain vibration signal, compared with traditional electromagnetism class sensor, small, electromagnetism interference of the invention
Ability is strong.The present invention utilizes the silica for being carved with required figure in preparation process, by using MEMS wet corrosion techniques
It does mask and carries out anisotropic etching on the surface of silicon pedestal, to make the second groove and third groove, preparation method is simple, just
It is made in batch machining, while the device precision being prepared is higher.
Description of the drawings
Fig. 1 is the sectional view of the present invention;
Fig. 2 is the structural schematic diagram of silicon pedestal 1 in the present invention.
Wherein, 1 be silicon pedestal, 2 be optic fibre cantilev, 3 be encapsulating housing, 4 be single optical fiber calibrator, 5 be third groove,
6 be the second groove, 7 be to increase anti-metal film.
Specific implementation mode
The present invention is described in further detail below in conjunction with the accompanying drawings:
As shown in Figures 1 and 2, optic fibre cantilev vibrating sensor of the present invention includes silicon pedestal 1, optic fibre cantilev
2, encapsulating housing 3 and single optical fiber calibrator 4, wherein encapsulating housing 3 is fixed on silicon pedestal 1, and the bottom of encapsulating housing 3 is set
Be equipped with the first groove, the upper surface of silicon pedestal 1, which is provided with, offers the second groove 6 and third groove 5, wherein the second groove 6 with
Third groove 5 is connected, and the first groove is located at the surface of the second groove 6, and it is recessed that the end of single optical fiber calibrator 4 is inserted in first
In slot, the end of optic fibre cantilev 2 is extend into along third groove 5 in the second groove 6, and the end injection of optic fibre cantilev 2
Light is incident on after the reflection of the inner wall of the second groove 6 in single optical fiber calibrator 4.
The third groove 5 is V-groove, and the cross section of the second groove 6 is trapezoidal;It is utilized using MEMS wet corrosion techniques
Be carved with required figure silica do mask silicon pedestal 1 surface carry out anisotropic etching, with formed the second groove 6 and
Third groove 5;Angle between the side wall of the side wall and third groove 5 of the upper surface of silicon pedestal 1 and the second groove 6 is
54.7°;The axis of optic fibre cantilev 2 and the angle increased between anti-metal film 7 are 54.7 °, the axis of optic fibre cantilev 2 and second
The bottom of groove 6 is parallel.
It is provided on the side wall of second groove 6 and increases anti-metal film 7, the light that the end of optic fibre cantilev 2 is projected is anti-through increasing
Metal film 7 is incident on after reflecting in single optical fiber calibrator 4;Optic fibre cantilev 2 is fixed on by adhesive glue in third groove 5.
The preparation method of optic fibre cantilev vibrating sensor of the present invention includes the following steps:
1) silicon pedestal 1 is chosen, then mask is done using the silica for being carved with required figure using MEMS wet corrosion techniques
Anisotropic etching is carried out on the surface of silicon pedestal 1, to make the second groove 6 and third groove 5;
2) cutting interception optic fibre cantilev 2;
3) optic fibre cantilev of interception 2 is fixed in third groove 5;
4) silicon pedestal 1 for being fixed with optic fibre cantilev 2 is fixed on to the bottom of encapsulating housing 3;
5) single optical fiber calibrator 4 is installed on encapsulating housing 3, then light source is connected on optic fibre cantilev 2, then in monochromatic light
Light power meter is connect in fine collimator 4, by changing the position of single optical fiber calibrator 4, to determine the maximum position of received optical power,
And fiber arm beam vibration sensor is obtained at corresponding position when single optical fiber calibrator 4 is fixed on received optical power maximum.
One layer being plated on the inner wall of the second groove 6 using sputtering technology and increasing anti-metal film 7, the encapsulating housing 3 is using gold
Belonging to processing and fabricating to form, encapsulating housing 3 can also form closed environment other than the support for entire sensor structure,
The interference for eliminating extraneous factor, keeps the stability of light path.
During sensor use, extraneous vibration signal function causes shaking for optic fibre cantilev 2 on entire sensor
Dynamic, so as to cause the variation of reflected light path, the range that single optical fiber calibrator 4 receives the reflected beams changes, then is filled by rear end
It sets and signal is handled and is analyzed, you can obtain vibration signal.
Claims (8)
1. a kind of optic fibre cantilev vibrating sensor, which is characterized in that including silicon pedestal (1), optic fibre cantilev (2), encapsulating shell
Body (3) and single optical fiber calibrator (4), wherein encapsulating housing (3) is fixed on silicon pedestal (1), and the bottom of encapsulating housing (3)
It is provided with the first groove, the upper surface of silicon pedestal (1), which is provided with, offers the second groove (6) and third groove (5), wherein the
Two grooves (6) are connected with third groove (5), and the first groove is located at the surface of the second groove (6), single optical fiber calibrator (4)
End be inserted in the first groove, the end of optic fibre cantilev (2) is extend into along third groove (5) in the second groove (6), and
The light that the end of optic fibre cantilev (2) is projected is incident on single optical fiber calibrator (4) after the reflection of the inner wall of the second groove (6)
In.
2. optic fibre cantilev vibrating sensor according to claim 1, which is characterized in that the third groove (5) is V-type
The cross section of slot, the second groove (6) is trapezoidal.
3. optic fibre cantilev vibrating sensor according to claim 2, which is characterized in that use MEMS wet corrosion techniques
Mask is done using the silica for being carved with required figure and carries out anisotropic etching on the surface of silicon pedestal (1), to form second
Groove (6) and third groove (5).
4. optic fibre cantilev vibrating sensor according to claim 3, which is characterized in that the upper surface of silicon pedestal (1) with
Angle between the side wall of second groove (6) and the side wall of third groove (5) is 54.7 °.
