CN203551100U - Novel Fabry-Perot interference-type MEMS sound wave sensor - Google Patents
Novel Fabry-Perot interference-type MEMS sound wave sensor Download PDFInfo
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- CN203551100U CN203551100U CN201320604333.6U CN201320604333U CN203551100U CN 203551100 U CN203551100 U CN 203551100U CN 201320604333 U CN201320604333 U CN 201320604333U CN 203551100 U CN203551100 U CN 203551100U
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Abstract
The utility model discloses a novel Fabry-Perot interference-type MEMS sound wave sensor comprising a collimator; an SOI wafer; a sleeve pipe, which is disposed on the lower part of the SOI wafer, and is used for supporting the SOI wafer and fixing the collimator. The SOI wafer is provided with a sound-sensitive film, and a central axis of the sleeve pipe is superposed with a central normal of a circular silicon film of the SOI wafer. The distance between the end surface of the optical fiber collimator of the inserted sleeve pipe and the sound-sensitive film is in a range from 100 micrometers to 300 micrometers. The end surface of the optical fiber collimator provided with the pigtail and the inner surface of the silicon micro-thin film can be used to form two parallel surfaces of the Fabry-Perot interferometer, and when the film is deformed under the action of the pressure generated by the external sound waves, the cavity length of the Fabry-Perot interference cavity is changed. The sound wave signal detection can be realized by demodulating the variable quantity of the cavity length of the Fabry-Perot interference cavity, and therefore the sensor having advantages of strong anti-interference capability, microminiaturization, and high sensitivity can be provided under the strong-electromagnetic interference environment.
Description
Technical field
The utility model relates to and belongs to mike technique field, relates in particular to a kind of novel Fabry-Paro interfere type MEMS sonic sensor.
Background technology
Sound wave be the vibration of object in the propagation of medium, and sonic sensor is exactly that the voice signal in medium is converted into the physical quantity that other can detect, thus by the device of these physical quantity restoring acoustical signals.In recent years, from the civilian Medical Devices based on Ultrasonic Diagnosis, to the detection to Submarine Target in Military Application, widespread use every field of sonic sensor.Along with the continuous exploration to acoustic signals, following acoustic detector will be more important in the effect in civilian and military field.
At present, the sonic sensor that utilizes MEMS technique to make mainly contains several technical systems.One, MEMS piezo-electric type sonic sensor.This microphone adopts piezoelectric to respond to extraneous sound pressure signal, thereby sound pressure signal is converted into voltage signal.Two, condenser type acoustic cavity sonic sensor.When sound pressure signal acts on the film of this sensor, film generation deformation changes the electric capacity in acoustic cavity, by the relation solving between variable quantity and the acoustic pressure of electric capacity, carrys out restoring acoustical signal.Three, the reflective microphone of optical fibre thin film.A kind of optical fiber microphone is disclosed in the patent No. 201010101144.8.This device is with film, to experience the vibration of voice signal, thereby causes changing to the distance of vibration film through the fiber end face of fine gtinding, and the luminous power of reflection is changed, and finally by the variation that detects light intensity, carrys out restoring acoustical signal.
But all there are several problems in above-mentioned a few class MEMS microphones.MEMS piezoelectric transducer is because the restriction sensitivity of material is lower, and anti-electromagnetic interference capability is poor; Condenser microphone generally adopts the capacitance detecting device with acoustic cavity, comprising elastic vibration film, the baroque device such as Detection capacitance, so complicated structure, the difficulty of processing not only causing is thus larger, and this type of microphone exists the poor shortcoming of anti-electromagnetic interference capability equally.Light source power noise in fiber optic microphone structure has affected reflective light intensity to a great extent, in addition uniform thickness reflective film causes thin plate curvature to change in deformation effect, thereby it is unstable to reflex in optical fiber Coupling power efficiency, has also brought the unstable of output optical signal.
Utility model content
The purpose of this utility model is to provide a kind of novel Fabry-Paro interfere type MEMS sonic sensor, and volume is little, antijamming capability is strong, and high at strong electromagnetic interference environment stability inferior.
The utility model adopts following technical proposals:
A kind of novel Fabry-Paro interfere type MEMS sonic sensor, comprise collimating apparatus, SOI wafer and be arranged on below SOI wafer for supporting the sleeve pipe of SOI wafer and fixing collimating apparatus, on described SOI wafer, be processed with acoustic sensing film, described collimating apparatus is fixed on sleeve pipe, and form two parallel surfaces of Fabry-Paro interferometer with the upper surface of its socket and collimating apparatus and acoustic sensing film inside surface, an interference cavity of matrix formation of two parallel surfaces and SOI wafer; The central axis of described sleeve pipe overlaps with the centre normal of circular silicon membrane on SOI wafer, and the distance of the optical fiber collimator end face distance acoustic sensing film of described insertion sleeve pipe is 100 ~ 300 μ m.