5. optic fibre cantilev vibrating sensor according to claim 1, which is characterized in that on the side wall of the second groove (6)
It is provided with and increases anti-metal film (7), the light that the end of optic fibre cantilev (2) is projected is incident on after increasing anti-metal film (7) reflection
In single optical fiber calibrator (4).
6. optic fibre cantilev vibrating sensor according to claim 2, which is characterized in that optic fibre cantilev (2) passes through viscous
Gum deposit is fixed in third groove (5).
7. optic fibre cantilev vibrating sensor according to claim 3, which is characterized in that the axis of optic fibre cantilev (2)
It it is 54.7 ° with the angle increased between anti-metal film (7), the axis of optic fibre cantilev (2) is equal with the bottom of the second groove (6)
Row.
8. a kind of preparation method of optic fibre cantilev vibrating sensor described in claim 1, which is characterized in that including following step
Suddenly:
1) silicon pedestal (1) is chosen, then mask is done using the silica for being carved with required figure using MEMS wet corrosion techniques and is existed
The surface of silicon pedestal (1) carries out anisotropic etching, to make the second groove (6) and third groove (5);
2) cutting interception optic fibre cantilev (2);
3) optic fibre cantilev of interception (2) is fixed in third groove (5);
4) silicon pedestal (1) for being fixed with optic fibre cantilev (2) is fixed on to the bottom of encapsulating housing (3);
5) single optical fiber calibrator (4) is installed on encapsulating housing (3), then light source is connected on optic fibre cantilev (2), then in list
Optical fiber collimator connects light power meter on (4), by changing the position of single optical fiber calibrator (4), to determine received optical power maximum
Position, and at when single optical fiber calibrator (4) is fixed on reception pipe maximum optical power corresponding position, obtain optic fibre cantilev and shake
Dynamic sensor.
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CN201810651088.1A CN108663113A (en) | 2018-06-22 | 2018-06-22 | A kind of optic fibre cantilev vibrating sensor and preparation method thereof |
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CN201810651088.1A CN108663113A (en) | 2018-06-22 | 2018-06-22 | A kind of optic fibre cantilev vibrating sensor and preparation method thereof |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109374112A (en) * | 2018-11-20 | 2019-02-22 | 浙江大学 | Optical-fiber two-dimensional vibrating sensor and preparation method thereof |
CN110108267A (en) * | 2019-05-24 | 2019-08-09 | 中国人民解放军国防科技大学 | Vibrating beam, vibrating beam preparation method and silicon micro gyroscope |
CN110207807A (en) * | 2019-07-10 | 2019-09-06 | 国网上海市电力公司 | A kind of optical fibre vibration sensor and its method of measurement vibration |
CN110207806A (en) * | 2019-07-10 | 2019-09-06 | 国网上海市电力公司 | A kind of oblique angle end face optical fibre vibration sensor and its method of measurement vibration |
CN112903085A (en) * | 2021-05-07 | 2021-06-04 | 欧梯恩智能科技(苏州)有限公司 | Contact type vibration photon sensor using Doppler effect and manufacturing method thereof |
CN116249058A (en) * | 2023-01-19 | 2023-06-09 | 江苏光微半导体有限公司 | Quantum voiceprint recognition probe, MEMS (micro-electromechanical system) voiceprint structure and preparation method of MEMS voiceprint structure |
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CN102680073A (en) * | 2012-05-21 | 2012-09-19 | 天津大学 | Novel optical fiber vibration measurement instrument |
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DD301205A7 (en) * | 1989-10-24 | 1992-10-22 | Adw Ddr Kybernetik Inf | ACCELERATION SENSOR |
DE4230087A1 (en) * | 1992-09-09 | 1994-03-10 | Bezzaoui Hocine Dipl Ing | Integrated optical micro-mechanical sensor for measuring physical or chemical parameters - has strip waveguide applied to etched membrane acting as integrated measuring path |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109374112A (en) * | 2018-11-20 | 2019-02-22 | 浙江大学 | Optical-fiber two-dimensional vibrating sensor and preparation method thereof |
CN110108267A (en) * | 2019-05-24 | 2019-08-09 | 中国人民解放军国防科技大学 | Vibrating beam, vibrating beam preparation method and silicon micro gyroscope |
CN110207807A (en) * | 2019-07-10 | 2019-09-06 | 国网上海市电力公司 | A kind of optical fibre vibration sensor and its method of measurement vibration |
CN110207806A (en) * | 2019-07-10 | 2019-09-06 | 国网上海市电力公司 | A kind of oblique angle end face optical fibre vibration sensor and its method of measurement vibration |
CN112903085A (en) * | 2021-05-07 | 2021-06-04 | 欧梯恩智能科技(苏州)有限公司 | Contact type vibration photon sensor using Doppler effect and manufacturing method thereof |
CN112903085B (en) * | 2021-05-07 | 2021-07-20 | 欧梯恩智能科技(苏州)有限公司 | Contact type vibration photon sensor using Doppler effect and manufacturing method thereof |
WO2022233172A1 (en) * | 2021-05-07 | 2022-11-10 | 欧梯恩智能科技(苏州)有限公司 | Contact-type vibration photon sensor using doppler effect and manufacturing method therefor |
CN116249058A (en) * | 2023-01-19 | 2023-06-09 | 江苏光微半导体有限公司 | Quantum voiceprint recognition probe, MEMS (micro-electromechanical system) voiceprint structure and preparation method of MEMS voiceprint structure |
CN116249058B (en) * | 2023-01-19 | 2023-10-27 | 江苏光微半导体有限公司 | Quantum voiceprint recognition probe, MEMS (micro-electromechanical system) voiceprint structure and preparation method of MEMS voiceprint structure |
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Application publication date: 20181016 |