The center of described acoustic sensing film is provided with a round boss, and the thickness of round boss equates with acoustic sensing film thickness, and diameter is not less than fibre diameter.
The thickness of described acoustic sensing film is 2 ~ 4 μ m, and radius is not more than 1000 μ m.
In the outer rim substrate of described acoustic sensing film, be etched with multiple through holes.
On described collimating apparatus and annulus, be processed with axially extending bore.
Described through hole is 4.
Described collimating apparatus comprises glass tube and the lens and the tail optical fiber that are arranged on glass tube two ends, and described tail optical fiber connects lens by glass tube.
The optical fiber collimator end face of the utility model utilization with tail optical fiber and two parallel surfaces of silicon mems thin film inside surface formation Fabry-Paro interferometer, when pressure-acting that extraneous sound wave produces will cause film generation deformation to time on film, thereby it is long to change the chamber of Fabry-Paro interference cavity.The variable quantity of growing by chamber and the relation that acts on the acoustic vibration signal on film, realize acoustic signals surveyed the demodulation of F-P change of cavity length amount.Thereby in order to provide under strong electromagnetic interference environment, a kind of antijamming capability is strong, microminiaturized, highly sensitive microphone.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the vertical view of silicon fiml described in the utility model;
System connection layout in use procedure of Fig. 3 the utility model.
Embodiment
As shown in Figure 1, a kind of novel Fabry-Paro interfere type MEMS sonic sensor, comprise collimating apparatus, SOI wafer and be arranged on below SOI wafer for supporting the sleeve pipe of SOI wafer and fixing collimating apparatus, due to collimating apparatus etc. be cylindric, so sleeve pipe is ring sleeve 10.Described ring sleeve 10 provides a supporting role for SOI wafer substrates, by ultraviolet glue, both are bonded together, wherein the centre normal of the circular silicon membrane on the central axis of ring sleeve 10 and SOI wafer overlaps, and the diameter of ring sleeve 10 is greater than the diameter of optical fiber collimator.On SOI wafer, by the oxidation of photoetching, burn into, be processed with acoustic sensing film 1, the center of described acoustic sensing film 1 is provided with a round boss 2, and the thickness of round boss 2 equates with acoustic sensing film 1 thickness, and diameter is not less than fibre diameter.
This novel Fabry-Paro interfere type MEMS sonic sensor that the utility model provides, utilize the mechanical characteristic of silicon materials, adopt bulk silicon process, can be directly on SOI wafer the multiple silicon sound wave sensitive thin film of machine-shaping unit once, guarantee the acoustic response consistency of performance of sensing unit, and be micron-sized circular silicon membrane by design thickness, the center of silicon fiml is thicker, formed the boss structure of a minor radius, when this structure has guaranteed silicon fiml generation deformation, photosensitive echo area, center curvature changes little, holding signal light reflection strength is relatively stable.Silicon fiml outward flange has kept the original thickness of wafer, and in the outer rim substrate of the acoustic sensing film on described SOI wafer, be etched with four through holes, so that silicon fiml structural member and glass bushing inside and outside differential pressure in the process of gummed is discharged as early as possible, guarantee interference cavity internal and external pressure balance.The making of above-mentioned silicon fiml adopts the SIO wafer of " sandwich " structure, utilize silicon and monox etching speed difference under different corrosive liquids or dark silicon etching, be easy to control the thickness of acoustic sensing silicon fiml, in addition because silicon/silicon dioxide interface is formed by bonding by the material having an even surface of the same race, after corrode silicon dioxide layer 5, can obtain smooth silicon face, make surface there is good mirror effect.In manufacturing process, first SOI wafer is carried out to photoetching and form two-dimentional figure, then adopt the method for dry etching or wet etching to carry out the three-dimensional structure of being processed to form of physics or chemical method to silicon materials, vibration of thin membrane resonance frequency is controlled in 30kHz, the thickness of acoustic sensing film is 2 ~ 4 μ m, and radius is not more than 1000 μ m.
Described collimating apparatus comprises glass tube 8 and the lens 7 and the tail optical fiber 9 that are arranged on glass tube 8 two ends, and described tail optical fiber 9 connects lens 7 by glass tube 8.The effect of described collimating apparatus is by the laser beam collimation sending from fiber end face, makes it have good beam quality, and light beam (active length) shape in certain scope is good.Collimating apparatus operating distance is greater than 1mm, the semi-transparent semi-reflecting blooming of GRIN Lens 7 plated surfaces of its front end, the single-mode tail fiber 9 of the fiber work wavelength 1550nm of connection collimating apparatus.
Described collimating apparatus is fixed on ring sleeve 10, and forms two parallel surfaces of Fabry-Paro interferometer with the upper surface of its socket and collimating apparatus and acoustic sensing film 1 inside surface, and the matrix 6 of two parallel surfaces and SOI wafer forms an interference cavity; The central axis of described ring sleeve 10 overlaps with the centre normal of acoustic sensing film 1 on SOI wafer, optical fiber collimator inserts ring sleeve 10, distance between one end and the acoustic sensing film 1 of the insertion acoustic sensing film 1 of described collimating apparatus is 100 ~ 300 μ m, be that Fabry-Paro interference cavity chamber is long, by observing spacing between the adjacent peak value of interference spectrum, can determine Free Spectral Range, according to the calculation relational expression between Free Spectral Range and interference cavity chamber length
obtain film and collimating apparatus end face distance, Fabry-Paro interference cavity chamber is long.Generalized case is designed to 100 μ m left and right, so both guarantees the scope of free spectral range, also can guarantee the loss in less Fabry-Paro interference cavity chamber.
Described ring sleeve 10 fixed support silicon fimls, at optical microphotograph Microscopic observation ring sleeve 10 and SOI sheet basalis 6, aim at both centers, adopt ultra-violet curing gluing to be combined.The internal diameter of ring sleeve 10 is slightly larger than collimating apparatus glass tube 8, so that collimating apparatus is inserted in ring sleeve 10.Be different from the sonic sensor that adopts Fizeau interference chamber to make, the feature in Fizeau interference chamber is coated reflection end face, to improve the light intensity reflecting into into optical fiber, but can change the physical construction of film, reduce the sensitivity of film in response sound wave, in the present embodiment, adopt silicon fiml intrinsic reflection characteristic, its reflectivity reaches 30%.
The utility model and light source, photodetector, signal amplify and demodulating unit forms complete sonic sensor system, final by detecting weak voltage signals, and the light signal of being modulated is restored to original acoustic signals.As shown in Figure 4.Novel Fabry-Paro interfere type MEMS sonic sensor 14 described in the utility model is connected with X-type fiber coupler 13 by single-mode fiber 12, the other one end of fiber coupler 13 connects semiconductor laser 11, the laser signal of its output is divided into two-way after coupling mechanism 13, one tunnel exports sensing unit to, an other road connects photodetector 15 as intensity of light source feedback arm, the reflection of fiber microphone interference light signal exports photodetector 17 to, photodetector 15 directly with under input is connected with 16 with the signal of 17 outputs, formation is with the Fibre Optical Sensor signal demodulating system of light intensity reaction type, greatly reduce like this source noise noise that demodulation brings to interference strength, improve the signal to noise ratio (S/N ratio) of fiber optic sensor system.
It is the reference light that Fabry-Paro parallel-plate is interfered that the utility model adopts optical fiber collimator, from the flashlight that modulated by sound wave, demodulate acoustic signals, this sensor is distinguished in parallel plate capacitor formula sonic sensor, probe segment adopts full light structural, without electric signal, participates in, and has the ability of natural anti-electromagnetic interference (EMI), in addition, adopt the high laser instrument of stability, guarantee the interference fringe of sensor stable output, improve the stability of sonic sensor.
Fabry-Paro interference cavity that the utility model provides adopts the vent hole structure of internal and external equilibrium, can be in the substrate of silicon fiml outer rim direct etching through-hole structure, or process axially extending bore on collimating apparatus and annulus, avoid like this top to be fixed with in ring sleeve and collimating apparatus manufacturing process and caused acoustic sensing deformation of thin membrane even to break because temperature variation produces external and internal pressure imbalance.
Claims (7)
1. novel Fabry-Paro interfere type MEMS sonic sensor, it is characterized in that: comprise collimating apparatus, SOI wafer and be arranged on below SOI wafer for supporting the sleeve pipe of SOI wafer and fixing collimating apparatus, on described SOI wafer, be processed with acoustic sensing film, described collimating apparatus is fixed on sleeve pipe, and form two parallel surfaces of Fabry-Paro interferometer with the upper surface of its socket and collimating apparatus and acoustic sensing film inside surface, an interference cavity of matrix formation of two parallel surfaces and SOI wafer; The central axis of described sleeve pipe overlaps with the centre normal of circular silicon membrane on SOI wafer, and the distance of the optical fiber collimator end face distance acoustic sensing film of described insertion sleeve pipe is 100 ~ 300 μ m.
2. novel Fabry-Paro interfere type MEMS sonic sensor according to claim 1, it is characterized in that: the center of described acoustic sensing film is provided with a round boss, the thickness of round boss equates with acoustic sensing film thickness, and diameter is not less than fibre diameter.
3. novel Fabry-Paro interfere type MEMS sonic sensor according to claim 1, is characterized in that: the thickness of described acoustic sensing film is 2 ~ 4 μ m, and radius is not more than 1000 μ m.
4. novel Fabry-Paro interfere type MEMS sonic sensor according to claim 1, is characterized in that: in the outer rim substrate of described acoustic sensing film, be etched with multiple through holes.
5. novel Fabry-Paro interfere type MEMS sonic sensor according to claim 4, is characterized in that: described through hole is 4.
6. novel Fabry-Paro interfere type MEMS sonic sensor according to claim 1, is characterized in that: on described collimating apparatus and annulus, be processed with axially extending bore.
7. according to the arbitrary described novel Fabry-Paro interfere type MEMS sonic sensor of claim 1-6, it is characterized in that: described collimating apparatus comprises glass tube and the lens and the tail optical fiber that are arranged on glass tube two ends, and described tail optical fiber connects lens by glass tube.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103528665A (en) * | 2013-09-29 | 2014-01-22 | 中国电子科技集团公司第二十七研究所 | Novel Fabry-Perot interference MEMS (Micro Electro Mechanical System) sound wave sensor |
| CN104019884A (en) * | 2014-06-23 | 2014-09-03 | 中国科学院电子学研究所 | Optical fiber FP cavity sonic probe |
| CN110332981A (en) * | 2019-07-10 | 2019-10-15 | 西北工业大学 | A kind of MEMS fibre optic hydrophone and preparation method thereof |
| CN112212964A (en) * | 2019-07-12 | 2021-01-12 | 清华大学 | Photoacoustic sensor, photoacoustic detection system, method, device, and storage medium |
| CN113340491A (en) * | 2021-07-07 | 2021-09-03 | 中北大学 | High-consistency preparation method of optical fiber Fabry-Perot pressure sensor and sensitive unit thereof |
| US20220155147A1 (en) * | 2020-11-15 | 2022-05-19 | Naiqian Han | Optical mems based monitoring system |
| CN116164781A (en) * | 2023-04-21 | 2023-05-26 | 西北工业大学 | MEMS sensor based on optical fiber F-P cavity and packaging method thereof |
| US11999612B2 (en) * | 2021-11-14 | 2024-06-04 | Naiqian Han | Optical MEMS based monitoring system |
-
2013
- 2013-09-29 CN CN201320604333.6U patent/CN203551100U/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103528665A (en) * | 2013-09-29 | 2014-01-22 | 中国电子科技集团公司第二十七研究所 | Novel Fabry-Perot interference MEMS (Micro Electro Mechanical System) sound wave sensor |
| CN104019884A (en) * | 2014-06-23 | 2014-09-03 | 中国科学院电子学研究所 | Optical fiber FP cavity sonic probe |
| CN110332981A (en) * | 2019-07-10 | 2019-10-15 | 西北工业大学 | A kind of MEMS fibre optic hydrophone and preparation method thereof |
| CN112212964A (en) * | 2019-07-12 | 2021-01-12 | 清华大学 | Photoacoustic sensor, photoacoustic detection system, method, device, and storage medium |
| CN112212964B (en) * | 2019-07-12 | 2021-10-01 | 清华大学 | Photoacoustic sensor, photoacoustic detection system, method, device, and storage medium |
| US20220155147A1 (en) * | 2020-11-15 | 2022-05-19 | Naiqian Han | Optical mems based monitoring system |
| CN113340491A (en) * | 2021-07-07 | 2021-09-03 | 中北大学 | High-consistency preparation method of optical fiber Fabry-Perot pressure sensor and sensitive unit thereof |
| CN113340491B (en) * | 2021-07-07 | 2024-01-05 | 中北大学 | Optical fiber Fabry-Perot pressure sensor and high-consistency preparation method of sensitive unit thereof |
| US11999612B2 (en) * | 2021-11-14 | 2024-06-04 | Naiqian Han | Optical MEMS based monitoring system |
| CN116164781A (en) * | 2023-04-21 | 2023-05-26 | 西北工业大学 | MEMS sensor based on optical fiber F-P cavity and packaging method thereof |
| CN116164781B (en) * | 2023-04-21 | 2023-07-07 | 西北工业大学 | MEMS sensor based on optical fiber F-P cavity and packaging method thereof |
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Granted publication date: 20140416 |